CN220752351U

CN220752351U - LCC optical module

Info

Publication number: CN220752351U
Application number: CN202322559182.3U
Authority: CN
Inventors: 翟广涛; 郭琦; 武玉谦
Original assignee: Qingdao Xinghang Photoelectric Technology Co ltd
Current assignee: Qingdao Xinghang Photoelectric Technology Co ltd
Priority date: 2023-09-20
Filing date: 2023-09-20
Publication date: 2024-04-09
Anticipated expiration: 2033-09-20

Abstract

The utility model discloses an LCC optical module, which comprises: a carrier plate; an annular frame fixed on the carrier plate; the upper cover plate is covered on the annular frame and forms a containing cavity together with the annular frame and the carrier plate; the chip assembly is fixed on the carrier plate; the FA optical fiber assembly is characterized in that an FA optical connector is positioned in the accommodating cavity and is adhered to the carrier plate; the fiber ribbon of the FA fiber assembly passes through the annular frame; the FA brackets are arranged on two sides of the FA optical connector in a crossing way and are fixed with the carrier plate; a gap is formed between the FA support and the FA optical connector, and adhesive is filled in the gap. According to the LCC optical module, the FA optical connector, the FA support and the carrier plate are fixed into a whole, so that the light path is stable; the periphery of the FA optical connector is completely wrapped by the adhesive, and thermal stress can be brought when the ambient temperature changes, but the periphery of the FA optical connector is uniformly wrapped by the adhesive, the periphery is uniformly stressed, and the FA optical path is not easy to deviate.

Description

LCC optical module

Technical Field

The utility model relates to the technical field of communication, in particular to an LCC optical module.

Background

Along with popularization and deep application of optical communication, various packaged optical modules are endlessly layered to adapt to different application scenes. Optical modules applied in the special fields are also continuously developed, and special working conditions such as vibration, impact or temperature change are required to be met. The special field optical module pushes out the customized packaging optical module such as LCC, and the LCC48 optical module is more common in the market at present, namely 48 pins are arranged on the PCB. However, the optical module is still large in size and difficult to apply in the limit space environment due to the limitation of the number of pins, the space of internal distribution parts, the light path fixing process level and the like.

The optical module product commonly used in the market at present is in an LCC48 packaging form, and when in use, the optical module is welded on a mounting board PCB. While LCCs 48 have been of miniaturized design, they still do not meet dimensional requirements under extreme space and fabric surface conditions.

The optical fiber of the existing LCC48 optical module is fixed by gluing and carrying a heat-shrinkable tube outside the optical fiber. However, this fixing method cannot prevent the external force from affecting the stability of the optical path. The optical fiber ribbon in the optical module has the internal structure that optical fibers are adhered into rows through ribbon adhesive, the ribbon optical fibers are manufactured, and then a layer of heat shrinkage tube is thermally shrunk outside the ribbon optical fibers. The heat shrinkage tube can shrink under the heated condition, thereby achieving the effect of wrapping the optical fiber. However, the heat shrinkage tube after heat shrinkage and the optical fiber with the heat shrinkage tube are not firmly fixed, and the heat shrinkage tube only plays roles of protecting and beautifying the appearance. Therefore, the external force acting on the tail part of the optical fiber cannot be prevented from affecting the stability of the optical path inside the module by gluing and fixing the optical fiber on the outer side of the heat shrinkage tube. In addition, the optical fiber is glued and fixed in the optical module, so that the placing space of internal components is occupied, space waste is caused, and the miniaturization design of products is not facilitated.

At present, most of fixing modes of the FA tail fiber are gluing fixing modes at two sides. After the coupling is finished, the FA is pre-fixed by using UV glue (a certain strength can be achieved after the UV lamp irradiates), and then the two sides of the FA cover plate are fixed by coating structural glue. However, the conventional fixed FA fiber approach is not suitable for modules with high temperature service requirements. Firstly, only two sides are glued and fixed, so that the glue coating amount is small, the colloid is softened at high temperature, and the fixing reliability is poor; and secondly, the glue amount of the glue coated on the two sides is uneven, and the thermal deformation of the glue at high temperature is different, so that the FA cover plate and the optical fiber are driven to deviate, and even the glass cover plate is pulled apart. A problem of degradation of signal transmission quality occurs at high temperatures. Therefore, the two-side gluing fixing mode is not suitable for a module with high-temperature environment working requirements.

