CN220689868U - Temperature equalizing plate with plane stacking structure - Google Patents
Temperature equalizing plate with plane stacking structure Download PDFInfo
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- CN220689868U CN220689868U CN202322396187.9U CN202322396187U CN220689868U CN 220689868 U CN220689868 U CN 220689868U CN 202322396187 U CN202322396187 U CN 202322396187U CN 220689868 U CN220689868 U CN 220689868U
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- capillary
- plate
- middle layer
- temperature equalization
- plates
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- 239000007788 liquid Substances 0.000 claims abstract description 25
- 239000002826 coolant Substances 0.000 claims abstract description 24
- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 238000007789 sealing Methods 0.000 claims abstract description 5
- 239000010410 layer Substances 0.000 claims description 38
- 238000005192 partition Methods 0.000 claims description 20
- WYTGDNHDOZPMIW-RCBQFDQVSA-N alstonine Natural products C1=CC2=C3C=CC=CC3=NC2=C2N1C[C@H]1[C@H](C)OC=C(C(=O)OC)[C@H]1C2 WYTGDNHDOZPMIW-RCBQFDQVSA-N 0.000 claims description 6
- 239000002356 single layer Substances 0.000 claims description 3
- 238000000926 separation method Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 12
- 230000017525 heat dissipation Effects 0.000 description 8
- 239000010949 copper Substances 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000005245 sintering Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 230000004308 accommodation Effects 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 241000276425 Xiphophorus maculatus Species 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a temperature equalization plate with a planar stacking structure, and relates to the technical field of temperature equalization plates. The temperature equalizing plate comprises a middle layer and cover bodies positioned on two sides of the middle layer, wherein the surface of the middle layer and the inner side surfaces of the two cover bodies are closely arranged, and the cover bodies are in sealing connection with the peripheral edges of the middle layer; the inner side of the middle layer is provided with a capillary channel for containing coolant, and the side wall of the middle layer is provided with a liquid inlet communicated with the capillary channel. Through setting up the intermediate level, and pile up the setting between intermediate level and the lid to guaranteed that whole intermediate level is not hollow, guaranteed the pressure-bearing capacity of whole samming board.
Description
Technical Field
The utility model relates to a temperature equalizing plate, in particular to a temperature equalizing plate with a planar stacking structure.
Background
The temperature equalizing plate is a structural element which rapidly evaporates heat nearby a heat source by utilizing liquid working medium phase change and transfers the heat to a two-dimensional area for condensation and heat dissipation, and has been widely applied to the fields of intelligent electronic equipment, new energy automobiles, household appliances and the like.
The conventional temperature equalization plate is conventionally prepared by adopting the processes of powder sintering, copper wire mesh sintering, copper wire sintering and the like. The upper cover and the lower cover of the temperature equalizing plate formed by the conventional processes are formed by adopting a mechanical processing mode (and punching production), and the middle capillary structure (namely a structure formed by powder sintering, copper wire mesh sintering or copper wire sintering) is clamped by the upper cover/the lower cover, and forms a middle hollow layer (steam channel) with the upper cover/the lower cover, so that the temperature equalizing plate is formed. The middle layer of the conventional temperature equalizing plate in the prior art is hollow, has limited pressure bearing capacity, and is not suitable for occasions with larger pressure bearing or has poor applicability.
Disclosure of Invention
In order to solve the technical problems, the utility model provides a technical scheme of a uniform Wen Banben with a planar stacking structure, which comprises the following steps:
the temperature equalization plate with the planar stacking structure comprises a middle layer and cover bodies positioned on two sides of the middle layer, wherein the surfaces of the middle layer and the inner side surfaces of the two cover bodies are closely adjacent, and the cover bodies are in sealing connection with the peripheral edges of the middle layer; the inner side of the middle layer is provided with a capillary channel for containing coolant, and the side wall of the middle layer is provided with a liquid inlet communicated with the capillary channel.
The utility model is further arranged that the middle layer is a single-layer capillary plate, the capillary channel is arranged on the capillary plate and penetrates through two side surfaces of the capillary plate, and the liquid inlet is arranged at the edge of the capillary plate.
The utility model is further arranged that the middle layer comprises a plurality of capillary plates and a plurality of partition boards which are alternately arranged, two surfaces of each partition board are closely adjacent to the surfaces of the adjacent capillary plates, the partition boards are connected with the peripheral edges of the capillary plates in a sealing way, the capillary channels are distributed on the capillary plates, and connecting holes communicated with the capillary channels are formed in the partition boards.
The utility model further provides that the number of the partition boards is at least one, and the capillary channels are distributed on the capillary plate.
