CN220808372U - Semiconductor element packaging mold convenient to unload - Google Patents
Semiconductor element packaging mold convenient to unload Download PDFInfo
- Publication number
- CN220808372U CN220808372U CN202322395341.0U CN202322395341U CN220808372U CN 220808372 U CN220808372 U CN 220808372U CN 202322395341 U CN202322395341 U CN 202322395341U CN 220808372 U CN220808372 U CN 220808372U
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- fixed
- packaging
- seat
- shaped frame
- encapsulation
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 54
- 239000004065 semiconductor Substances 0.000 title claims abstract description 41
- 238000005538 encapsulation Methods 0.000 claims abstract description 26
- 238000007599 discharging Methods 0.000 claims abstract description 5
- 244000309464 bull Species 0.000 claims description 5
- 230000006978 adaptation Effects 0.000 claims description 3
- 238000007493 shaping process Methods 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 6
- 239000012768 molten material Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The utility model discloses a packaging mould for a semiconductor element, which is convenient to discharge, and comprises a packaging seat, wherein a plurality of packaging grooves are formed in the top of the packaging seat, a U-shaped frame is fixed between two sides of the packaging seat, an automatic press-fitting mechanism is arranged on the U-shaped frame, and an automatic discharging assembly is arranged in the packaging seat; the utility model relates to the technical field of packaging molds, in particular to an automatic press-fitting mechanism, which comprises a cylinder fixed at the top of a U-shaped frame, wherein the output end of the cylinder penetrates through the U-shaped frame and extends to the bottom of the U-shaped frame, a pressing plate is fixed at the output end of the cylinder, and a plurality of press-fitting blocks are arranged at the bottom of the pressing plate. This semiconductor component is with encapsulation mould convenient to unload, through the setting of automatic subassembly of unloading, realized the automatic quick unloading of semiconductor component, solved after the semiconductor component shaping with the inconvenient problem of unloading of encapsulation groove adhesion, degree of automation is high, and the practicality is very strong.
Description
Technical Field
The utility model relates to the technical field of packaging molds, in particular to a packaging mold for a semiconductor element, which is convenient to discharge.
Background
Semiconductor devices are widely used in modern electronics, and the packaging process is a key ring for guaranteeing the performance of the devices.
Referring to China patent, a high heat dissipation semiconductor element packaging mould (publication No. CN115401865A, publication No. 2022-11-29) solves the problems that the heat dissipation efficiency of the traditional semiconductor element packaging mould is low when in use, after the corresponding molten material is injected into the mould for packaging, the material is high in temperature, the corresponding product can be obtained after the material is cooled, the mould is released, the natural cooling rate is low, the product packaging efficiency is low, the traditional semiconductor element packaging mould cannot well meet the packaging requirement of the traditional semiconductor element, and the use is inconvenient, but the traditional semiconductor element packaging mould is easy to adhere to the inside of a packaging groove when the semiconductor element is needed after the packaging is completed, and the unloading is inconvenient.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model provides a packaging die for a semiconductor element, which is convenient to discharge, and solves the technical problems in the background art.
In order to achieve the above purpose, the utility model is realized by the following technical scheme: the packaging mold for the semiconductor element convenient to discharge comprises a packaging seat, wherein a plurality of packaging grooves are formed in the top of the packaging seat, a U-shaped frame is fixed between two sides of the packaging seat, an automatic press-fitting mechanism is arranged on the U-shaped frame, and an automatic discharging assembly is arranged in the packaging seat;
The automatic press mounting mechanism comprises an air cylinder fixed at the top of a U-shaped frame, the output end of the air cylinder penetrates through the U-shaped frame and extends to the bottom of the U-shaped frame, a pressing plate is fixed at the output end of the air cylinder, a plurality of press mounting blocks are arranged at the bottom of the pressing plate, rebound protection components are arranged between the press mounting blocks and the pressing plate, each rebound protection component comprises a plurality of fixed pipes fixed at the bottom of the pressing plate, movable rods are fixed at the tops of the press mounting blocks, the tops of the movable rods penetrate through the fixed pipes and extend to the inside of the fixed pipes, the outer surfaces of the movable rods are in sliding connection with the inner surfaces of the fixed pipes, springs are sleeved on the outer surfaces of the fixed pipes, the bottoms of the springs are fixed with the tops of the press mounting blocks, and the tops of the springs are fixed with the bottoms of the pressing plates.