Disclosure of Invention

The utility model provides an LCC optical module, which solves the technical problem that an FA optical connector is easy to deviate in the prior art.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides an LCC optical module, comprising:

a carrier plate;

an annular frame fixed on the carrier plate;

the upper cover plate is covered on the annular frame and forms an accommodating cavity with the annular frame and the carrier plate;

the chip assembly is fixed on the carrier plate;

the FA optical fiber assembly is provided with an FA optical connector which is positioned in the accommodating cavity and is adhered to the carrier plate; the fiber ribbon of the FA fiber assembly passes through the annular frame;

the FA brackets are arranged on two sides of the FA optical connector in a crossing way and are fixed with the carrier plate; and a gap is formed between the FA support and the FA optical connector, and the gap is filled with an adhesive.

In some embodiments of the present application, the FA bracket is inverted U-shaped, and includes a transverse support plate and two vertical support plates;

the transverse supporting plate is positioned above the FA optical joint, and a gap is formed between the transverse supporting plate and the top end of the FA optical joint;

the two vertical supporting plates are respectively positioned at two sides of the FA optical connector; the gap width between the two vertical support plates and the FA optical joint is equal;

the bottom end face of the vertical supporting plate is provided with a transverse folding edge, and the transverse folding edge is welded on the carrier plate.

In some embodiments of the present application, a tailpipe is disposed on an outer side surface of the annular frame, and the tailpipe is communicated with the accommodating chamber;

the optical fiber ribbon passes through the tail pipe; the tail pipe is fixed with the optical fiber ribbon through an adhesive.

In some embodiments of the present application, an inverted U-shaped tail plug is disposed in the tail pipe, the tail plug includes a transverse plate and two vertical plates, and the tail plug spans two sides of the optical fiber ribbon; and an adhesive is filled between the optical fiber ribbon and the tail plug, and an adhesive is filled between the tail plug and the tail pipe.

In some embodiments of the present application, the top end surface of the transverse plate has a limiting protrusion; a limiting stop piece is arranged on the inner peripheral surface of the tail pipe;

when the tail plug moves to a limit position in the tail pipe in a direction approaching to the annular frame, the limit protrusion is in contact with the limit stop piece.

In some embodiments of the present application, the transverse plate is provided with a through hole penetrating up and down.

In some embodiments of the present application, the carrier plate includes a PCB board and a ceramic substrate; the ceramic substrate is adhered to the PCB;

the chip assembly comprises an electric chip and an optical chip, and the electric chip is adhered to the PCB;

the optical chip is adhered to the ceramic substrate; the FA optical connector is adhered to the ceramic substrate;

when the FA optical connector is adhered to the ceramic substrate, the optical fiber ribbon is parallel to the axial direction of the tail pipe, and a gap is formed between the optical fiber ribbon and the inner peripheral surface of the tail pipe.

In some embodiments of the present application, the LCC light module further includes a protective cover, a bottom surface and one of side surfaces of the protective cover having openings;

the protection casing cover is established FA optical joint and chip subassembly, the bottom face of protection casing with the PCB board contact and fixed.

In some embodiments of the present application, one positioning post is disposed on each of two sides of the side opening;

when the protective cover is covered on the FA optical connector and the chip assembly, the two positioning columns are respectively contacted with the two sides of the FA bracket.

In some embodiments of the present application, the electrical chip is adhered to the PCB board by a thermally conductive patch adhesive;

the optical chip is adhered to the ceramic substrate through heat conduction patch adhesive;

the ceramic substrate is adhered to the PCB through heat conduction patch glue.

