CN220740594U

CN220740594U - Sapphire wafer production and processing is with equipment of polishing

Info

Publication number: CN220740594U
Application number: CN202322380672.7U
Authority: CN
Inventors: 郑东; 王鑫; 刘奔
Original assignee: Qingdao Xinkang Semiconductor Technology Co ltd
Current assignee: Qingdao Xinkang Semiconductor Technology Co ltd
Priority date: 2023-09-04
Filing date: 2023-09-04
Publication date: 2024-04-09
Anticipated expiration: 2033-09-04

Abstract

The utility model relates to the technical field of polishing equipment, and discloses polishing equipment for producing and processing sapphire wafers. According to the utility model, the rotary station is utilized to push the polishing mold to circularly rotate, the sapphire wafers in the bin mechanism are sequentially fed into the polishing mold by the material taking mechanism under the condition that the sapphire wafers are sequentially picked up by the suction cups, the sapphire wafers are rotationally conveyed to the lower part of the polishing mechanism for polishing, the sequentially polished sapphire wafers are circularly picked up by the material taking mechanism of another group, and the polished sapphire wafers are circularly picked up and discharged into the bin mechanism of another group, so that the sapphire wafers are only required to be periodically picked up and discharged.

Description

Sapphire wafer production and processing is with equipment of polishing

Technical Field

The utility model relates to the technical field of polishing equipment, in particular to polishing equipment for sapphire wafer production and processing.

Background

The sapphire wafer is a semiconductor material with wide application, and has important roles in the fields of electronics and optics due to the unique physical characteristics, such as an LED wafer substrate, a biochip, a laser, an optical fiber device and the like, after cutting is finished, the sapphire wafer generally needs to be subjected to polishing procedures on crystal faces so as to improve the wave permeability, smoothness and other performances of the crystal faces, the sapphire wafer is usually polished by polishing equipment, however, when the sapphire wafer is polished by the existing polishing equipment, the sapphire wafer is polished by adopting a manual feeding mode, the cyclic operation is complicated, and meanwhile, the cyclic polishing efficiency of the sapphire wafer is lower, so that the continuous polishing of the sapphire wafer is not facilitated. To this end, a polishing apparatus for sapphire wafer production and processing is provided by those skilled in the art to solve the problems set forth in the background art.

Disclosure of Invention

The utility model mainly aims to provide polishing equipment for sapphire wafer production and processing, which can effectively solve the problems of complicated cyclic feeding and low polishing efficiency of the existing sapphire wafer in the prior art when polishing work is carried out.

In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows: the polishing equipment for the production and processing of the sapphire wafers comprises a processing box frame, a rotating station, a polishing die, a stock bin mechanism, a material taking mechanism and a polishing mechanism;

the rotary station is assembled in the middle of the box body of the processing box frame, and a plurality of groups of polishing dies are arranged above the station disc of the rotary station along the circumferential direction of the station disc;

the number of the bin mechanisms is two, and the two bin mechanisms are symmetrically assembled on two sides of the rotary station;

the number of the material taking mechanisms is two, and each group of material taking mechanisms is sequentially assembled between the bin mechanism and the rotary station;

the polishing mechanism is vertically arranged and assembled at the rear side of the rotary station.

As still further aspects of the utility model: the bin mechanism comprises a supporting base, three groups of positioning bolts are arranged on the upper plate surface of the supporting base in a star-delta mode, a storage bin is clamped above a support seat of the supporting base, and three groups of positioning plug bushes which are buckled with the positioning bolts are arranged at the bottom of a cylinder seat of the storage bin in a star-delta mode.

As still further aspects of the utility model: the material taking mechanism comprises a supporting vertical frame, a material taking rail is arranged at the top end of a support of the supporting vertical frame, synchronous pulleys are arranged at two ends of a guide rail of the material taking rail, two groups of output ends of one group of synchronous pulleys are provided with a transmission motor fixed on the material taking rail, the two groups of synchronous pulleys are connected through a synchronous belt, a conveying belt of the synchronous belt is connected with a material taking sliding table guided by the material taking rail, an electric push rod is arranged at the front end of the support of the material taking sliding table, and a sucker is arranged at the telescopic end of the electric push rod.

As still further aspects of the utility model: the polishing dies are symmetrically arranged in an annular mode along the station disc of the rotary station.