Preferably, the automatic unloading assembly comprises a vertical pipe fixed on the bottom wall of the packaging seat, the top end of the vertical pipe is slidably connected with a square rod, and the bottom end of the square rod penetrates through the vertical pipe and extends to the inside of the vertical pipe.
Preferably, the bottom wall of the vertical pipe is rotationally connected with a threaded rod, the top end of the threaded rod penetrates through the square rod and extends to the inside of the square rod, the outer surface of the threaded rod is in threaded connection with the inner surface of the square rod, and the top end of the square rod is fixedly provided with a transverse plate.
Preferably, the top of diaphragm is fixed with a plurality of liftout pieces, and a plurality of the top of liftout piece is all run through the encapsulation groove and is extended to the inside of encapsulation groove, a plurality of the surface of liftout piece all with the internal surface sliding connection of encapsulation groove, a plurality of the liftout piece all with the size looks adaptation of encapsulation groove, one side rotation of encapsulation seat inner wall is connected with the bull stick.
Preferably, one end of the rotating rod penetrates through the vertical pipe and extends to the inside of the vertical pipe, the outer surface of the rotating rod is rotationally connected with the inner surface of the vertical pipe, one end of the rotating rod is fixedly provided with a first bevel gear, the outer surface of the threaded rod is fixedly provided with a second bevel gear, and the first bevel gear is meshed with the second bevel gear.
Preferably, the other end of the rotating rod penetrates through the packaging seat and extends to the outside of the packaging seat, a driving motor is fixed on one side of the packaging seat, and the output end of the driving motor is fixed with the other end of the rotating rod through a coupler.
Advantageous effects
The utility model provides a packaging die for a semiconductor element, which is convenient to discharge. Compared with the prior art, the method has the following beneficial effects:
(1) This semiconductor component is with encapsulation mould convenient to unload, through the setting of automatic subassembly of unloading, realized the automatic quick unloading of semiconductor component, solved after the semiconductor component shaping with the inconvenient problem of unloading of encapsulation groove adhesion, degree of automation is high, and the practicality is very strong.
(2) The packaging mold for the semiconductor element, which is convenient to discharge, realizes the press mounting of the semiconductor element through the arrangement of the automatic press mounting mechanism, and prevents the semiconductor element from being damaged by excessive downward pressing of the press mounting block through the arrangement of the rebound protection assembly, thereby protecting the semiconductor element.
Drawings
FIG. 1 is a perspective view of an external structure of the present utility model;
FIG. 2 is a perspective view of an automated press-fitting mechanism of the present utility model;
FIG. 3 is an enlarged view of a portion of the utility model at A in FIG. 2;
FIG. 4 is a cross-sectional view of a package base of the present utility model;
Fig. 5 is a partial enlarged view of the present utility model at B in fig. 4.
In the figure: 1. a packaging seat; 2. a packaging groove; 3. a U-shaped frame; 4. an automatic press-fitting mechanism; 5. an automated discharge assembly; 6. a rebound protection assembly; 41. a cylinder; 42. a pressing plate; 43. pressing the block; 51. a standpipe; 52. square rods; 53. a threaded rod; 54. a cross plate; 55. a jacking block; 56. a rotating rod; 57. bevel gears I; 58. bevel gears II; 59. a driving motor; 61. a fixed tube; 62. a movable rod; 63. and (3) a spring.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model provides three technical schemes: the method specifically comprises the following examples:
example 1
Referring to fig. 1-5, a packaging mold for a semiconductor element convenient for unloading comprises a packaging seat 1, wherein a plurality of packaging grooves 2 are formed in the top of the packaging seat 1, molten materials are injected into the packaging grooves 2 and wait for complete cooling to form the semiconductor element, a U-shaped frame 3 is fixed between two sides of the packaging seat 1, an automatic press-fitting mechanism 4 is arranged on the U-shaped frame 3, and an automatic unloading assembly 5 is arranged in the packaging seat 1;
The automatic press-fitting mechanism 4 comprises a cylinder 41 fixed at the top of the U-shaped frame 3, the cylinder 41 is controlled by an external switch and is electrically connected with an external power supply, the output end of the cylinder 41 penetrates through the U-shaped frame 3 and extends to the bottom of the U-shaped frame 3, a pressing plate 42 is fixed at the output end of the cylinder 41, a plurality of press-fitting blocks 43 are arranged at the bottom of the pressing plate 42, a rebound protection assembly 6 is arranged between the plurality of press-fitting blocks 43 and the pressing plate 42, the rebound protection assembly 6 comprises a plurality of fixed pipes 61 fixed at the bottom of the pressing plate 42, movable rods 62 are fixed at the top of the plurality of press-fitting blocks 43, the top ends of the plurality of movable rods 62 penetrate through the fixed pipes 61 and extend to the inside of the fixed pipes 61, the outer surfaces of the plurality of movable rods 62 are in sliding connection with the inner surfaces of the fixed pipes 61, springs 63 are sleeved on the outer surfaces of the plurality of the fixed pipes 61, the bottom ends of the plurality of springs 63 are fixed with the top of the pressing blocks 43, the top of the plurality of springs 63 are fixed with the bottom of the pressing plate 42, the rebound protection assembly 6 is arranged between the plurality of press-fitting blocks 43, the rebound protection assembly 4 is arranged, the semiconductor element is prevented from being damaged by the rebound protection assembly 6, and the semiconductor element is prevented from being excessively pressed by the rebound protection assembly 43.
