CN220776357U

CN220776357U - Domain controller and vehicle

Info

Publication number: CN220776357U
Application number: CN202322378635.2U
Authority: CN
Inventors: 陈锐文; 刘洪亮; 刘松
Original assignee: Haomo Zhixing Technology Co Ltd
Current assignee: Haomo Zhixing Technology Co Ltd
Priority date: 2023-09-01
Filing date: 2023-09-01
Publication date: 2024-04-12
Anticipated expiration: 2033-09-01

Abstract

The application provides a domain controller and a vehicle, wherein the domain controller comprises a bottom shell and a top cover, a first heating element is arranged in an inner cavity of the bottom shell, the top cover is connected to the bottom shell, and a heat dissipation air channel with an air inlet and an air outlet is formed between the top cover and the bottom shell; the air inlet and the air outlet are provided with fan components, the fan components are connected to the bottom shell, a heat dissipation module and a first fin group are arranged in the heat dissipation air duct, and the heat dissipation module and the first fin group are distributed at intervals along the axial direction of the fan components; the heat dissipation module is connected with the bottom shell and is used for conducting heat generated by the first heating element and dissipating the heat; the first fin group is connected to the bottom shell, and the first fin group comprises a plurality of first fins which are distributed at intervals, and the extending direction of each first fin is consistent with the axial direction of the fan assembly. The heat dissipation cost in the domain controller is smaller, and the installation steps of the domain controller on the whole vehicle are simplified.

Description

Domain controller and vehicle

Technical Field

The application relates to the technical field of unmanned vehicles, in particular to a domain controller and a vehicle.

Background

The domain controller (DomainControlUnit, DCU) is generated from the problem that buses become long due to the fact that the number of electronic control units (Electronic Control Unit, ECU) is increased in the vehicle development process, and in order to control the length of the buses, reduce the number of the ECU, or keep the number of the ECU unchanged, lighten the weight of electronic components and reduce the manufacturing cost of the whole vehicle, the dispersed small sensors are integrated to be single sensors with stronger functions, and the dispersed controllers are divided according to the functional domain and integrated to be the domain controller with stronger calculation capability.

Generally, the domain controller includes a housing, a circuit board is disposed in an inner cavity of the housing, and a chip is disposed on the circuit board, so that in order to enable the domain controller to operate normally, heat generated by the domain controller needs to be dissipated, and heat dissipation of some high-power chips, for example, chips with a thermal power of 30 watts to 70 watts, is achieved by adopting a water cooling mode in the related art, and external water cooling devices, for example, a water pump, a water pipe, a valve, a water overflow tank and the like need to be disposed.

However, the heat dissipation mode has higher cost and higher requirement on external water cooling equipment, so that the manufacturing cost of the whole vehicle can be increased; furthermore, the installation of the domain controller may be complicated by the provision of the water cooling apparatus.

Disclosure of Invention

The application provides a domain controller and a vehicle, which can reduce the heat dissipation cost of the domain controller so as to reduce the manufacturing cost of the vehicle; in addition, the installation steps of the domain controller on the whole vehicle can be simplified. The specific technical scheme is as follows:

in one aspect, the application provides a domain controller, which comprises a bottom shell and a top cover, wherein a first heating element is arranged in an inner cavity of the bottom shell, the top cover is connected to the bottom shell, and a heat dissipation air channel with an air inlet and an air outlet is formed between the top cover and the bottom shell; the air inlet and the air outlet are provided with fan components, the fan components are connected to the bottom shell, a heat dissipation module and a first fin group are arranged in the heat dissipation air duct, and the heat dissipation module and the first fin group are distributed at intervals along the axial direction of the fan components; the heat dissipation module is connected with the bottom shell and is used for conducting heat generated by the first heating element and dissipating the heat; the first fin group is connected to the bottom shell, and the first fin group comprises a plurality of first fins which are distributed at intervals, and the extending direction of each first fin is consistent with the axial direction of the fan assembly.

As an alternative embodiment, the bottom shell is provided with a through hole opposite to the first heating element; the heat dissipation module comprises a vacuum cavity vapor chamber and a plurality of second fins which are distributed at intervals, the vacuum cavity vapor chamber is connected with the bottom shell, and one end of the vacuum cavity vapor chamber is positioned in the inner cavity and is abutted against the first heating element; the second fins are arranged at the other end of the vacuum cavity vapor chamber, extend out of the inner cavity through the through holes, and the extending direction of each second fin is consistent with the axial direction of the fan assembly. Therefore, the heat emitted by the first heating element can be rapidly transferred, and the heat dissipation performance of the domain controller provided by the embodiment is good.

As an alternative embodiment, the side of the vacuum chamber vapor chamber facing the first heating element is provided with a first heat conducting element. In this way, the heat generated by the first heating element can be quickly transferred to the vacuum cavity vapor chamber.

As an alternative embodiment, the first heating element is a chip, and the thermal power of the first heating element is 30 to 70 watts.

As an optional implementation manner, a separation fin is arranged between the top cover and the bottom shell, the separation fin separates the heat dissipation air duct into a plurality of sub air ducts, a heat dissipation module and a plurality of first fins are arranged in each sub air duct, and one heat dissipation module corresponds to one first heating element. Therefore, not only can heat generated by each first heating element be rapidly dissipated, but also the way of dividing the radiating air duct into a plurality of sub air ducts through the dividing fins is not only beneficial to radiating, and the plurality of first fins are conveniently arranged and formed.