Compared with the prior art, the technical scheme of the utility model has the following technical effects: according to the LCC optical module, the accommodating cavity is formed by designing the upper cover plate, the annular frame and the carrier plate, and the chip assembly and the FA optical connector are positioned in the accommodating cavity; the FA support is fixed on the carrier plate, and an adhesive is filled in a gap between the FA support and the FA optical connector, so that the FA optical connector, the FA support and the carrier plate can be fixed into a whole, and the light path stability is ensured; moreover, gaps between the FA support and the FA optical connector are filled with the adhesive, the periphery of the FA optical connector is completely wrapped with the adhesive, and thermal stress can be brought when the ambient temperature changes, but the periphery of the FA optical connector is evenly wrapped with the adhesive, the periphery is evenly stressed, the FA optical path is not easy to deviate, and the technical problem that the FA optical connector is easy to deviate in the prior art is solved. Fixing the FA optical connector by adopting an FA bracket, weakening the influence of thermal stress on an optical path, and widening the service temperature range of the optical module; the optical fiber is fixed and arranged in the tail pipe, so that the light path stability is prevented from being influenced by external force.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a front structure of one embodiment of an LCC optical module in accordance with the teachings of the present utility model;

FIG. 2 is a schematic diagram of the back structure of one embodiment of an LCC optical module in accordance with the teachings of the present utility model;

FIG. 3 is an exploded view of FIG. 1;

FIG. 4 is a schematic view of the installation of an FA bracket and an FA optical connector;

FIG. 5 is a cross-sectional view of FIG. 4;

FIG. 6 is a schematic diagram of the structure of an FA optical fiber assembly;

FIG. 7 is a schematic structural view of a tail plug;

FIG. 8 is a schematic view of the tailpipe and ring frame construction;

FIG. 9 is a cross-sectional view of FIG. 8;

FIG. 10 is a schematic view of the structure of the tailpipe with the tailplug installed therein;

FIG. 11 is a schematic view of the installation of the shield with the FA bracket;

FIG. 12 is a schematic structural view of the FA stent;

fig. 13 is a schematic structural view of the shield.

Reference numerals:

10. a carrier plate; 11. a PCB board; 12. a ceramic substrate;

20. an annular frame;

30. a tail pipe; 31. a limit stop;

40. a tail plug; 41. a first riser; 42. a second riser; 43. a cross plate; 43-1, limit protrusions; 43-2, through holes;

50. an upper cover plate;

60. a chip assembly; 61. an electrical chip; 62. an optical chip;

70. FA fiber assembly; 71. an optical fiber ribbon; 72. FA optical connector; 72-1, a substrate; 72-2, cover plate; 73. a silicone tube;

80. FA rack;

81. a first vertical support plate; 81-1, transverse flanging;

82. a second vertical support plate; 82-1, transverse flanging;

83. a transverse support plate;

90. a protective cover; 91. a first positioning column; 92. a second positioning column;

100. and (5) a screw.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by one of ordinary skill in the art without undue burden on the person of ordinary skill in the art based on the embodiments of the present utility model, are intended to be within the scope of the present application.

In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and therefore should not be construed as limiting the present application.

In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or an implicit indication of the number of technical features being indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.

The LCC optical module of the present embodiment includes a carrier plate 10, an annular frame 20, an upper cover plate 50, a chip assembly 60, an FA optical fiber assembly 70, an FA bracket 80, and the like, as shown in fig. 1 to 13.

A carrier plate 10, which serves as a carrier for mounting the chip assembly 60 and the ring frame 20.

An annular frame 20 fixed to the carrier plate 10. The peripheral edge of the top end surface of the carrier plate 10 is provided with a mounting area, and the bottom end surface of the annular frame 20 is contacted with the mounting area of the carrier plate 10 and welded together by soldering tin.

An upper cover plate 50 provided to cover the ring frame 20, and the upper cover plate 50 is connected to the ring frame 21. The upper cover plate 50 forms a containing chamber with the annular frame 20 and the carrier plate 10. The upper cover plate 50 is fastened to the top of the ring frame 20 by screws 100.

