CN220731477U - Silicon chip loading attachment - Google Patents
Silicon chip loading attachment Download PDFInfo
- Publication number
- CN220731477U CN220731477U CN202322352491.3U CN202322352491U CN220731477U CN 220731477 U CN220731477 U CN 220731477U CN 202322352491 U CN202322352491 U CN 202322352491U CN 220731477 U CN220731477 U CN 220731477U
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- Prior art keywords
- feeding
- silicon wafer
- gear stage
- discharging
- loading
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 59
- 239000010703 silicon Substances 0.000 title claims abstract description 59
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 59
- 239000000463 material Substances 0.000 claims abstract description 86
- 238000007599 discharging Methods 0.000 claims abstract description 25
- 238000005086 pumping Methods 0.000 claims abstract description 12
- 230000007246 mechanism Effects 0.000 claims description 66
- 239000000919 ceramic Substances 0.000 claims description 7
- 210000001503 joint Anatomy 0.000 claims description 5
- 238000000605 extraction Methods 0.000 abstract description 3
- 235000012431 wafers Nutrition 0.000 description 34
- 238000000034 method Methods 0.000 description 6
- 230000008569 process Effects 0.000 description 4
- 230000003028 elevating effect Effects 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 230000001502 supplementing effect Effects 0.000 description 1
Abstract
The application discloses silicon chip loading attachment, it includes feed portion, moves material portion, material loading portion and take out material portion, and material loading portion is equipped with two at least storage units, wherein: the feeding part is arranged at a material taking station of the material moving part; the feeding part is arranged at a discharging station of the material moving part; the feeding end of the material pumping part corresponds to the discharging end of the material loading part; the material transferring part is configured to transfer the silicon wafer of the material supplying part to the material storing unit; the feeding part is configured to switch and move different storage units to the discharging end of the feeding part. The material sucking part is configured to suck the silicon wafer in the storage unit positioned at the discharging end of the feeding part and convey the silicon wafer to the subsequent step. When the silicon chip in the storage unit of the discharge end of the feeding part is subjected to light extraction, the new storage unit is switched through the feeding part, so that quick feeding can be realized, and the material changing efficiency is effectively improved.
Description
Technical Field
The utility model belongs to the technical field of photovoltaic manufacturing, and particularly relates to a silicon wafer feeding device.
Background
In the production process of photovoltaic products, silicon wafers are one of the required raw materials. In the process of processing silicon wafers, the silicon wafers need to be loaded into a feed box (basket) in a stacked mode for transferring, and when the silicon wafers in the feed box of processing equipment are used up, the empty feed box is taken out through a transfer device and then put into the fully loaded feed box in a common processing method in the prior art. The method has the advantages that the replacement speed of the material box is low, and the productivity of equipment is affected.
Disclosure of Invention
In order to solve the problems in the related art, the application provides the silicon wafer feeding device which can effectively improve the supplementing speed of the silicon wafer and improve the productivity of equipment.
The technical proposal is as follows:
the utility model provides a silicon chip loading attachment, its includes feed portion, moves material portion, material loading portion and take out material portion, and material loading portion is equipped with two at least storage units, wherein: the feeding part is arranged at a material taking station of the material moving part; the feeding part is arranged at a discharging station of the material moving part; the feeding end of the material pumping part corresponds to the discharging end of the material loading part; the material transferring part is configured to transfer the silicon wafer of the material supplying part to the material storing unit; the feeding part is configured to switch and move different storage units to the discharging end of the feeding part. The material sucking part is configured to suck the silicon wafer in the storage unit positioned at the discharging end of the feeding part and convey the silicon wafer to the subsequent step.
When the silicon chip in the storage unit of the discharge end of the feeding part is subjected to light extraction, the new storage unit is switched through the feeding part, so that quick feeding can be realized, and the material changing efficiency is effectively improved.
Further, the material loading portion includes elevating system and material loading frame, wherein: the lifting mechanism is arranged above the feeding end of the material drawing part; the feeding frame is arranged at the lifting end of the lifting mechanism; a plurality of storage units are sequentially arranged on the upper material rack along the lifting direction of the lifting mechanism; the lifting mechanism is configured to lift the plurality of storage units and enable the plurality of storage units to pass through the feeding end of the material pumping part one by one.
Further, the storage unit comprises at least one storage group comprising a first gear stage, a second gear stage, a first rack plate and a second rack plate, wherein: the storage groups are arranged side by side along the lifting direction perpendicular to the lifting mechanism; the first frame plate and the second frame plate are oppositely arranged along the lifting direction of the lifting mechanism; the first gear table is arranged on the side surface of the first frame plate, which faces the second frame plate; the second gear platform is arranged on the side surface of the second frame plate, which faces the first frame plate; the first tooth platforms and the second tooth platforms are arranged along the lifting direction of the lifting mechanism; the first tooth platforms and the second tooth platforms are arranged in one-to-one correspondence.
