CN220775662U - Pulse power supply - Google Patents
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- CN220775662U CN220775662U CN202321812391.8U CN202321812391U CN220775662U CN 220775662 U CN220775662 U CN 220775662U CN 202321812391 U CN202321812391 U CN 202321812391U CN 220775662 U CN220775662 U CN 220775662U
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Abstract
The utility model relates to the technical field of electroplating and discloses a pulse power supply, which comprises a pulse power supply module and a flow guide module; the pulse power supply module is used for providing voltage for the external electroplating bath; the flow guiding module is arranged between the pulse power module and the external electroplating bath and is used for stopping reverse current flowing from the pulse power module to the external electroplating bath. According to the utility model, the flow guide module is arranged between the pulse power module and the electroplating tank, so that the problem that the service life of the insoluble anode is influenced due to the phenomenon that the insoluble anode of the electroplating tank repeatedly flows through reverse current to cause hydrogen evolution corrosion due to the fact that the electrodes of the pulse electroplating are continuously exchanged with the anode and the cathode can be avoided.
Description
Technical Field
The utility model relates to the technical field of electroplating, in particular to a pulse power supply.
Background
The pulse power supply is a special power supply with parameters such as output pulse waveform, frequency, duty ratio and average current density which can be set according to electroplating requirements, and is characterized by comprising adjustable frequency and duty ratio, settable current/voltage waveform and the like. The practical significance of these characteristics of the pulse power supply in production is that in the electroplating process, the pulse power supply can change the metal ion electrodeposition process in the electroplating bath by changing the frequency, the duty ratio and the average current density of the output waveform of the pulse power supply, so that the electrodeposition process is changed in a wider range, and a uniform, compact and ideal coating is obtained. For example, in the printed circuit board industry (PCB), pulse power supply electroplating is used, so that the deep plating capability of the PCB can be improved, and the plating layer is uniform and compact and does not fall off.
In the field of electroplating of Printed Circuit Boards (PCBs), electroplating of high-density interconnection products with strict requirements on electroplating uniformity, especially blind hole filling electroplating, mainly comprises pulse filling holes of insoluble titanium-based noble metal oxide coating nets. At present, the coating of the anode mainly comprises iridium or ruthenium ternary mixed metal oxide, the market price is high and the fluctuation is severe, and the service life of the anode is generally only about 2 years.
The insoluble anode is directly used as an anode, and because the anode and the cathode of the pulse electroplating can be continuously exchanged, the insoluble anode generates hydrogen evolution corrosion phenomenon due to repeated flowing of reverse current, the activity of hydrogen is higher than that of insoluble anode metal, so that the insoluble anode has reduction reaction, is reduced and falls off, the phenomenon that the anode is corroded is shown, the service life of the insoluble anode is influenced, the insoluble anode is electroplated, the anode is equivalent to the situation that the anode is electrolyzed with water, oxygen can be generated, the oxygen can generate oxidation effect on important additives such as a brightening agent, and the like, so that the electrolyte is decomposed faster, the electroplating glossiness is influenced, more organic pollutants are generated, and the electroplating quality is influenced.
Disclosure of Invention
In view of this, the present utility model provides a pulse power source to solve the problem that the insoluble anode is corroded by hydrogen evolution caused by repeated reverse current flowing to affect the life of the insoluble anode by continuously exchanging the positive electrode and the negative electrode of the pulse plating electrode.
In a first aspect, the present utility model provides a pulsed power supply comprising: a pulse power module and a flow guiding module;
the pulse power supply module is used for providing voltage for the external electroplating bath;
the flow guiding module is arranged between the pulse power module and the external electroplating bath and is used for stopping reverse current flowing from the pulse power module to the external electroplating bath.
According to the pulse power supply provided by the embodiment of the utility model, the flow guide module is arranged between the pulse power supply module and the external electroplating tank, so that the problem that the service life of the insoluble anode is influenced due to the phenomenon that the insoluble anode of the electroplating tank repeatedly flows through reverse current due to the fact that the anode and the cathode of the pulse electroplating electrode are continuously exchanged can be avoided.
