CN220752577U - Semiconductor local environment temperature control device - Google Patents
Semiconductor local environment temperature control device Download PDFInfo
- Publication number
- CN220752577U CN220752577U CN202420437310.9U CN202420437310U CN220752577U CN 220752577 U CN220752577 U CN 220752577U CN 202420437310 U CN202420437310 U CN 202420437310U CN 220752577 U CN220752577 U CN 220752577U
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- temperature control
- bin
- heat exchange
- temperature
- control box
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000010438 heat treatment Methods 0.000 claims abstract description 42
- 238000005192 partition Methods 0.000 claims abstract description 15
- 238000009434 installation Methods 0.000 claims abstract 3
- 238000001816 cooling Methods 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 11
- 230000008859 change Effects 0.000 claims description 6
- 238000005057 refrigeration Methods 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims 1
- 238000001514 detection method Methods 0.000 abstract description 7
- 230000001105 regulatory effect Effects 0.000 abstract description 4
- 238000000034 method Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 230000000630 rising effect Effects 0.000 abstract 1
- 239000002699 waste material Substances 0.000 abstract 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000001815 facial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Control Of Temperature (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model discloses a semiconductor local environment temperature control device, wherein a partition plate is arranged in the middle position in a temperature control box, a space between the left side of the partition plate and the temperature control box is a refrigerating bin, a space between the right side of the partition plate and the temperature control box is a heating bin, a through hole is formed in the middle position of the partition plate, an installation seat is rotatably arranged at the through hole, and a heat exchange structure is arranged between the refrigerating bin and the heating bin. The temperature control box is divided into the refrigerating bin and the heating bin through the arranged partition plate, the semiconductor device can be directly switched to the high temperature or low temperature environment from the low temperature or high temperature environment, the gradual temperature reduction and temperature rising process of the detection environment of the semiconductor device can be avoided, the detection efficiency of the semiconductor device is improved, the local temperature of the refrigerating bin and the heating bin in the temperature control box can be regulated and controlled through the heat exchange structure, and the waste caused by the energy passing is avoided.
Description
Technical Field
The utility model relates to the technical field of detection temperature control, in particular to a semiconductor local environment temperature control device.
Background
The semiconductor device has the advantages of excellent thermal, electrical, mechanical and chemical properties, small volume, light weight, low power consumption and the like, is widely applied to the fields of computers, communication, electronic control and the like, and brings great convenience for daily production and life of people. The semiconductor device is required to operate under different temperature conditions according to the application, and in order to determine the operating condition of the semiconductor device at a predetermined operating temperature, it is required to detect the output characteristics of the semiconductor device at the corresponding operating temperature.
The authorized bulletin number is: the patent of CN213581867U discloses a temperature control device for semiconductor device detects, comprising a base plate, bottom plate up end fixedly connected with box, box up end fixedly connected with hinge, hinge one end is rotated and is connected with the apron, the bottom plate up end is provided with the storage box, the storage box up end is provided with the lid, water pump one end is provided with the cooler, cooler fixedly connected with condenser pipe, the one end fixedly connected with of condenser pipe intensifiers, terminal surface fixedly connected with baffle under the fixed plate, baffle side fixedly connected with spacing, box left end face is provided with the louvre, box right-hand member face fixedly connected with fender bracket.
According to the technical scheme, the cooling piece is cooled through condensate, so that the temperature of a semiconductor on the cooling piece is reduced, the semiconductor is detected in a low-temperature state, the semiconductor device is heated through the heating rod, the semiconductor is detected in a heated state, however, when the same semiconductor is detected in a low-temperature to high-temperature state or the semiconductor device is detected in a low-temperature state, the semiconductor device is required to be discharged from the box body at the original low temperature or high temperature, and in the heating or cooling step, not only is energy wasted, but also the detection duration is increased in the heating or cooling process.