A chip assembly 60, which is fixed on the carrier plate 10. The chip assembly 60 includes an electrical chip 61 and an optical chip 62, the electrical chip 61 and the optical chip 62 being bonded to the carrier plate 10. The chip assembly 60 is located within the receiving chamber.

FA fiber assembly 70 includes FA optical splice 72, fiber optic ribbon 71, and a pigtail optical interface (not shown). One end of the optical fiber ribbon 71 is connected with an FA optical connector 72, the FA optical connector 72 is positioned in the accommodating cavity, and the FA optical connector 72 is adhered to the carrier plate 10; the fiber optic ribbon 71 of the FA fiber optic assembly passes through the ring frame 20. The other end of the optical fiber ribbon 71 is connected to a tail optical interface, which is located outside the accommodating chamber and is used for connecting with other devices for optical signal transmission.

FA brackets 80 that are straddled on both sides of the FA optical connector 72 and are fixed to the carrier plate 10. For example, the FA frame 80 is soldered to the carrier plate 10 by solder. The FA bracket 80 and the FA optical connector 72 have a gap therebetween, and the gap is filled with an adhesive. Thus, the FA bracket 80 is not in direct contact with the FA optical connector 72, but is fixed together by an adhesive.

The FA bracket 80 is fixed on the carrier plate 10, and the gap between the FA bracket 80 and the FA optical connector 72 is filled with an adhesive, and the FA optical connector 72, the FA bracket 80 and the carrier plate 10 can be fixed together by the adhesive, so that the optical path can be firmly fixed. Meanwhile, gaps between the FA support 80 and the FA optical connector 72 are completely filled by the adhesive, the periphery of the FA optical connector 72 is completely wrapped by the adhesive, thermal stress can be brought when the ambient temperature changes, the periphery of the FA optical connector is evenly wrapped by the adhesive, the periphery is evenly stressed, and the FA optical path is not easy to deviate.

The FA optical connector 72 has a base plate 72-1 and a cover plate 72-2, as shown in FIGS. 5 and 6; the lower surface of the base plate 72-1 has a V-shaped groove for placing the optical fiber ribbon 71, and the upper surface of the cover plate 72-2 covers the V-shaped groove and is bonded with the base plate 72-1; the lower surface of the cover plate 72-2 is adhered to the carrier plate 10. One end of the optical fiber ribbon 71 is placed in the V-groove, and coupled to and aligned with the optical chip 62 for optical signal transmission. Both the base plate 72-1 and the cover plate 72-2 are made of glass.

The LCC optical module of the present embodiment forms a receiving chamber by designing the upper cover plate 50, the ring frame 20, and the carrier plate 10, and the chip assembly 60 and the FA optical connector 72 are located in the receiving chamber; the FA support 80 is fixed on the carrier plate 10, and an adhesive is filled in a gap between the FA support 80 and the FA optical connector 72, so that the FA optical connector 72, the FA support 80 and the carrier plate 10 can be fixed into a whole, and the light path stability is ensured; moreover, gaps between the FA support 80 and the FA optical connector 72 are filled with adhesive, the periphery of the FA optical connector 72 is completely wrapped with the adhesive, and thermal stress is brought when the ambient temperature changes, but the periphery of the FA optical connector 72 is evenly wrapped with the adhesive, the periphery is evenly stressed, the FA optical path is not easy to deviate, and the technical problem that the FA optical connector is easy to deviate in the prior art is solved.

In some embodiments of the present application, the FA bracket 80 is inverted U-shaped, and includes a lateral support plate 83, a first vertical support plate 81, and a second vertical support plate 82, as shown in fig. 4, 5, and 12. The first vertical supporting plates 81 and the second vertical supporting plates 82 are arranged at intervals and positioned below the transverse supporting plates 83, and the transverse supporting plates 83 are respectively connected with the first vertical supporting plates 81 and the second vertical supporting plates 82.

The FA brackets 80 are arranged on opposite sides of the FA optical connector 72 in a straddling manner, and the transverse supporting plate 83 is positioned above the FA optical connector 72; a gap is formed between the lateral support plate 83 and the top end of the FA optical connector 72, and the gap is filled with an adhesive.

