CN210323477U

CN210323477U - Optical coupling structure

Info

Publication number: CN210323477U
Application number: CN201921450634.1U
Authority: CN
Inventors: 方刚; 苏超; 高飞; 何帅
Original assignee: Wuhan Aoxin Technology Co ltd
Current assignee: Jiepu Technology Wuhan Co ltd
Priority date: 2019-09-02
Filing date: 2019-09-02
Publication date: 2020-04-14
Anticipated expiration: 2029-09-02

Abstract

The utility model provides an optical coupling structure, includes base plate, chip, optic fibre and connecting block, the chip encapsulate in the base plate includes back, side and waveguide, optic fibre includes the fibre core, the terminal surface of fibre core aim at in the waveguide and through first viscose glue in the side, first viscose comprises refractive index matching fluid, the connecting block including hold lean on in the face of leaning on of optic fibre one side with place in the bottom surface at the back, hold lean on the face with the bottom surface is through the second viscose glue respectively in optic fibre with the back. The optical coupling structure can reduce the complexity of structural design and manufacturing cost and improve the adjustability of optical fibers in the coupling process through the design of the connecting block; through the connection relation among the chip, the optical fiber and the connecting block, the coupling reliability of the optical fiber and the chip can be improved.

Description

Optical coupling structure

Technical Field

The utility model relates to an optical coupling structure especially relates to an optical coupling structure of coupling optic fibre and chip.

Background

In the existing method for coupling the optical fiber and the chip, the optical fiber is firstly assembled and fixed on a bearing block, then the bearing block is clamped by a clamp, the position of the bearing block is adjusted by an adjusting frame, the fiber core end face of the optical fiber is aligned to the waveguide of the chip, and finally the bearing block is fixed on a substrate of the bearing chip, so that the external optical signal is transmitted into the chip through the optical fiber and then converted into an electric signal.

The aforementioned manner of fixing the optical fiber on the carrier block results in the subsequent adjustment of the position of the optical fiber by the carrier block. Since the carrier block is fixed on the substrate, and the position and angle of the carrier block fixed on the substrate are limited, the adjustability of the adjusting frame for adjusting the position and angle of the optical fiber through the carrier block is limited. Therefore, the end face of the fiber core of the optical fiber cannot be accurately aligned with the waveguide of the chip, and the coupling efficiency of the optical fiber is reduced. Therefore, the existing coupling method can only couple single mode fibers, and is not suitable for coupling multi-mode fibers.

In addition, the carrier block needs to be machined to form V-shaped grooves or through holes for the optical fibers to penetrate through, which results in a complex structure and high manufacturing cost of the carrier block.

SUMMERY OF THE UTILITY MODEL

It is an object of the present invention to provide an optical coupling structure that overcomes at least one of the disadvantages of the background art.

The utility model discloses an aim at and solve background technical problem adopt following technical scheme to realize, the foundation the utility model provides an optical coupling structure, including base plate, chip, optic fibre and connecting block, the chip encapsulate in the base plate and include the back, side and form in the waveguide of side, optic fibre includes the fibre core, the terminal surface of fibre core aim at in the waveguide and through first viscose glue bond in the side, first viscose comprises refractive index matching fluid, the connecting block including hold lean on in the face of leaning on of optic fibre one side and place in the bottom surface at the back, hold lean on the face with the bottom surface respectively through the second viscose glue bond in optic fibre with the back, the connecting block is located at the interval the top of base plate, just the second viscose with first viscose looks interval.

The utility model discloses an optical coupling structure, the face of leaning on is the straight facade of side.

The utility model discloses an optical coupling structure, the connecting block still includes first block, first block have hold the face of leaning on and with inject the confession between the side the fluting of a part of holding of first viscose, glue admittedly in hold the face of leaning on with between the optic fibre the second viscose passes through the fluting with first viscose looks interval just follows the length direction of optic fibre is glued admittedly optic fibre.

The utility model discloses an optical coupling structure, first block is the L type of lying and has preceding terminal surface, be on the contrary the rear end face of preceding terminal surface and connect in the lower surface on the top of preceding terminal surface, the side with preceding terminal surface is along fore-and-aft direction looks interval, the side preceding terminal surface and the lower surface is injectd jointly the fluting, the second viscose is followed preceding terminal surface extends to the rear end face.