The first gear platform and the second gear platform are oppositely arranged, so that the material sucking part can contact with the bottom of the silicon wafer and suck the silicon wafer while carrying the silicon wafer.
Further, take out the material portion and include at least one take out piece mechanism, flexible module and ejection of compact platform, wherein: the plurality of sheet drawing mechanisms are arranged in parallel; the plurality of sheet drawing mechanisms are in one-to-one correspondence with the plurality of storage groups; the feeding end of the sheet drawing mechanism is arranged between the first gear stage and the second gear stage; the discharge end of the sheet drawing mechanism is butted with the feed end of the discharge table; the slice drawing mechanism is connected with the telescopic end of the telescopic module; the telescopic module is configured to drive the feeding end of the sheet drawing mechanism to extend into the space between the first gear stage and the second gear stage, or drive the feeding end of the sheet drawing mechanism to draw out from the space between the first gear stage and the second gear stage.
The telescopic module is arranged to enable the sheet drawing mechanism to be drawn out of the storage unit, and a yielding space is provided for switching the storage unit.
Further, the sheet drawing mechanism comprises a conveyor belt and a driving device, wherein: the feeding area of the conveyor belt is arranged between the first gear stage and the second gear stage; the discharging area of the conveyor belt is in butt joint with the feeding end of the discharging table; the conveyor belt is connected with the driving end of the driving device; the driving device is arranged on the telescopic end of the telescopic module.
Further, elevating system is the cylinder module, and the drive end of cylinder module is connected in the material loading frame.
Further, the material moving part is a mechanical arm, a ceramic sucker mechanism is arranged at the grabbing end of the mechanical arm, and the ceramic sucker mechanism is configured to adsorb silicon wafers.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the utility model as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the utility model and together with the description, serve to explain the principles of the utility model.
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic diagram of a multi-group storage unit according to the present utility model;
FIG. 3 is a schematic view of the ceramic chuck mechanism of the present utility model;
fig. 1-3 include:
1. a feeding section; 2. a material moving part; 3. a feeding part; 31. a lifting mechanism; 32. a feeding frame; 4. a storage unit; 41. a first gear stage; 42. a second gear stage; 43. a first shelf; 44. a second shelf; 5. a material pumping part; 51. a slice drawing mechanism; 52. a telescopic module; 53. a discharging table; 6. a ceramic sucker mechanism; 7. and (3) a silicon wafer.
Detailed Description
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples do not represent all implementations consistent with the utility model. Rather, they are merely examples of apparatus and methods consistent with aspects of the utility model as detailed in the accompanying claims.
As shown in fig. 1-3:
silicon chip 7 loading attachment, it includes feed portion 1, moves material portion 2, material loading portion 3 and take out material portion 5, and material loading portion 3 is equipped with two at least storage units 4, wherein: the feeding part 1 is arranged at a material taking station of the material moving part 2; the feeding part 3 is arranged at a discharging station of the material moving part 2; the feeding end of the material pumping part 5 corresponds to the discharging end of the material loading part 3; the transfer part 2 is configured to transfer the silicon wafer 7 of the supply part 1 to the storage unit 4; the charging section 3 is configured to switch the different storage units 4 to move to the discharge end of the charging section 3. The material sucking part 5 is configured to suck out the silicon wafer 7 in the material storing unit 4 at the material discharging end of the material feeding part 3 and convey the silicon wafer to the subsequent process.
The feeding process of the application is as follows:
the feeding part 1 loads silicon wafers into the device by manual or automatic equipment, the picking end of the material moving part 2 takes the piled silicon wafers out of the feeding part 1 and transfers the piled silicon wafers into the storage units 4, as at least two storage units 4 are arranged, the material pumping part 5 pumps the silicon wafers in one storage unit 4, when the silicon wafers of one storage unit 4 are pumped, the feeding part 3 replaces the empty storage units 4 with the storage units 4 filled with the next silicon wafers, then the material pumping part 5 continues to pump the materials, and meanwhile, the material moving part 2 picks the silicon wafers from the feeding part 1 to supplement the empty storage units 4 for the next replacement.
Therefore, when the silicon wafer 7 in the storage unit 4 positioned at the discharge end of the feeding part 3 is subjected to light extraction, the new storage unit 4 is switched through the feeding part 3, so that quick feeding can be realized, and the material changing efficiency is effectively improved.