As an alternative embodiment, the thickness of the second fins is 2 mm to 4 mm, and the outer side of the plurality of second fins is provided with a first sealing ring; the through hole comprises a first hole section and a second hole section which are sequentially communicated, and the aperture of the first hole section is larger than that of the second hole section so as to form a step surface at the joint of the first hole section and the second hole section; the first sealing ring is positioned in the first hole section, one end of the first sealing ring is abutted with the vacuum cavity vapor chamber, and the other end of the first sealing ring is abutted with the step surface. In this way, by setting the first sealing ring, the vibration resistance performance of the second fin and the vacuum cavity vapor chamber can be improved, so that the second fin is prevented from being broken, and the normal use of the domain controller provided by the embodiment is prevented from being influenced; in addition, through the setting of first sealing washer, can also avoid dust etc. to get into in the inner chamber 11 through the through-hole, promote the performance of the domain controller that this embodiment provided.

As an alternative embodiment, the wall of the first bore section has a gap with the outer circumference of the first sealing ring. Therefore, when the upper heat dissipation module and the bottom shell are in relative motion, kinetic energy can be converted into elastic potential energy of the first sealing ring, so that the first sealing ring is elastically deformed in the radial direction of the first sealing ring, vibration is reduced, and breakage of the second fins is avoided to a certain extent.

As an alternative embodiment, the bottom shell comprises an upper shell, a lower shell and a second sealing ring, wherein the upper shell is positioned on one side of the lower shell, which is close to the top cover, the upper shell and the lower shell are buckled to form an inner cavity, and the second sealing ring is arranged between the upper shell and the lower shell; the fan assembly and the first fin group are connected to the upper shell, and the first fin group and the upper shell are of an integrated structure. In this way, through the arrangement of the second sealing ring, dust and the like can be prevented from entering the inner cavity through the gap between the upper shell and the lower shell, and the usability of the domain controller provided by the embodiment can be further improved; in addition, through integrated into one piece's mode shaping a plurality of first fins on the casing, not only can promote the shaping convenience of first fin, can simplify the shaping technology of first fin moreover for the manufacturing cost of epitheca and a plurality of first fins is lower.

As an alternative embodiment, the domain controller provided herein further includes a second heating element positioned within the inner cavity, the second heating element having a thermal power less than the thermal power of the first heating element; the upper shell is provided with a protruding part protruding towards the second heating element, and the second heating element is abutted against the protruding part. In this way, a rapid heat dissipation of the second heating element can be achieved.

As an alternative embodiment, the side of the projection facing the second heating element is provided with a second heat conducting element. Thus, by arranging the second heat conducting member, heat generated by the second heating element can be rapidly dissipated.

As an alternative embodiment, the upper shell is further provided with a second fin set, the second fin set is located between the upper shell and the top cover, and the second fin set is located beside the first fin set. In this way, through the arrangement of the second fin group, the heat generated by each heating element in the domain controller provided by the embodiment can be rapidly dissipated, so that the heat dissipation performance of the domain controller provided by the embodiment is better.

In another aspect, the present application provides a vehicle including a vehicle body and the domain controller described above, the domain controller being disposed on the vehicle body.

In the domain controller and the vehicle provided by the application, the domain controller comprises a bottom shell and a top cover, a first heating element is arranged in an inner cavity of the bottom shell, the top cover is connected to the bottom shell, and a heat dissipation air channel with an air inlet and an air outlet is formed between the top cover and the bottom shell; the air inlet and the air outlet are provided with fan components, the fan components are connected to the bottom shell, a heat dissipation module and a first fin group are arranged in the heat dissipation air duct, and the heat dissipation module and the first fin group are distributed at intervals along the axial direction of the fan components; the heat dissipation module is connected with the bottom shell and is used for conducting heat generated by the first heating element and dissipating the heat; the first fin group is connected to the bottom shell, and the first fin group comprises a plurality of first fins which are distributed at intervals, and the extending direction of each first fin is consistent with the axial direction of the fan assembly. In the domain controller provided by the application, in the heat dissipation process, the heat generated by the first heating element is transferred out through the heat dissipation module, the heat generated by other heating elements positioned in the inner cavity is transferred out through the first fin group, and then the heat is pumped away from the heat dissipation module and the first fin component under the action of the fan component, namely, the heat dissipation mode in the domain controller provided by the application is a mode of combining the heat dissipation module with a plurality of first fins and the fan component, and compared with the water-cooled heat dissipation mode in the related art, external water cooling equipment is not needed, so that the heat dissipation cost of the domain controller provided by the application is lower, and the manufacturing cost of the domain controller provided by the application is lower, so that the manufacturing cost of a vehicle provided by the application is lower; in addition, the heat dissipation module, the plurality of first fins and the fan assembly are combined to dissipate heat, so that the heat dissipation effect is good, and the service performance of the domain controller provided by the application can be improved; moreover, the domain controller provided by the application does not depend on water cooling equipment, so that the installation steps of the domain controller on a vehicle can be simplified.

Drawings

Fig. 1 is a schematic perspective view of a domain controller according to the present embodiment;

FIG. 2 is a schematic perspective view of FIG. 1 from another perspective;

FIG. 3 is an exploded view of the domain controller provided in this embodiment;

fig. 4 is a schematic structural diagram of a local structure of a domain controller according to the present embodiment;

FIG. 5 is a cross-sectional view taken along line A-A of FIG. 4;

FIG. 6 is an enlarged schematic view of a partial structure at B in FIG. 5;

fig. 7 is a schematic perspective view of a heat dissipation module in a domain controller according to the present embodiment;

fig. 8 is a schematic perspective view of an upper case in the domain controller according to the present embodiment;

fig. 9 is a schematic heat dissipation diagram of a vacuum chamber vapor chamber in the domain controller according to the present embodiment;

fig. 10 is a schematic perspective view of an upper case of the domain controller according to the present embodiment at another view angle.

