CN217239441U

CN217239441U - Shock-resistant electromagnetic interference resistance integrated circuit

Info

Publication number: CN217239441U
Application number: CN202221160986.5U
Authority: CN
Inventors: 张洲; 张文; 龚婷; 蒋雪梅
Original assignee: Shenzhen Huiyoudi Technology Co ltd
Current assignee: Shenzhen Huiyoudi Technology Co ltd
Priority date: 2022-05-13
Filing date: 2022-05-13
Publication date: 2022-08-19
Anticipated expiration: 2032-05-13

Abstract

The utility model discloses an antidetonation electromagnetic interference resistance integrated circuit relates to integrated circuit technical field, and its technical scheme is: including the storehouse body, the even fixed mounting pole of moving away to avoid possible earthquakes of internal wall of storehouse, pole tip fixed connection support frame moves away to avoid possible earthquakes, the support frame includes the shell, shell fixed mounting is at the pole top of moving away to avoid possible earthquakes, shell inner wall central point puts fixed mounting vacuum tube, the vacuum tube is inside to be set up to the vacuum structure, shell inner wall fixed mounting inner support, inner support top elastic connection circuit board subassembly, the utility model discloses an at the even fixed mounting pole of moving away to avoid possible earthquakes of storehouse body and inner wall, through outer sleeve and inner skleeve cooperation direction, when receiving the vibration, can deform through reset spring one to the absorption vibration ripples, thereby has improved the performance of circuit board subassembly anti-vibration, can improve circuit board subassembly life.

Description

Shock-resistant electromagnetic interference resistance integrated circuit

Technical Field

The utility model relates to an integrated circuit technical field, concretely relates to antidetonation electromagnetic interference resistance integrated circuit.

Background

An integrated circuit is a microelectronic device or component. The integrated circuit has the advantages of small size, light weight, few lead-out wires and welding points, long service life, high reliability, good performance and the like, and is low in cost and convenient for large-scale production, and can be widely applied to the aspects of industrial and civil electronic equipment such as televisions and the like, and military communication and the like.

The prior art has the following defects: the existing integrated circuit is easy to be impacted and vibrated when in use, thereby causing the service life of the integrated circuit, and simultaneously, the circuit board is damaged and inconvenient to use due to poor anti-interference performance.

Therefore, it is necessary to provide an anti-shock emi ic.

SUMMERY OF THE UTILITY MODEL

Therefore, the utility model provides an antidetonation electromagnetic interference resistance integrated circuit through the pole of moving away to avoid possible earthquakes at the even fixed mounting of the storehouse body and inner wall, through outer sleeve and inner skleeve cooperation direction, through reset spring one when receiving the vibration, can deform through reset spring one to the absorption vibration ripples, thereby has improved the performance of circuit board assembly anti-vibration, can improve circuit board assembly life, with the problem of solving among the background art.

In order to achieve the above object, the present invention provides the following technical solutions: the utility model provides an antidetonation electromagnetic interference resistance integrated circuit, includes the storehouse body, the even fixed mounting of storehouse internal wall pole of moving away to avoid possible earthquakes, pole tip fixed connection support frame moves away to avoid possible earthquakes, the support frame includes the shell, shell fixed mounting is at the pole top of moving away to avoid possible earthquakes, shell inner wall central point puts fixed mounting vacuum tube, the inside vacuum tube that sets up of vacuum tube is the vacuum structure, shell inner wall fixed mounting inner support, inner support top elastic connection circuit board subassembly.

Preferably, the bin body comprises a first resin layer, the first resin layer is arranged to be rectangular, a shielding net is fixedly installed on the inner wall of the first resin layer, a second resin layer is fixedly installed on the inner wall of the shielding net, and a copper plate layer is fixedly installed on the inner wall of the second resin layer.

Preferably, the shock absorbing rod comprises an outer sleeve, and the bottom of the outer sleeve is fixedly arranged on the inner wall of the copper plate layer.