Example 2
On the basis of embodiment 1, referring to fig. 4 and 5, the automatic discharging assembly 5 comprises a vertical tube 51 fixed on the bottom wall of the package base 1, wherein a square rod 52 is slidably connected to the top end of the vertical tube 51, and the bottom end of the square rod 52 penetrates through the vertical tube 51 and extends into the vertical tube 51.
The bottom wall of the vertical pipe 51 is rotatably connected with a threaded rod 53, the top end of the threaded rod 53 penetrates through the square rod 52 and extends into the square rod 52, the outer surface of the threaded rod 53 is in threaded connection with the inner surface of the square rod 52, and a transverse plate 54 is fixed to the top end of the square rod 52.
The top of diaphragm 54 is fixed with a plurality of top material pieces 55, and the top of a plurality of top material pieces 55 all runs through encapsulation groove 2 and extends to the inside of encapsulation groove 2, and the surface of a plurality of top material pieces 55 all is connected with the internal surface sliding of encapsulation groove 2, and a plurality of top material pieces 55 all with the size looks adaptation of encapsulation groove 2, one side rotation of encapsulation seat 1 inner wall is connected with bull stick 56.
One end of the rotating rod 56 penetrates through the vertical pipe 51 and extends to the inside of the vertical pipe 51, the outer surface of the rotating rod 56 is rotationally connected with the inner surface of the vertical pipe 51, one end of the rotating rod 56 is fixedly provided with a first bevel gear 57, the outer surface of the threaded rod 53 is fixedly provided with a second bevel gear 58, and the first bevel gear 57 is meshed with the second bevel gear 58.
The other end of bull stick 56 runs through encapsulation seat 1 and extends to encapsulation seat 1's outside, and one side of encapsulation seat 1 is fixed with driving motor 59, and driving motor 59 is three-phase asynchronous motor, can carry out positive and negative rotation, receives external switch control, and with external power source electric connection, driving motor 59's output passes through the shaft coupling to be fixed with the other end of bull stick 56, through the setting of automatic subassembly 5 of unloading, has realized the automatic quick unloading of semiconductor component, has solved the semiconductor component shaping after with the inconvenient problem of unloading of encapsulation groove 2 adhesion, degree of automation is high, the practicality is very strong.
Example 3
On the basis of embodiment 1 and embodiment 2, as shown in fig. 1-5, during operation, molten materials are injected into the packaging groove 2, the cylinder 41 is further started, the cylinder 41 drives the pressing plate 42 to move downwards, meanwhile, the pressing plate 42 drives the pressing block 43 to press into the packaging groove 2, the pressing block 43 is utilized to press the molten materials, the reaction force of the further pressing drives the pressing block 43 to move upwards, meanwhile, the pressing block 43 drives the movable rod 62 to slide upwards along the inner surface of the fixed pipe 61, meanwhile, compression springs 63 are extruded, the rebound protection assembly 6 is utilized to protect the pressed semiconductor elements, after the molten materials are completely cooled, the semiconductor elements are formed, when the semiconductor elements need to be unloaded, the driving motor 59 is started, the driving motor 59 drives the rotary rod 56 to rotate, meanwhile, the rotary rod 56 drives the bevel gear one 57 to rotate, the bevel gear one 57 drives the bevel gear two 58 to rotate, meanwhile, the threaded rod 53 drives the square rod 52 to slide upwards, the square rod 52 further drives the transverse plate 54 and the jacking block 55 to move upwards, finally, the jacking block 55 slides along the inner surface of the packaging groove 2, and the semi-conductor elements are jacked up, and the semi-conductor elements are completely unloaded.
And all that is not described in detail in this specification is well known to those skilled in the art.
