CN220733277U - Power adapter heat abstractor - Google Patents
Power adapter heat abstractor Download PDFInfo
- Publication number
- CN220733277U CN220733277U CN202321950340.1U CN202321950340U CN220733277U CN 220733277 U CN220733277 U CN 220733277U CN 202321950340 U CN202321950340 U CN 202321950340U CN 220733277 U CN220733277 U CN 220733277U
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- China
- Prior art keywords
- plate
- heat dissipation
- power adapter
- fan
- base
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 53
- 238000001816 cooling Methods 0.000 claims abstract description 36
- 230000007246 mechanism Effects 0.000 claims abstract description 17
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000005057 refrigeration Methods 0.000 claims description 24
- 238000009423 ventilation Methods 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 6
- 230000009286 beneficial effect Effects 0.000 description 8
- 230000001681 protective effect Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 238000002791 soaking Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 2
- 206010020649 Hyperkeratosis Diseases 0.000 description 1
- 206010043417 Therapeutic response unexpected Diseases 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model belongs to the technical field of heat dissipation devices, in particular to a heat dissipation device of a power adapter, which comprises a base and a top plate, wherein a first threaded hole is penetrated through the base, a second threaded hole is penetrated through the top plate, a locking bolt is connected between the first threaded hole and the second threaded hole, a bottom cooling mechanism is clamped on the inner side of the base, a top cooling mechanism is clamped on the top plate, side heat dissipation mechanisms are respectively arranged at the top of the base and the bottom of the top plate, a first connecting column and a second connecting column are respectively arranged at the top of the base and the bottom of the top plate, and the top of the first connecting column and the top of the second connecting column are respectively provided with an electrified contact block.
Description
Technical Field
The utility model belongs to the technical field of heat dissipation devices, and particularly relates to a power adapter heat dissipation device.
Background
The Power adapter (Power adapter) is a Power supply conversion device for small portable electronic equipment and electronic appliances, and generally consists of components such as a shell, a transformer, an inductor, a capacitor, a control IC, a PCB (printed circuit board) and the like, and the working principle of the Power adapter is that an alternating current input is converted into a direct current output; the connection mode can be divided into a wall-inserted type and a desktop type. The power adapter is widely matched with equipment such as security cameras, set top boxes, routers, lamp bars, massage apparatuses, notebook computers and the like, the temperature of the power adapter is often raised to a higher level in long-time continuous operation, and the power adapter at present adopts a passive heat dissipation mode that a shell is in contact with air for heat dissipation, so that the heat dissipation effect is poor, and the problem of faults caused by overheat of internal components is easily caused.
Disclosure of Invention
In view of the above problems, an object of the present utility model is to: the utility model provides a power adapter heat abstractor, this device dispels the heat through the effectual passive heat dissipation means when power adapter temperature is lower, and when the temperature is higher, dispels the heat through fan, semiconductor refrigeration board cooperation passive heat dissipation means, and heat dissipation cooling efficiency is high, effectual, effectively prevents overheated protection to power adapter.
In order to achieve the above object, the present utility model provides the following technical solutions: the utility model provides a power adapter heat abstractor, includes base and roof, run through on the base and be equipped with first screw hole, run through on the roof and be equipped with the second screw hole, be connected with the locking bolt between first screw hole and the second screw hole, the inboard joint of base has bottom cooling body, the joint has top cooling body on the roof, bottom cooling body includes first fan mounting panel and semiconductor refrigeration board, be equipped with first fan mounting hole on the first fan mounting panel, first fan is installed to the inboard of first fan mounting hole, top cooling body includes second fan mounting panel and liquid cooling vapor chamber, be equipped with the second fan mounting hole on the second fan mounting panel, the second fan is installed to the inboard of second fan mounting hole, the top of base and the bottom of roof all are equipped with side cooling body, first spliced pole and second spliced pole are installed respectively to the top of base and the bottom of roof, the top of first spliced pole and the top of second spliced pole all are equipped with the electrical contact piece.
The beneficial effects of the utility model are as follows: the device dissipates heat through the passive heat dissipation means with good effect when the temperature of the power adapter is low, dissipates heat through the fan and the semiconductor refrigeration plate matched with the passive heat dissipation means when the temperature is high, and has high heat dissipation and cooling efficiency and good effect, and the power adapter is effectively protected against overheat.
In order to cool the semiconductor refrigeration plate:
as a further improvement of the above technical scheme: the bottom of the semiconductor refrigeration plate is provided with a heat dissipation frame, and the inner side of the heat dissipation frame is provided with a first heat dissipation fin and is provided with a third fan.
The beneficial effects of this improvement are: the third fan cools the heating surface of the semiconductor refrigeration plate, the first radiating fins absorb heat of the semiconductor refrigeration plate, and the third fan cools the semiconductor refrigeration plate and simultaneously cools the first radiating fins.
