CN220710343U

CN220710343U - Light emitting device and display module

Info

Publication number: CN220710343U
Application number: CN202322008278.0U
Authority: CN
Inventors: 巫殷伟; 岳春波; 李健林
Original assignee: Huizhou Shiwei New Technology Co Ltd
Current assignee: Huizhou Shiwei New Technology Co Ltd
Priority date: 2023-07-27
Filing date: 2023-07-27
Publication date: 2024-04-02
Anticipated expiration: 2033-07-27

Abstract

The embodiment of the application provides a light emitting device and display module, light emitting device includes: a substrate; the light-emitting chip is arranged on the substrate; the packaging lens comprises a first refraction layer and a second refraction layer which are respectively arranged on the substrate, wherein the first refraction layer covers and packages the light-emitting chip, the second refraction layer covers the surface of one side, far away from the light-emitting chip, of the first refraction layer, and the refractive index of the first refraction layer is smaller than that of the second refraction layer.

Description

Light emitting device and display module

Technical Field

The application relates to the technical field of photoelectric display, in particular to a light emitting device and a display module.

Background

A light emitting device as a backlight generally includes an LED chip and a package structure for packaging the LED chip. In the related art, due to the influence of the packaging structure, the light emitting device has the defect of insufficient light emitting uniformity, and can not better meet the uniform visual effect requirement of the display module.

Disclosure of Invention

The embodiment of the application provides a light emitting device and a display module, which can improve the light emitting uniformity of the light emitting device and better realize the uniform visual effect of the display module.

In one aspect, embodiments of the present application provide a light emitting device, including: a substrate; the light-emitting chip is arranged on the substrate; the packaging lens comprises a first refraction layer and a second refraction layer which are respectively arranged on the substrate, wherein the first refraction layer covers and packages the light-emitting chip, the second refraction layer covers the surface of one side, far away from the light-emitting chip, of the first refraction layer, and the refractive index of the first refraction layer is smaller than that of the second refraction layer.

In some embodiments, a plurality of quantum dots are disposed at intervals within the second refractive layer.

In some embodiments, the first refractive layer has a bullet head structure.

In some embodiments, a surface of the second refractive layer remote from the first refractive layer is a free-form surface.

In some embodiments, the light emitting device further includes a reflective layer, a concave portion is disposed on a side of the second refractive layer away from the substrate, and the reflective layer is filled in the concave portion.

In some embodiments, the light emitting device further includes a water-oxygen barrier layer disposed on the substrate, the water-oxygen barrier layer covering a surface of the second refractive layer remote from the first refractive layer.

In some embodiments, the light emitting device further includes an anti-reflection film layer disposed on the substrate and covering a surface of the water-oxygen barrier layer remote from the second refractive layer.

In some embodiments, the first refractive layer is a transparent silicone layer; and/or, the second refraction layer is a transparent silica gel layer.

In some embodiments, the encapsulated lens is a 3D print lens.

On the other hand, the embodiment of the application provides a display module, which comprises the light-emitting device provided by any one of the embodiments.

The embodiment of the application sets the refractive index of the first refraction layer smaller than the refractive index of the second refraction layer by arranging the packaging lens with the first refraction layer and the second refraction layer; therefore, when the light-emitting chip emits light, the light emitted by the light-emitting chip is emitted after being refracted and diffused by the first refraction layer and the second refraction layer, so that the light is gradually diffused to a larger light-emitting angle range to form more uniform light-emitting distribution, the light-emitting uniformity of the light-emitting device is improved, and the uniform visual effect of the display module is better realized.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the description of the embodiments will be briefly introduced below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a cross-sectional structural view of a light emitting device provided in some embodiments of the present application.

Description of main reference numerals:

1-light-emitting device, 10-substrate, 20-light-emitting chip, 30-packaging lens, 31-first refraction layer, 311-cylinder subsection, 312-bullet subsection, 32-second refraction layer, 321-quantum dot, 40-reflection layer, 50-water oxygen barrier layer and 60-antireflection film layer.

Detailed Description

The following description of the embodiments of the present application will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.

In the description of the present application, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate an orientation or positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

"A and/or B" includes the following three combinations: only a, only B, and combinations of a and B.

The use of "adapted" or "configured to" in this application is meant to be open and inclusive language that does not exclude devices adapted or configured to perform additional tasks or steps. In addition, the use of "based on" is intended to be open and inclusive in that a process, step, calculation, or other action "based on" one or more of the stated conditions or values may be based on additional conditions or beyond the stated values in practice.