Preferably, the inner wall of the outer sleeve is slidably connected with the inner sleeve, the top of the inner sleeve is fixedly connected with the outer wall of the outer shell, and the outer sleeve is fixedly connected with the inner sleeve through a first return spring.

Preferably, the circuit board assembly comprises a frame, screw holes are formed in the inner walls of the tops of the left end and the right end of the frame, a screw rod is inserted into the inner wall of the inner support, and the outer wall of the screw rod is sleeved with a second reset spring.

Preferably, the outer wall of the top of the screw rod is inserted with a screw hole, the frame is positioned above the second reset spring, and the outer wall of the screw rod is in threaded connection with a nut.

Preferably, the first circuit board is fixedly mounted on the inner wall of the frame, the lower layer frames are fixedly mounted on the outer walls of the bottoms of the left side and the right side of the first circuit board, the lower layer frames are bilaterally symmetrical, and the second circuit board is fixedly mounted between the two lower layer frames.

Preferably, the supporting plates are fixedly installed on the left inner wall and the right inner wall of the shell, a groove is formed in the center position of the inner wall of each supporting plate, the inner wall of each groove is in threaded connection with a bolt, the outer wall of each bolt is in threaded connection with the inner wall of the shell, heat dissipation silicone grease is fixedly installed on the top of each supporting plate, the bottom of each heat dissipation silicone grease is fixedly connected with the top of a circuit board, and the top of each circuit board is flush with the top of the bin body.

The utility model has the advantages that:

1. by arranging the bin body, the anti-vibration performance of the integrated circuit is improved under the action of the first resin layer and the second resin layer, so that the service life of the circuit board assembly is prolonged;

2. the vibration-proof rods are uniformly and fixedly arranged on the bin body and the inner wall, the outer sleeve and the inner sleeve are matched for guiding, and the first reset spring can deform when being vibrated, so that vibration waves are absorbed, the vibration-proof performance of the circuit board assembly is improved, and the service life of the circuit board assembly is prolonged;

3. through setting up reset spring cup joint on the screw rod outer wall for when taking place the vibration, stretch out and draw back the change after the two atress of reset spring, thereby consume the energy of vibration, reduce the transmission of vibration energy, thereby reduced the vibration and led to the fact the probability of destruction to circuit board one and circuit board two, thereby stability when convenient improvement circuit board surface integrated circuit's the use.

Drawings

Fig. 1 is a schematic sectional view of the present invention;

FIG. 2 is a drawing of the utility model at A in FIG. 1;

fig. 3 is an enlarged view of the point B in fig. 1 according to the present invention;

fig. 4 is a schematic structural diagram of the circuit board according to the present invention.

In the figure: the novel multifunctional vacuum cleaner comprises a bin body 100, a first resin layer 110, a shielding net 120, a second resin layer 130, a copper plate layer 140, a shock-absorbing rod 150, an outer sleeve 151, an inner sleeve 152, a first return spring 153, a support frame 200, a shell 210, a vacuum tube 220, an inner support 230, a support plate 240, a groove 241, a bolt 242, a circuit board assembly 300, a screw 310, a second return spring 320, a nut 330, a frame 340, a screw hole 341, a first circuit board 350, a lower layer frame 360, a second circuit board 370 and heat-dissipation silicone grease 380.

Detailed Description

The preferred embodiments of the present invention will be described in conjunction with the accompanying drawings, and it will be understood that they are presented herein only to illustrate and explain the present invention, and not to limit the present invention.