Disclosure of Invention
The present utility model is directed to a semiconductor local environment temperature control device, which solves the problems of the semiconductor local environment temperature control device proposed in the above background art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a semiconductor local environment temperature control device, the division board has been installed to the intermediate position in the control by temperature change case, space between division board left side and the control by temperature change case is the refrigeration storehouse, space between division board right side and the control by temperature change case is the storehouse of heating, intermediate position department of division board is provided with the through-hole, through-hole department rotates and is provided with the mount pad, the mount pad is provided with motor drive, the closing plate with through-hole looks adaptation has all been installed to the upper and lower both sides of mount pad, the left and right sides of mount pad all is provided with the backup pad, the mount pad facial make-up has installed the mount pad, the movable tank has been seted up to the upside of mount pad, the telescopic link has been installed to one side in the movable tank, splint have been installed to the other end of telescopic link, and movable tank sliding connection, fixed limiting plate has been installed on the mount pad on one side of movable tank, telescopic link outside cover between splint and the movable tank opposite face is equipped with the spring, be provided with heat transfer structure between refrigeration storehouse and the storehouse.
As the further preferred of this technical scheme, heat transfer structure includes the induced fan that the center department at refrigeration storehouse and heating storehouse top set up, all install curved heat exchange tube on the control by temperature change case at induced fan top, the center department at control by temperature change case top has installed the heat exchange case, the tip of heat exchange tube is installed on the lateral wall of heat exchange case, the inside center department slip of heat exchange case is provided with the baffle.
As a further preferable mode of the technical scheme, the outer side temperature control boxes of the refrigerating bin and the heating bin are respectively provided with a sealing door, and handles are arranged on the sealing doors.
As a further preferable mode of the technical scheme, the motor is arranged on the temperature control box between the closed doors, and the output end of the motor is coaxially fixed with the center of the mounting seat.
As a further preferable mode of the technical scheme, a temperature sensor is arranged at the top distance between the refrigerating bin and the heating bin, a controller is arranged on the outer side of the temperature control box, and the controller is electrically connected with the motor, the induced fan and the temperature sensor respectively.
The utility model provides a semiconductor local environment temperature control device, which has the following beneficial effects:
(1) According to the utility model, the temperature control box is divided into the refrigerating bin and the heating bin by the partition plate, the semiconductor device can be fixed on the mounting table by the clamping plate and the limiting plate, and the motor drives the supporting plate to rotate, so that the clamped semiconductor device is switched between the refrigerating bin and the heating bin, thereby facilitating the detection of the semiconductor device in a low-temperature and high-temperature environment, and further increasing the detection speed of the semiconductor device in the low-temperature and high-temperature environment.
(2) According to the utility model, through the heat exchange structure, the low temperature in the refrigerating bin can be led into the heating bin through the heat exchange structure under the condition that the temperatures of the refrigerating bin and the heating bin are too high or too low, so that the temperature in the heating bin can be reduced, or the high temperature in the heating bin can be led into the refrigerating bin, and the temperature of the refrigerating bin can be increased, so that the temperature in the heating bin of the refrigerating bin can be conveniently regulated and controlled.
Drawings
FIG. 1 is a schematic diagram of a semiconductor local ambient temperature control device according to the present utility model;
FIG. 2 is a schematic view of a partial cross-sectional structure of a semiconductor local ambient temperature control device according to the present utility model;
FIG. 3 is a schematic view showing the structure of parts on a mounting base in the semiconductor local environment temperature control device of the present utility model;
in the figure: 1. a temperature control box; 2. a controller; 3. a closed door; 4. a heat exchange structure; 401. a heat exchange box; 402. a baffle plate; 403. a fan; 404. a heat exchange tube; 5. a handle; 6. a motor; 7. a support plate; 8. a refrigerating bin; 9. a temperature sensor; 10. a partition plate; 11. a mounting table; 12. a heating bin; 13. a moving groove; 14. a clamping plate; 15. a sealing plate; 16. a spring; 17. a limiting plate; 18. and (5) a mounting seat.
Detailed Description
The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.