As still further aspects of the utility model: the polishing mechanism comprises a Z-axis track, a Z-axis screw rod is arranged in the middle of a guide rail of the Z-axis track, a Z-axis sliding table guiding the Z-axis track is sleeved at the end of a shaft rod of the Z-axis screw rod, an X-axis track is arranged above a rack of the Z-axis sliding table, an X-axis screw rod is arranged in the middle of the guide rail of the X-axis track, an X-axis sliding table guiding the X-axis track is sleeved at the end of the shaft rod of the X-axis screw rod, a Y-axis screw rod is arranged at the front side of a rack of the X-axis sliding table, a Y-axis sliding table guiding the Y-axis track is sleeved at the end of the shaft rod of the Y-axis screw rod, a polishing stand is arranged at the front side of the rack of the Y-axis sliding table, a polishing head is arranged at the bottom end of a rack of the polishing stand, a polishing motor is arranged at the top of the rack of the polishing stand, and the polishing head is connected with the polishing motor through a polishing transmission belt.

As still further aspects of the utility model: the bottom of the guide rail of the Z-axis track is provided with a Z-axis motor which is right opposite to the output end at one end of the Z-axis screw rod, and the Z-axis motor is connected with the Z-axis screw rod through a Z-axis transmission belt.

As still further aspects of the utility model: an X-axis motor which is right opposite to the output end of one end of the X-axis screw rod is arranged on the guide rail backboard of the X-axis track, and the X-axis motor is connected with the X-axis screw rod through an X-axis transmission belt.

As still further aspects of the utility model: and a Y-axis motor which is right opposite to the output end at one end of the Y-axis screw rod is arranged at the top of the guide rail of the Y-axis track, and the Y-axis motor is connected with the Y-axis screw rod through a Y-axis transmission belt.

Compared with the prior art, the utility model has the following beneficial effects:

according to the utility model, the rotary station is utilized to push the polishing mold to circularly rotate, the sapphire wafers in the bin mechanism are sequentially fed into the polishing mold by the material taking mechanism under the condition that the sapphire wafers are sequentially picked by the suction cups, the sapphire wafers are rotationally conveyed to the lower part of the polishing mechanism for polishing, the sequentially polished sapphire wafers are circularly picked and discharged into the other bin mechanism under the condition that the other group of the material taking mechanisms are circularly picked, and the polished sapphire wafers have good mechanical linkage performance.

Drawings

FIG. 1 is a schematic structural view of polishing equipment for producing and processing sapphire wafers;

FIG. 2 is a schematic plan view of a polishing apparatus for producing and processing sapphire wafers according to the present utility model;

FIG. 3 is a schematic structural view of a bin mechanism in polishing equipment for sapphire wafer production and processing according to the present utility model;

FIG. 4 is a schematic structural view of a material taking mechanism in polishing equipment for producing and processing sapphire wafers;

fig. 5 is a schematic structural view of a polishing mechanism in polishing equipment for sapphire wafer production and processing according to the present utility model.

In the figure: 1. processing a box frame; 2. a rotating station; 3. polishing a die; 4. a stock bin mechanism; 41. a support base; 42. positioning a bolt; 43. positioning the plug bush; 44. placing a storage bin; 5. a material taking mechanism; 51. a supporting stand; 52. a drive motor; 53. a material taking track; 54. a synchronous pulley; 55. a synchronous belt; 56. a material taking sliding table; 57. an electric push rod; 58. a suction cup; 6. a polishing mechanism; 61. a Z-axis track; 62. a Z-axis screw rod; 63. a Z-axis sliding table; 64. a Z-axis motor; 65. a Z-axis transmission belt; 66. an X-axis track; 67. an X-axis motor; 68. an X-axis transmission belt; 69. an X-axis screw rod; 610. an X-axis sliding table; 611. a Y-axis track; 612. a Y-axis screw rod; 613. a Y-axis motor; 614. a Y-axis transmission belt; 615. a Y-axis sliding table; 616. polishing head; 617. polishing a transmission belt; 618. polishing the vertical frame; 619. and (5) polishing the motor.