The utility model discloses an optical coupling structure, the connecting block still includes the second block, the second block connect integratively in the front end of first block has the bottom surface.

The utility model discloses an optical coupling structure, the connecting block is the L type of lying, the length that the second block was got along the fore-and-aft direction is greater than first block is followed the length that the fore-and-aft direction was got, the perpendicular to is followed to the second block the width that the left and right sides direction of fore-and-aft direction was got is greater than first block is followed the width that the left and right sides direction was got.

The utility model discloses an optical coupling structure, connecting block formula single component as an organic whole.

The utility model discloses an aim at and solve background technical problem adopt following technical scheme to realize, the foundation the utility model provides an optical coupling structure, including base plate, chip, optic fibre and connecting block, the chip encapsulate in the base plate and including the back, side and form in the waveguide of side, optic fibre includes the fibre core, the terminal surface of fibre core aim at the waveguide and glue admittedly in the side, the connecting block including hold lean on in the face of leaning on of optic fibre one side and place in the bottom surface at the back, hold lean on the face with the bottom surface respectively glue admittedly in optic fibre with the back.

The utility model discloses an aim at and solve background technical problem adopt following technical scheme to realize, the foundation the utility model provides an optical coupling structure, including base plate, chip, optic fibre and connecting block, the chip encapsulate in the base plate and including the back, side and form in the waveguide of side, optic fibre includes the fibre core, the terminal surface of fibre core aim at the waveguide and glue in the side, the connecting block includes the edge the length direction of optic fibre glue in the first block of optic fibre and with first block is connected and is held and lean on and be fixed in the second block at the back.

The utility model discloses an aim at and solve background technical problem adopt following technical scheme to realize, the foundation the utility model provides an optical coupling structure, including base plate, chip, optic fibre and connecting block, the chip encapsulate in the upper surface of base plate includes the waveguide, optic fibre includes the fibre core, the terminal surface of fibre core aim at the waveguide and glue in the chip, the connecting block includes the edge the length direction of optic fibre glue in the first block of optic fibre and with first block is connected and is held and lean on and be fixed in the second block of the upper surface of chip.

The beneficial effects of the utility model reside in that: through the design of the connecting block, the complexity of structural design and the manufacturing cost can be reduced, and the adjustability of the optical fiber in the coupling process can be improved; through the connection relation among the chip, the optical fiber and the connecting block, the coupling reliability of the optical fiber and the chip can be improved.

Drawings

FIG. 1 is a perspective view of one embodiment of an optical coupling structure of the present invention;

FIG. 2 is an exploded perspective view of FIG. 1 illustrating the assembled relationship between the substrate, the chip, the optical fibers, and the connector block;

FIG. 3 is a perspective view of the chip of FIG. 2 from another perspective;

FIG. 4 is an enlarged view of a portion of the optical fiber of FIG. 2;

FIG. 5 is a perspective view from another perspective of the connector block of FIG. 2;

FIG. 6 is a fragmentary side view of FIG. 1 illustrating a chip packaged in a flip chip package on a substrate;

FIG. 7 is a fragmentary perspective view of FIG. 1 illustrating the optical fiber undergoing an alignment step;

FIG. 8 is an enlarged view of a portion of FIG. 1 illustrating the end face of the optical fiber precisely aligned with the waveguide of the chip;

FIG. 9 is a fragmentary side view of FIG. 1, illustrating the connector block placed on the back side of the chip and bearing against one side of the optical fiber;

FIG. 10 is a fragmentary top view of FIG. 1, illustrating the connector block bearing against one side of the optical fibers and placed on the back side of the chip; and

fig. 11 is a fragmentary side view of fig. 1 illustrating a first adhesive adhered between the chip and the optical fiber, a second adhesive adhered between the connection block and the chip and between the connection block and the optical fiber.

Detailed Description

The present invention will be described in detail below with reference to the accompanying drawings and embodiments.

Referring to fig. 1, which is an embodiment of the optical coupling structure 100 of the present invention, the optical coupling structure 100 includes a substrate 1, a chip 2, an optical fiber 3, and a connection block 4.