Reference numerals illustrate:

1. a bottom case; 2. a top cover; 3. a first heating element; 4. a sub-air duct; 5. a fan assembly; 6. a heat dissipation module; 7. a first fin; 8. a circuit board; 9. a first heat conductive member;

10. a domain controller; 11. an inner cavity; 12. an upper case; 13. a lower case; 14. a first connection post; 15. a fan base; 16. a second connection post; 17. positioning columns; 18. a third connecting column; 19. a protruding portion; 21. a buckle cover part; 22. an extension; 51. a blower; 52. a bracket; 61. a vacuum chamber vapor chamber; 62. a second fin; 20. a third fin; 30. a first seal ring; 40. a second seal ring; 50. a separation fin;

121. A through hole; 141. a second connection hole; 161. a fourth connection hole; 211. a top plate; 212. a side plate; 221. a first connection hole; 222. positioning the notch; 521. a main body portion; 522. a connection part; 611. a fifth connection hole; 612. copper plate; 613. a vacuum chamber; 614. a capillary structure; 615. copper columns;

1211. a first bore section; 1212. a second bore section; 1213. a step surface; 5211. a support plate; 5212. coaming plate; 5221. and a third connection hole.

Detailed Description

The technical solutions in the present application will be clearly and thoroughly described below with reference to the accompanying drawings. Wherein, in the description of the present application, "/" means or, unless otherwise indicated, for example, a/B may represent a or B: the text "and/or" is merely an association relation describing the associated object, and indicates that three relations may exist, for example, a and/or B may indicate: the three cases where a exists alone, a and B exist together, and B exists alone, and in addition, in the description of the present application, "plural" means two or more than two.

The terms "first," "second," and the like, are used below for descriptive purposes only and are not to be construed as implying or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature.

"domain" refers to decomposing the vehicle electronic system into several functional blocks according to the functions, the domain controller mainly builds the system architecture inside different functional blocks, and utilizes the multi-core central processing unit (Central Processing Unit, CPU) or graphic processing unit (graphics processing unit, GPU) chip with stronger processing capability to relatively intensively control each domain to replace the distributed electronic and electric architecture in the current vehicle. The interconnection of the systems within each domain CAN use a controller area network (controller areanetwork, CAN) and FlexRay communication bus. Communication between different domains requires that the ethernet with higher transmission performance be used as a backbone network to carry out information exchange tasks.

The domain controller is central in domain-centralized vehicle architecture design, requiring high computing power, high real-time performance, and a large number of communication peripherals. Because the hardware computing capability of the domain controller is strong, the domain controller has rich software interface support, so that a plurality of core function modules are concentrated in the domain controller, the system function integration level is improved to a great extent, and the hardware requirements of function perception and execution are reduced. With the standardization of the interface of data interaction, the parts become standard parts, thereby reducing the development or manufacturing cost of the parts.

For the specific division of the functional domain, different vehicle brands can have own design concepts, for example, the domain can be divided into: power domain, chassis domain, cabin domain, autopilot domain, body domain; it can also be divided into: an autopilot domain, an intelligent cockpit domain, and a body control domain.

Generally, the domain controller includes a housing, a circuit board is disposed in an inner cavity of the housing, and a chip is disposed on the circuit board, so that in order to enable the domain controller to operate normally, heat generated by the domain controller needs to be dissipated, and heat dissipation of some high-power chips, for example, chips with a thermal power of 30 watts to 70 watts, is achieved by adopting a water cooling mode in the related art, and external water cooling devices, for example, a water pump, a water pipe, a valve, a water overflow tank and the like need to be disposed. However, the heat dissipation method has higher cost and higher requirement on external water cooling equipment, so that the manufacturing cost of the whole vehicle can be increased.

Therefore, the present embodiment provides a domain controller and a vehicle, where the domain controller provided by the present embodiment includes a bottom shell and a top cover, a first heating element is disposed in an inner cavity of the bottom shell, the top cover is connected to the bottom shell, and a heat dissipation air channel having an air inlet and an air outlet is formed between the top cover and the bottom shell; the air inlet and the air outlet are provided with fan components, the fan components are connected to the bottom shell, a heat dissipation module and a first fin group are arranged in the heat dissipation air duct, and the heat dissipation module and the first fin group are distributed at intervals along the axial direction of the fan components; the heat dissipation module is connected with the bottom shell and is used for conducting heat generated by the first heating element and dissipating the heat; the first fin group is connected to the bottom shell, and the first fin group comprises a plurality of first fins which are distributed at intervals, and the extending direction of each first fin is consistent with the axial direction of the fan assembly. In the domain controller provided by the embodiment, in the heat dissipation process, the heat generated by the first heating element is transferred out through the heat dissipation module, the heat generated by other heating elements in the inner cavity is transferred out through the first fin group, and then the heat is pumped away from the heat dissipation module and the first fin component under the action of the fan component, namely, the heat dissipation mode in the domain controller provided by the embodiment is a mode of combining the heat dissipation module, a plurality of first fins and the fan component, and compared with the water-cooled heat dissipation mode in the related art, no external water cooling equipment is needed, so that the heat dissipation cost of the domain controller provided by the embodiment is lower, and the manufacturing cost of the domain controller provided by the embodiment is lower, so that the manufacturing cost of the vehicle provided by the embodiment is lower; in addition, through the mode that combines heat dissipation module, a plurality of first fin and fan unit together dispels the heat, the radiating effect is also better, can promote the performance of domain controller that this embodiment provided.

It should be noted that the vehicle provided in this embodiment includes, but is not limited to, an unmanned vehicle. Here, the type of vehicle provided in the present embodiment is not limited.

The present embodiment will be described in detail below with reference to the accompanying drawings and detailed description.

Referring to fig. 1 to 5, fig. 1 is a schematic perspective view of a domain controller according to the present embodiment, fig. 2 is a schematic perspective view of the domain controller according to another view of fig. 1, fig. 3 is an exploded view of the domain controller according to the present embodiment, fig. 4 is a schematic structural view of a partial structure of the domain controller according to the present embodiment, and fig. 5 is a cross-sectional view of fig. 4 along A-A direction. The present embodiment provides a domain controller 10, which includes a bottom shell 1 and a top cover 2, wherein a first heating element 3 is provided in an inner cavity 11 of the bottom shell 1, the top cover 2 is connected to the bottom shell 1, and a heat dissipation air channel having an air inlet and an air outlet is formed between the top cover 2 and the bottom shell 1; the air inlet and the air outlet are provided with a fan assembly 5, the fan assembly 5 is connected with the bottom shell 1, a heat dissipation module 6 and a first fin group are arranged in a heat dissipation air duct, and the heat dissipation module 6 and the first fin group are distributed at intervals along the axial direction of the fan assembly 5; the heat dissipation module 6 is connected to the bottom shell 1, and the heat dissipation module 6 is used for conducting heat generated by the first heating element 3 and dissipating the heat; the first fin group is connected to the bottom shell 1, and the first fin group comprises a plurality of first fins 7 distributed at intervals, and the extending direction of each first fin 7 is consistent with the axial direction of the fan assembly 5. In the domain controller 10 provided in this embodiment, during the heat dissipation process, the heat generated by the first heating element 3 is transferred out through the heat dissipation module 6, the heat generated by other heating elements located in the inner cavity 11 is transferred out through the first fin group, and then the heat is pumped out from the heat dissipation module 6 and the first fin group under the action of the fan assembly 5, that is, the heat dissipation mode in the domain controller 10 provided in this embodiment is the mode of combining the heat dissipation module 6, the plurality of first fins 7 and the fan assembly 5, compared with the water-cooled heat dissipation mode in the related art, no external water cooling device is needed, so that the heat dissipation cost of the domain controller 10 provided in this embodiment is lower, and further the manufacturing cost of the domain controller 10 provided in this embodiment is lower, so that the manufacturing cost of the vehicle provided in this embodiment is lower; in addition, the heat dissipation module 6, the plurality of first fins 7 and the fan assembly 5 are combined to dissipate heat, so that the heat dissipation effect is good, and the usability of the domain controller 10 provided by the embodiment can be improved; furthermore, the domain controller 10 provided in the present embodiment does not rely on water cooling equipment, so that the steps of installing the domain controller 10 on a vehicle can be simplified.

A Printed circuit board (Printed CircuitBoard, PCB) 8 is also provided in the cavity 11, and the first heating element 3 is disposed on the PCB.

The bottom case 1 is die-cast from an aluminum alloy, and in some other embodiments, the bottom case 1 may be made from other materials. Here, the material of the bottom chassis 1 is not limited.

Specifically, the bottom shell 1 may include an upper shell 12 and a lower shell 13 that are fastened together, the upper shell 12 is located on a side of the lower shell 13 near the top cover 2, the upper shell 12 and the lower shell 13 are fastened to form an inner cavity 11, and the fan assembly 5 and the plurality of first fins 7 are connected to the upper shell 12.

In some embodiments, the end of the side of the first fin 7 facing the heat dissipation module 6 facing away from the upper case 12 has a rounded structure, so that when the air flow passes through, a vortex phenomenon can be avoided to some extent, and noise can be reduced. Here, the shape of the first fin 7 is not limited.

In order to facilitate the arrangement of the first heating element 3 and the circuit board 8 in the inner cavity 11, the upper shell 12 and the lower shell 13 may be detachably connected, for example, by a threaded fastener; in other embodiments, the upper and lower shells 12 and 13 may be connected in other ways. Here, the connection manner between the upper case 12 and the lower case 13 is not particularly limited.

Further, in order to form a heat dissipation air channel between the top cover 2 and the bottom shell 1, in some specific embodiments, the top cover 2 includes a cover portion 21 for forming the heat dissipation air channel and two extension portions 22 for connecting with the upper shell 12, wherein the cover portion 21 includes a top plate 211 and two side plates 212, the top plate 211 is opposite to the upper shell 12, the two side plates 212 are respectively arranged at opposite ends of the top plate 211 so as to form an air inlet and an air outlet which are relatively distributed with the upper shell 12, and the distribution direction of the air inlet and the air outlet is perpendicular to the distribution direction of the two side plates 212; the two extending portions 22 are disposed corresponding to the two side plates 212, one side plate 212 corresponds to one extending portion 22, one end of the extending portion 22 is connected to the corresponding side plate 212, the other end of the extending portion 22 extends along the extending direction of the upper shell 12 toward a direction away from the other extending portion 22, and the extending portion 22 can be detachably connected to the upper shell 12 through a threaded fastener.

In order to realize the detachable connection between the extension portion 22 and the upper case 12, a first connection post 14 may be disposed on a side of the upper case 12 facing the extension portion 22, a first connection hole 221 may be formed on the extension portion 22, a second connection hole 141 may be formed on the first connection post 14, and the extension portion 22 and the upper case 12 may be detachably connected together by sequentially penetrating through the first connection hole 221 and the second connection hole 141 through a threaded fastener such as a screw, so as to realize the detachable connection between the top cover 2 and the bottom case 1.

In some alternative embodiments, in order to facilitate the installation of the top cover 2 on the bottom case 1, a positioning structure may be disposed between the top cover 2 and the bottom case 1, and the relative position between the top cover 2 and the bottom case 1 may be limited by the positioning structure, so as to improve the connection efficiency between the top cover 2 and the bottom case 1.

Specifically, the extending portion 22 may be provided with a positioning notch 222, and correspondingly, a side of the bottom shell 1 facing the extending portion 22 may be provided with a positioning post 17, where the positioning post 17 can extend into the positioning notch 222. Thus, when the top cover 2 is connected to the bottom case 1, the positioning column 17 and the positioning notch 222 are aligned, and then the top cover 2 is moved along the axial direction of the positioning column 17 so that the positioning column 17 extends into the positioning notch 222, after the positioning column 17 is matched with the positioning notch 222, the first connecting hole 221 and the second connecting hole 141 can be aligned, and at this time, the top cover 2 and the bottom case 1 can be detachably connected together by sequentially passing through the first connecting hole 221 and the second connecting hole 141 through a threaded fastener such as a screw.

It should be noted that other detachable connection manners may be adopted between the top cover 2 and the bottom shell 1, and other positioning structures may be further arranged between the extension portion 22 and the top cover 2. Here, the connection between the top cover 2 and the bottom case 1 and the positioning structure provided between the extension 22 and the top cover 2 are not particularly limited.

Further, in some specific embodiments, the fan assembly 5 may include a fan 51 and a bracket 52 connected to the fan 51, and in order to facilitate the installation of the fan assembly 5, the bracket 52 includes a main body 521 and two connection portions 522, the main body 521 includes two support plates 5211 and a shroud 5212 connected between the two support plates 5211, a receiving space for accommodating the fan 51 is formed between the shroud 5212 and the two support plates 5211, and the fan 51 may be detachably connected to the main body 521 by a threaded fastener such as a screw; the two connecting portions 522 are disposed in one-to-one correspondence with the two support plates 5211, and the connecting portions 522 are connected to the outer sides of the support plates 5211, and the connecting portions 522 are plate-shaped members and detachably connected to the upper case 12 by threaded fasteners such as screws.

Further, in order to realize the detachable connection between the connection portion 522 and the upper case 12, a fan seat 15 is disposed on a side of the upper case 12 facing the top cover 2, the fan 51 is located between the main body portion 521 and the fan seat 15, a second connection post 16 is disposed on the fan seat 15, each connection portion 522 is connected to two second connection posts 16, specifically, a third connection hole 5221 is formed on the connection portion 522, a fourth connection hole 161 is formed on the second connection post 16, and a screw or other threaded fastener can sequentially pass through the third connection hole 5221 and the fourth connection hole 161 to detachably connect the connection portion 522 with the upper case 12, so as to detachably connect the bracket 52 with the upper case 12.

In order to reduce the manufacturing cost of the upper shell 12 and facilitate the arrangement of the first fin group, in some embodiments, the first fin group is formed integrally with the upper shell 12, that is, the plurality of first fins 7 are formed integrally with the upper shell 12. In this way, by forming the plurality of first fins 7 on the upper case 12 in an integrally formed manner, not only can the convenience of forming the first fins 7 be improved, but also the process of forming the first fins 7 can be simplified, so that the manufacturing cost of the upper case 12 and the plurality of first fins 7 is low.

With continued reference to fig. 6 to 8, fig. 6 is an enlarged schematic view of a partial structure at B in fig. 5, fig. 7 is a schematic view of a three-dimensional structure of a heat dissipation module in a domain controller according to the present embodiment, and fig. 8 is a schematic view of a three-dimensional structure of an upper case in the domain controller according to the present embodiment. In order to enable the heat dissipation module 6 to transfer out the heat generated by the first heating element 3, in some embodiments, the bottom case 1 has a through hole 121 facing the first heating element 3; the heat dissipation module 6 comprises a vacuum cavity Vapor Chamber 61 (VC) and a plurality of second fins 62 which are distributed at intervals, the vacuum cavity Vapor Chamber 61 is connected with the bottom shell 1, and one end of the vacuum cavity Vapor Chamber 61 is positioned in the inner cavity 11 and is abutted against the first heating element 3; the plurality of second fins 62 are provided on the other end of the vacuum chamber soaking plate 61, and protrude out of the inner chamber 11 through the through holes 121, and the extending direction of each second fin 62 coincides with the axial direction of the fan assembly 5. In this way, the heat emitted by the first heating element 3 can be rapidly transferred, so that the heat dissipation performance of the domain controller 10 provided by the embodiment is better.

In order to reduce the manufacturing cost of the domain controller 10 provided in this embodiment, the first heating element 3 is a chip, and the thermal power of the first heating element 3 is 30 to 70 watts, that is, in this embodiment, the heat dissipation module 6 only dissipates heat of the electrical components with high thermal power, and for other electrical components with smaller thermal power, the heat dissipation is directly performed through the first fin 7 located on the upper case 12. In this way, the electric components with high thermal power can radiate heat in a high-cost radiating manner, and the electric components with low thermal power radiate heat in a low-cost radiating manner, so that the radiating cost is lower, and the manufacturing cost of the domain controller 10 provided by the embodiment can be reduced.

Wherein the thermal power of the first heating element 3 may be 30 watts, 35 watts, 40 watts, 45 watts, 50 watts, 55 watts, 60 watts, 65 watts, 70 watts, etc. Here, the thermal power of the first heating element 3 is not particularly limited.

Thermal power refers to power lost to heat generation in a circuit, and is determined by the product of the square of the current intensity through the conductor and the resistance of the conductor.

In some alternative embodiments, the vacuum chamber vapor chamber 61 and the upper shell 12 may be detachably connected by using fasteners such as screws, specifically, a fifth connection hole 611 may be provided on the vacuum chamber vapor chamber 61, a third connection post 18 protruding toward the top cover 2 may be provided on the upper shell 12, a sixth connection hole (not shown in the drawing) is provided on the third connection post 18, and the fasteners sequentially pass through the fifth connection hole 611 and the sixth connection hole to connect the vacuum chamber vapor chamber 61 and the upper shell 12 together, so as to connect the heat dissipation module 6 to the upper shell 12.

In order to enable the heat generated by the first heating element 3 to be quickly transferred to the vacuum chamber vapor chamber 61, in some embodiments, a first heat conducting member 9 may be disposed on a side of the vacuum chamber vapor chamber 61 facing the first heating element 3, and by disposing the first heat conducting member 9, the heat generated by the first heating element 3 can be quickly transferred to the vacuum chamber vapor chamber 61, and then transferred to the outside by the vacuum chamber vapor chamber 61.

The first heat conductive member 9 may be a heat conductive pad, for example, a heat conductive gel or the like. Here, the first heat conductive member 9 described above is not particularly limited.

With continued reference to fig. 9, fig. 9 is a schematic heat dissipation diagram of a vacuum chamber vapor chamber in the domain controller according to the present embodiment. The direction of the dot-dash line arrow is the heat absorption direction of the heat source surface, the direction of the dotted line arrow is the back flow direction of the liquid working medium, the direction of the solid line arrow is the flow direction of the vapor, and the direction of the double-dot-dash line arrow is the heat dissipation direction of the heat dissipation surface.

Note that, in the present embodiment, the material of the vacuum chamber vapor chamber 61 is C1020 oxygen-free copper, wherein "C1020" is the brand of oxygen-free copper. In some other embodiments, the vacuum chamber vapor chamber 61 may be made of other materials, which is not limited herein.

Specifically, the vacuum chamber vapor chamber 61 is formed by welding two layers of copper plates 612, and a vacuum chamber 613 is formed therein, the inner wall of the vacuum chamber 613 has a capillary structure 614, and a plurality of copper columns 615 are disposed in the vacuum chamber 613 to provide support, wherein pure water is usually used as a working fluid in the vacuum chamber 613, and the capillary structure 614 is made by a copper powder sintering or combined copper mesh microstructure process.

In the heat dissipation process of the vacuum chamber vapor chamber 61, when heat is conducted from the heat source surface to the evaporation region, the cooling liquid in the vacuum chamber 613 begins to generate evaporation phenomenon after being heated in the environment with low vacuum degree, at this time, the volume of the cooling liquid expands rapidly after absorbing heat energy, so that the cooling liquid is converted into gas, and then the gaseous working fluid can fill the whole vacuum chamber 613 quickly; condensation occurs when the gaseous working fluid contacts the condensation zone, by which heat accumulated during evaporation is released, and the condensed liquid working fluid returns to the evaporation heat source again by capillary action of the capillary structure 614, and the whole process is continued and repeated.

In this embodiment, when the temperature of the first heating element 3 increases to 80 ℃ or higher, the heat source surface of the vacuum chamber vapor chamber 61 starts to generate a phase transition phenomenon, and at this time, the vacuum chamber vapor chamber 61 exhibits a high-efficiency heat conduction performance, the heat conduction capacity of which is about 1000 times that of pure copper, and 99% of heat is rapidly conducted from the heat source surface to the heat radiation surface of the vacuum chamber vapor chamber 61.

In some embodiments, since there is more than one first heating element 3 with high heat power, in order to enable heat of each first heating element 3 to be rapidly dissipated, in some embodiments, a separation fin 50 is disposed between the top cover 2 and the bottom case 1, the separation fin 50 separates the heat dissipation duct into a plurality of sub-ducts 4, and a heat dissipation module 6 and a plurality of first fins 7 are disposed in each sub-duct 4, and a heat dissipation module 6 corresponds to one first heating element 3. In this way, not only the heat generated by each first heat generating element 3 can be rapidly dissipated, but also the heat dissipation is facilitated by dividing the heat dissipation duct into the plurality of sub-ducts 4 by the dividing fins 50, and the plurality of first fins 7 are conveniently arranged and shaped.

The above-described partition fins 50 are provided on the upper case 12 and are integrally formed with the upper case 12. Here, the connection manner between the separation fins 50 and the upper case 12 is not particularly limited.

In order to accelerate the flow of the air, in some embodiments, in each sub-air duct 4, the width of the air duct at the heat dissipation module 6 is larger than the width of the air duct at the first fin group, so that the air duct at the heat dissipation module 6 is horn-shaped compared with the air duct at the first fin group, and the air flow can quickly flow to the heat dissipation module 6 to dissipate the heat of the first heating element 3 with higher heat power.

It will be appreciated that it is difficult to have the heat dissipating module 6 and the first fin group described above cover all the heat generating elements in the cavity 11 during the actual design process. Therefore, in order to enable the heat generated by the heating element in the inner cavity 11 to be rapidly dissipated, in some embodiments, a second fin set is further disposed on the upper shell 12, the second fin set is located between the upper shell 12 and the top cover 2, and the second fin set is located beside the first fin set, specifically, the second fin set includes a plurality of third fins 20 distributed at intervals, and an extending direction of the third fins 20 is consistent with an axial direction of the fan assembly 5. In this way, by the arrangement of the second fin group, the heat generated by each heating element in the domain controller 10 provided in the present embodiment can be rapidly dissipated, so that the heat dissipation performance of the domain controller 10 provided in the present embodiment is better.

Wherein the third fin 20 is integrally formed with the upper shell 12. Here, the connection manner between the third fin 20 and the upper case 12 is not particularly limited.

In the present embodiment, the thickness of the second fin 62 is 2 mm to 4 mm, and the thickness of the second fin 62 is generally 3.5 mm, so that the domain controller 10 provided in the present embodiment can pass the vibration resistance test of the vehicle to adapt to the vehicle gauge due to the thinner thickness of the second fin 62.

