CN220711722U - Multilayer circuit board - Google Patents

Multilayer circuit board Download PDF

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Publication number
CN220711722U
CN220711722U CN202322310213.1U CN202322310213U CN220711722U CN 220711722 U CN220711722 U CN 220711722U CN 202322310213 U CN202322310213 U CN 202322310213U CN 220711722 U CN220711722 U CN 220711722U
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CN
China
Prior art keywords
circuit board
board main
main body
short rod
plate
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Active
Application number
CN202322310213.1U
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Chinese (zh)
Inventor
曾月明
唐远飞
刘澜涛
张元礼
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Dongguan Maolin Electronics Co ltd
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Dongguan Maolin Electronics Co ltd
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Priority to CN202322310213.1U priority Critical patent/CN220711722U/en
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Publication of CN220711722U publication Critical patent/CN220711722U/en
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Abstract

The utility model discloses a multilayer circuit board, in particular to the technical field of multilayer circuit boards, which comprises a plurality of circuit board main bodies, wherein a buffer component for buffering vibration is arranged between every two circuit board main bodies; the buffer component comprises mounting holes formed in four corners of the top of each circuit board main body, and hollow short rods are fixed at four corners of the bottom of each circuit board main body. According to the utility model, the four hollow short rods are arranged at the bottom of each circuit board main body, the buffer springs are fixed in each hollow short rod, vibration born by the top of the circuit board main body is relieved by the buffer springs, the two elastic metal plates are arranged at the top of the annular limiting plate, the bending directions of the two elastic metal plates are opposite, the rebound of the buffer springs can be resisted, the purpose of shock absorption is achieved, and gaps are reserved between each circuit board main body, so that the heat dissipation can be conveniently realized while the shock absorption effect is ensured.