The utility model is further arranged that the capillary channel comprises surrounding parts distributed around the capillary plate and filling parts positioned in the surrounding range of the surrounding parts, the liquid inlet is communicated with the surrounding parts, and the filling parts are densely distributed on the capillary plate.
The utility model is further arranged that the connecting hole is communicated with the surrounding part and is arranged at a position close to the liquid inlet.
The utility model is further arranged such that the filling part is arranged in a serpentine shape on the capillary plate.
The utility model is further arranged that the length directions of the serpentine trend on the two adjacent capillary plates are mutually staggered.
The utility model further provides that the capillary channel is spaced from the peripheral wall of the intermediate layer.
The utility model is further characterized in that a plurality of through holes which are mutually communicated are formed in the middle layer and the cover body.
The beneficial technical effects of the utility model are as follows:
through set up the intermediate level between two covers, and the intermediate level divide into the baffle that sets up between two capillary boards and two capillary boards, its layer number is more to guaranteed whole samming board in the ascending intensity of thickness direction, and two capillary board surfaces are level and smooth, are the plane with the contact surface of cover and baffle, make the intermediate level of whole samming board not hollow, further guaranteed the bearing capacity. And the baffle is the copper, and the surface only has a plurality of connecting holes to and a plurality of through-holes that are used for supplying the bolt to pass through, thereby further strengthened the bearing force of whole equal Wen Banhou degree direction, and set up the capillary passage of snakelike trend on the capillary board, guaranteed the accommodation of coolant, guaranteed the radiating effect of whole samming board.
Drawings
FIG. 1 is a schematic view of a first embodiment of the present utility model;
FIG. 2 is an exploded view of a first embodiment of the present utility model;
FIG. 3 is a schematic diagram of a second embodiment of the present utility model;
FIG. 4 is an exploded view of a second embodiment of the present utility model;
FIG. 5 is an enlarged view of FIG. 4 at A;
FIG. 6 is an exploded view of an intermediate layer in a second embodiment of the utility model.
In the figure: 1. a cover body; 2. a partition plate; 3. a capillary plate; 4. a capillary channel; 5. a surrounding part; 6. a filling part; 7. a liquid inlet; 8. a connection hole; 9. and a through hole.
Detailed Description
In order that the manner in which the above recited features of the present utility model are attained and can be understood in detail, a more particular description of the utility model, briefly summarized below, may be had by reference to the appended drawings and examples, which are illustrated in their embodiments, but are not intended to limit the scope of the utility model.
A temperature equalizing plate with a planar stacked structure, as shown in figures 1-3, comprises a middle layer and cover bodies 1 welded on two sides of the middle layer in a peripheral brazing mode. Intermediate level and two lid 1 are the platy thing, and the top surface and the bottom surface of intermediate level and two lid 1 are the plane for when intermediate level and two lid 1 pile up, make the contact surface of both be the plane, thereby guaranteed the roughness of whole samming board, and the bearing capacity of whole samming board, offered the capillary passageway 4 that is used for holding the coolant in the intermediate level, lid 1 is used for shutoff capillary passageway 4, offered the inlet 7 with capillary passageway 4 intercommunication on the lateral wall of intermediate level.
Embodiment one: as shown in fig. 1 and 2, the middle layer is a single-layer capillary plate 3, the capillary plate 3 adopts a copper plate, a capillary channel 4 is formed on the capillary plate 3 through a stamping process, and a liquid inlet 7 is formed at the edge of the capillary plate 3. The capillary channel 4 is formed to penetrate the upper and lower surfaces of the capillary plate 3 and to have a space from the peripheral wall of the intermediate layer. This capillary passage 4 is including setting up portion 5 and being located around setting up portion 5 around the portion in the limit of establishing the filling portion 6, and inlet 7 and enclose the tip intercommunication of setting up portion 5, filling portion 6 is densely covered on capillary plate 3, and the trend of filling portion 6 is serpentine trend, and both ends all with enclose and establish portion 5 intercommunication, serpentine arrangement can be better the utilization space for filling portion 6 can be densely covered on capillary plate 3, has guaranteed the space of whole capillary passage 4, thereby has guaranteed the accommodation volume of coolant. And the liquid inlet 7 is communicated with the end part of the surrounding part 5, so that the capillary channel 4 on the capillary plate 3 is a whole path from the liquid inlet 7 to the tail end, and the circulation of the coolant is ensured.
Two cover bodies 1 are respectively arranged on two sides of a capillary plate 3, after welding is finished, coolant is injected from a liquid inlet 7, and after the coolant is injected, the liquid inlet 7 is sealed and welded in an argon arc welding mode, so that plugging is realized, the internal coolant is prevented from flowing out, and the whole temperature equalizing plate is manufactured.
The capillary plate 3 of the middle layer is arranged to be a copper plate instead of being sintered by copper powder, so that the middle layer of the whole temperature equalizing plate is not hollow, the pressure bearing capacity of the temperature equalizing plate is guaranteed, and the capillary channel 4 is formed on the capillary plate 3 in a stamping process mode, the injection amount of the coolant can be guaranteed, and the heat dissipation effect of the whole temperature equalizing plate is guaranteed.
Embodiment two: the difference from the first embodiment is that, as shown in fig. 3 to 6, the intermediate layer includes two capillary plates 3 and a separator 2, the two capillary plates 3 are made of copper plates and are manufactured by a stamping process, and a plurality of capillary channels 4 are also stamped and formed on the capillary plates 3 at the same time of stamping, and the formed capillary channels 4 penetrate through the upper and lower surfaces of the capillary plates 3. And the capillary channel 4 is spaced from the peripheral wall of the middle layer, so that when the cover body 1 is welded on two sides of the middle layer in a brazing manner, brazing filler metal cannot permeate into the capillary channel 4 to block the capillary channel 4, and the capacity of the capillary channel 4 is ensured. The partition board 2 is also made of copper material, copper has good heat conductivity and good heat exchange rate, so that the heat dissipation effect of the whole middle layer is ensured. A plurality of connecting holes 8 are formed in the partition plate 2 in a punching mode, and the connecting holes 8 can be communicated with the capillary channels 4 in the two capillary plates 3, so that the coolant can flow into one capillary plate 3 only when the coolant is injected into the other capillary plate 3, the filling of the coolant in the capillary channels 4 is guaranteed, and the heat dissipation effect of the whole temperature equalization plate is further guaranteed.
As shown in fig. 3-6, the capillary channel 4 includes surrounding portions 5 distributed at the edges of the capillary plates 3 and filling portions 6 located in the surrounding range of the surrounding portions 5, the liquid inlet 7 is communicated with the end portion of the surrounding portion 5 on one of the capillary plates 3, the liquid inlet 7 and the capillary plates 3 are also in an integrated structure, the filling portions 6 are densely distributed on the capillary plates 3, the trend of the filling portions 6 is in a serpentine trend, two ends of the filling portions are communicated with the surrounding portions 5, the serpentine arrangement can better utilize space, the filling portions 6 can be densely distributed on the capillary plates 3, the space of the whole capillary channel 4 is guaranteed, and accordingly the containing amount of coolant is guaranteed. And the liquid inlet 7 is communicated with the end part of the surrounding part 5, so that the capillary channel 4 on one capillary plate 3 is a whole path from the liquid inlet 7 to the tail end, and the circulation of the coolant is ensured. The connecting holes 8 on the partition plate 2 are arranged in two, one of the connecting holes is arranged near the liquid inlet 7, and when the coolant is injected, the coolant can quickly flow into the capillary channel 4 on the other capillary plate 3 through the connecting holes 8, so that the circulation of the coolant is further ensured, and the forming of the whole temperature equalization plate is ensured.
As shown in fig. 3-6, through holes 9 are formed in four corners of two cover bodies 1, corresponding through holes 9 are formed in a partition board 2, corresponding through holes 9 are integrally formed in the capillary plates 3, the through holes 9 are far away from a capillary channel 4, one cover is placed at the bottommost part, the two prepared capillary plates 3 and the partition board 2 are stacked on the cover body 1 in the sequence of the capillary plates 3-the partition board 2-the capillary plates 3, the other cover body 1 is covered on the uppermost capillary plate 3, the through holes 9 are aligned and all communicated, the two capillary plates 3 and the partition board 2 form an intermediate layer, in addition, when stacking, the two capillary plates 3 are arranged in a staggered mode, more preferably in a mutually perpendicular mode, the two cover bodies 1 and the intermediate layer are welded in a brazing mode to obtain the whole uniform temperature plate, after welding is finished, a liquid inlet 7 on one capillary plate 3 is inserted by a liquid conveying pipe, a cooling agent is vacuumized and injected into the liquid inlet 7 on the capillary plate 3, the cooling agent is pumped into the capillary plate 3 along the cooling inlet, and the cooling plate 4 is connected to the capillary plate 4 along the capillary channel 4, and the two heat dissipation plate 3 and the other capillary plate 3 along the length direction of the two capillary plates 3 are connected with each other, and the heat dissipation effect of the two heat dissipation plate is guaranteed. After the injection of the coolant is completed, the liquid inlet 7 is sealed and welded in an argon arc welding mode, so that the plugging is realized, and the outflow of the internal coolant is prevented.