The foregoing describes one embodiment of the present utility model in detail, but the description is only a preferred embodiment of the present utility model and should not be construed as limiting the scope of the utility model. All equivalent changes and modifications within the scope of the present utility model are intended to be covered by the present utility model.
Claims (6)
1. The utility model provides a semiconductor component is with encapsulation mould convenient to unload, includes encapsulation seat (1), its characterized in that: a plurality of packaging grooves (2) are formed in the top of the packaging seat (1), a U-shaped frame (3) is fixed between two sides of the packaging seat (1), an automatic press-fitting mechanism (4) is arranged on the U-shaped frame (3), and an automatic unloading assembly (5) is arranged in the packaging seat (1);
the automatic press-fitting mechanism (4) comprises an air cylinder (41) fixed at the top of a U-shaped frame (3), the output end of the air cylinder (41) penetrates through the U-shaped frame (3) and extends to the bottom of the U-shaped frame (3), a pressing plate (42) is fixed at the output end of the air cylinder (41), a plurality of press-fitting blocks (43) are arranged at the bottom of the pressing plate (42), rebound protection components (6) are arranged between the press-fitting blocks (43) and the pressing plate (42), each rebound protection component (6) comprises a plurality of fixed pipes (61) fixed at the bottom of the pressing plate (42), movable rods (62) are fixed at the top of the press-fitting blocks (43), the top ends of the movable rods (62) penetrate through the fixed pipes (61) and extend to the inside of the fixed pipes (61), the outer surfaces of the movable rods (62) are slidably connected with the inner surfaces of the fixed pipes (61), springs (63) are sleeved on the outer surfaces of the fixed pipes (61), and the bottoms of the springs (63) are fixed at the top ends of the bottoms of the pressing blocks (43).
2. The package mold for semiconductor elements facilitating unloading according to claim 1, wherein: automatic change subassembly (5) of unloading is including fixing standpipe (51) on encapsulation seat (1) diapire, the top sliding connection of standpipe (51) has square pole (52), the bottom of square pole (52) runs through standpipe (51) and extends to the inside of standpipe (51).
3. The semiconductor component packaging mold facilitating unloading according to claim 2, wherein: the bottom wall of the vertical pipe (51) is rotationally connected with a threaded rod (53), the top end of the threaded rod (53) penetrates through the square rod (52) and extends to the inside of the square rod (52), the outer surface of the threaded rod (53) is in threaded connection with the inner surface of the square rod (52), and a transverse plate (54) is fixed to the top end of the square rod (52).
4. A semiconductor component packaging mold facilitating unloading according to claim 3, wherein: the top of diaphragm (54) is fixed with a plurality of liftout pieces (55), and a plurality of the top of liftout piece (55) all runs through encapsulation groove (2) and extends to the inside of encapsulation groove (2), a plurality of the surface of liftout piece (55) all with the internal surface sliding connection of encapsulation groove (2), a plurality of liftout piece (55) all with the size looks adaptation of encapsulation groove (2), one side rotation of encapsulation seat (1) inner wall is connected with bull stick (56).
5. The package mold for semiconductor elements facilitating discharging as claimed in claim 4, wherein: one end of the rotating rod (56) penetrates through the vertical pipe (51) and extends to the inside of the vertical pipe (51), the outer surface of the rotating rod (56) is rotationally connected with the inner surface of the vertical pipe (51), one end of the rotating rod (56) is fixedly provided with a first bevel gear (57), the outer surface of the threaded rod (53) is fixedly provided with a second bevel gear (58), and the first bevel gear (57) is meshed with the second bevel gear (58).
6. The package mold for semiconductor elements facilitating discharging as claimed in claim 4, wherein: the other end of the rotating rod (56) penetrates through the packaging seat (1) and extends to the outside of the packaging seat (1), a driving motor (59) is fixed on one side of the packaging seat (1), and the output end of the driving motor (59) is fixed with the other end of the rotating rod (56) through a coupler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322395341.0U CN220808372U (en) | 2023-09-04 | 2023-09-04 | Semiconductor element packaging mold convenient to unload |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322395341.0U CN220808372U (en) | 2023-09-04 | 2023-09-04 | Semiconductor element packaging mold convenient to unload |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220808372U true CN220808372U (en) | 2024-04-19 |
Family
ID=90706957
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322395341.0U Active CN220808372U (en) | 2023-09-04 | 2023-09-04 | Semiconductor element packaging mold convenient to unload |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220808372U (en) |
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2023
- 2023-09-04 CN CN202322395341.0U patent/CN220808372U/en active Active
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