In an alternative embodiment, the output positive end of the pulse power module is connected with the input end of the flow guiding module, and the first output end of the flow guiding module is used as a first output anode; the second output end of the flow guiding module is used as a second output anode;
the first output anode is connected with an insoluble anode of the external electroplating bath; the second output anode is connected with an auxiliary anode of the external electroplating bath.
According to the pulse power supply provided by the embodiment of the utility model, the flow guide module forms the double-anode output, and the double-anode output is respectively connected with the insoluble anode and the auxiliary anode of the external electroplating bath, so that the external electroplating bath does not flow a reverse current, the insoluble anode of the external electroplating bath is not corroded by the reverse current, and the glossiness of electroplating is improved.
In an alternative embodiment, the flow guiding module comprises a first flow guiding pipe and a second flow guiding pipe;
the anode of the first flow guiding pipe is connected with the output positive end of the pulse power supply module, and the cathode of the first flow guiding pipe is used as a first output anode to be connected with an insoluble anode of an external electroplating bath;
the cathode of the second flow guiding pipe is connected with the output positive end of the pulse power supply module, and the anode of the second flow guiding pipe is used as a second output anode to be connected with an auxiliary anode of the external electroplating bath.
According to the pulse power supply provided by the embodiment of the utility model, the flow guiding module adopts the first flow guiding pipe and the second flow guiding pipe to realize double-anode output.
In an alternative embodiment, the negative output terminal of the pulse power module is connected to the cathode of the external plating tank as the output cathode.
In an alternative embodiment, when the output voltage of the pulse power module is positive polarity voltage, the reverse current flowing from the pulse power module to the external plating tank is cut off through the first output anode;
when the output voltage of the pulse power supply module is negative voltage, the reverse current flowing from the pulse power supply module to the external electroplating bath is cut off through the second output anode.
In an alternative embodiment, when the output voltage of the pulse power module is positive voltage, the second flow guiding tube is turned off reversely.
In an alternative embodiment, when the output voltage of the pulse power module is a negative voltage, the first flow guiding tube is reversely cut off.
When the output voltage of the pulse power supply module is positive voltage, the pulse power supply provided by the embodiment of the utility model cuts off the reverse current flowing from the pulse power supply module to the external electroplating bath through the second output anode, and at the moment, the second guide pipe is reversely cut off. When the output voltage of the pulse power supply module is negative voltage, the second output anode is used for stopping the reverse current flowing from the pulse power supply module to the external electroplating bath, and at the moment, the first flow guide pipe is reversely stopped, so that the purpose that the reverse current flows through the insoluble anode of the external electroplating bath is achieved.
In an alternative embodiment, the pulse power module includes an energy storage sub-module, a pulse power sub-module, and a digital control sub-module;
the energy storage sub-module is used for storing low-voltage direct current and providing power for the pulse power sub-module;
the input end of the pulse power sub-module is connected with the output end of the energy storage sub-module, and the output end of the pulse power sub-module is connected with one end of the flow guide module; the pulse power sub-module is used for converting the electric signals flowing to the flow guiding module into pulse signals;
one end of the digital control sub-module is connected with the output end of the pulse power sub-module, and the other end of the digital control sub-module is connected with the other end of the flow guiding module; the digital control sub-module is used for monitoring the working state of the pulse power supply and protecting the pulse power module and the flow guiding module when abnormality occurs.
According to the pulse power supply provided by the embodiment of the utility model, the energy storage sub-module, the pulse power sub-module and the digital control sub-module are arranged in the pulse power supply module, the pulse power sub-module converts an electric signal flowing to the flow guiding module into a pulse signal, and the digital control sub-module protects the pulse power module and the flow guiding module when abnormality occurs, so that a circuit foundation is provided for better electroplating work.
In an alternative embodiment, the pulse power module further includes: a three-phase rectifier sub-module and a full-bridge LLC sub-module;
the output end of the three-phase rectifier sub-module is connected with the input end of the full-bridge LLC sub-module; the three-phase rectifier sub-module is used for providing direct current for the full-bridge LLC sub-module;
the output end of the full-bridge LLC sub-module is connected with the input end of the energy storage sub-module; the full-bridge LLC sub-module is used for providing low-voltage direct current for the energy storage sub-module.