Description

Multilayer circuit board
Technical Field
The utility model relates to the technical field of multilayer circuit boards, in particular to a multilayer circuit board.
Background
The circuit board may be referred to as a printed wiring board or a printed circuit board. The circuit board is composed of an integrated circuit, a quartz vibrator, a trimming capacitor and a printed circuit board. The names of the circuit boards are: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, and the like. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in mass production of fixed circuits and optimization of the layout of electrical appliances. The device is mainly used for connecting various electronic components in electronic equipment and plays a role of a structural support.
The multilayer circuit board is when single circuit board can't satisfy the connection demand, can link together a plurality of circuit boards to utilize the screw to fix a plurality of circuit boards together, as shown in publication number CN218217804U, through first blotter and second blotter, cushion the shock attenuation to the circuit board, avoid causing the possibility that the electronic device damaged to appear because of vibrations. The buffer pad arranged in the technical scheme is made of a common rubber material, and the arrangement of the buffer pad can influence the normal heat dissipation of the circuit board because the heat conductivity coefficient of the rubber material is low.
Disclosure of Invention
The utility model aims to provide a multilayer circuit board, four hollow short rods are arranged at the bottom of each circuit board main body, buffer springs are fixed in each hollow short rod, vibration born by the top of the circuit board main body is relieved by the buffer springs, two elastic metal plates are arranged at the top of an annular limiting plate, the bending directions of the two elastic metal plates are opposite, the rebound of the buffer springs can be resisted, the purpose of shock absorption is achieved, and gaps are reserved between each circuit board main body to facilitate heat dissipation, so that the shock absorption effect is ensured, and meanwhile heat dissipation is ensured.
In order to achieve the above object, the present utility model provides the following technical solutions: a multi-layer circuit board comprises a plurality of circuit board main bodies, wherein a buffer component for buffering vibration is arranged between every two circuit board main bodies;
the buffer assembly comprises mounting holes formed in four corners of the top of each circuit board main body, hollow short rods are fixed at the four corners of the bottom of each circuit board main body, buffer springs are fixed at the top ends of the inner parts of the hollow short rods, telescopic short rods are arranged at the bottoms of the buffer springs, and the bottom ends of the telescopic short rods are arranged in the mounting holes;
the hollow short rod bottom is run through and is had the mounting panel, mounting panel one side is fixed with two curved elastic metal plates, and the opposite direction of two elastic metal plates, two elastic metal plates top and circuit board main part bottom fixed connection.
Preferably, the outer wall of the bottom end of the telescopic short rod is provided with an external thread, the inner wall of the mounting hole is provided with an internal thread, and the bottom end of the telescopic short rod is connected with the inner wall of the mounting hole through threads.
Preferably, the outer wall of the top end of the telescopic short rod is fixedly provided with an annular limiting plate, and the annular limiting plate is arranged inside the bottom end of the hollow short rod and rotates inside the hollow short rod.
Preferably, the bottom end of the hollow short rod is provided with an annular groove for accommodating the annular limiting plate, and the annular limiting plate rotates in the annular groove.
Preferably, the bottom of the circuit board main body positioned at the bottommost part is provided with a supporting bottom plate, four corners of the supporting bottom plate are respectively provided with a circular through hole, and the bottom ends of the telescopic short rods positioned at the bottom of the circuit board main body positioned at the bottommost part are in threaded connection with the top of the supporting bottom plate.
Preferably, a heat conducting plate for conducting heat is fixed at the top of the supporting bottom plate, the top of the heat conducting plate is contacted with the bottom of the circuit board main body, and the heat conducting plate is used for helping the circuit board main body to dissipate heat, so that the heat dissipation effect of the heat dissipation device is improved.
In the technical scheme, the utility model has the technical effects and advantages that:
1. the four hollow short rods are arranged at the bottom of each circuit board main body, the buffer springs are fixed in each hollow short rod, vibration born by the top of the circuit board main body is relieved by the buffer springs, the two elastic metal plates are arranged at the top of the annular limiting plate, the bending directions of the two elastic metal plates are opposite, the rebound of the buffer springs can be resisted, the purpose of buffering and damping is achieved, gaps are reserved between each circuit board main body, and the heat dissipation can be facilitated, so that the heat dissipation can be ensured while the damping effect is ensured;
2. external threads are formed on the outer wall of the bottom end of the telescopic short rod and can be connected with the internal threads of the inner wall of the mounting hole in a threaded manner, so that a plurality of circuit board main bodies can be fixed together, and the telescopic short rod is convenient to mount.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a side view of FIG. 1 of the present utility model;
FIG. 3 is an exploded view of the present utility model;
FIG. 4 is a schematic view of a single circuit board body according to the present utility model;
FIG. 5 is an enlarged view of FIG. 4A in accordance with the present utility model;
fig. 6 is an enlarged view of B of fig. 4 in accordance with the present utility model.
Reference numerals illustrate:
the circuit board comprises a circuit board body 1, a buffer assembly 2, a mounting hole 21, a hollow short rod 22, a telescopic short rod 23, a buffer spring 24, an annular limiting plate 25, an annular groove 26, a mounting plate 27, an elastic metal plate 28, a supporting bottom plate 3, a heat conducting plate 4 and a circular through hole 5.
Detailed Description
In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.
The utility model provides a multilayer circuit board as shown in fig. 1-3, which comprises a plurality of circuit board main bodies 1, wherein a buffer component 2 for buffering vibration is arranged between every two circuit board main bodies 1, the plurality of circuit board main bodies 1 can be separated by the buffer component 2, so that the buffer component 2 can buffer the vibration of the circuit board main bodies 1, and meanwhile, gaps among the plurality of circuit board main bodies 1 can facilitate circulation of surrounding air so as to facilitate heat dissipation;
further, as shown in fig. 3, a supporting bottom plate 3 is disposed at the bottom of the bottommost circuit board main body 1, round through holes 5 are formed in four corners of the supporting bottom plate 3, a heat conducting plate 4 for conducting heat is fixed at the top of the supporting bottom plate 3, the top of the heat conducting plate 4 is contacted with the bottom of the circuit board main body 1, and the heat conducting plate 4 is used for helping the circuit board main body 1 to dissipate heat, so that the heat dissipation effect of the utility model can be improved.
As shown in fig. 2-6, the buffer assembly 2 includes mounting holes 21 formed at four corners of the top of each circuit board main body 1, hollow short rods 22 are fixed at four corners of the bottom of each circuit board main body 1, buffer springs 24 are fixed at the top ends of the bottoms of the hollow short rods 22, telescopic short rods 23 are arranged at the bottoms of the buffer springs 24, the bottom ends of the telescopic short rods 23 at the bottom of the bottommost circuit board main body 1 are connected with the top of the supporting bottom plate 3 through threads, the bottom ends of the telescopic short rods 23 are arranged in the mounting holes 21, external threads are machined on the outer walls of the bottom ends of the telescopic short rods 23, internal threads are machined on the inner walls of the mounting holes 21, and the bottom ends of the telescopic short rods 23 are connected with the inner walls of the mounting holes 21 through threads;
when a plurality of circuit board main bodies 1 are combined together, the bottom ends of the telescopic short rods 23 are required to be inserted into the mounting holes 21, and then the telescopic short rods 23 are rotated, so that the bottom ends of the telescopic short rods 23 can be fixed inside the mounting holes 21.
Moreover, in order to prevent the telescopic short rod 23 from falling out of the hollow short rod 22, as shown in fig. 5 and 6, an annular limiting plate 25 is fixed on the outer wall of the top end of the telescopic short rod 23, the annular limiting plate 25 is arranged inside the bottom end of the hollow short rod 22 and rotates inside the hollow short rod 22, an annular groove 26 for accommodating the annular limiting plate 25 is arranged at the bottom end of the hollow short rod 22, the annular limiting plate 25 rotates inside the annular groove 26, and the thickness of the annular groove 26 is larger than that of the annular limiting plate 25 in the utility model, so that the annular limiting plate 25 can conveniently move up and down along with the telescopic short rod 23 inside the hollow short rod 22.
The utility model has the advantages of convenient installation, and can also effectively resist external vibration, as shown in fig. 5 and 6, the buffer spring 24 arranged at the top end of the telescopic short rod 23 can be used for relieving the vibration applied to the circuit board main body 1 by the outside, when the circuit board main body 1 is impacted by the vibration, the hollow short rod 22 can be compressed to move downwards, meanwhile, the buffer 24 is compressed by virtue of the downward movement of the hollow short rod 22 so as to absorb the impact suffered by the circuit board main body 1, in addition, in order to avoid that the buffer spring 24 rebounds to the circuit board main body 1 after being compressed, the bottom end of the hollow short rod 22 is penetrated with the mounting plate 27, one side of the mounting plate 27 is fixed with two arc-shaped elastic metal plates 28, the directions of the two elastic metal plates 28 are opposite, and the tops of the two elastic metal plates 28 are fixedly connected with the bottom of the circuit board main body 1;
the two elastic metal plates 28 provided in the present utility model have elasticity, and since the bending of the two elastic metal plates 28 is reversed and the arc surfaces of the two elastic metal plates 28 are tangential, when an upward elastic force is applied to the hollow stub 22 after the buffer spring 24 is compressed, the two elastic metal plates 28 are pressed to bend the two elastic metal plates 28, but since the two elastic metal plates 28 resist each other, the elastic force applied by 14 can be resisted, and the shock absorbing effect can be achieved.
While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.