In order to exhaust air:
as a further improvement of the above technical scheme: and a ventilation air duct is arranged between the first fan mounting plate and the first fan mounting hole and between the second fan mounting plate and the second fan mounting hole.
The beneficial effects of this improvement are: the first fan and the second fan directly cool the surface of the power adapter, and blown wind is discharged to the side face through the ventilation air duct after cooling the power adapter.
In order to control the device to actively dissipate heat:
as a further improvement of the above technical scheme: the bottom of the top plate is provided with a temperature sensor, and the top of the top plate is provided with a control module.
The beneficial effects of this improvement are: the surface temperature of the power adapter is monitored in real time through the temperature sensor, and when the temperature sensor monitors that the surface temperature of the power adapter is higher, the control module automatically controls the first fan, the second fan, the third fan and the semiconductor refrigeration plate to operate.
To passively dissipate heat from the power adapter sides:
as a further improvement of the above technical scheme: the side radiating mechanism comprises a radiating fin mounting plate, a telescopic rod is mounted on the radiating fin mounting plate, a spring is mounted in the telescopic rod, one end of the telescopic rod is connected with a radiating plate, and a second radiating fin is connected to the radiating plate.
The beneficial effects of this improvement are: the heat dissipation plate is abutted against and contacted with the side face of the power adapter under the action of the elastic force of the spring in the telescopic rod, and the heat dissipation device can conduct passive heat dissipation on the side face of the power adapter through the heat dissipation plate.
In order to protect the junction of two energized contact blocks:
as a further improvement of the above technical scheme: the top outside threaded connection of first spliced pole has the protection thread bush, the bottom outside of second spliced pole is equipped with the external screw thread.
The beneficial effects of this improvement are: after the electrified contact blocks on the first connecting column are contacted with the electrified contact blocks on the second connecting column, the protective thread sleeve is rotated, so that the protective thread sleeve on the first connecting column is rotated upwards and is connected with the external thread on the second connecting column in a threaded manner, and the joint of the two electrified contact blocks is protected.
In order to power the device:
as a further improvement of the above technical scheme: the side of base is equipped with the USB connecting wire.
The beneficial effects of this improvement are: the device can be powered by connecting a USB connecting wire with a chargeable USB interface.
Space for providing ventilation for the bottom cooling mechanism:
as a further improvement of the above technical scheme: the bottom of base is equipped with the support callus on the sole.
The beneficial effects of this improvement are: the support foot pad is used for lifting the base and providing an air circulation space for the bottom cooling mechanism.
None of the parts of the device are the same as or can be implemented using prior art.
Drawings
FIG. 1 is a schematic view of a left front axle construction of the present utility model;
FIG. 2 is a schematic view of the bottom structure of the present utility model;
FIG. 3 is a right side cut-away schematic view of the present utility model;
FIG. 4 is a schematic elevational cross-sectional view of the present utility model;
FIG. 5 is a schematic diagram of a side heat dissipation mechanism according to the present utility model;
in the figure: 1. a base; 2. a top plate; 3. a first threaded hole; 4. a second threaded hole; 5. a locking bolt; 6. a bottom cooling mechanism; 7. a top cooling mechanism; 8. a first fan mounting plate; 9. a semiconductor refrigeration plate; 10. a ventilation duct; 11. a first fan; 12. a second fan mounting plate; 13. liquid cooling soaking plate; 14. a temperature sensor; 15. a second fan; 16. a side heat dissipation mechanism; 17. a first connection post; 18. a second connection post; 19. energizing the contact block; 20. a heat dissipation frame; 21. a first heat sink fin; 22. a third fan; 23. a control module; 24. a heat sink mounting plate; 25. a telescopic rod; 26. a spring; 27. a heat dissipation plate; 28. a second heat sink fin; 29. protecting the thread sleeve; 30. a USB connecting wire; 31. and supporting foot pads.
Detailed Description
In order that those skilled in the art may better understand the technical solutions of the present utility model, the following detailed description of the present utility model with reference to the accompanying drawings is provided for exemplary and explanatory purposes only and should not be construed as limiting the scope of the present utility model.