The first vertical supporting plate 81 and the second vertical supporting plate 82 are respectively positioned at two sides of the FA optical joint 72; a gap is formed between the first vertical support plate 81 and one side of the FA optical connector 72, and the gap is filled with an adhesive; a gap is formed between the second vertical support plate 82 and the other side of the FA optical connector 72, and the gap is filled with adhesive; the gap width between the two vertical support plates and the FA optical joint 72 is equal. The gaps are the same, the glue coating amount is basically the same, and the stress brought by the colloid when the colloid is deformed is basically the same. The connection between the FA bracket 80 and the FA optical connector 72 is made more stable and reliable.

The bottom end surface of the first vertical support plate 81 has a lateral fold 81-1, and the bottom end surface of the second vertical support plate 82 has a lateral fold 82-1; the lateral folds 81-1 and the lateral folds 82-1 are soldered to the carrier plate 10. The contact area between the FA support 80 and the carrier plate 10 is increased by the transverse folded edges 81-1 and the transverse folded edges 82-1, and the connection stability of the FA support 80 and the carrier plate 10 is further improved.

In some embodiments of the present application, a tail pipe 30 is disposed on an outer side surface of the ring frame 20, the tail pipe 30 is hollow, and two ends are provided with openings; the tailpipe 30 communicates with the containment chamber; fiber optic ribbon 71 passes through tailpipe 30; the tail pipe 30 and the optical fiber ribbon 71 are fixed by an adhesive, so that the optical fiber ribbon 71 is prevented from shaking.

One end of the optical fiber ribbon 71 passes through the tail pipe 30 into the accommodating chamber, and the adhesive is filled in the tail pipe 30, so that the optical fiber ribbon 71 and the tail pipe 30 can be fixed as a whole. If an external force is applied to the optical fiber ribbon 71, the external force can be prevented from being transmitted to the optical path inside the optical module. In addition, the optical fiber ribbon 71 is fixed in the tail pipe 30, so that the optical path can be moved to the tail pipe 30 to the maximum extent, and the optical fiber can be fixed without occupying the space for placing the internal components, thereby further reducing the structural size of the optical module.

The optical fiber ribbon 71 has a section of optical fiber ribbon without heat shrink tubing and silica gel tubing. And the optical fiber is positioned in the tail pipe 30 and fixed with the tail pipe 30 through an adhesive.

Accordingly, the fiber ribbon 71 has no portion inside the housing chamber and the tail pipe 30, and has a heat shrink tube and a silicone tube 73 on the outside, as shown in fig. 6.

The LCC optical module adopts the FA bracket to fix the FA optical connector, reduces the influence of thermal stress on an optical path, and widens the service temperature range of the optical module; the optical fiber is fixed and arranged in the tail pipe, so that the light path stability is prevented from being influenced by external force.

In some embodiments of the present application, an inverted U-shaped tail plug 40 is disposed in the tail pipe 30, as shown in fig. 7; the tail plug 40 comprises a cross plate 43 and two risers: a first riser 41, a second riser 42; the first riser 41 and the second riser 42 are arranged at intervals and positioned below the transverse plate 43, and the transverse plate 43 is connected with the first riser 41 and the second riser 42 respectively.

Tail plugs 40 straddle the optical fiber ribbon 71; the cross plate 43 is positioned above the optical fiber ribbon 71, a gap is formed between the cross plate 43 and the optical fiber ribbon 71, and the gap is filled with an adhesive.

The first riser 41 and the second riser 42 are respectively positioned at two sides of the optical fiber ribbon 71; a gap is formed between the first vertical plate 41 and the optical fiber ribbon 71, and the gap is filled with adhesive; a gap is formed between the second riser 42 and the optical fiber ribbon 71, and the gap is filled with adhesive; the adhesive is filled between the optical fiber ribbon 71 and the tail plug 40, and the adhesive is filled between the tail plug 40 and the tail pipe 30, so that the optical fiber ribbon 71, the tail plug 40 and the tail pipe 30 are stably connected.