Detailed Description

The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-5, a polishing device for producing and processing a sapphire wafer includes a processing box frame 1, a rotating station 2, a polishing mold 3, a bin mechanism 4, a material taking mechanism 5 and a polishing mechanism 6, wherein the number of the bin mechanisms 4 is two, the two bin mechanisms 4 are symmetrically assembled on two sides of the rotating station 2, the bin mechanism 4 includes a supporting base 41, three groups of positioning pins 42 are mounted on the upper plate surface of the supporting base 41 in a star-delta form, a material placing bin 44 is clamped above a support seat of the supporting base 41, three groups of positioning pins 43 buckled with the positioning pins 42 are arranged at the bottom of a cylinder seat of the material placing bin 44 in a star-delta form, when the polishing device is used for polishing the sapphire wafer, the cut sapphire wafer to be polished is sequentially stacked in the material placing bin 44, after stacking, the material placing bin 44 loaded with the sapphire wafer is clamped on the supporting base 41 by the positioning pins 42 corresponding to the insertion of the positioning pins 43, so that the sapphire wafer is vertically placed under the material taking mechanism 5, the sapphire wafer is synchronously unloaded, and the sapphire wafer is sequentially unloaded from another group of the material taking mechanism.

The number of the material taking mechanisms 5 is two, each material taking mechanism 5 is assembled between the bin mechanism 4 and the rotary station 2 in sequence, the material taking mechanism 5 comprises a supporting vertical frame 51, a material taking rail 53 is installed at the top end of a support of the supporting vertical frame 51, synchronous pulleys 54 are installed at two ends of a guide rail of the material taking rail 53, a transmission motor 52 fixed on the material taking rail 53 is installed at one output end of the two synchronous pulleys 54, the two synchronous pulleys 54 are connected through a synchronous belt 55, a transmission belt of the synchronous belt 55 is connected with a material taking sliding table 56 guided by the material taking rail 53, an electric push rod 57 is installed at the front end of the support of the material taking sliding table 56, a sucking disc 58 is installed at the telescopic end of the electric push rod 57, in the process of polishing a sapphire wafer by utilizing polishing equipment, the telescopic end of the electric push rod 57 is controlled to stretch out, the sucking disc 58 is detected into the material placing bin 44, after material taking is completed, the transmission motor 52 is controlled to operate, the synchronous pulleys 54 are driven to rotate, the synchronous driving synchronous belt 55 is driven to rotate, the synchronous driving synchronous belt 56 is pushed to slide the material taking table 53 along the direction of the material taking rail 53, the material taking tool is pushed to slide horizontally, and the sapphire wafer is polished by the electric push rod 58 to the inside the die 3, and the sapphire is polished.

The rotary station 2 is assembled in the middle of the box body of the processing box frame 1, a plurality of groups of polishing dies 3 are arranged above the station disc of the rotary station 2 along the circumferential direction of the rotary station, the plurality of groups of polishing dies 3 are symmetrically arranged in a ring shape along the station disc of the rotary station 2, when the sapphire wafer is polished by utilizing polishing equipment, the polishing dies 3 after being fed are rotationally conveyed to the position right below the polishing mechanism 6 to perform polishing work by utilizing the rotary transmission of the rotary station 2, and the unloaded polishing dies 3 are sequentially rotated beside the feeding station to perform cyclic feeding work, and continuous material taking, feeding and polishing work is performed on the sapphire wafer.

The polishing mechanism 6 is vertically arranged and assembled at the rear side of the rotary station 2, the polishing mechanism 6 comprises a Z-axis track 61, a Z-axis screw rod 62 is arranged in the middle of a guide rail of the Z-axis track 61, a Z-axis sliding table 63 guided by the Z-axis track 61 is sleeved at the end of a shaft rod of the Z-axis screw rod 62, an X-axis track 66 is arranged above a rack of the Z-axis sliding table 63, a Z-axis motor 64 right opposite to the output end of one end of the Z-axis screw rod 62 is arranged at the bottom of the guide rail of the Z-axis track 61, the Z-axis motor 64 is connected with the Z-axis screw rod 62 through a Z-axis transmission belt 65, the Z-axis motor 64 can be controlled to work when a sapphire wafer is circularly conveyed to the right below the polishing mechanism 6 by using polishing equipment, the Z-axis transmission belt 65 drives the Z-axis screw rod 62 to rotate, the rotating force of the Z-axis screw rod 62 is converted into front-back thrust in the rotating process, the Z-axis sliding table 63 is pushed to slide along the front-back direction of the Z-axis track 61, and the front-back direction of the polishing head 616 is flexibly regulated and controlled.