The utility model provides the technical scheme that: in the embodiment, as shown in fig. 1-3, a partition plate 10 is installed at the middle position in a temperature control box 1, a space between the left side of the partition plate 10 and the temperature control box 1 is a refrigerating bin 8, a space between the right side of the partition plate 10 and the temperature control box 1 is a heating bin 12, a through hole is formed in the middle position of the partition plate 10, a semiconductor device is conveniently moved between the refrigerating bin 8 and the heating bin 12, a mounting seat 18 is rotatably arranged at the through hole, the mounting seat 18 is driven by a motor 6, sealing plates 15 matched with the through holes are installed on the upper side and the lower side of the mounting seat 18, the temperature of the refrigerating bin 8 and the temperature control bin 12 can be prevented from being conducted to the other bin through the arrangement of the sealing plates 15, a supporting plate 7 is arranged on the left side and the right side of the supporting plate 7, a mounting table 11 is provided with a moving groove 13, a telescopic rod is installed on one side of the moving groove 13, a clamping plate 14 is installed on the other end of the telescopic rod, a clamping plate 14 is arranged on the side of the telescopic rod, the clamping plate 14 is connected with the moving groove 13 through the moving groove 13, a clamping plate 13 and a spring sleeve 16 is required to be fixedly arranged between the clamping plate 14 and the semiconductor device and the clamping plate 16 through the sliding groove 16, and the clamping plate 16 is required to be fixedly clamped between the clamping plate 14 and the clamping plate 16 through the moving groove 16, and the clamping plate 16 is fixed by the clamping plate 16, and the clamping plate 14 is arranged between the clamping plate and the clamping plate 13.
As shown in fig. 1 and 2, the heat exchange structure 4 includes a cooling bin 8 and a fan 403 disposed at the center of the top of the heating bin 12, arc-shaped heat exchange tubes 404 are disposed on the temperature control box 1 at the top of the fan 403, a heat exchange box 401 is disposed at the center of the top of the temperature control box 1, an end of each heat exchange tube 404 is disposed on a side wall of the heat exchange box 401, a baffle plate 402 is slidably disposed at the center of the inside of the heat exchange box 401, when the temperature of the cooling bin 8 or the heating bin 12 needs to be raised and lowered, the baffle plate 402 is firstly pulled out from the heat exchange box 401, and then the temperature of the cooling bin 8 or the heating bin 12 is conducted into the heating bin 12 or the cooling bin 8 through the heat exchange tubes 404 by controlling the forward and backward rotation of the fan 403, so that the temperature of the cooling bin 8 or the cooling bin 8 is regulated and controlled.
As shown in fig. 1 and 2, the outside temperature control boxes 1 of the refrigerating bin 8 and the heating bin 12 are respectively provided with a sealing door 3, the sealing doors 3 are provided with handles 5, and the semiconductor devices can be conveniently placed or taken out of the refrigerating bin 8 and the heating bin 12 through the arrangement of the sealing doors 3.
As shown in fig. 1 and 3, the motor 6 is installed on the temperature control box 1 between the airtight doors 3, the output end of the motor 6 is coaxially fixed with the center of the mounting seat 18, and the semiconductor device on the mounting table 11 can be driven to be switched into the heating bin 12 or the refrigerating bin 8 when the motor 6 is started through the coaxial fixation of the motor 6 and the center of the mounting seat 18.
As shown in fig. 1 and 2, a temperature sensor 9 is arranged at the top distance between the refrigerating bin 8 and the heating bin 12, the temperature in the refrigerating bin 8 and the heating bin 12 can be monitored in real time through the arrangement of the temperature sensor 9, a controller 2 is arranged on the outer side of the temperature control box 1, the controller 2 is respectively electrically connected with the motor 6, the induced fan 403 and the temperature sensor 9, and the operator can conveniently control the forward and reverse rotation of the induced fan 403 and the start and stop of the motor 6 through the arrangement of the controller 2.