After the preparation of the temperature equalization plate is finished, as the middle layer is arranged between the two cover bodies 1, and the middle layer is divided into the two capillary plates 3 and the partition plate 2 arranged between the two capillary plates 3, the number of layers is more, so that the strength of the whole temperature equalization plate in the thickness direction is ensured, the surfaces of the two capillary plates 3 are flat, the contact surfaces of the cover bodies 1 and the partition plate 2 are planes, the middle layer of the whole temperature equalization plate is not hollow, the bearing capacity is further ensured, the partition plate 2 is a copper plate, the surface is only provided with a plurality of connecting holes 8, and a plurality of through holes 9 for bolts to pass through, the bearing force in the direction of the whole temperature equalization plate Wen Banhou degrees is further enhanced, and the capillary channels 4 in a snakelike trend are arranged on the capillary plates 3, the containing amount of coolant is ensured, and the heat dissipation effect of the whole temperature equalization plate is ensured.
The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and it should be noted that it is possible for those skilled in the art to make several improvements and modifications without departing from the technical principle of the present utility model, and these improvements and modifications should also be regarded as the protection scope of the present utility model.
Claims (10)
1. A samming board with plane stacked structure, its characterized in that: the novel anti-theft device comprises a middle layer and cover bodies (1) positioned on two sides of the middle layer, wherein the surface of the middle layer and the inner side surfaces of the two cover bodies (1) are closely arranged, and the cover bodies (1) are in sealing connection with the peripheral edges of the middle layer; capillary channel (4) for holding coolant is offered in the intermediate level, just offer on the lateral wall of intermediate level with capillary channel (4) intercommunication go into liquid mouth (7).
2. The temperature equalization plate having a planar stacked structure as recited in claim 1, wherein: the middle layer is a single-layer capillary plate (3), the capillary channel (4) is arranged on the capillary plate (3) and penetrates through two side surfaces of the capillary plate (3), and the liquid inlet (7) is arranged at the edge of the capillary plate (3).
3. The temperature equalization plate having a planar stacked structure as recited in claim 1, wherein: the middle layer comprises a plurality of capillary plates (3) and a plurality of partition boards (2) which are alternately arranged, wherein two surfaces of each partition board (2) are closely adjacent to the surfaces of the adjacent capillary plates (3), the partition boards (2) are in sealing connection with the peripheral edges of the capillary plates (3), capillary channels (4) are distributed on the capillary plates (3), and connecting holes (8) communicated with the capillary channels (4) are formed in the partition boards (2).
4. A temperature equalization plate having a planar stacked configuration as recited in claim 3 wherein: the number of the capillary plates (3) is at least two, and the number of the separation plates (2) is at least one.
5. The temperature equalization plate having a planar stacked configuration of claim 4, wherein: the capillary channel (4) comprises surrounding parts (5) distributed on the edge of the capillary plate (3) and filling parts (6) located in the surrounding range of the surrounding parts (5), the liquid inlet (7) is communicated with the surrounding parts (5), and the filling parts (6) are densely distributed on the capillary plate (3).
6. The temperature equalization plate having a planar stacked configuration of claim 5, wherein: the connecting hole (8) is communicated with the surrounding part (5) and is arranged at a position close to the liquid inlet (7).
7. The temperature equalization plate having a planar stacked configuration of claim 5, wherein: the filling part (6) is arranged on the capillary plate (3) in a serpentine shape.
8. The temperature equalization plate having a planar stacked configuration of claim 7, wherein: the length directions of the serpentine trend on two adjacent capillary plates (3) are staggered with each other.
9. The temperature equalization plate having a planar stacked structure as recited in claim 1, wherein: the capillary channel (4) is spaced from the peripheral wall of the intermediate layer.
10. The temperature equalization plate having a planar stacked structure as recited in claim 1, wherein: a plurality of through holes (9) which are mutually communicated are formed in the middle layer and the cover body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322396187.9U CN220689868U (en) | 2023-09-05 | 2023-09-05 | Temperature equalizing plate with plane stacking structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322396187.9U CN220689868U (en) | 2023-09-05 | 2023-09-05 | Temperature equalizing plate with plane stacking structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220689868U true CN220689868U (en) | 2024-03-29 |
Family
ID=90407681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322396187.9U Active CN220689868U (en) | 2023-09-05 | 2023-09-05 | Temperature equalizing plate with plane stacking structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220689868U (en) |
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2023
- 2023-09-05 CN CN202322396187.9U patent/CN220689868U/en active Active
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