The tail plug 40 is used to facilitate the flow and spreading of the adhesive in the tail pipe 30 and to enhance the bonding effect of the adhesive. By designing the tail plug 40 in the tail pipe 30, the strength of the connection between the tail pipe 30 and the adhesive or the optical fiber ribbon 71 can be improved.

In some embodiments of the present application, the top end surface of the transverse plate 43 has a limiting protrusion 43-1; the tail pipe 30 has a limit stopper 31 on its inner peripheral surface, as shown in fig. 7, 9 and 10.

When the tail plug 40 moves to the limit position in the tail pipe 30 in a direction approaching the ring frame 20, the limit projection 43-1 contacts the limit stopper 31. The limit stop 31 prevents the tail plug 40 from continuing to move in a direction approaching the annular frame 20, avoiding the tail plug 40 from entering the containing chamber.

In some embodiments of the present application, the cross plate 43 has a through hole 43-2 penetrating up and down, as shown in fig. 7, the through hole 43-2 is convenient for the adhesive to flow through, so that the tail plug 40 is completely immersed in the adhesive, and the connection stability of the tail plug 40 and the tail pipe 30 is improved.

In some embodiments of the present application, the carrier board 10 includes a PCB board 11 and a ceramic substrate 12; the ceramic substrate 12 is bonded to the PCB 11 as shown in fig. 10.

The chip assembly 60 includes an electrical chip 61 and an optical chip 62, the electrical chip 61 being bonded to the PCB 11; the optical chip 62 is bonded to the ceramic substrate 12; the FA optical connector 72 is bonded to the ceramic substrate 12. The FA bracket 80 spans opposite sides of the ceramic substrate 12 and is soldered to the PCB 11 by solder.

When the FA optical connector 72 is bonded to the ceramic substrate 12, the optical fiber ribbon 71 is parallel to the axial direction of the tail pipe 30, and a gap is provided between the optical fiber ribbon 71 and the inner peripheral surface of the tail pipe 30, and the gap is filled with glue bonding.

By designing the ceramic substrate 12 such that the optical fiber ribbon 71 is parallel to the axial direction of the tail pipe 30, bending or tilting of the optical fiber ribbon 71 is avoided. A gap is formed between the optical fiber ribbon 71 and the inner peripheral surface of the tail pipe 30, and the gap is filled with an adhesive, so that the optical fiber ribbon 71 and the tail pipe 30 can be stably and reliably connected, and further the stability of optical signal transmission between the FA optical connector 72 and the optical chip 62 is ensured.

In some embodiments of the present application, the LCC light module further includes a protective cover 90, wherein a bottom surface and one of side surfaces of the protective cover 90 have openings; the protection cover 90 is covered on the FA optical connector 72 and the chip assembly 60, and the bottom end surface of the protection cover 90 is contacted and fixed with the PCB 12. For example, the shield 90 is bonded to the PCB 12.

The bottom and side openings of the boot 90 facilitate top-to-bottom covering of the FA optical connector 72 and the chip assembly 60.

The boot 90 is used to secure the FA optical connector 72 and the chip assembly 60 to ensure proper operation of the FA optical connector 72 and the chip assembly 60.

In some embodiments of the present application, one positioning post is disposed on each side of the side opening of the protection cover 90, as shown in fig. 13, one side of the side opening has a first positioning post 91, and the other side has a second positioning post 92. When the shield 90 is placed over the FA optical connector 72 and the chip assembly 60, the two positioning posts are in contact with the two sides of the FA bracket 80, respectively, as shown in fig. 11.

The first positioning post 91 and the second positioning post 92 perform a positioning function, so that the protection cover 90 is conveniently covered on the FA optical connector 72 and the chip assembly 60. When the protective cover 90 is downwards covered, the two positioning columns are contacted with the two sides of the FA support 80 respectively, and then the protective cover 90 is slowly moved down until the bottom end surface of the protective cover 90 is contacted with the PCB 12.