Claims (6)

1. A multilayer circuit board comprising a plurality of circuit board bodies (1), characterized in that: a buffer component (2) for buffering vibration is arranged between every two circuit board main bodies (1);
the buffer assembly (2) comprises mounting holes (21) formed in four corners of the top of each circuit board main body (1), hollow short rods (22) are fixed at four corners of the bottom of each circuit board main body (1), buffer springs (24) are fixed at the top ends of the interiors of the hollow short rods (22), telescopic short rods (23) are arranged at the bottoms of the buffer springs (24), and the bottoms of the telescopic short rods (23) are arranged inside the mounting holes (21);
the bottom of the hollow short rod (22) is penetrated with a mounting plate (27), one side of the mounting plate (27) is fixed with two arc-shaped elastic metal plates (28), the directions of the two elastic metal plates (28) are opposite, and the tops of the two elastic metal plates (28) are fixedly connected with the bottom of the circuit board main body (1).
2. A multi-layer circuit board as defined in claim 1, wherein: the outer wall of the bottom end of the telescopic short rod (23) is provided with an external thread, the inner wall of the mounting hole (21) is provided with an internal thread, and the bottom end of the telescopic short rod (23) is connected with the inner wall of the mounting hole (21) through threads.
3. A multi-layer circuit board as defined in claim 1, wherein: the outer wall of the top end of the telescopic short rod (23) is fixedly provided with an annular limiting plate (25), and the annular limiting plate (25) is arranged inside the bottom end of the hollow short rod (22) and rotates inside the hollow short rod (22).
4. A multi-layer circuit board as defined in claim 2, wherein: an annular groove (26) for accommodating an annular limiting plate (25) is formed in the bottom end of the hollow short rod (22), and the annular limiting plate (25) rotates in the annular groove (26).
5. A multi-layer circuit board as defined in claim 1, wherein: the bottom of the circuit board main body (1) at the bottommost part is provided with a supporting bottom plate (3), four corners of the supporting bottom plate (3) are provided with round through holes (5), and the bottom ends of the telescopic short rods (23) at the bottom of the circuit board main body (1) at the bottommost part are in threaded connection with the top of the supporting bottom plate (3).
6. The multilayer circuit board of claim 5, wherein: the top of the supporting bottom plate (3) is fixedly provided with a heat conducting plate (4) for conducting heat, and the top of the heat conducting plate (4) is contacted with the bottom of the circuit board main body (1).
CN202322310213.1U 2023-08-25 2023-08-25 Multilayer circuit board Active CN220711722U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322310213.1U CN220711722U (en) 2023-08-25 2023-08-25 Multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322310213.1U CN220711722U (en) 2023-08-25 2023-08-25 Multilayer circuit board

Publications (1)

Publication Number Publication Date
CN220711722U true CN220711722U (en) 2024-04-02

Family

ID=90435423

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322310213.1U Active CN220711722U (en) 2023-08-25 2023-08-25 Multilayer circuit board

Country Status (1)

Country Link
CN (1) CN220711722U (en)

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