The utility model provides a semiconductor local environment temperature control device, which has the following specific working principle: the temperature control box 1 is divided into the refrigerating bin 8 and the heating bin 12 through the partition plate 10, the semiconductor device can be fixed on the mounting table 11 through the clamping plate 14 and the limiting plate 17, the motor 6 drives the supporting plate 7 to rotate, so that the clamped semiconductor device is switched between the refrigerating bin 8 and the heating bin 12, the semiconductor device is conveniently detected in a low-temperature and high-temperature environment, the detection speed of the semiconductor device in the low-temperature and high-temperature environment is increased, the low temperature in the refrigerating bin 8 and the heating bin 12 can be led into the heating bin 12 through the heat exchange structure 4 under the condition that the temperature of the refrigerating bin 8 and the heating bin 12 is too high or too low, or the high temperature in the heating bin 12 is led into the refrigerating bin 8, and the temperature of the refrigerating bin 8 is improved, so that the temperature in the refrigerating bin 8 and the heating bin 12 can be conveniently regulated and controlled.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. The utility model provides a semiconductor local environment temperature control device, includes control by temperature change case (1), its characterized in that: a separation plate (10) is arranged in the middle position in the temperature control box (1), the space between the left side of the partition plate (10) and the temperature control box (1) is a refrigeration bin (8), the space between the right side of the partition plate (10) and the temperature control box (1) is a heating bin (12), a through hole is arranged at the middle position of the partition plate (10), a mounting seat (18) is rotatably arranged at the through hole, the mounting seat (18) is provided with a motor (6) for driving, sealing plates (15) matched with the through holes are respectively arranged on the upper side and the lower side of the mounting seat (18), the left side and the right side of the mounting seat (18) are respectively provided with a supporting plate (7), the supporting plate (7) is provided with an installation table (11), the upper side of the installation table (11) is provided with a moving groove (13), a telescopic rod is arranged at one side in the moving groove (13), a clamping plate (14) is arranged at the other end of the telescopic rod, the clamping plate (14) is in sliding connection with the moving groove (13), a limiting plate (17) is fixedly arranged on the mounting table (11) at one side of the moving groove (13), a spring (16) is sleeved outside the telescopic rod between the clamping plate (14) and the opposite surface of the moving groove (13), a heat exchange structure (4) is arranged between the refrigerating bin (8) and the heating bin (12).
2. A semiconductor local ambient temperature control device as claimed in claim 1, wherein: the heat exchange structure (4) comprises a cooling bin (8) and a fan (403) arranged at the center of the top of a heating bin (12), arc-shaped heat exchange pipes (404) are arranged on a temperature control box (1) at the top of the fan (403), a heat exchange box (401) is arranged at the center of the top of the temperature control box (1), the end parts of the heat exchange pipes (404) are arranged on the side wall of the heat exchange box (401), and a baffle plate (402) is arranged at the center of the inside of the heat exchange box (401) in a sliding manner.
3. A semiconductor local ambient temperature control device as claimed in claim 1, wherein: the outside temperature control boxes (1) of the refrigerating bin (8) and the heating bin (12) are respectively provided with a sealing door (3), and the sealing doors (3) are provided with handles (5).
4. A semiconductor local ambient temperature control device as claimed in claim 1, wherein: the motor (6) is arranged on the temperature control box (1) between the airtight doors (3), and the output end of the motor (6) is coaxially fixed with the center of the mounting seat (18).
5. A semiconductor local ambient temperature control device as claimed in claim 1, wherein: the top distance between the refrigerating bin (8) and the heating bin (12) is provided with a temperature sensor (9), the outside of the temperature control box (1) is provided with a controller (2), and the controller (2) is electrically connected with the motor (6), the induced fan (403) and the temperature sensor (9) respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420437310.9U CN220752577U (en) | 2024-03-07 | 2024-03-07 | Semiconductor local environment temperature control device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420437310.9U CN220752577U (en) | 2024-03-07 | 2024-03-07 | Semiconductor local environment temperature control device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220752577U true CN220752577U (en) | 2024-04-09 |
Family
ID=90554540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420437310.9U Active CN220752577U (en) | 2024-03-07 | 2024-03-07 | Semiconductor local environment temperature control device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220752577U (en) |
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2024
- 2024-03-07 CN CN202420437310.9U patent/CN220752577U/en active Active
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