As shown in fig. 1-5, a power adapter heat dissipation device comprises a base 1 and a top plate 2, wherein a first threaded hole 3 is penetrated and arranged on the base 1, a second threaded hole 4 is penetrated and arranged on the top plate 2, a locking bolt 5 is connected between the first threaded hole 3 and the second threaded hole 4, a bottom cooling mechanism 6 is clamped on the inner side of the base 1, a top cooling mechanism 7 is clamped on the top plate 2, the bottom cooling mechanism 6 comprises a first fan mounting plate 8 and a semiconductor refrigerating plate 9, a first fan 11 is arranged on the first fan mounting plate 8, a first fan mounting plate 12 and a liquid cooling soaking plate 13 are arranged on the inner side of the first fan mounting plate, a second fan mounting hole is arranged on the second fan mounting plate 12, a second fan 15 is arranged on the inner side of the second fan mounting plate, the top of the base 1 and the bottom of the top plate 2 are respectively provided with a side heat dissipation mechanism 16, the top of the base 1 and the bottom of the top plate 2 are respectively provided with a first connecting column 17 and a second connecting column 18, the top of the first connecting column 17 and the top of the second connecting column 18 are respectively provided with an electrified contact block 19, when the temperature of the power adapter is lower, the device dissipates heat through a good-effect passive heat dissipation means, when the temperature is higher, the heat dissipation and cooling efficiency is high and the effect is good through the cooperation of a fan and a semiconductor refrigeration plate 9 with the passive heat dissipation means, the power adapter is effectively protected from overheat, the bottom of the semiconductor refrigeration plate 9 is provided with a heat dissipation frame 20, the inner side of the heat dissipation frame 20 is provided with a first heat dissipation fin 21 and is provided with a third fan 22, the third fan 22 cools the heat generating surface of the semiconductor refrigeration plate 9, the first cooling fin 21 absorbs heat of the semiconductor refrigeration plate 9, the third fan 22 cools the semiconductor refrigeration plate 9, and simultaneously cools the first cooling fin 21, a ventilation air duct 10 is arranged between the first fan mounting plate 8 and the first fan mounting hole and between the second fan mounting plate and the second fan mounting hole, the first fan 11 and the second fan 15 directly cool the surface of the power adapter, blown air is discharged to the side through the ventilation air duct 10 after cooling the power adapter, a temperature sensor 14 is arranged at the bottom of the top plate 2, a control module 23 is arranged at the top of the top plate 2, the device monitors the surface temperature of the power adapter in real time through the temperature sensor 14, when the temperature sensor 14 monitors that the surface temperature of the power adapter is higher, the control module 23 automatically controls the first fan 11, the second fan 15, the third fan 22 and the semiconductor refrigeration plate 9 to run, the side radiating mechanism 16 comprises a radiating fin mounting plate 24, a telescopic rod 25 is mounted on the radiating fin mounting plate 24, a spring 26 is mounted in the telescopic rod 25, one end of the telescopic rod 25 is connected with a radiating plate 27, a second radiating fin 28 is connected on the radiating plate 27, the radiating plate 27 is abutted against and contacted with the side surface of the power adapter under the elastic force of the spring 26 in the telescopic rod 25, the device can perform passive radiating on the side surface of the power adapter through the radiating plate 27, the heat conducting and radiating capability of the radiating plate 27 is greatly improved due to the fact that the second radiating fin 28 is arranged, a protective thread sleeve 29 is connected on the outer side of the top of the first connecting column 17 in a threaded manner, external threads are arranged on the outer side of the bottom of the second connecting column 18, after the electrified contact blocks 19 on the first connecting column 17 and the electrified contact blocks 19 on the second connecting column 18 are contacted, the protective thread sleeve 29 is rotated, so that the protective thread sleeve 29 on the first connecting column 17 is rotated upwards and is in threaded connection with the external threads on the second connecting column 18, the joint of the two electrified contact blocks 19 is protected, the side face of the base 1 is provided with a USB connecting wire 30, the device can be powered by using the USB connecting wire 30 to be connected with a chargeable USB interface, the bottom of the base 1 is provided with a supporting foot pad 31, and the supporting foot pad 31 is used for lifting the base and provides an air circulation space for the bottom cooling mechanism 6.