In this application, the term "exemplary" is used to mean "serving as an example, instance, or illustration. Any embodiment described herein as "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments. The following description is presented to enable any person skilled in the art to make and use the application. In the following description, details are set forth for purposes of explanation. It will be apparent to one of ordinary skill in the art that the present application may be practiced without these specific details. In other instances, well-known structures and processes have not been shown in detail to avoid obscuring the description of the present application with unnecessary detail. Thus, the present application is not intended to be limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.

As shown in fig. 1, the embodiment of the present application provides a light emitting device 1, where the light emitting device 1 includes a substrate 10, a light emitting chip 20 and a packaging lens 30, so that light emitting uniformity of the light emitting device 1 can be improved, and uniform viewing efficiency of a display module can be better realized.

The type of the substrate 10 may be determined according to actual needs, and may be, for example, a printed circuit board, a flexible circuit board, or the like, which is not limited in the embodiment of the present application. The light emitting chip 20 is disposed on the substrate 10, and may be fixed on the substrate 10 by, for example, a die bonding process. The type of the light emitting chip 20 may be determined according to actual needs, and for example, micro LEDs, mini LEDs, etc. may be used, which is not limited in the embodiment of the present application.

The package lens 30 is disposed on the substrate 10 and encloses the substrate 10 to form a package cavity, and the light emitting chip 20 is disposed in the package cavity to be reliably packaged. Here, the package lens 30 includes a first refractive layer 31 and a second refractive layer 32 respectively disposed on the substrate 10; the first refraction layer 31 covers the packaged light emitting chip 20, the second refraction layer 32 covers a surface of the first refraction layer 31, which is far away from the light emitting chip 20, and the refractive index of the first refraction layer 31 is smaller than that of the second refraction layer 32. Thus, the package lens 30 has a refractive lens configuration.

When the light emitting chip 20 emits light, the light irradiates into the first refraction layer 31, is further irradiated into the second refraction layer 32 after being refracted and diffused by the first refraction layer 31, and is further emitted after being further refracted and diffused by the second refraction layer 32, so that the light emitted by the light emitting chip 20 is diffused to a larger light emitting angle range to form uniform light emitting distribution, the light emitting uniformity of the light emitting device 1 is improved, and the uniform visual effect of the display module is better realized.

In some embodiments, a plurality of quantum dots 321 may be disposed at intervals within the second refractive layer 32. The quantum dots 321 are nanoparticles made of a semiconductor material, and can be excited to generate an excitation spectrum when irradiated with light emitted from the light emitting chip 20, thereby obtaining a desired display spectrum.

In some embodiments, the first refractive layer 31 may have a bullet head structure. Here, the bullet structure may include a pillar portion 311 and a bullet portion 312 sequentially provided, the pillar portion 311 being in contact with the substrate 10, the bullet portion 312 being provided at one end of the pillar portion 311 away from the substrate 10, the bullet portion 312 being a hemisphere or a semi-ellipsoid.

In some embodiments, a surface of the second refractive layer 32 away from the first refractive layer 31 may be a free-form surface. By the above arrangement, the package lens 30 can be made to be a free-form lens, and has a good light diffusion effect.

In some embodiments, the light emitting device 1 may further include a reflective layer 40, where a recess is disposed on a side of the second refractive layer 32 away from the substrate 10, and the reflective layer 40 is filled in the recess. Here, the reflective layer 40 may fill up the concave portion at the top of the package lens 30; when the light irradiates the concave portion to emit, the reflecting layer 40 can reflect the light, so that the light reenters the package lens 30 and is emitted from the peripheral surface of the package lens 30, and the light diffusion of the package lens 30 is increased to form a uniform light distribution. In some examples, the side of the reflective layer 40 remote from the substrate 10 is flush with the top of the side of the second refractive layer 32 remote from the substrate 10, thereby forming a relatively flat surface for leveling.

The material of the reflective layer 40 may be determined according to practical needs, and for example, a white silica gel material with a relatively high reflectivity is used, which is not limited in the embodiment of the present application. In some examples, the white silica gel material used for the reflective layer 40 has a reflectance of 90% or more with respect to the light emission spectrum of the light emitting chip 20.

In some embodiments, the light emitting device 1 may further include a water oxygen barrier layer 50. The water-oxygen barrier layer 50 is disposed on the substrate 10, and the water-oxygen barrier layer 50 covers a surface of the second refractive layer 32 away from the first refractive layer 31. In this way, the water-oxygen barrier layer 50 can perform water-oxygen isolation protection on the package lens 30 and the light emitting chip 20 packaged between the package lens 30 and the substrate 10, so as to avoid water-oxygen invasion to affect the performance and service life of the light emitting chip 20. The molding mode of the water-oxygen barrier layer 50 may be determined according to actual needs, and may be, for example, spraying, sputtering, or the like, which is not limited in the embodiment of the present application.

