CN218083792U

CN218083792U - Setting device for preparing rubber sole material

Info

Publication number: CN218083792U
Application number: CN202222291598.7U
Authority: CN
Inventors: 唐毅
Original assignee: Shangqiu Jingwei Sporting Goods Co ltd
Current assignee: Shangqiu Jingwei Sporting Goods Co ltd
Priority date: 2022-08-30
Filing date: 2022-08-30
Publication date: 2022-12-20
Anticipated expiration: 2032-08-30

Abstract

The utility model discloses a setting device is used in preparation of rubber sole material relates to sole setting device technical field, for solving the rubber sole material among the prior art when preparing, need use setting device to finalize the design to the rubber materials, generally adopts the design mould, and the mould is inside to need heating and cooling, but traditional setting device cooling efficiency is low, the slow problem of shaping speed. The internally mounted of design mould has the semiconductor cooling plate, and the semiconductor cooling plate passes through fastening screw fixed connection with the design mould, the heat dissipation support is installed to the below of semiconductor cooling plate, and just dispels the heat the support and pass through fastening screw fixed connection with the semiconductor cooling plate, the location axle is installed to the top of design mould, and fixes a position the axle and pass through bolt fixed connection with the design mould, sealed lid and location axle sliding connection.

Description

Setting device for preparing rubber sole material

Technical Field

The utility model relates to a sole setting device technical field specifically is a setting device is used in preparation of rubber sole material.

Background

The rubber sole is made of rubber, the rubber sole material can be roughly divided into natural rubber or artificial synthetic rubber, and the sole needs to be stably shaped in the processing process of the rubber sole;

for example, the application publication number is CN213428669U, a shaping device for processing rubber soles comprises a workbench, wherein a sole mold is fixedly connected to the middle part of the workbench, front shoe edge clamping plates are slidably connected to the left side and the right side of the workbench, the front shoe edge clamping plates are positioned on the inner side of the rear part of the workbench, a heel clamping plate is slidably connected to the surface of the workbench, a fixed lantern ring is fixedly connected to the middle part of a pull rod, a pull pipe is sleeved inside the fixed lantern ring, and one end, away from the pull rod, of the pull pipe is coaxially connected with a top block;

above-mentioned rubber sole processing sole setting device has solved traditional setting device and can only carry out the problem of design processing to the sole of fixed dimension shoes size, and the device is easy and simple to handle, has solved that current setting device is fixed comparatively loaded down with trivial details, the inconvenient problem of operation get up for production efficiency promotes greatly, but traditional setting device cooling efficiency is low, the shaping speed is slow, therefore the market is urgently needed to develop a rubber sole material preparation and helps people to solve current problem with setting device.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a setting device is used in rubber sole material preparation to solve the rubber sole material that provides in the above-mentioned background art when preparing, need use setting device to finalize the design to rubber materials, generally adopt design mould, the mould is inside to need heating and cooling, but traditional setting device cooling efficiency is low, the slow problem of shaping speed.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a setting device is used in preparation of rubber sole material, is including design mould and sealed lid, the internally mounted of design mould has the semiconductor cooling plate, and the semiconductor cooling plate passes through fastening screw fixed connection with the design mould, the heat dissipation support is installed to the below of semiconductor cooling plate, and the heat dissipation support passes through fastening screw fixed connection with the semiconductor cooling plate.

Preferably, the positioning shaft is installed above the shaping mold, the positioning shaft is fixedly connected with the shaping mold through a bolt, and the sealing cover is connected with the positioning shaft in a sliding mode.

Preferably, the inside of design mould is provided with mould benevolence, and mould benevolence and design mould set up structure as an organic whole, the internally mounted of design mould has the heating resistor silk, and the heating resistor silk passes through insulating screw fixed connection with the design mould.

Preferably, a heat dissipation bracket is installed below the semiconductor cooling plate, the heat dissipation bracket is fixedly connected with the semiconductor cooling plate through a fastening screw, and a heat dissipation fan is installed on the inner side of the heat dissipation bracket.