The working principle and the using flow of the utility model are as follows: when the device is used, the top plate 2 and the base 1 are respectively arranged above and below the power adapter, the top plate 2 and the base 1 are respectively contacted with the top surface and the bottom surface of the power adapter, the heat dissipation plate 27 is abutted against and contacted with the side surface of the power adapter under the action of the elastic force of the spring 26 in the telescopic rod 25, the locking bolt 5 is used for connecting and screwing the first threaded hole 3 on the base 1 and the second threaded hole 4 on the top plate 2, so that the top plate 2, the base 1 and the power adapter are fixed, at the moment, the electrified contact blocks 19 on the first connecting column 17 and the electrified contact blocks 19 on the second connecting column 18 are contacted, the protective threaded sleeve 29 is rotated, the protective threaded sleeve 29 on the first connecting column 17 is rotated upwards and is connected with the external threads on the second connecting column 18, the joint of the two electrified contact blocks 19 is protected, the USB connecting wire 30 is used for connecting with a chargeable USB interface, so that the device can be powered, the device monitors the surface temperature of the power adapter in real time through the temperature sensor 14, when the temperature is not high, the device only carries out passive heat dissipation through the liquid cooling soaking plate 13 contacted with the top surface of the power adapter and the heat dissipation plate 27 contacted with the side surface of the power adapter, because the second heat dissipation fins 28 are arranged, the heat conduction and dissipation capacity of the heat dissipation plate 27 is greatly improved, the good low-temperature heat dissipation effect can be achieved by matching with the liquid cooling soaking plate 13, when the temperature sensor 14 monitors that the surface temperature of the power adapter is higher, the control module 23 automatically controls the first fan 11, the second fan 15, the third fan 22 and the semiconductor refrigeration plate 9 to operate, the first fan 11 and the second fan 15 directly cool the surface of the power adapter, blown air is discharged to the side surface through the ventilation air duct 10 after cooling the power adapter, meanwhile, the semiconductor refrigeration plate 9 cools the power adapter at the bottom of the power adapter, the third fan 22 cools the heating surface of the semiconductor refrigeration plate 9, the first heat dissipation fins 21 absorb heat of the semiconductor refrigeration plate 9, and the third fan 22 cools the first heat dissipation fins 21 when cooling the semiconductor refrigeration plate 9, so that when the temperature of the power adapter is low, the device dissipates heat through a good passive heat dissipation means, and when the temperature is high, the fan and the semiconductor refrigeration plate 9 cooperate with the passive heat dissipation means to dissipate heat, so that the heat dissipation and cooling efficiency is high, and the effect is good, and the overheat protection is effectively prevented for the power adapter.
Claims (8)
1. A power adapter heat sink, characterized in that: including base (1) and roof (2), run through on base (1) and be equipped with first screw hole (3), run through on roof (2) and be equipped with second screw hole (4), be connected with locking bolt (5) between first screw hole (3) and second screw hole (4), the inboard joint of base (1) has bottom cooling body (6), the joint has top cooling body (7) on roof (2), bottom cooling body (6) include first fan mounting panel (8) and semiconductor refrigeration board (9), be equipped with first fan mounting hole on first fan mounting panel (8), first fan (11) are installed to the inboard in first fan mounting hole, top cooling body (7) include second fan mounting panel (12) and liquid cooling homothermal plate (13), be equipped with second fan mounting hole on second fan mounting panel (12), the inboard in second fan mounting hole has second fan (15), the top of base (1) and the bottom of roof (2) all are equipped with side cooling body (16), first fan (17) are installed on the top of base (1) and roof (17) respectively, the tops of the first connecting columns (17) and the tops of the second connecting columns (18) are respectively provided with an energizing contact block (19).
2. A power adapter heat sink as recited in claim 1 wherein: the bottom of the semiconductor refrigeration plate (9) is provided with a heat dissipation frame (20), and the inner side of the heat dissipation frame (20) is provided with a first heat dissipation fin (21) and a third fan (22).
3. A power adapter heat sink as recited in claim 1 wherein: a ventilation air duct (10) is arranged between the first fan mounting plate (8) and the first fan mounting hole and between the second fan mounting plate and the second fan mounting hole.
4. A power adapter heat sink as recited in claim 1 wherein: the bottom of the top plate (2) is provided with a temperature sensor (14), and the top of the top plate (2) is provided with a control module (23).
5. A power adapter heat sink as recited in claim 1 wherein: the side heat dissipation mechanism (16) comprises a heat dissipation plate mounting plate (24), a telescopic rod (25) is mounted on the heat dissipation plate mounting plate (24), a spring (26) is mounted in the telescopic rod (25), one end of the telescopic rod (25) is connected with a heat dissipation plate (27), and a second heat dissipation fin (28) is connected to the heat dissipation plate (27).
6. A power adapter heat sink as recited in claim 1 wherein: the top outside threaded connection of first spliced pole (17) has protection thread bush (29), the bottom outside of second spliced pole (18) is equipped with the external screw thread.
7. A power adapter heat sink as recited in claim 1 wherein: the side of the base (1) is provided with a USB connecting wire (30).
8. A power adapter heat sink as recited in claim 1 wherein: the bottom of the base (1) is provided with a supporting foot pad (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321950340.1U CN220733277U (en) | 2023-07-24 | 2023-07-24 | Power adapter heat abstractor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321950340.1U CN220733277U (en) | 2023-07-24 | 2023-07-24 | Power adapter heat abstractor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220733277U true CN220733277U (en) | 2024-04-05 |
Family
ID=90487756
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321950340.1U Active CN220733277U (en) | 2023-07-24 | 2023-07-24 | Power adapter heat abstractor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220733277U (en) |
-
2023
- 2023-07-24 CN CN202321950340.1U patent/CN220733277U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |