CN220691996U

CN220691996U - Integrated circuit chip bonding device

Info

Publication number: CN220691996U
Application number: CN202322288725.2U
Authority: CN
Inventors: 肖国庆; 林坚; 黄鑫
Original assignee: Jiangxi Core Microelectronics Co ltd
Current assignee: Jiangxi Core Microelectronics Co ltd
Priority date: 2023-08-24
Filing date: 2023-08-24
Publication date: 2024-03-29
Anticipated expiration: 2033-08-24

Abstract

The utility model discloses an integrated circuit chip bonding device which comprises a workbench, wherein limiting rods are arranged on two sides of the top surface of the workbench, a top plate is arranged at the top end of each limiting rod, an electric cylinder is arranged in the middle of the top surface of the top plate, and limiting blocks are connected onto the limiting rods in a sliding mode. According to the utility model, the chip and the metal guide plate are placed in the placing seat, the micro-cylinder on the two side surfaces of the placing seat drives the clamping blocks to move, when the clamping blocks are abutted against the chip and the metal guide plate in the placing seat, the clamping blocks can be automatically clamped and positioned, the inclined deviation is prevented during processing, the stability of the chip and the metal guide plate during bonding processing is conveniently maintained, after the chip and the metal guide plate are clamped and fixed, the electric cylinder drives the pushing plate to move, so that the hot pressing head on the bottom surface of the pushing plate moves, and the bonding processing can be performed on the chip and the metal guide plate in the placing seat, thereby being beneficial to improving the processing effect.

Description

Integrated circuit chip bonding device

Technical Field

The present disclosure relates to chip bonding, and particularly to an integrated circuit chip bonding device.

Background

Due to the rapid development of global electronic information technology, integrated circuit chips are continuously developed in the directions of high density, high performance, thinness and shortness, and at present, when the integrated circuit chips are processed, a chip bonding device is required to process the integrated circuit chips.

The current China patent with the bulletin number of CN211654779U discloses a chip alignment bonding structure, and the key points of the technical scheme are as follows: the novel lifting device comprises a bottom plate, wherein the left side and the right side of the bottom plate are fixedly provided with supporting legs, and the top of an inner cavity of the bottom plate is fixedly provided with a limiting rod. When the chip is required to be bonded, the chip body and the metal guide plate are placed in the placing table, then the driving motor is started to enable the screw rod to rotate, the movable sleeve rod moves left and right under the thrust of the screw rod, the placing table can be driven to move left and right, the placing table is adjusted to the hot press head and is matched with the hot press head, then the left and right cylinders are started, the hot press head is moved downwards by pushing the pushing plate, and when the hot press head presses the metal guide plate, the metal guide plate is preheated and is matched with the chip body quickly, so that the bonding process of the chip is realized, the whole bonding process is very concise and efficient, the working efficiency of the chip is greatly improved, and the production requirements of people are more met.

The prior art scheme has the following defects that the whole bonding process is very simple and efficient, and the working efficiency of the chip is greatly improved, but the chip is easy to incline on a placing table when the chip is subjected to bonding processing due to the lack of a clamping mechanism in the technical scheme, so that the processing effect on the chip is easy to be reduced.

Disclosure of Invention

(one) solving the technical problems

Aiming at the defects of the prior art, the utility model provides an integrated circuit chip bonding device which has the advantages of convenience in clamping and fixing chips, high stability and good processing effect, thereby solving the problems in the background art.

(II) technical scheme

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides an integrated circuit chip bonding device, includes the workstation, the top surface both sides of workstation are equipped with the gag lever post, and the top of gag lever post is equipped with the roof, electronic jar is installed to top surface intermediate position department of roof, sliding connection has the stopper on the gag lever post, and is equipped with the push pedal between the stopper, the output of electronic jar runs through roof and push pedal fixed connection, the bottom surface intermediate position department of push pedal is equipped with the hot-press head, the both sides that the gag lever post was kept away from to the top surface of workstation are equipped with the backup pad, and the top surface of backup pad is equipped with places the seat, the both sides surface mounting who places the seat has miniature cylinder, and the output of miniature cylinder runs through places seat fixedly connected with clamp block, the below of workstation is equipped with the supporting box, and installs the motor in the bottom upper surface intermediate position department of supporting box, the output fixedly connected with screw rod of motor, and threaded connection has a screw thread section of thick bamboo on the screw thread section of thick bamboo's top and workstation fixed connection, the both sides surface of screw section of thick bamboo is equipped with the connecting block, and the one end of connecting block extends to the inside of the spread groove that the supporting box inner wall both sides were seted up.

Preferably, a protection pad is arranged on one side surface of the clamping block, and the protection pad is made of rubber.

Preferably, the clamping block is matched with the placing seat.