Referring to fig. 1 and 2, the top end of the substrate 1 has a step-like structure and includes a first upper surface 11, a second upper surface 12, a side connection surface 13, and a plurality of metal pads 14. The height of the first upper surface 11 in the up-down direction Z is higher than the height of the second upper surface 12 in the up-down direction Z, and the first upper surface 11 and the second upper surface 12 are arranged in the front-rear direction X perpendicular to the up-down direction Z. The side connection face 13 is connected between the first upper face 11 and the second upper face 12. The metal pads 14 are disposed on the first upper surface 11 and arranged in a circle at intervals. In the present embodiment, the substrate 1 is made of low temperature Co-fired Ceramic (LTCC) material, but not limited thereto.

Referring to fig. 2 and 3, the Chip 2 is a silicon optical Chip and can be packaged on the metal pad 14 of the substrate 1 by Flip Chip (Flip Chip). Chip 2 includes a front surface 21, a back surface 22, side surfaces 23, a waveguide 24, a plurality of metal pads 25, and a plurality of solder balls 26. The side surface 23 is connected between the front surface 21 and the back surface 22. A waveguide 24 is formed at the intersection of the side 23 and the front 21. The plurality of metal pads 25 are disposed on the front surface 21 and arranged in a circle at intervals. Each solder ball 26 is disposed on the corresponding metal pad 25 for being soldered to the corresponding metal pad 14 of the substrate 1.

Referring to fig. 2 and 4, the optical fiber 3 of the present embodiment is a cylindrical single-mode optical fiber including a core 31, a cladding 32, and a protective layer 33. The core 31 is used for conducting optical signals and has an end face 311 at the front end, and the end face 311 is used for aligning the waveguide 24 (as shown in fig. 3). The cladding 32 surrounds the core 31 and has an end face 321 flush with the end face 311. The protective layer 33 covers a part of the coating layer 32 to expose a front end of the coating layer 32, and the material of the protective layer 33 is, for example, resin.

Referring to fig. 2 and 5, the connecting block 4 is a one-piece, unitary member, which is L-shaped in a lying position and includes a first block 41 and a second block 42. The first block 41 is in a horizontal L shape and has a bearing surface 411, a first bottom surface 412, a front end surface 413 and a lower surface 414. The seating surface 411 is a side vertical surface and has a lower vertical surface portion 415 and an upper vertical surface portion 416 located above the lower vertical surface portion 415. The lower surface 415 is adapted to abut against the cladding 32 side of the optical fiber 3. The first bottom surface 412 is vertically connected to the bottom end of the lower standing surface portion 415. The front end surface 413 is an upright surface perpendicularly connected to the front end of the lower upright surface portion 415 and the front end of the first bottom surface 412. The lower surface 414 is vertically connected to the bottom end of the upper standing surface portion 416 and the top end of the front end surface 413, and the height of the lower surface 414 in the vertical direction Z is higher than the height of the first bottom surface 412.

The second block 42 is integrally connected to the front end of the first block 41 and protrudes out of the supporting surface 411, the second block 42 is strip-shaped, and the length direction thereof extends along the front-back direction X and has a second bottom surface 421, and the second bottom surface 421 and the lower surface 414 are coplanar for being adhered to the back surface 22 of the chip 2.

In the present embodiment, the length L2 of the second block 42 taken in the front-rear direction X is greater than the length L1 of the first block 41 taken in the front-rear direction X, and the width W2 of the second block 42 taken in the left-right direction Y perpendicular to the front-rear direction X is greater than the width W1 of the first block 41 taken in the left-right direction Y. Therefore, the area of the second bottom 421 of the second block 42 can be designed to be larger, so as to improve the stability of the adhesive on the back 22 of the chip 2. In addition, the volume of the first block 41 can be reduced to reduce the weight of the entire connection block 4, thereby reducing the load applied to the chip 2 by the connection block 4.

The following describes a coupling and sealing method of the optical coupling structure 100 according to the present embodiment:

the coupling packaging method comprises a flip chip packaging step, an alignment step, a connecting block mounting step, a filling step and a curing step.

Referring to fig. 2 and 6, in the flip-chip packaging step, the front surface 21 of the chip 2 is first aligned to the area surrounded by the metal pads 14, and then the chip 2 is placed on the substrate 1 such that each solder ball 26 contacts the corresponding metal pad 14. Next, each solder ball 26 is melted and solidified on the corresponding metal pad 14 by means of hot pressing or reflow. Thus, the chip 2 can be fixed and electrically connected to the substrate 1, and the two together form a semi-finished product. Wherein the side 23 of the chip 2 protrudes a suitable distance beyond the side connection face 13.

Referring to fig. 7, 8 and 9, in the alignment step, the semi-finished product is mounted and positioned on a jig (not shown), and the substrate 1 is energized. The optical fiber 3 is mounted on a fiber holder (not shown) so that the fiber holder holds the optical fiber 3. A six-dimensional adjusting bracket (not shown) is connected to the optical fiber clamp and can adjust the position and angle of the optical fiber 3 by the optical fiber clamp, so that the optical fiber 3 can be freely translated in the front-back direction X, the left-right direction Y, and the up-down direction Z, and can freely rotate around the three directions.

The photoelectric conversion efficiency of the aforementioned semi-finished product is a criterion for determining whether the end face 311 of the optical fiber 3 is accurately aligned with the waveguide 24 of the chip 2. The photoelectric conversion efficiency of the semi-finished product is monitored by a monitoring device (not shown), so that an operator can adjust the position and the angle of the optical fiber 3 through the six-dimensional adjusting bracket according to the value of the photoelectric conversion efficiency. When the value of the photoelectric conversion efficiency reaches the maximum value, it means that the optical fiber 3 is adjusted to the most suitable position and angle, and the end surface 311 is precisely aligned with the waveguide 24 of the chip 2. At this time, the waveguide 24 and the side surface 23 of the chip 2 are spaced apart from the end surfaces 311 and 321 of the optical fiber 3 in the front-rear direction X, respectively.

Referring to fig. 9 and 10, in the connector block mounting step, the second bottom surface 421 of the second block 42 of the connector block 4 is placed on and in contact with the back surface 22 of the chip 2, and the lower standing surface portion 415 of the bearing surface 411 of the first block 41 is in bearing contact with one side of the cladding layer 32 of the optical fiber 3. Wherein the back surface 22 against which the second block 42 bears is the upper surface of the chip 2, as shown in fig. 9. By the design that the supporting surface 411 is a side vertical surface, an operator can conveniently check whether the lower vertical surface 415 is actually supported on one side of the covering layer 32. After the connection block 4 is mounted, a part of the lower surface 414 of the first block 41 is located on the back surface 22, the side surface 23 of the chip 2 is spaced from the front end surface 413 of the first block 41 in the front-back direction X, and the lower surface 414, the front end surface 413 and the side surface 23 together define a slot 43, and the slot 43 is located on the side of the end surfaces 311, 321 of the optical fiber 3. The first bottom surface 412 of the first block 41 is spaced above and not in contact with the second upper surface 12 of the substrate 1. Because the semi-finished product is stably installed and positioned in the jig, and the optical fiber 3 is stably clamped by the optical fiber clamp, the positions of the chip 2 and the optical fiber 3 cannot be influenced in the process that the connecting block 4 is placed on the chip 2 and leans against the optical fiber 3.

Referring to fig. 1 and 11, in the filling step, the first adhesive 5 in a liquid state is filled in the gap between the end surface 311 of the optical fiber 3 and the waveguide 24, and the first adhesive 5 covers the outer periphery of the end surface 321 adjacent to the cladding layer 32, the end surface 321 of the cladding layer 32, the end surface 311 of the core 31, a portion of the front surface 21 and the side surface 23 of the chip 2, and the waveguide 24. Through the design of the slot 43, the operation of filling the first adhesive 5 by an operator is facilitated, so that the first adhesive 5 can completely wrap the outer periphery of the covering layer 32 and is partially accommodated in the slot 43. In the present embodiment, the first adhesive 5 is made of refractive index matching fluid (refractive index Liquids), and the first adhesive 5 is filled in the gap between the end surface 311 of the fiber core 31 and the waveguide 24, so that the optical signal output from the end surface 311 of the fiber core 31 can be smoothly input into the waveguide 24 through the first adhesive 5, thereby reducing reflection and refraction of light at the end surface 311 and reducing loss caused by fresnel reflection.

On the other hand, for example, the liquid second adhesive 6 is filled between the lower standing surface portion 415 of the bearing surface 411 of the first block 41 and the coating layer 32 of the optical fiber 3, and the liquid second adhesive 6 can seep into the gap between the lower standing surface portion 415 and the coating layer 32 to coat a part of the coating layer 32. The slot 43 between the connection block 4 and the chip 2 also plays a role of blocking, so that the second adhesive 6 is separated from the first adhesive 5 by the slot 43, and the liquid second adhesive 6 is prevented from overflowing to the first adhesive 5 and mixing with the first adhesive. Then, the liquid second adhesive 6 is filled between the second bottom 421 of the second block 42 and the back 22 of the chip 2, and the liquid second adhesive 6 seeps into the gap between the second bottom 421 and the back 22. Of course, the second adhesive 6 may be filled between the second bottom 421 of the second block 42 and the back 22 of the chip 2, and then the second adhesive 6 may be filled between the lower standing surface 415 of the bearing surface 411 of the first block 41 and the cladding 32 of the optical fiber 3, or the second adhesive 6 may be filled at the two positions.

In the present embodiment, the second adhesive 6 is filled in the cladding layer 32 and the lower vertical surface 415 along the length direction of the optical fiber 3, so that the area where the second adhesive 6 can adhere to the cladding layer 32 is longer to improve the adhesion stability. More specifically, the second adhesive 6 is filled in a range extending from the front end face 413 of the first block 41 to a rear end face 417 of the first block 41, so that the area where the second adhesive 6 can adhere to the covering layer 32 is longer. The first adhesive 5 and the second adhesive 6 are ultraviolet curing adhesives that can be cured by ultraviolet irradiation.

In the curing step, first, the first adhesive 5 and the second adhesive 6 are irradiated with ultraviolet light under a certain power for a predetermined time, so that the first adhesive 5 and the second adhesive 6 are gradually changed from a liquid state to a solid state. The transition process is slow to prevent the position of the core 31 of the optical fiber 3 and the waveguide 24 from being shifted due to excessive stress release when the first and

second glues

5 and 6 are cured. Subsequently, the fiber clamp is released to release the optical fiber 3, and the substrate 1 is taken out of the jig. The entire assembly shown in fig. 11 is placed in an oven (not shown) and baked, so that the first adhesive 5 and the second adhesive 6 are further cured to enhance the rigidity, thereby increasing the stability of the first adhesive 5 for bonding the optical fiber 3 and the chip 2, and increasing the stability of the second adhesive 6 for bonding the connecting block 4, the optical fiber 3 and the chip 2. After the baking operation is completed, the coupling package of the optical coupling structure 100 is completed.

In the alignment step of the coupling and packaging method, the optical fiber 3 does not need to be assembled and fixed on the connecting block 4 in advance, so the optical fiber clamp can directly clamp the optical fiber 3, and the six-dimensional adjusting bracket can drive the optical fiber 3 to freely translate along the front-back direction X, the left-right direction Y and the up-down direction Z through the optical fiber clamp to adjust the position, and drive the optical fiber 3 to freely rotate around the three directions to adjust the angle. Because the six-dimensional adjusting frame drives the optical fiber 3 to be subjected to position and angle adjustment through the optical fiber clamp, the six-dimensional adjusting frame is not limited, the adjustability of the optical fiber 3 in the coupling process can be improved, and the end face 311 of the fiber core 31 can be accurately aligned to the waveguide 24 to improve the coupling efficiency. Therefore, the optical fiber 3 of the optical coupling structure 100 may be a multimode fiber in addition to a single-mode fiber, and the types of the optical fibers 3 that can be coupled are wide.

In addition, the optical fiber 3 and the chip 2 are fixed by the connection block 4 through the second adhesive 6, and when the substrate 1 undergoes a volume change due to expansion or contraction due to a temperature change, the chip 2, the connection block 4, and the optical fiber 3 are displaced together with the volume change of the substrate 1. Since the first bottom surface 412 of the connecting block 4 is spaced apart from the substrate 1 and does not contact the substrate 1, the volume change of the substrate 1 can be prevented from directly affecting the connecting block 4 and the optical fiber 3 fixed to the connecting block 4. Because the first adhesive 5, the second adhesive 6 adhered between the chip 2 and the connecting block 4, and the second adhesive 6 adhered between the optical fiber 3 and the connecting block 4 are in a mutually separated state, the second adhesive 6 can be prevented from expanding or contracting due to temperature change to directly affect the first adhesive 5, so that the degree of relative displacement between the end surface 311 of the fiber core 31 and the waveguide 24 of the chip 2 is reduced. Thereby, the reliability of the coupling between the optical fiber 3 and the chip 2 of the optical coupling structure 100 can be improved.