According to the pulse power supply provided by the embodiment of the utility model, the pulse power supply module is arranged in the three-phase rectifier sub-module and the full-bridge LLC sub-module, so that low-voltage direct current is indirectly supplied to the flow guide module and the external electroplating bath, and the electroplating work of the external electroplating bath can be smoothly carried out.
In an alternative embodiment, the pulse power supply module further comprises a full-bridge digital control sub-module, the full-bridge digital control sub-module being connected to the output of the full-bridge LLC sub-module, the full-bridge digital control sub-module being adapted to reduce the ripple current of the direct current.
According to the pulse power supply provided by the embodiment of the utility model, the full-bridge digital control submodule is arranged in the pulse power supply module, so that the ripple current of direct current of the full-bridge LLC submodule is reduced, and the quality of output voltage is improved.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present utility model, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
FIG. 1 is a block diagram of a pulsed power supply according to an embodiment of the present utility model;
FIG. 2 is a block diagram of another pulsed power supply according to an embodiment of the present utility model;
FIG. 3 is a block diagram of yet another pulsed power supply according to an embodiment of the present utility model;
FIG. 4 is a block diagram of still another pulsed power supply according to an embodiment of the present utility model;
fig. 5 is a schematic diagram of a circuit board of a pulse power module according to an embodiment of the utility model.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments of the present utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The embodiment of the utility model provides a pulse power supply, as shown in fig. 1, fig. 1 is a structural block diagram of the pulse power supply according to the embodiment of the utility model, and the pulse power supply comprises a pulse power supply module 11 and a flow guiding module 113; the pulse power module is used for providing voltage for the external electroplating bath 12; the diversion module 13 is disposed between the pulse power module 11 and the external plating tank 12, and the diversion module 13 is used for stopping the reverse current flowing from the pulse power module 11 to the external plating tank 12.
According to the pulse power supply provided by the embodiment of the utility model, the flow guide module is arranged between the pulse power supply module and the external electroplating bath, so that the problem that the service life of the insoluble anode is influenced due to the phenomenon that the insoluble anode of the external electroplating bath repeatedly flows through reverse current due to the fact that the electrodes of the pulse electroplating are continuously exchanged with the anode and the cathode is avoided.
In an alternative embodiment, as shown in fig. 2, the output positive end of the pulse power module 11 is connected with the input end of the flow guiding module 13, and the first output end of the flow guiding module 13 is used as a first output anode; the second output end of the flow guiding module 13 is used as a second output anode.
The external plating tank 12 includes an insoluble anode and an auxiliary anode, and the first output anode may be connected to the insoluble anode of the external plating tank 12; the second output anode is connected to an auxiliary anode of the external plating tank 12. Specifically, the insoluble anode refers to an anode in which substances on the surface of the anode are not dissolved in an ionic state during plating, allowing a large current density to pass therethrough, and a passivation film is not generated. Materials for insoluble anodes in electroplating include lead, carbon, platinum, graphite, nickel, stainless steel, platinized titanium, lead alloys, and cast magnetic iron oxides, among others. The auxiliary anode mainly solves the problem that current cannot flow in deep places of the electroplated product, an inert anode is bound on an external electroplating bath, the inert anode is placed in the lowest position of the electroplated product, and the other end of the inert anode is connected to a conductive bar of the insoluble anode, so that the low-potential current intensity can be increased, and the thickness and the dispersion capacity of a low-potential coating can be increased. The auxiliary anode may also be replaced by other auxiliary means, such as: the auxiliary anode may be replaced by a noble metal mixed oxide coated anode or a titanium blue bezel.