Preferably, the connecting block is matched with the connecting groove.

Preferably, a movable plate is arranged on the front end surface of the supporting box, and the movable plate is fixedly connected with the supporting box through a screw.

Preferably, the hot pressing head is matched with the placing seat.

Preferably, the workbench is matched with the supporting box.

(III) beneficial effects

Compared with the prior art, the utility model provides an integrated circuit chip bonding device, which has the following beneficial effects:

(1) According to the utility model, the chip and the metal guide plate are placed in the placing seat, the clamping blocks are driven to move through the micro-cylinders on the two side surfaces of the placing seat, when the clamping blocks are abutted against the chip and the metal guide plate in the placing seat, the clamping blocks can be automatically clamped and positioned, the chip and the metal guide plate are prevented from tilting and shifting during processing, the stability of the chip and the metal guide plate during bonding processing is conveniently maintained, and after the chip and the metal guide plate are clamped and fixed, the push plate is driven to move through the electric cylinders, so that the hot pressing head on the bottom surface of the push plate is moved, and the chip and the metal guide plate in the placing seat can be bonded, thereby being beneficial to improving the processing effect.

(2) According to the utility model, the screw is driven to rotate by the motor, and the threaded cylinder on the screw is limited by the connecting block and the connecting groove, so that the threaded cylinder can move up and down on the screw, and the threaded cylinder drives the workbench to move while moving on the screw, so that the height position of the workbench can be adjusted, the device can be suitable for workers with different heights, the limitation in use is reduced, and the practicality of the device is improved.

Drawings

In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of an integrated circuit chip bonding apparatus according to the present utility model;

FIG. 2 is an enlarged view of an integrated circuit chip bonding apparatus according to the present utility model;

FIG. 3 is a front view of an integrated circuit die bonding apparatus according to the present utility model;

fig. 4 is a schematic diagram of a supporting case of an integrated circuit chip bonding apparatus according to the present utility model.

Legend description:

1. a work table; 2. a support plate; 3. a placement seat; 4. a limiting block; 5. a limit rod; 6. a top plate; 7. an electric cylinder; 8. a push plate; 9. a hot press head; 10. a connecting groove; 11. a connecting block; 12. a supporting box; 13. a motor; 14. a screw; 15. a thread cylinder; 16. a protective pad; 17. a clamping block; 18. a micro cylinder; 19. a movable plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., are based on directions or positional relationships shown in the drawings, are merely for convenience of description and simplification of description, and do not indicate or imply that the apparatus or element to be referred to must have a specific direction, be constructed and operated in the specific direction, and thus should not be construed as limiting the present utility model; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Referring to fig. 1-4, an integrated circuit chip bonding device comprises a workbench 1, wherein two sides of the top surface of the workbench 1 are provided with a limiting rod 5, the top end of the limiting rod 5 is provided with a top plate 6, an electric cylinder 7 is installed at the middle position of the top surface of the top plate 6, a limiting block 4 is connected onto the limiting rod 5 in a sliding manner, a push plate 8 is arranged between the limiting blocks 4, the output end of the electric cylinder 7 penetrates through the top plate 6 and is fixedly connected with the push plate 8, a hot press head 9 is arranged at the middle position of the bottom surface of the push plate 8, two sides of the top surface of the workbench 1 far away from the limiting rod 5 are provided with support plates 2, the top surface of the support plates 2 is provided with a placing seat 3, two side surfaces of the placing seat 3 are provided with micro cylinders 18, the output end of the micro cylinders 18 penetrate through the placing seat 3 and are fixedly connected with clamping blocks 17, a supporting box 12 is arranged below the workbench 1, and a motor 13 is installed at the middle position of the bottom upper surface of the supporting box 12, the output end of the motor 13 is fixedly connected with a screw 14, the screw 14 is in threaded connection with a threaded cylinder 15, the top end of the threaded cylinder 15 is fixedly connected with the workbench 1, connecting blocks 11 are arranged on the surfaces of two sides of the threaded cylinder 15, one end of each connecting block 11 extends to the inside of a connecting groove 10 formed in two sides of the inner wall of the supporting box 12, a chip and a metal guide plate are placed in the placing seat 3, the clamping block 17 is driven to move through a micro cylinder 18 on the surfaces of two sides of the placing seat 3, when the clamping block 17 is abutted with the chip and the metal guide plate in the placing seat 3, the clamping block can be automatically clamped and positioned, oblique deflection is prevented during machining, the stability of the chip and the metal guide plate during bonding machining is conveniently maintained, after the chip and the metal guide plate are clamped and fixed, the push plate 8 is driven to move through the electric cylinder 7, the hot pressing head 9 on the bottom surface of the push plate 8 moves, so that the chip in the placing seat 3 and the metal guide plate can be bonded, and the processing effect of the chip is improved.