Preferably, the surface mounting of semiconductor cooling plate has the heat dissipation blade, and the heat dissipation blade passes through fastening screw fixed connection with the semiconductor cooling plate, the hydraulic ram is installed to the top of sealed lid, and hydraulic ram passes through bolt fixed connection with sealed lid.

Preferably, the mount is installed to the top of sealed lid, and the mount passes through bolt fixed connection with sealed lid, the cylinder is installed to the inboard of mount, and the cylinder passes through bolt fixed connection with the mount, the inside of sealed lid is provided with the pressure disk, the jacking end and the pressure disk of cylinder pass through bolt fixed connection.

Compared with the prior art, the beneficial effects of the utility model are that:

1. the utility model discloses a setting through the semiconductor cooling plate, also called thermoelectric refrigeration piece, be a heat pump, the advantage does not have sliding part, the reliability is high, no refrigerant pollution, utilize semiconductor material's Peltier effect, when the galvanic couple that the direct current was established ties into through two kinds of different semiconductor material, can absorb the heat respectively and emit the heat at the both ends of galvanic couple, can realize refrigerated purpose, thereby also can descend the temperature rapidly under the narrow and small condition in space, the refrigerated efficiency has been improved, make the fashioned speed of rubber shoe substrate preparation faster, the fashioned efficiency is improved.

2. The utility model discloses a through the setting of pressure disk, can extrude the inside rubber shoe substrate of mould benevolence, order about the pressure disk through the cylinder and get into mould benevolence to the size of pressure disk is the same with mould benevolence, thereby carries out abundant extrusion to rubber sole material, makes rubber material more tight real, improves the fashioned quality of rubber sole.

Drawings

FIG. 1 is a front view of a setting device for preparing a rubber sole material according to the present invention;

FIG. 2 is a schematic view of the internal structure of a shaping device for preparing rubber sole materials according to the present invention;

fig. 3 is a front view of the heat dissipation bracket of the present invention.

In the figure: 1. shaping the mold; 2. a sealing cover; 3. positioning the shaft; 4. a fixed mount; 5. a cylinder; 6. a hydraulic ram; 7. pressing a plate; 8. a mold core; 9. heating resistance wires; 10. a semiconductor cooling plate; 11. a heat dissipation bracket; 12. a heat radiation fan; 13. a heat dissipation blade.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1-3, the present invention provides an embodiment: the utility model provides a setting device is used in preparation of rubber sole material, includes design mould 1 and sealed lid 2, and the internally mounted of design mould 1 has semiconductor cooling plate 10, and semiconductor cooling plate 10 passes through fastening screw fixed connection with design mould 1, and heat dissipation support 11 is installed to the below of semiconductor cooling plate 10, and heat dissipation support 11 passes through fastening screw fixed connection with semiconductor cooling plate 10.

Further, location axle 3 is installed to design mould 1's top, and location axle 3 passes through bolt fixed connection with design mould 1, sealed

lid

2 and 3 sliding connection of location axle, and location axle 3 is provided with four, and four location axles 3 can insert the inside of sealed lid 2.

Further, the inside of the setting mold 1 is provided with a mold core 8, the mold core 8 and the setting mold 1 are arranged into an integral structure, the inside of the setting mold 1 is provided with a heating resistance wire 9, the heating resistance wire 9 is fixedly connected with the setting mold 1 through an insulating screw, and the heating resistance wire 9 and the semiconductor cooling plate 10 are both arranged outside the mold core 8.

Further, a heat dissipation bracket 11 is installed below the semiconductor cooling plate 10, the heat dissipation bracket 11 is fixedly connected with the semiconductor cooling plate 10 through a fastening screw, a heat dissipation fan 12 is installed inside the heat dissipation bracket 11, and a motor is installed inside the heat dissipation fan 12 to drive the heat dissipation fan 12 to rotate at a high speed.