In an alternative embodiment, the flow guiding module 13 comprises a first flow guiding tube and a second flow guiding tube; the anode of the first flow guide pipe is connected with the cathode of the second flow guide pipe to form a common connection point serving as an input point of the flow guide module 13, and the common connection point is connected with the output positive end of the pulse power supply module. Specifically, the anode of the first flow guiding tube is connected with the output positive end of the pulse power module 11, and the cathode of the first flow guiding tube is used as the first output anode of the whole pulse power supply and is connected with the insoluble anode of the external electroplating tank 12. The cathode of the second flow guiding pipe is connected with the output positive end of the pulse power supply module 11, and the anode of the second flow guiding pipe is used as a second output anode of the whole pulse power supply and is connected with an auxiliary anode of the external electroplating tank 12. The existence of the first flow guiding pipe ensures that the insoluble anode of the external plating bath only flows forward current and cuts off reverse current. The second guide pipe is used for forming a reverse large current path between the pulse power supply module and the external electroplating bath, and the reverse current flows through the path and then returns to the pulse power supply module, so that the external electroplating bath does not flow through the reverse current, and insoluble anodes of the external electroplating bath are not corroded by the reverse current.
In an alternative embodiment, the negative output terminal of the pulse power module is connected to the cathode of the external plating tank as the output cathode. Specifically, the negative output terminal of the pulse power supply module is used as the output cathode of the whole pulse power supply to be connected with the cathode of the external electroplating bath, and is used for stopping the reverse current of the insoluble anode of the external electroplating bath. The cathode of the external electroplating bath is an electrode formed by plating metal, and the insoluble anode can be dissolved to release metal ions in the electroplating process, so that the metal ions are deposited on the cathode of the external electroplating bath to form a layer of metal film.
In an alternative embodiment, when the output voltage of the pulse power module is positive voltage, the reverse current flowing from the pulse power module to the external plating tank is cut off through the first output anode, and at this time, the second flow guiding pipe is cut off reversely. Specifically, as shown in fig. 3, when the output voltage of the pulse power module is positive polarity voltage, the current output from the pulse power module flows through the first guide tube D1 of the guide module 13, the insoluble anode of the external electroplating bath, the cathode of the external electroplating bath, and the output cathode of the pulse power module in sequence, and finally returns to the pulse power module, at this time, the second guide tube D2 in the guide module is turned off reversely at this time, so that the reverse current does not flow through the insoluble anode of the external electroplating bath, and corrosion of the insoluble anode by the reverse current is avoided.
When the output voltage of the pulse power supply module is negative voltage, the reverse current flowing from the pulse power supply module to the external electroplating bath is cut off through the second output anode, and at the moment, the first diversion pipe is reversely cut off. Specifically, as shown in fig. 4, when the output voltage of the pulse power module is a negative positive voltage, the current output from the pulse power module flows through the output cathode, the cathode of the external plating tank, the auxiliary anode or other auxiliary devices of the external plating tank, the second guide tube D2 of the guide module 13, and finally returns to the pulse power module, at this time, the first guide tube D1 in the guide module is turned off reversely, so that the reverse current does not flow through the insoluble anode of the external plating tank, and the insoluble anode is prevented from being corroded by the reverse current.
When the output voltage of the pulse power supply module is negative voltage, the pulse power supply provided by the embodiment of the utility model cuts off the reverse current flowing from the pulse power supply module to the external electroplating bath through the second output anode, and at the moment, the second flow guide pipe is reversely cut off. When the output voltage of the pulse power supply module is negative voltage, the second output anode is used for stopping the reverse current flowing from the pulse power supply module to the external electroplating bath, and at the moment, the first flow guide pipe is reversely stopped, so that the purpose that the reverse current flows through the insoluble anode of the external electroplating bath is achieved.
In an alternative embodiment, the pulse power module 11 includes an energy storage sub-module, a pulse power sub-module, and a digital control sub-module;
the energy storage sub-module is used for storing low-voltage direct current and providing power for the pulse power sub-module; specifically, as shown in fig. 5, the energy storage sub-module is a large number of capacitors with parallel structures, stores energy input from the input end of the energy storage sub-module, and provides required energy for generating reverse large-amplitude pulse current for the pulse power module.
The input end of the pulse power sub-module is connected with the output end of the energy storage sub-module, and the output end of the pulse power sub-module is connected with one end of the flow guiding module; the pulse power sub-module is used for converting the electric signals flowing to the flow guiding module into pulse signals; specifically, the pulse power sub-module mainly comprises a plurality of H-bridge type power Mosfet transistors and an isolation driving circuit thereof, the input end of the pulse power sub-module is connected with the low-voltage direct-current output end of the energy storage module, the output positive end of the pulse power sub-module is connected with the flow guiding module through a filter inductor, and the output negative end of the pulse power sub-module is connected with the electroplating cathode. The pulse power supply module is internally provided with a plurality of pulse power sub-modules which are connected in parallel for outputting, and the pulse power supply module is used for redundancy combination and modularization design and can meet the requirements of different current specifications.
One end of the digital control sub-module is connected with the output end of the pulse power sub-module, and the other end of the digital control sub-module is connected with the other end of the flow guiding module; the digital control sub-module is used for monitoring the working state of the pulse power supply and protecting the pulse power module and the flow guiding module when abnormality occurs. Specifically, the digital control sub-module mainly comprises a digital controller FPGA, an ARM controller and a PWM generating circuit. And a plurality of groups of PWM generating circuits are arranged in the digital control sub-module to control the on and off of the pulse power sub-modules, so as to generate preset pulse current waveforms. The protection of the pulse power sub-module when abnormality occurs is realized by monitoring the information such as the output current of the pulse power sub-module, the working state of the power supply and the like through a digital controller FPGA and an ARM controller.
According to the pulse power supply provided by the embodiment of the utility model, the energy storage sub-module, the pulse power sub-module and the digital control sub-module are arranged in the pulse power supply module, the pulse power sub-module converts an electric signal flowing to the flow guiding module into a pulse signal, and the digital control sub-module protects the pulse power module and the flow guiding module when abnormality occurs, so that a circuit foundation is provided for better electroplating work.
In an alternative embodiment, the pulse power module further includes: a three-phase rectifier sub-module and a full-bridge LLC sub-module;
the output end of the three-phase rectifier sub-module is connected with the input end of the full-bridge LLC sub-module; the three-phase rectifying module is used for providing direct current for the full-bridge LLC sub-module; specifically, the three-phase rectifying sub-module comprises a three-phase input LC filter circuit, and the output ends of the three-phase rectifying sub-module are respectively connected with the input ends of the full-bridge LLC sub-module. The output end of the three-phase rectifier sub-module forms direct current bus voltage after passing through an LC filter circuit, and provides direct current bus voltage for the two-way staggered full-bridge LLC sub-module of the rear stage.
The output end of the full-bridge LLC sub-module is connected with the input end of the energy storage sub-module; the full-bridge LLC sub-module is used for providing low-voltage direct current for the energy storage sub-module. Specifically, the primary side of the transformer of the full-bridge LLC sub-module consists of a plurality of power mosfets in an H-bridge form and isolation driving of the power mosfets, and soft switching is realized by including resonance inductance, resonance capacitance and the like, so that the conversion efficiency of the module is improved; the primary side of the transformer of the full-bridge LLC sub-module is used for realizing the electric energy conversion of input high voltage and output voltage; the secondary of the transformer of the full-bridge LLC sub-module is synchronous rectification of a full-wave rectification type. At least two full-bridge LLC sub-modules are provided.
According to the pulse power supply provided by the embodiment of the utility model, the pulse power supply module is arranged in the three-phase rectifier sub-module and the full-bridge LLC sub-module, so that low-voltage direct current is indirectly supplied to the flow guide module and the external electroplating bath, and the electroplating work of the external electroplating bath can be smoothly carried out.
In an alternative embodiment, the pulse power supply module further comprises a full-bridge digital control sub-module, the full-bridge digital control sub-module being connected to the output of the full-bridge LLC sub-module, the full-bridge digital control sub-module being adapted to reduce the ripple current of the direct current. Specifically, the full-bridge digital control sub-module comprises a digital controller DSP, an input/output current, a voltage sampling circuit, a protection circuit, a communication circuit and a PWM output circuit. And respectively controlling corresponding power Mosfet devices of the two full-bridge LLC sub-modules through 2 groups of 8-path staggered PWM (ABCD ). By means of staggered parallel connection, ripple current of the direct current bus is greatly reduced.