Referring to the attached drawings 1-4, the utility model provides a pair of shock-resistant electromagnetic interference resistance integrated circuit, in order to realize above-mentioned purpose, the utility model provides a following technical scheme: an anti-seismic electromagnetic interference integrated circuit comprises a bin body 100, a shock-absorbing rod 150 is uniformly and fixedly arranged on the inner wall of the bin body 100, the end part of the shock-absorbing rod 150 is fixedly connected with a support frame 200, the support frame 200 comprises a shell 210, the shell 210 is fixedly arranged at the top of the shock-absorbing rod 150, a vacuum tube 220 is fixedly arranged at the central position of the inner wall of the shell 210, the interior of the vacuum tube 220 is arranged to be a vacuum structure, an inner support 230 is fixedly arranged on the inner wall of the shell 210, the top of the inner support 230 is elastically connected with a circuit board assembly 300, the bin body 100 comprises a first resin layer 110, the first resin layer 110 is arranged to be rectangular, a shielding net 120 is fixedly arranged on the inner wall of the first resin layer 110, a second resin layer 130 is fixedly arranged on the inner wall of the shielding net 120, a copper plate layer 140 is fixedly arranged on the inner wall of the second resin layer 130, the shock-absorbing rod 150 comprises an outer sleeve 151, the bottom of the outer sleeve 151 is fixedly arranged on the inner wall of the copper plate 140, the inner wall of the outer sleeve 151 is slidably connected with an inner sleeve 152, and the top of the inner sleeve 152 is fixedly connected with the outer wall of the shell 210, the first reset spring 153 is fixedly connected between the outer sleeve 151 and the inner sleeve 152, specifically, the bin body 100 has the function of conveniently installing the shock-absorbing rod 150, meanwhile, the bin body 100 has the functions of protecting and absorbing energy and improving the mechanical performance of the circuit board assembly 300 by arranging the bin body 100, the first resin layer 110 has the functions of absorbing energy and absorbing shock, the shielding net 120 has the function of isolating electronic signals and preventing other electronic equipment in the environment from transmitting electromagnetic signals to interfere with the integrated circuits on the surfaces of the first circuit board 350 and the second circuit board 370, the anti-interference performance of the integrated circuits is conveniently improved, the second resin layer 130 has the functions of absorbing energy and absorbing shock, the shock-absorbing rod 150 has the function of avoiding shock, when the bin body 100 is vibrated, as the shock-absorbing rod 150 is stressed, the first reset spring 153 is stressed and compressed, the kinetic energy is converted into the elastic potential energy of the first reset spring 153, and then after the external force is removed, the first return spring 153 is reset, the kinetic energy of the vibration of the bin body 100 can be consumed when the first return spring 153 is stretched and contracted in a reciprocating manner, thereby conveniently improving the protection function of the circuit board assembly 300, the copper plate layer 140 is made of metal copper, the copper plate layer 140 is favorable for the heat dissipation of the bin body 100, meanwhile, the mechanical property, the impact resistance and the vibration resistance of the bin body 100 are conveniently improved, the copper plate layer 140 has a certain electromagnetic signal shielding function, the inner wall of the vacuum tube 220 is vacuum, and the heat insulation and the insulativity are realized, thereby conveniently providing protection performance to the circuit board assembly 300, conveniently protecting the circuit board assembly 300, avoiding the circuit board assembly 300 from being influenced by high temperature and vibration of the external environment when in operation, the vacuum tube 220 is beneficial to shielding sound vibration, and the protection of the circuit board assembly 300 is conveniently improved.