In one embodiment, a protection pad 16 is disposed on a side surface of the clamping block 17, and the protection pad 16 is made of rubber, wherein the chip edge in the placement seat 3 can be protected by using the protection pad 16, so as to prevent the clamping block 17 from damaging the chip edge.

In one embodiment, the clamping block 17 is matched with the placement seat 3, so that the clamping block 17 can move in the placement seat 3 conveniently, and a chip in the placement seat 3 can be clamped.

In one embodiment, the connection block 11 is matched with the connection groove 10, so that the connection block 11 can move in the connection groove 10 conveniently, and the thread cylinder 15 can be limited conveniently.

In one embodiment, the front end surface of the supporting box 12 is provided with a movable plate 19, and the movable plate 19 is fixedly connected with the supporting box 12 through a screw, wherein by loosening the screw, the movable plate 19 is removed, so that the parts in the supporting box 12 can be maintained and overhauled.

In one embodiment, the thermal head 9 is matched with the placement base 3 to facilitate processing of the chips in the placement base 3.

In one embodiment, the table 1 is matched with the supporting box 12, so that the table 1 can be conveniently moved.

In one embodiment, the control panel control circuit is implemented by simple programming by those skilled in the art, and is only used without modification, and thus the control mode and circuit connection will not be described in detail.

Working principle:

during the use, place chip and metal guide plate in placing seat 3, micro cylinder 18 through placing on the seat 3 both sides surface drives clamp block 17 and removes, when clamp block 17 and place chip and metal guide plate butt in the seat 3, can press from both sides tight location to it voluntarily, prevent to take place the skew when processing, be convenient for keep the stability of chip and metal guide plate when bonding processing, wherein when pressing from both sides tight fixed back to chip and metal guide plate, drive push pedal 8 through electric cylinder 7 and remove, make hot pressing head 9 on push pedal 8 bottom surface remove, can carry out bonding processing to chip and metal guide plate in placing seat 3, be favorable to improving its processing effect, wherein drive screw rod 14 through motor 13 and rotate, rethread connecting block 11 and spread groove 10 carry out spacingly to screw rod 14's screw tube 15, make screw tube 15 can reciprocate on screw rod 14, screw tube 15 drives workstation 1 and removes when moving on screw rod 14, thereby can adjust the high position of workstation 1, make this device can adapt to the work that is difficult to use, the practicality is improved when having reduced the practicality of using of this device.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. The utility model provides an integrated circuit chip bonding device, includes workstation (1), its characterized in that, the top surface both sides of workstation (1) are equipped with gag lever post (5), and the top of gag lever post (5) is equipped with roof (6), electric cylinder (7) are installed to the top surface intermediate position department of roof (6), sliding connection has stopper (4) on gag lever post (5), and is equipped with push pedal (8) between stopper (4), the output of electric cylinder (7) runs through roof (6) and push pedal (8) fixed connection, the bottom surface intermediate position department of push pedal (8) is equipped with hot press head (9), the both sides that the top surface of workstation (1) kept away from gag lever post (5) are equipped with backup pad (2), and the top surface of backup pad (2) is equipped with places seat (3), place both sides surface mounting of seat (3) has miniature cylinder (18), and the output of miniature cylinder (18) runs through places seat (3) fixedly connected with clamp block (17), the below of workstation (1) is equipped with supporting box (12), and supporting box (14) are equipped with screw thread (13) on the screw rod (13) of screw thread department on the bottom surface mounting, the top of a thread cylinder (15) is fixedly connected with the workbench (1), connecting blocks (11) are arranged on the surfaces of the two sides of the thread cylinder (15), and one end of each connecting block (11) extends to the inside of a connecting groove (10) formed in the two sides of the inner wall of the supporting box (12).

2. An integrated circuit chip bonding apparatus according to claim 1, wherein a protection pad (16) is provided on a side surface of the clamping block (17), and the protection pad (16) is made of rubber.

3. An integrated circuit chip bonding apparatus according to claim 1, characterized in that the clamping block (17) is matched to the placement base (3).

4. An integrated circuit chip bonding apparatus according to claim 1, characterized in that the connection block (11) is matched with the connection groove (10).

5. An integrated circuit chip bonding apparatus according to claim 1, wherein the front end surface of the supporting case (12) is provided with a movable plate (19), and the movable plate (19) is fixedly connected with the supporting case (12) by a screw.

6. An integrated circuit chip bonding apparatus according to claim 1, characterized in that the thermo-compression head (9) is matched to the placement base (3).

7. An integrated circuit chip bonding apparatus according to claim 1, characterized in that the table (1) is matched to a supporting box (12).