In one possible embodiment, the loading section 3 comprises a lifting mechanism 31 and a loading rack 32, wherein: the lifting mechanism 31 is arranged above the feeding end of the material extracting part 5; the feeding frame 32 is arranged at the lifting end of the lifting mechanism 31; the plurality of storage units 4 are sequentially arranged on the upper material rack 32 along the lifting direction of the lifting mechanism 31; the lifting mechanism 31 is configured to lift the plurality of storage units 4, and to pass the plurality of storage units 4 one by one through the feeding end of the drawing portion 5.
The vertical arrangement of a plurality of storage units 4 sets up, and after the silicon chip of a storage unit 4 empties, elevating system 31 goes up and down all storage units 4 through material loading frame 32, removes the position of empty storage unit 4 with full-load storage unit 4, and the storage unit 4 of empty is supplemented the silicon chip by material transfer portion 2 simultaneously, therefore can accomplish the effect of continuous confession piece.
In one possible embodiment, the storage unit 4 comprises at least one storage group comprising a first gear stage 41, a second gear stage 42, a first rack plate 43 and a second rack plate 44, wherein: the storage groups are arranged side by side along the lifting direction perpendicular to the lifting mechanism 31; the first frame plate 43 and the second frame plate 44 are disposed opposite to each other in the lifting direction of the lifting mechanism 31; the first gear stage 41 is provided on the side of the first rack plate 43 facing the second rack plate 44; the second gear stage 42 is arranged on the side of the second frame plate 44 facing the first frame plate 43; the first tooth platforms 41 and the second tooth platforms 42 are arranged along the lifting direction of the lifting mechanism 31; the first tooth platforms 41 and the second tooth platforms 42 are arranged in a one-to-one correspondence.
The first frame plate 43 and the second frame plate 44 are arranged in parallel along the lifting direction, the inner sides of the first frame plate and the second frame plate are respectively provided with a toothed plate, each layer of toothed plate is provided with a silicon wafer, as the toothed plates only bear two sides of the silicon wafer, the middle part of the bottom of the silicon wafer is exposed, the middle part of the bottom of the silicon wafer contacts with the feeding end of the material sucking part 5 to suck the silicon wafer, then the lifting mechanism 31 drives the material storing unit 4 to descend by one layer of height, and the material sucking part 5 takes the next layer of silicon wafer until the silicon wafer of the material storing unit 4 is completely sucked.
In one possible embodiment, the extracting portion 5 comprises at least one extracting mechanism 51, a telescopic module 52 and a discharge table 53, wherein: a plurality of sheet drawing mechanisms 51 are arranged in parallel; the plurality of sheet drawing mechanisms 51 are in one-to-one correspondence with the plurality of storage groups; the feeding end of the sheet drawing mechanism 51 is arranged between the first gear stage 41 and the second gear stage 42; the discharging end of the sheet drawing mechanism 51 is in butt joint with the feeding end of the discharging table 53; the pulling mechanism 51 is connected to the telescopic end of the telescopic module 52; the telescopic module 52 is configured to drive the feeding end of the sheet drawing mechanism 51 to extend between the first gear stage 41 and the second gear stage 42, or to drive the feeding end of the sheet drawing mechanism 51 to draw out from between the first gear stage 41 and the second gear stage 42.
Since the lifting mechanism 31 needs to drive all the storage units 4 to lift simultaneously, in the lifting action, the slice drawing mechanism 51 is extended and retracted backwards by the extension module 52, so that the lifting action of the storage units 4 is facilitated, after the fully loaded storage units 4 are lifted to the set position, the slice drawing mechanism 51 stretches into the storage units 4 again to draw slices, and the silicon slices drawn by the slice drawing mechanism 51 are directly transferred to the discharge table 53 and transferred to the next process.
In one possible embodiment, the drawer 51 comprises a conveyor belt and a drive, wherein: the feeding area of the conveyor belt is arranged between the first gear stage 41 and the second gear stage 42; the discharge zone of the conveyor belt is in butt joint with the feed end of the discharge table 53; the conveyor belt is connected with the driving end of the driving device; the drive means is mounted on the telescopic end of the telescopic module 52.
In one possible embodiment, the lifting mechanism 31 is a cylinder module, and the driving end of the cylinder module is connected to the feeding frame 32.
In one possible embodiment, the material moving part 2 is a mechanical arm, and a gripping end of the mechanical arm is provided with a ceramic chuck mechanism 6, and the ceramic chuck mechanism 6 is configured to adsorb the silicon wafer 7.