As an alternative embodiment, the first seal ring 30 may be hooped outside the plurality of second fins 62; the through hole 121 comprises a first hole section 1211 and a second hole section 1212 which are communicated in sequence, wherein the aperture of the first hole section 1211 is larger than that of the second hole section 1212, so that a step surface 1213 is formed at the joint of the first hole section 1211 and the second hole section 1212; the first seal ring 30 is located in the first hole section 1211, and one end of the first seal ring 30 abuts against the vacuum chamber vapor chamber 61, and the other end of the first seal ring 30 abuts against the step surface 1213. In this way, by setting the first sealing ring 30, the vibration resistance performance of the second fin 62 and the vacuum chamber vapor chamber 61 can be improved, so as to avoid the second fin 62 from breaking, which affects the normal use of the domain controller 10 provided in the present embodiment; in addition, through the arrangement of the first sealing ring 30, dust and the like can be prevented from entering the inner cavity 11 through the through hole 121, and the usability of the domain controller 10 provided by the embodiment is improved.

The first seal ring 30 may be made of an elastic material such as rubber. Here, the material of the first seal ring 30 is not particularly limited.

In vibration-proof testing of a vehicle, relative movement between the heat dissipating module 6 and the bottom case 1 may occur, in order to allow sufficient deformation of the first gasket 30, in some embodiments, a gap is provided between the wall of the first bore section 1211 and the outer periphery of the first gasket 30. In this way, when the upper heat dissipation module 6 and the bottom shell 1 perform relative movement, kinetic energy can be converted into elastic potential energy of the first sealing ring 30, so that the first sealing ring 30 elastically deforms in the radial direction of the first sealing ring 30, vibration is reduced, and breakage of the second fins 62 is avoided to a certain extent.

Since the heat dissipation of the first heating element 3 is achieved by the heat dissipation module 6, and the heat dissipation of the other heating elements is achieved by the first fin 7 and the third fin 20, specifically, the domain controller 10 provided in this embodiment further includes a second heating element (not shown in the figure) located in the inner cavity 11, where the thermal power of the second heating element is smaller than that of the first heating element 3.

With continued reference to fig. 10, fig. 10 is a schematic perspective view of the upper shell of the domain controller according to the present embodiment at another view angle. In order to enable the heat generated by the second heat generating element to be transferred to the first fin 7 and the third fin 20 on the upper case 12, in some embodiments, the upper case 12 has a protrusion 19 protruding toward the second heat generating element, and the second heat generating element abuts against the protrusion 19. In this way, the heat generated by the second heat generating element can be quickly transferred to the first fin 7 or the third fin 20.

In order to quickly dissipate the heat generated by the second heating element, in some embodiments, a second heat conducting member, such as a heat conducting pad, may be disposed on a side of the protruding portion 19 facing the second heating element, and reference may be made to the first heat conducting member 9 described above. Thus, by arranging the second heat conducting member, heat generated by the second heating element can be rapidly dissipated.

In some embodiments, in order to further improve the sealing performance of the bottom case 1, a second sealing ring 40 may be disposed between the upper case 12 and the lower case 13. In this way, by the arrangement of the second sealing ring 40, dust and the like can be prevented from entering the inner cavity 11 through the gap between the upper shell 12 and the lower shell 13, and the usability of the domain controller 10 provided in the embodiment can be further improved.

The material of the second sealing ring 40 may be the same as that of the first sealing ring 30. Here, the material of the second seal ring 40 is not particularly limited.

The second sealing ring 40 may be pressed between the upper case 12 and the lower case 13, or grooves into which the second sealing ring 40 is inserted may be provided on the upper case 12 and the lower case 13, respectively. Here, the connection between the second seal ring 40 and the bottom case 1 is not particularly limited.

The domain controller provided by the embodiment comprises a bottom shell and a top cover, wherein a first heating element is arranged in an inner cavity of the bottom shell, the top cover is connected to the bottom shell, and a heat dissipation air channel with an air inlet and an air outlet is formed between the top cover and the bottom shell; the air inlet and the air outlet are provided with fan components, the fan components are connected to the bottom shell, a heat dissipation module and a first fin group are arranged in the heat dissipation air duct, and the heat dissipation module and the first fin group are distributed at intervals along the axial direction of the fan components; the heat dissipation module is connected with the bottom shell and is used for conducting heat generated by the first heating element and dissipating the heat; the first fin group is connected to the bottom shell, and the first fin group comprises a plurality of first fins which are distributed at intervals, and the extending direction of each first fin is consistent with the axial direction of the fan assembly. In the domain controller provided by the embodiment, in the heat dissipation process, the heat generated by the first heating element is transferred out through the heat dissipation module, the heat generated by other heating elements in the inner cavity is transferred out through the first fin group, and then the heat is pumped away from the heat dissipation module and the first fin component under the action of the fan component, namely, the heat dissipation mode in the domain controller provided by the embodiment is a mode of combining the heat dissipation module, a plurality of first fins and the fan component, and compared with the water-cooled heat dissipation mode in the related art, no external water cooling equipment is needed, so that the heat dissipation cost of the domain controller provided by the embodiment is lower, and the manufacturing cost of the domain controller provided by the embodiment is lower, so that the manufacturing cost of the vehicle provided by the embodiment is lower; in addition, the heat dissipation module, the plurality of first fins and the fan assembly are combined to dissipate heat, so that the heat dissipation effect is good, and the usability of the domain controller provided by the embodiment can be improved; moreover, the domain controller provided by the embodiment does not depend on water cooling equipment, so that the installation steps of the domain controller on a vehicle can be simplified.

The present embodiment also provides a vehicle including a vehicle body and the domain controller 10 in the above embodiment, the domain controller 10 being provided on the vehicle body. The structure of the domain controller 10 is described in detail in the above embodiments, and will not be described herein.

It should be noted that, the vehicle provided in this embodiment should further include other modules or components that enable the vehicle to operate normally, and no limitation is imposed on the other modules or components.