Further, the circuit board assembly 300 includes a frame 340, screw holes 341 are formed on the top inner walls of the left and right ends of the frame 340, a screw 310 is inserted into the inner wall of the inner support 230, a second return spring 320 is sleeved on the outer wall of the screw 310, screw holes 341 are inserted into the outer wall of the top of the screw 310, the frame 340 is positioned above the second return spring 320, a nut 330 is connected to the outer wall of the screw 310 through screw threads, a first circuit board 350 is fixedly installed on the inner wall of the frame 340, a lower frame 360 is fixedly installed on the outer walls of the left and right sides of the first circuit board 350, two sets of lower frames 360 are bilaterally symmetric, a second circuit board 370 is fixedly installed between the two sets of lower frames 360, support plates 240 are fixedly installed on the inner walls of the left and right clusters of the shell 210, a groove 241 is formed in the center position of the inner wall of the support plates 240, a bolt 242 is connected to the inner wall of the shell 210 through screw threads, heat dissipation silicone grease 380 is fixedly installed on the top of the support plates 240, the bottom of the heat dissipation silicone grease 380 is fixedly connected to the top of the first circuit board 350, the top of the first circuit board 350 is flush with the top of the silo 100, specifically, the first circuit board 300 has an effect of facilitating the installation of an integrated circuit, the frame 340 is made of copper metal, the first circuit board 350 is facilitated to be installed by arranging the frame 340, meanwhile, the first circuit board 350 is conveniently connected with the screw 310, the frame 340 is conveniently elastically connected with the top of the support plate 240 by arranging the screw 310, the elastic connection of the frame 340 and the top of the support plate 240 is facilitated by arranging the frame 340 and the elastic connection of the top of the support plate 240, the vibration energy transmission device is convenient to use in the circuit board 300 and can timely stretch and retract through the second reset spring 320 when being vibrated, so that the vibration energy is conveniently consumed, the energy transmitted by the kinetic energy is reduced, and the circuit board 300 and the integrated circuit installed on the surface of the circuit board 300 are protected, the screw 310 has the function of preventing the connection of the frame 340 and the support plate 240, and simultaneously, the screw 310 has the guiding and limiting functions when the reset spring II 320 is in telescopic operation, thereby improving the stability of the circuit board assembly 300 in operation, the nut 330 has the function of conveniently installing the frame 340 on the outer wall of the bolt 242, the circuit board I350 has the function of conveniently installing a dust collecting circuit, the integrated circuit is favorably dispersed and distributed by arranging the circuit board I350 and the circuit board II 370 for use, thereby improving the vibration resistance and the heat dissipation efficiency of the dust collecting circuit, avoiding the phenomenon that more electronic elements are accumulated to cause the local high temperature of the integrated circuit in operation, conveniently dissipating the heat of the dust collecting circuit, improving the working performance of the integrated circuit, the lower layer frame 360 has the function of conveniently installing the circuit board II 370, and has the function of conveniently dissipating the heat of the integrated circuit on the surface of the circuit board I350 through the heat transfer by arranging the heat dissipation silicone grease 380 and fixedly connecting with the top of the circuit board I350, meanwhile, the first circuit board 350 has certain vibration damping and protecting effects, the supporting plate 240 has a supporting effect on the heat dissipation silicone grease 380, the groove 241 has an effect of facilitating installation of the bolt 242, and the bolt 242 has an effect of facilitating fixed connection of the supporting plate 240 and the inner wall of the shell 210.

The utility model discloses a use as follows: the skilled person can install the electronic components in the integrated circuit on the surfaces of the first circuit board 350 and the second circuit board 370, so that the electronic components in the integrated circuit are arranged in a staggered manner, sleeve the outer sleeve 151 and the inner sleeve 152, connect the first return spring 153 between the outer sleeve 151 and the inner sleeve 152, then fixedly install the support frame 200 on the top of the shock rod 150, then vacuumize the vacuum tube 220, then install the first circuit board 350 on the top of the frame 340, fixedly install the lower frame 360 on the bottom of the first circuit board 350, fix the second circuit board 370 on the inner wall of the lower frame 360, then connect the frame 340 to the bottom of the inner frame 230 through the screw 310, sleeve the second return spring 320 on the outer wall of the screw 310, fixedly install the support plate 240 on the inner wall of the housing 210 through the bolt 242, then install the heat-dissipating silicone grease 380 on the top of the support plate 240, when the integrated circuit is in use, keep away through the first 110 and the second 130 of resin layer in the storehouse body 100 and shake, shield other electromagnetic signal in to the environment through shielding net 120 and copper sheet layer 140, improved integrated circuit's anti-interference ability, when the vibration, through the reciprocal flexible of pole 150 and the two 320 atress of reset spring of moving away to consume the energy of vibration, reduce the vibration to integrated circuit's influence, improved integrated circuit's anti-vibration performance.