In some embodiments of the present application, the electric chip 61 is adhered to the PCB board 11 through the heat conducting adhesive, so that heat dissipation of the electric chip 61 is quickened, and the electric chip 61 is stably fixed on the PCB board 11. The optical chip 62 is adhered to the ceramic substrate 12 through the heat-conducting adhesive, so that the heat dissipation of the optical chip 62 is quickened, and the optical chip 62 is stably fixed on the ceramic substrate 12; the ceramic substrate 12 is adhered to the PCB 11 through the heat-conducting adhesive, and the connection is stable.

The LCC optical module of the present embodiment can firmly fix the FA optical fiber assembly 70 by adding the FA bracket 80 for welding fixation. Meanwhile, the tail pipe 30 is added on the annular frame 20, the optical fiber ribbon 71 in the tail pipe 30 is fixed in an adhesive mode, the light path stability is improved, and the influence of external force on the light path inside the optical module is prevented. The optical fiber fixing position is transferred to the tail pipe to increase the piece distribution space of the PCB, so that the size of the optical module is further reduced.

The LCC optical module of the embodiment further reduces the size of the optical module, increases the board arrangement space of internal components, adapts to smaller application space and meets the application requirement of small space; the optical path is firmly fixed, the influence of thermal stress on the optical path is reduced, the high-temperature stability of the optical path is increased, the optical fiber is firmly fixed on the premise of not occupying the space of the internal distribution part, and the external force acting on the tail fiber is prevented from influencing the internal optical path.

The LCC optical module of the embodiment has 32 pins on the PCB, and the size of the optical module can be reduced by reducing the number of the pins to 32 by reducing the electrical pins. The annular frame 20 and the upper cover plate 50 are made of high heat conduction materials, the annular frame SMT is attached to the PCB, and the annular frame is connected with the upper cover plate through the screws 100, so that the junction-shell heat resistance can be reduced, the heat dissipation effect of the optical module is improved, and the service temperature interval of the optical module is widened.

The LCC optical module reduces the number of electric pins of the optical module, moves the FA optical path outwards, reduces the space occupied by the optical path for placing components and parts inside, and further compresses the size of the optical module; and fixing and transferring the optical fiber into a tail pipe, and filling glue into the tail pipe to fix the optical fiber. The addition of the FA bracket in the form of a weld secures the FA fiber optic assembly and reduces the effects of thermal stresses on the base plate 72-1 and the cover plate 72-2.

The LCC optical module of the present embodiment is a high-reliability tail-tube-type miniaturized LCC optical module, and the size of the module is reduced by operations such as reducing the number of electrical pins, moving the optical path outward, and the like. In this embodiment, the FA optical connector is secured using a welded FA bracket, while the fiber ribbon section is secured within the frame tailpipe. The high reliability fixation of the optical path is realized while the miniaturization is satisfied, and the optical path is suitable for optical communication equipment with high-temperature service requirements in a limited space and is suitable for special working conditions such as vibration, impact, temperature change and the like.

The LCC optical module reduces the number of electric pins, the outward-moving FA optical path and the LCC micro-encapsulation size; the size of the optical module can be reduced, and the optical module is suitable for application environments extremely sensitive to the size. Fixing the FA optical connector by adopting a welding FA bracket, and surrounding and coating glue between the FA bracket and the cover plate to fix the FA optical connector; the fixed glue coating amount of the light path is increased, the stability and the reliability of the light path are improved, and the device is suitable for environments such as vibration, impact and the like; the influence of thermal stress on the light path is reduced. Reinforcing the fiber-incorporated part in the tail pipe, and bonding the fiber-incorporated part and the tail pipe into a whole; external force acting on the tail fiber can be shielded, so that the influence of the external force on an internal light path is minimized; the optical fiber is fixed outside, so that the space of internal components can be saved.

The assembling process of the LCC optical module comprises the following steps:

(1) The SMT technology patch for the PCB is characterized in that an annular frame and an FA bracket are SMT on the PCB.