The X-axis screw rod 69 is arranged in the middle of a guide rail of the X-axis rail 66, an X-axis sliding table 610 which is guided by the X-axis rail 66 is sleeved at the end of a shaft rod of the X-axis screw rod 69, a Y-axis rail 611 is arranged at the front side of a rack of the X-axis sliding table 610, an X-axis motor 67 which is right opposite to the output end of one end of the X-axis screw rod 69 is arranged on a guide rail backboard of the X-axis rail 66, the X-axis motor 67 is connected with the X-axis screw rod 69 through an X-axis driving belt 68, in the polishing process of a sapphire wafer by polishing equipment, when the sapphire wafer is circularly conveyed to the position right below the polishing mechanism 6, the X-axis motor 67 can be controlled to work, the X-axis screw rod 69 is driven to rotate through the X-axis driving belt 68, the X-axis sliding table 610 is pushed to slide along the left and right directions of the X-axis rail 66 in the rotating process, and the left and right directions of the polishing head 616 are flexibly regulated and controlled.

The Y-axis screw rod 612 is installed in the middle of a guide rail of the Y-axis track 611, a Y-axis sliding table 615 which is guided by the Y-axis track 611 is sleeved at the shaft rod end of the Y-axis screw rod 612, a polishing vertical frame 618 is installed at the front side of a rack of the Y-axis sliding table 615, a polishing head 616 is installed at the bottom end of a support of the polishing vertical frame 618, a polishing motor 619 is installed at the top end of the support of the polishing vertical frame 618, the polishing head 616 is connected with the polishing motor 619 through a polishing driving belt 617, a Y-axis motor 613 which is right opposite to the output end of one end of the Y-axis screw rod 612 is installed at the top of the guide rail of the Y-axis track 611, the Y-axis motor 613 is connected with the Y-axis screw rod 612 through a Y-axis driving belt 614, when a sapphire wafer is circularly conveyed to the right under the polishing mechanism 6 by polishing equipment, the Y-axis motor 613 can be controlled to work, the Y-axis driving belt 614 drives the Y-axis screw rod 612 to rotate, the Y-axis screw rod 612 converts a regulating and controlling rotating force into a lifting thrust in the rotation process, and the Y-axis sliding table 611 to slide up and down along the Y-axis track 611, and flexible up and down directions of the polishing head 616.

The working principle of the utility model is as follows: in the polishing process of the sapphire wafer by using polishing equipment, the telescopic end of the electric push rod 57 can be controlled to stretch out, the suction disc 58 is inserted into the storage bin 44, negative pressure suction and material taking work is carried out on the stacked sapphire wafer, then after material taking is finished, the transmission motor 52 is controlled to work, the synchronous belt 54 is driven to rotate, the synchronous belt 55 is driven to rotate, the material taking sliding table 56 is driven to slide along the horizontal direction of the material taking track 53, the sapphire wafer on the suction disc 58 is pushed to the position right above the polishing mould 3, the sapphire wafer is placed in the polishing mould 3 by using telescopic transmission of the electric push rod 57, after the material loading of the sapphire wafer is finished, the rotation transmission of the rotation station 2 is utilized, the polishing mould 3 after the material loading is rotated and transmitted to the position right below the polishing mechanism 6 for polishing work, further when the sapphire wafer is circularly conveyed to the position right below the polishing mechanism 6, the Z-axis motor 64 can be controlled to work, the Z-axis screw rod 62 is driven to rotate by the Z-axis transmission belt 65, the Z-axis screw rod 62 converts the rotation force into front-back thrust in the rotating process, the Z-axis sliding table 63 is pushed to slide along the front-back direction of the Z-axis track 61, the front-back direction of the polishing head 616 is flexibly regulated and controlled, the synchronous controllable X-axis motor 67 works, the X-axis screw rod 69 is driven to rotate by the X-axis transmission belt 68, the X-axis screw rod 69 converts the rotation force into horizontal thrust in the rotating process, the X-axis sliding table 610 is pushed to slide along the left-right direction of the X-axis track 66, the left-right direction of the polishing head 616 is flexibly regulated and controlled, the Y-axis motor 613 can be controlled to work, the Y-axis screw rod 612 is driven to rotate by the Y-axis transmission belt 614, the rotation force is converted into lifting thrust by the Y-axis sliding table 615 in the rotating process, the Y-axis sliding table 611 is pushed to slide along the up-down direction of the Y-axis track 611, the upper and lower directions of the polishing head 616 are flexibly regulated and controlled, then after the polishing head 616 is regulated and controlled to be displaced to the upper surface of the sapphire wafer in three directions, the polishing motor 619 is controlled to work, the polishing head 616 is driven to rotate through the polishing driving belt 617 to polish the sapphire wafer, the polished sapphire wafer is rotationally transmitted to the other group of material taking mechanisms 5, the polished sapphire wafer is taken, placed and unloaded into the empty bin mechanism 4, the unloaded polishing mold 3 is sequentially rotated to the side of the material loading station to circularly feed the sapphire wafer, and continuous material taking, polishing and unloading work is carried out on the sapphire wafer.