The above are only preferred embodiments of the present invention, and any person skilled in the art may modify the present invention or modify it into equivalent technical solutions by using the technical solutions described above. Therefore, any simple modifications or equivalent replacements made according to the technical solution of the present invention belong to the scope of protection claimed by the present invention as far as possible.

Claims

1. The utility model provides an antidetonation electromagnetic interference resistance integrated circuit, includes storehouse body (100), the even fixed mounting of storehouse body (100) inner wall pole (150) of moving away to avoid possible earthquakes, pole (150) tip fixed connection support frame (200) of moving away to avoid possible earthquakes, its characterized in that: the support frame (200) comprises a shell (210), the shell (210) is fixedly installed at the top of the shock absorption rod (150), a vacuum tube (220) is fixedly installed at the center position of the inner wall of the shell (210), a vacuum structure is arranged inside the vacuum tube (220), an inner support (230) is fixedly installed on the inner wall of the shell (210), and the inner support (230) is elastically connected with the circuit board assembly (300) at the top.

2. An anti-seismic EMI integrated circuit according to claim 1, wherein said cartridge body (100) comprises a first resin layer (110), said first resin layer (110) is configured as a rectangle, a shielding net (120) is fixedly installed on an inner wall of said first resin layer (110), a second resin layer (130) is fixedly installed on an inner wall of said shielding net (120), and a copper plate layer (140) is fixedly installed on an inner wall of said second resin layer (130).

3. An earthquake-resistant EMI protection IC as claimed in claim 2 wherein said shock rod (150) includes an outer sleeve (151), the bottom of said outer sleeve (151) is fixedly mounted on the inner wall of the copper plate layer (140).

4. An earthquake-resistant EMI preventing IC as claimed in claim 3, wherein the inner wall of said outer sleeve (151) is slidably connected with the inner sleeve (152), the top of said inner sleeve (152) is fixedly connected with the outer wall of the housing (210), and a first return spring (153) is fixedly connected between said outer sleeve (151) and said inner sleeve (152).

5. An anti-seismic electromagnetic interference (emi) ic according to claim 1, wherein the circuit board assembly (300) includes a frame (340), screw holes (341) are formed on top inner walls of left and right ends of the frame (340), a screw rod (310) is inserted into an inner wall of the inner support (230), and an outer wall of the screw rod (310) is sleeved with a second return spring (320).

6. An anti-seismic EMI integrated circuit according to claim 5, wherein the screw (310) is inserted into the screw hole (341) on the top outer wall, the frame (340) is located above the second return spring (320), and the nut (330) is screwed on the outer wall of the screw (310).

7. An anti-seismic EMI integrated circuit according to claim 6, wherein the inner wall of the frame (340) is fixedly mounted with a first circuit board (350), the outer walls of the left and right bottom sides of the first circuit board (350) are fixedly mounted with a lower shelf (360), the lower shelves (360) are bilaterally symmetrical, and a second circuit board (370) is fixedly mounted between the two lower shelves (360).

8. An anti-seismic electromagnetic interference resistance integrated circuit according to claim 7, characterized in that two clusters of inner walls of the left and right of the housing (210) are fixedly provided with the supporting plate (240), a groove (241) is formed in the center of the inner wall of the supporting plate (240), the inner wall of the groove (241) is connected with the bolt (242) in a threaded manner, the outer wall of the bolt (242) is connected with the inner wall of the housing (210) in a threaded manner, the top of the supporting plate (240) is fixedly provided with the heat dissipation silicone grease (380), the bottom of the heat dissipation silicone grease (380) is fixedly connected with the top of the first circuit board (350), and the top of the first circuit board (350) is flush with the top of the bin body (100).