Further, the surface mounting of semiconductor cooling plate 10 has heat dissipation blade 13, and heat dissipation blade 13 passes through fastening screw fixed connection with semiconductor cooling plate 10, and hydraulic ram 6 is installed to the top of sealed lid 2, and hydraulic ram 6 passes through bolt fixed connection with sealed lid 2, and hydraulic ram 6 is connected with fixed knot constructs.

Further, mount 4 is installed to the top of sealed lid 2, and mount 4 passes through bolt fixed connection with sealed lid 2, and cylinder 5 is installed to the inboard of mount 4, and cylinder 5 passes through bolt fixed connection with mount 4, and the inside of sealed lid 2 is provided with pressure disk 7, and the jacking end of cylinder 5 passes through bolt fixed connection with pressure disk 7, and pressure disk 7 accords with the size of mould benevolence 8.

The working principle is as follows: during the use, pack rubber sole material into mould benevolence 8 inside, order about sealed lid 2 through hydraulic ram 6 and sink, make sealed lid 2 lid in the top of design mould 1, then heat 8 insides of mould benevolence through heating resistor silk 9, make rubber sole material soften, then start cylinder 5, order about pressure disk 7 through cylinder 5 and sink, extrude rubber sole material, make rubber sole material by extrusion, cool off 8 insides of mould benevolence through semiconductor cooling plate 10 simultaneously, make rubber sole material can solidify fast, thereby improve fashioned efficiency, radiator fan 12 and cooling blade 13 can dispel the heat for semiconductor cooling plate 10.

It is obvious to a person skilled in the art that the invention is not restricted to details of the above-described exemplary embodiments, but that it can be implemented in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. The utility model provides a setting device is used in preparation of rubber sole material, includes design mould (1) and sealed lid (2), its characterized in that: the semiconductor cooling plate fixing device is characterized in that a semiconductor cooling plate (10) is arranged inside the shaping mold (1), the semiconductor cooling plate (10) is fixedly connected with the shaping mold (1) through fastening screws, a heat dissipation support (11) is arranged below the semiconductor cooling plate (10), and the heat dissipation support (11) is fixedly connected with the semiconductor cooling plate (10) through the fastening screws.

2. The setting device for rubber sole material preparation according to claim 1, wherein: the fixing device is characterized in that a positioning shaft (3) is installed above the fixing mold (1), the positioning shaft (3) is fixedly connected with the fixing mold (1) through a bolt, and the sealing cover (2) is connected with the positioning shaft (3) in a sliding mode.

3. The setting device for rubber sole material preparation according to claim 1, wherein: the die comprises a forming die (1), a die core (8) is arranged inside the forming die (1), the die core (8) and the forming die (1) are arranged into an integral structure, a heating resistance wire (9) is arranged inside the forming die (1), and the heating resistance wire (9) is fixedly connected with the forming die (1) through an insulating screw.

4. The setting device for rubber sole material preparation according to claim 1, wherein: a heat dissipation support (11) is installed below the semiconductor cooling plate (10), the heat dissipation support (11) is fixedly connected with the semiconductor cooling plate (10) through fastening screws, and a heat dissipation fan (12) is installed on the inner side of the heat dissipation support (11).

5. The setting device for rubber sole material preparation according to claim 1, wherein: the surface mounting of semiconductor cooling plate (10) has heat dissipation blade (13), and heat dissipation blade (13) and semiconductor cooling plate (10) pass through fastening screw fixed connection, hydraulic ram (6) are installed to the top of sealed lid (2), and hydraulic ram (6) pass through bolt fixed connection with sealed lid (2).

6. The setting device for rubber sole material preparation according to claim 1, wherein: mount (4) are installed to the top of sealed lid (2), and mount (4) pass through bolt fixed connection with sealed lid (2), cylinder (5) are installed to the inboard of mount (4), and cylinder (5) pass through bolt fixed connection with mount (4), the inside of sealed lid (2) is provided with pressure disk (7), the jacking end and the pressure disk (7) of cylinder (5) pass through bolt fixed connection.