In some examples, the light emitting device 1 may further include an anti-reflection film layer 60, where the anti-reflection film layer 60 is disposed on the substrate 10 and covers a surface of the water-oxygen barrier layer 50 away from the second refractive layer 32. The anti-reflection film 60 can reduce or eliminate the reflected light on the surface of the package lens 30 and increase the light transmission of the package lens 30. The forming manner of the antireflection film layer 60 may be determined according to actual needs, and may be, for example, spraying, sputtering, or the like, which is not limited in the embodiment of the present application.

In some examples, when the light emitting device 1 includes the reflective layer 40 and the water-oxygen barrier layer 50, the water-oxygen barrier layer 50 may cover a surface of the reflective layer 40 away from the second refractive layer 32, so as to perform a relatively comprehensive water-oxygen barrier function.

The material of the first refraction layer 31 may be determined according to practical needs, and different types of transparent dielectric materials may be used, which is not limited in the embodiment of the present application. In some embodiments, the first refractive layer 31 may be a transparent silica gel layer, i.e. made of a transparent silica gel material.

Similarly, the material of the second refraction layer 32 may be determined according to practical needs, and different types of transparent dielectric materials may be used, which is not limited in this embodiment of the present application. In some embodiments, the second refractive layer 32 may be a transparent silicone layer, i.e., made of a transparent silicone material.

The molding process of the encapsulated lens 30 may be determined according to actual needs, and the embodiment of the present application is not limited thereto. In some embodiments, the encapsulated lens 30 may be a 3D printed lens. In other words, the package lens 30 may be manufactured using a 3D printing process; in the 3D printing, the first refractive layer 31 and the second refractive layer 32 may be sequentially printed on the substrate 10 after the die bonding. The package lens 30 manufactured by the 3D printing process has a compact tissue structure, and has good sealing property, so that the package reliability of the light emitting chip 20 is improved.

In some examples, the first refractive layer 31 and the second refractive layer 32 may be transparent silica gel layers, respectively, made of transparent silica gel materials having different refractive indexes; here, the first refractive layer 31 and the second refractive layer 32 may be manufactured using a 3D printing process, and ultraviolet light may be simultaneously irradiated during the 3D printing process, so that the transparent silica gel material is rapidly cured.

On the other hand, the embodiment of the present application provides a display module including the light emitting device 1 provided in any one of the above embodiments. The type of the display module may be determined according to actual needs, and for example, a direct type display module, a side-entry type display module, etc. may be used.

The light emitting device and the display module provided by the embodiments of the present application are described in detail, and specific examples are applied to illustrate the principles and embodiments of the present application, and the description of the above embodiments is only used to help understand the method and core idea of the present application; meanwhile, those skilled in the art will have variations in the specific embodiments and application scope in light of the ideas of the present application, and the present description should not be construed as limiting the present application in view of the above.

Claims

1. A light emitting device, comprising:

a substrate;

the light-emitting chip is arranged on the substrate;

the packaging lens comprises a first refraction layer and a second refraction layer which are respectively arranged on the substrate, wherein the first refraction layer covers and packages the light-emitting chip, the second refraction layer covers the surface of one side, far away from the light-emitting chip, of the first refraction layer, and the refractive index of the first refraction layer is smaller than that of the second refraction layer;

and a plurality of quantum dots are arranged in the second refraction layer at intervals.

2. The light emitting device of claim 1, wherein the first refractive layer has a bullet structure.

3. The light-emitting device according to claim 1, wherein a surface of the second refractive layer away from the first refractive layer is a free-form surface.

4. A light-emitting device according to claim 1 or 3, further comprising a reflective layer, wherein a recess is provided on a side of the second refractive layer remote from the substrate, and the reflective layer is filled in the recess.

5. The light-emitting device according to claim 1, further comprising a water-oxygen barrier layer provided on the substrate, the water-oxygen barrier layer covering a side surface of the second refractive layer remote from the first refractive layer.

6. The light-emitting device according to claim 5, further comprising an antireflection film layer provided on the substrate and covering a surface of the water-oxygen barrier layer remote from the second refractive layer.

7. The light emitting device of claim 1, wherein the first refractive layer is a transparent silicone layer; and/or, the second refraction layer is a transparent silica gel layer.

8. The light emitting device of claim 1, wherein the encapsulated lens is a 3D printed lens.

9. A display module comprising the light-emitting device according to any one of claims 1 to 8.