(2) The electric chip is adhered to the PCB by adopting heat conduction patch glue, the optical chip is adhered to the ceramic substrate by adopting heat conduction patch glue, and the ceramic substrate is fixed on the PCB by adopting heat conduction patch glue.

(3) The electric chip is interconnected with the printed pattern of the PCB board through a gold wire bonding process. The optical chip is interconnected with the electrical chip by a gold wire bonding process.

(4) The FA optical fiber is coupled with the photosensitive surfaces of the chips such as a laser array, a detector array and the like in the optical chip and aligned; the FA optical fiber is preliminarily fixed by applying a glue between the cover plate 72-2 and the base plate 72-1. The adhesive then fills the adhesive around the cover plate 72-2, and the adhesive completely fills the gap between the FA bracket and the cover plate 72-2, securing the FA optical connector and the FA bracket as a unit.

(5) The plastic tail plug is arranged in the tail pipe, and the tail plug has the functions of facilitating the flowing and spreading of the adhesive in the tail pipe and improving the bonding effect of the adhesive.

(6) And filling the tail pipe by injecting glue into the tail pipe from the tail pipe opening position, and fixing the tail pipe with the optical fiber and the frame. The process can fix and tape the optical fiber (optical fiber tape) by installing the tail plug in the tail pipe and then filling the tail pipe with an adhesive. The tail plug and the tail pipe are designed with a limiting function, and the position of the tail plug can be limited in the installation process of the tail plug.

(7) And installing a protective cover, gluing gaps around the protective cover, and sealing and protecting areas such as an electric chip, an optical chip, an FA optical connector and the like. Filling the hollow cavity formed by each part with pouring sealant, and finishing the pouring of the product.

(8) The upper cover plate is fastened to the top of the metal ring frame by screws. The upper cover plate is square, the annular frame is square, and four screws are used for connecting four corners of the upper cover plate with four corners of the annular frame respectively, so that the upper cover plate is stably and reliably connected with the annular frame.

In the process flow, the FA bracket is SMT on the PCB. After the coupling step, a UV adhesive is applied between the cover plate 72-2 and the base plate 72-1 to pre-fix the optical path, and then the adhesive uniformly fills the gap between the FA bracket and the FA optical connector.

In the description of the above embodiments, particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples. The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present utility model should be included in the scope of the present utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.

Claims

1. An LCC optical module, comprising:

a carrier plate;

an annular frame fixed on the carrier plate;

the chip assembly is fixed on the carrier plate;

2. The LCC light module according to claim 1, wherein:

the FA support is of an inverted U shape and comprises a transverse support plate and two vertical support plates;

3. The LCC light module according to claim 1, wherein:

a tail pipe is arranged on the outer side surface of the annular frame and communicated with the accommodating cavity;

4. An LCC light module according to claim 3, wherein:

an inverted U-shaped tail plug is arranged in the tail pipe and comprises a transverse plate and two vertical plates, and the tail plug spans the two sides of the optical fiber ribbon; and an adhesive is filled between the optical fiber ribbon and the tail plug, and an adhesive is filled between the tail plug and the tail pipe.

5. The LCC light module according to claim 4, wherein:

the top end surface of the transverse plate is provided with a limiting bulge; a limiting stop piece is arranged on the inner peripheral surface of the tail pipe;

6. The LCC light module according to claim 4, wherein: the transverse plate is provided with a through hole which penetrates up and down.

7. The LCC light module according to claim 1, wherein:

the carrier plate comprises a PCB and a ceramic substrate; the ceramic substrate is adhered to the PCB;

8. The LCC light module according to claim 7, wherein: the LCC optical module further comprises a protective cover, wherein the bottom surface and one side surface of the protective cover are provided with openings;

9. The LCC light module of claim 8, wherein: two sides of the side opening are respectively provided with a positioning column;

10. The LCC light module according to claim 7, wherein:

the electric chip is adhered to the PCB through heat conduction patch adhesive;

the ceramic substrate is adhered to the PCB through heat conduction patch glue.