Furthermore, the connecting block 4 is supported by one side of the optical fiber 3 through the supporting surface 411, so that the connecting block 4 does not need to be additionally processed to form a V-shaped groove or a through hole for the optical fiber 3 to pass through. Since the connecting block 4 is an integrated single member manufactured by machining, the complexity of the structural design and the manufacturing cost of the connecting block 4 can be reduced without additionally machining a V-shaped groove or a through hole.

To sum up, the optical coupling structure 100 of the present embodiment can reduce the complexity of the structural design and the manufacturing cost by the design of the connection block 4, and can improve the adjustability of the optical fiber 3 in the coupling process; through the relation of connection between chip 2, optic fibre 3 and the connecting block 4, can promote the reliability of optic fibre 3 and chip 2 coupling, can reach really the utility model discloses the purpose of seeking.

Claims

1. A light coupling structure, characterized by:

the optical coupling structure includes base plate, chip, optic fibre and connecting block, the chip encapsulate in the base plate and include the back, side and form in the waveguide of side, optic fibre includes the fibre core, the terminal surface of fibre core aim at in the waveguide and through first viscose glue in the side, first viscose comprises refractive index matching fluid, the connecting block including hold lean on in the face of leaning on of optic fibre one side and place in the bottom surface at the back, hold lean on the face with the bottom surface respectively through the second viscose glue in optic fibre with the back, the connecting block interval is located the top of base plate, just the second viscose with first viscose looks interval.

2. The light coupling structure of claim 1, wherein: the bearing surface is a side vertical surface.

3. The light coupling structure of claim 1, wherein: the connecting block further comprises a first block body, the first block body is provided with the bearing surface and a groove for accommodating a part of the first adhesive is defined between the side surfaces, and the second adhesive is adhered between the bearing surface and the optical fibers and is adhered to the optical fibers through the groove and the first adhesive at intervals and along the length direction of the optical fibers.

4. The light coupling structure of claim 3, wherein: the first block body is in a horizontal L shape and is provided with a front end face, a rear end face opposite to the front end face and a lower surface connected to the top end of the front end face, the side face and the front end face are spaced at intervals in the front-back direction, the side face, the front end face and the lower surface jointly limit the groove, and the second adhesive extends to the rear end face from the front end face.

5. The light coupling structure of claim 3, wherein: the connecting block further includes a second block integrally connected to a front end of the first block and having the bottom surface.

6. The light coupling structure of claim 5, wherein: the connecting block is in a horizontal L shape, the length of the second block body taken along the front-back direction is larger than that of the first block body taken along the front-back direction, and the width of the second block body taken along the left-right direction perpendicular to the front-back direction is larger than that of the first block body taken along the left-right direction.

7. The light coupling structure of claim 1, wherein: the connecting block is an integrated single component.

8. A light coupling structure, characterized by:

the optical coupling structure comprises a substrate, a chip, an optical fiber and a connecting block, wherein the chip is packaged on the substrate and comprises a back face, a side face and a waveguide formed on the side face, the optical fiber comprises a fiber core, the end face of the fiber core is aligned to the waveguide and is adhered to the side face, the connecting block comprises a bearing face bearing against one side of the optical fiber and a bottom face placed on the back face, and the bearing face and the bottom face are adhered to the optical fiber and the back face respectively.

9. A light coupling structure, characterized by:

the optical coupling structure comprises a substrate, a chip, an optical fiber and a connecting block, wherein the chip is packaged on the substrate and comprises a back face, a side face and a waveguide formed on the side face, the optical fiber comprises a fiber core, the end face of the fiber core is aligned to the waveguide and is adhered to the side face, and the connecting block comprises a first block body adhered to the optical fiber along the length direction of the optical fiber and a second block body connected with the first block body and bearing against and fixed on the back face.

10. A light coupling structure, characterized by:

the optical coupling structure comprises a substrate, a chip, an optical fiber and a connecting block, wherein the chip is packaged on the upper surface of the substrate and comprises a waveguide, the optical fiber comprises a fiber core, the end surface of the fiber core is aligned to the waveguide and is adhered to the chip, and the connecting block comprises a first block body adhered to the optical fiber along the length direction of the optical fiber and a second block body connected with the first block body and bearing against and fixed on the upper surface of the chip.