According to the pulse power supply provided by the embodiment of the utility model, the full-bridge digital control submodule is arranged in the pulse power supply module, so that the ripple current of direct current of the full-bridge LLC submodule is reduced, and the quality of output voltage is improved.
Although embodiments of the present utility model have been described in connection with the accompanying drawings, various modifications and variations may be made by those skilled in the art without departing from the spirit and scope of the utility model, and such modifications and variations fall within the scope of the utility model as defined by the appended claims.
Claims (8)
1. A pulsed power supply, comprising: a pulse power module and a flow guiding module;
the pulse power supply module is used for providing voltage for the external electroplating bath;
the flow guide module is arranged between the pulse power supply module and the external electroplating bath and is used for stopping reverse current flowing from the pulse power supply module to the external electroplating bath;
the output positive end of the pulse power supply module is connected with the input end of the flow guide module, and the first output end of the flow guide module is used as a first output anode; the second output end of the flow guide module is used as a second output anode;
the first output anode is connected with an insoluble anode of the external electroplating bath; the second output anode is connected with an auxiliary anode of the external electroplating bath;
the flow guiding module comprises a first flow guiding pipe and a second flow guiding pipe;
the anode of the first flow guide pipe is connected with the output positive end of the pulse power supply module, and the cathode of the first flow guide pipe is used as a first output anode to be connected with an insoluble anode of an external electroplating bath;
the cathode of the second flow guide pipe is connected with the output positive end of the pulse power supply module, and the anode of the second flow guide pipe is used as a second output anode to be connected with an auxiliary anode of the external electroplating bath.
2. The pulsed power supply of claim 1, wherein an output negative terminal of the pulsed power supply module is connected as an output cathode to a cathode of the external plating tank.
3. The pulse power supply according to claim 1, wherein when the output voltage of the pulse power supply module is a positive polarity voltage, a reverse current flowing from the pulse power supply module to the external plating tank is cut off through the first output anode;
when the output voltage of the pulse power supply module is negative voltage, the reverse current flowing from the pulse power supply module to the external electroplating bath is cut off through the second output anode.
4. The pulse power supply according to claim 3, wherein the second flow guide tube is reversely cut off when the output voltage of the pulse power supply module is positive polarity voltage.
5. The pulse power supply of claim 3, wherein the first flow guide tube is turned off reversely when the output voltage of the pulse power supply module is negative voltage.
6. The pulsed power supply of claim 1, wherein the pulsed power supply module comprises an energy storage sub-module, a pulsed power sub-module, and a digital control sub-module;
the energy storage sub-module is used for storing low-voltage direct current and providing power for the pulse power sub-module;
the input end of the pulse power sub-module is connected with the output end of the energy storage sub-module, and the output end of the pulse power sub-module is connected with one end of the flow guiding module; the pulse power sub-module is used for converting an electric signal flowing to the flow guiding module into a pulse signal;
one end of the digital control sub-module is connected with the output end of the pulse power sub-module, and the other end of the digital control sub-module is connected with the other end of the flow guiding module; the digital control sub-module is used for monitoring the working state of the pulse power supply and protecting the pulse power module and the flow guiding module when abnormality occurs.
7. The pulsed power supply of claim 6, wherein the pulsed power supply module further comprises: a three-phase rectifier sub-module and a full-bridge LLC sub-module;
the output end of the three-phase rectifier sub-module is connected with the input end of the full-bridge LLC sub-module; the three-phase rectifier sub-module is used for providing direct current for the full-bridge LLC sub-module;
the output end of the full-bridge LLC sub-module is connected with the input end of the energy storage sub-module; the full-bridge LLC sub-module is used for providing low-voltage direct current for the energy storage sub-module.
8. The pulsed power supply of claim 7, further comprising a full-bridge digital control sub-module coupled to an output of the full-bridge LLC sub-module, the full-bridge digital control sub-module configured to reduce ripple current of the direct current.
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