The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. The polishing equipment for the production and processing of the sapphire wafers is characterized by comprising a processing box frame (1), a rotating station (2), a polishing die (3), a feed bin mechanism (4), a material taking mechanism (5) and a polishing mechanism (6);

the rotary station (2) is assembled in the middle of the box body of the processing box frame (1), and a plurality of groups of polishing dies (3) are arranged above the station disc of the rotary station (2) along the circumferential direction of the station disc;

the number of the bin mechanisms (4) is two, and the two bin mechanisms (4) are symmetrically assembled at two sides of the rotary station (2);

the number of the material taking mechanisms (5) is two, and each group of material taking mechanisms (5) is sequentially assembled between the material bin mechanism (4) and the rotary station (2);

the polishing mechanism (6) is vertically arranged and assembled at the rear side of the rotary station (2).

2. The polishing equipment for sapphire wafer production and processing according to claim 1, wherein the bin mechanism (4) comprises a supporting base (41), three groups of positioning pins (42) are installed on the upper plate surface of the supporting base (41) in a star-delta mode, a storage bin (44) is clamped above a support seat of the supporting base (41), and three groups of positioning plug bushes (43) buckled with the positioning pins (42) are arranged at the bottom of a cylinder seat of the storage bin (44) in a star-delta mode.

3. The polishing device for sapphire wafer production and processing according to claim 1, wherein the material taking mechanism (5) comprises a supporting vertical frame (51), a material taking rail (53) is installed at the top end of a support of the supporting vertical frame (51), synchronous pulleys (54) are installed at two ends of a guide rail of the material taking rail (53), a transmission motor (52) fixed on the material taking rail (53) is installed at one output end of two groups of synchronous pulleys (54), the two groups of synchronous pulleys (54) are connected through a synchronous belt (55), a material taking sliding table (56) guided by the material taking rail (53) is connected with a transmission belt of the synchronous belt (55), an electric push rod (57) is installed at the front end of the support of the material taking sliding table (56), and a sucker (58) is installed at the telescopic end of the electric push rod (57).

4. The polishing equipment for producing and processing the sapphire wafer according to claim 1, wherein a plurality of groups of polishing dies (3) are arranged in an annular symmetrical manner along a station disc of the rotary station (2).

5. The polishing device for sapphire wafer production and processing according to claim 1, wherein the polishing mechanism (6) comprises a Z-axis track (61), a Z-axis screw (62) is installed in the middle of a guide rail of the Z-axis track (61), a Z-axis sliding table (63) guided by the Z-axis track (61) is sleeved on the shaft rod end of the Z-axis screw (62), an X-axis track (66) is installed above a rack of the Z-axis sliding table (63), an X-axis screw (69) is installed in the middle of a guide rail of the X-axis track (66), an X-axis sliding table (610) guided by the X-axis track (66) is sleeved on the shaft rod end of the X-axis screw (69), a Y-axis track (611) is installed in the middle of a guide rail of the X-axis sliding table (610), a Y-axis sliding table (615) guided by the Y-axis track (611) is sleeved on the shaft rod end of the Y-axis screw (612), a polishing stand (618) is installed on the front side of the Y-axis sliding table (615), and a polishing stand (618) is installed on the stand (618), and a polishing stand (619) is installed on the stand (616) is connected with a polishing head (619).

6. The polishing device for sapphire wafer production and processing according to claim 5, wherein a Z-axis motor (64) for outputting an end of a Z-axis screw (62) is installed at the bottom of the guide rail of the Z-axis rail (61), and the Z-axis motor (64) is connected with the Z-axis screw (62) through a Z-axis transmission belt (65).

7. The polishing equipment for sapphire wafer production and processing according to claim 5, wherein the guide rail back plate of the X-axis rail (66) is provided with an X-axis motor (67) which is opposite to the output end of one end of the X-axis screw (69), and the X-axis motor (67) is connected with the X-axis screw (69) through an X-axis transmission belt (68).

8. The polishing device for sapphire wafer production and processing of claim 5, wherein a Y-axis motor (613) for outputting one end of the Y-axis screw (612) is mounted on top of the guide rail of the Y-axis rail (611), and the Y-axis motor (613) is connected with the Y-axis screw (612) through a Y-axis transmission belt (614).