Other embodiments of the utility model will be apparent to those skilled in the art from consideration of the specification and practice of the utility model disclosed herein. This application is intended to cover any variations, uses, or adaptations of the utility model following, in general, the principles of the utility model and including such departures from the present disclosure as come within known or customary practice within the art to which the utility model pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the utility model being indicated by the following claims.
It is to be understood that the utility model is not limited to the precise arrangements and instrumentalities shown in the drawings, which have been described above, and that various modifications and changes may be effected without departing from the scope thereof. The scope of the utility model is limited only by the appended claims.
Claims (7)
1. The utility model provides a silicon chip loading attachment, its characterized in that, silicon chip loading attachment includes feed portion, moves material portion, material loading portion and takes out material portion, material loading portion is equipped with two at least storage units, wherein:
the feeding part is arranged at a material taking station of the material moving part;
the feeding part is arranged at a discharging station of the material moving part;
the feeding end of the material pumping part corresponds to the discharging end of the material loading part;
the material moving part is configured to move the silicon wafer of the material supplying part to the material storing unit;
the feeding part is configured to switch and move different storage units to the discharging end of the feeding part;
the material sucking part is configured to suck out the silicon wafer in the material storage unit positioned at the discharging end of the material feeding part and convey the silicon wafer to the subsequent step.
2. The silicon wafer loading device of claim 1, wherein the loading section comprises a lifting mechanism and a loading frame, wherein:
the lifting mechanism is arranged above the feeding end of the material pumping part;
the feeding frame is arranged at the lifting end of the lifting mechanism;
the storage units are sequentially arranged on the feeding frame along the lifting direction of the lifting mechanism;
the lifting mechanism is configured to lift the plurality of storage units and enable the plurality of storage units to pass through the feeding end of the material pumping part one by one.
3. The silicon wafer loading device of claim 2 wherein the storage unit comprises at least one storage group comprising a first gear stage, a second gear stage, a first shelf and a second shelf, wherein:
the storage groups are arranged side by side along the lifting direction perpendicular to the lifting mechanism;
the first frame plate and the second frame plate are oppositely arranged along the lifting direction of the lifting mechanism;
the first gear rack is arranged on the side surface of the first rack plate, which faces the second rack plate;
the second gear rack is arranged on the side surface of the second rack plate, which faces the first rack plate;
the first tooth platforms and the second tooth platforms are arranged along the lifting direction of the lifting mechanism;
the first tooth platforms and the second tooth platforms are arranged in one-to-one correspondence.
4. The silicon wafer loading device of claim 3, wherein the pumping section comprises at least one pumping mechanism, a telescopic module and a discharging table, wherein:
the plurality of sheet drawing mechanisms are arranged in parallel;
the plurality of sheet drawing mechanisms are in one-to-one correspondence with the plurality of storage groups;
the feeding end of the sheet drawing mechanism is arranged between the first gear stage and the second gear stage;
the discharging end of the sheet drawing mechanism is in butt joint with the feeding end of the discharging table;
the sheet drawing mechanism is connected to the telescopic end of the telescopic module;
the telescopic module is configured to drive the feeding end of the sheet drawing mechanism to extend into the space between the first gear stage and the second gear stage, or drive the feeding end of the sheet drawing mechanism to draw out from the space between the first gear stage and the second gear stage.
5. The silicon wafer loading device of claim 4, wherein the wafer pulling mechanism comprises a conveyor belt and a driving device, wherein:
the feeding area of the conveyor belt is arranged between the first gear stage and the second gear stage;
the discharging area of the conveyor belt is in butt joint with the feeding end of the discharging table;
the conveyor belt is connected to the driving end of the driving device;
the driving device is arranged on the telescopic end of the telescopic module.
6. The silicon wafer loading device according to claim 2, wherein the lifting mechanism is a cylinder module, and the driving end of the cylinder module is connected to the loading frame.
7. The silicon wafer loading device according to claim 1, wherein the material moving part is a mechanical arm, and a ceramic chuck mechanism is arranged at a grabbing end of the mechanical arm and is configured to adsorb a silicon wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322352491.3U CN220731477U (en) | 2023-08-31 | 2023-08-31 | Silicon chip loading attachment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322352491.3U CN220731477U (en) | 2023-08-31 | 2023-08-31 | Silicon chip loading attachment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220731477U true CN220731477U (en) | 2024-04-05 |
Family
ID=90499317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322352491.3U Active CN220731477U (en) | 2023-08-31 | 2023-08-31 | Silicon chip loading attachment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220731477U (en) |
-
2023
- 2023-08-31 CN CN202322352491.3U patent/CN220731477U/en active Active
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| GR01 | Patent grant |