The vehicle provided by the embodiment comprises a vehicle body and a domain controller, wherein the domain controller comprises a bottom shell and a top cover, a first heating element is arranged in an inner cavity of the bottom shell, the top cover is connected to the bottom shell, and a heat dissipation air channel with an air inlet and an air outlet is formed between the top cover and the bottom shell; the air inlet and the air outlet are provided with fan components, the fan components are connected to the bottom shell, a heat dissipation module and a first fin group are arranged in the heat dissipation air duct, and the heat dissipation module and the first fin group are distributed at intervals along the axial direction of the fan components; the heat dissipation module is connected with the bottom shell and is used for conducting heat generated by the first heating element and dissipating the heat; the first fin group is connected to the bottom shell, and the first fin group comprises a plurality of first fins which are distributed at intervals, and the extending direction of each first fin is consistent with the axial direction of the fan assembly. In this embodiment, during the heat dissipation process, the heat generated by the first heating element is transferred out through the heat dissipation module, the heat generated by other heating elements located in the inner cavity is transferred out through the first fin group, and then the heat is pumped away from the heat dissipation module and the first fin component under the action of the fan component, that is, the heat dissipation mode in the domain controller provided by this embodiment is a mode of combining the heat dissipation module, a plurality of first fins and the fan component, and compared with the water-cooled heat dissipation mode in the related art, no external water cooling device is required, so that the heat dissipation cost of the domain controller provided by this embodiment is lower, and further the manufacturing cost of the domain controller provided by this embodiment is lower, so that the manufacturing cost of the vehicle provided by this embodiment is lower; in addition, the heat dissipation module, the plurality of first fins and the fan assembly are combined to dissipate heat, so that the heat dissipation effect is good, the service performance of the domain controller can be improved, and the service performance of the vehicle provided by the embodiment is further improved; moreover, the domain controller in the embodiment does not depend on the water cooling equipment, so that the installation steps of the domain controller on the vehicle can be simplified, and the overall assembly efficiency of the vehicle can be improved.

The foregoing is merely specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present application, and the changes and substitutions are intended to be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. The domain controller is characterized by comprising a bottom shell and a top cover, wherein a first heating element is arranged in an inner cavity of the bottom shell, the top cover is connected to the bottom shell, and a heat dissipation air channel with an air inlet and an air outlet is formed between the top cover and the bottom shell;

the air inlet and the air outlet are provided with a fan assembly, the fan assembly is connected to the bottom shell, a heat dissipation module and a first fin group are arranged in the heat dissipation air duct, and the heat dissipation module and the first fin group are distributed at intervals along the axial direction of the fan assembly;

the heat dissipation module is connected to the bottom shell and is used for conducting heat generated by the first heating element and dissipating the heat;

the first fin group is connected to the bottom shell, and the first fin group comprises a plurality of first fins which are distributed at intervals, and the extending direction of each first fin is consistent with the axial direction of the fan assembly.

2. The domain controller according to claim 1, wherein the bottom case has a through hole facing the first heating element;

the heat dissipation module comprises a vacuum cavity vapor chamber and a plurality of second fins which are distributed at intervals, the vacuum cavity vapor chamber is connected with the bottom shell, and one end of the vacuum cavity vapor chamber is positioned in the inner cavity and is abutted against the first heating element;

the second fins are arranged on the other end of the vacuum cavity vapor chamber, extend out of the inner cavity through the through holes, and the extending direction of each second fin is consistent with the axial direction of the fan assembly.

3. A domain controller according to claim 2, characterized in that the side of the vacuum chamber soaking plate facing the first heating element is provided with a first heat conducting member.

4. A domain controller according to any one of claims 1 to 3, wherein the first heating element is a chip and the thermal power of the first heating element is 30 to 70 watts; and/or the number of the groups of groups,

the heat dissipation device comprises a top cover, a bottom shell, a plurality of heat dissipation modules, a plurality of first fins, a plurality of second heat dissipation elements, a plurality of first heat dissipation elements, a plurality of second heat dissipation elements and a plurality of second heat dissipation elements.

5. A domain controller according to claim 2 or 3, wherein the thickness of the second fins is 2 to 4 mm, a plurality of the second fins being provided with first sealing rings on outer hoops;

the through hole comprises a first hole section and a second hole section which are communicated in sequence, wherein the aperture of the first hole section is larger than that of the second hole section so as to form a step surface at the joint of the first hole section and the second hole section;

the first sealing ring is positioned in the first hole section, one end of the first sealing ring is abutted to the vacuum cavity vapor chamber, and the other end of the first sealing ring is abutted to the step surface.

6. The domain controller of claim 5, wherein a gap is provided between a wall of the first bore section and a periphery of the first seal ring.

7. A domain controller according to any one of claims 1 to 3, wherein the bottom case comprises an upper case, a lower case and a second sealing ring, the upper case being located on a side of the lower case near the top cover, the upper case and the lower case being snapped to form the inner cavity, the second sealing ring being disposed between the upper case and the lower case;

the fan assembly and the first fin group are both connected to the upper shell, and the first fin group and the upper shell are of an integrated structure.

8. The domain controller of claim 7, further comprising a second heating element located within the interior cavity, the second heating element having a thermal power that is less than a thermal power of the first heating element;

the upper shell is provided with a protruding part protruding towards the second heating element, and the second heating element is abutted to the protruding part.

9. The domain controller according to claim 8, wherein a side of the protruding portion facing the second heating element is provided with a second heat conductive member; and/or the number of the groups of groups,

the upper shell is also provided with a second fin group, the second fin group is positioned between the upper shell and the top cover, and the second fin group is positioned beside the first fin group.

10. A vehicle comprising a body and the domain controller of any one of claims 1 to 9;

the domain controller is disposed on the vehicle body.