CN220685227U - Evaporation mechanism, evaporation equipment and battery manufacturing system - Google Patents
Evaporation mechanism, evaporation equipment and battery manufacturing system Download PDFInfo
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- CN220685227U CN220685227U CN202322065256.8U CN202322065256U CN220685227U CN 220685227 U CN220685227 U CN 220685227U CN 202322065256 U CN202322065256 U CN 202322065256U CN 220685227 U CN220685227 U CN 220685227U
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- 238000001704 evaporation Methods 0.000 title claims abstract description 113
- 230000008020 evaporation Effects 0.000 title claims abstract description 110
- 230000007246 mechanism Effects 0.000 title claims abstract description 54
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000007740 vapor deposition Methods 0.000 claims abstract description 233
- 238000004804 winding Methods 0.000 claims abstract description 34
- 238000001816 cooling Methods 0.000 claims description 38
- 239000000919 ceramic Substances 0.000 claims description 8
- 239000000463 material Substances 0.000 abstract description 83
- 238000007747 plating Methods 0.000 abstract description 16
- 238000010030 laminating Methods 0.000 abstract description 5
- 239000007789 gas Substances 0.000 description 32
- 239000010408 film Substances 0.000 description 29
- 239000011248 coating agent Substances 0.000 description 20
- 238000000576 coating method Methods 0.000 description 20
- 238000009834 vaporization Methods 0.000 description 9
- 230000008016 vaporization Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 5
- 230000008901 benefit Effects 0.000 description 3
- 239000012141 concentrate Substances 0.000 description 3
- 239000002826 coolant Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005269 aluminizing Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 239000007888 film coating Substances 0.000 description 1
- 238000009501 film coating Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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Abstract
The application relates to a vapor deposition mechanism, vapor deposition equipment and battery production system. The vapor deposition mechanism comprises a vapor deposition source; the winding assembly is used for transporting the plated object, is positioned on the evaporation side of the evaporation source and is arranged at intervals with the evaporation source; the winding assembly comprises a main roller and an auxiliary roller, wherein the main roller, the auxiliary roller and an evaporation source jointly define an evaporation zone, and the evaporation source can act on a plated object attached to the main roller and the auxiliary roller in the evaporation zone. Through setting up the auxiliary roller to define an evaporation zone jointly between main roll, auxiliary roller and evaporation source, make evaporation source can act on the evaporation zone simultaneously and main roll and auxiliary roller laminating by the plating thing mutually, so the auxiliary roller can replace the evaporation baffle to shelter from gaseous molecule evaporation material, gaseous molecule evaporation material can be attached to and be laminated by the plating thing mutually with the auxiliary roller, consequently, evaporation material can make full use of, thereby improved evaporation material's utilization ratio.
Description
Technical Field
The application relates to the technical field of vapor deposition, in particular to a vapor deposition mechanism, vapor deposition equipment and a battery manufacturing system.
Background
The statements herein merely provide background information related to the present application and may not necessarily constitute prior art.
The vapor deposition is a process of sublimating a vapor deposition material and then adhering the vapor deposition material to the surface of the object to be plated to form a thin film. In the evaporation process, a shielding structure is often used to enable evaporation materials to be concentrated to evaporate to a substrate on a conveying main roller, so that the evaporation materials are prevented from evaporating to other peripheral structures. But the evaporation material can be deposited on the shielding structure in a large quantity, so that the utilization rate of the evaporation material is reduced.
Disclosure of Invention
In view of the problems, the application provides a vapor deposition mechanism, a laser cutting device and a battery production system, which can solve the problem of low utilization rate of vapor deposition materials.
In a first aspect, the present application provides an evaporation mechanism comprising:
a vapor deposition source; and
the winding assembly is used for transporting the plated object, is positioned on the evaporation side of the evaporation source and is arranged at intervals with the evaporation source;
the winding assembly comprises a main roller and an auxiliary roller, wherein the main roller, the auxiliary roller and an evaporation source jointly define an evaporation zone, and the evaporation source can act on a plated object attached to the main roller and the auxiliary roller in the evaporation zone.
According to the vapor deposition mechanism, the auxiliary roller is arranged, the vapor deposition area is defined among the main roller, the auxiliary roller and the vapor deposition source, so that the vapor deposition source can act on a plated object attached to the main roller and the auxiliary roller at the same time, the auxiliary roller can replace the vapor deposition baffle to shield the gas molecule vapor deposition material, and the gas molecule vapor deposition material can be attached to the plated object attached to the auxiliary roller, so that the vapor deposition material can be fully utilized, and the utilization rate of the vapor deposition material is improved. In addition, the plated objects can pass through the main roller and the auxiliary roller respectively, and the plated objects on the main roller and the auxiliary roller can be evaporated, so that the thickness of the plated film is also increased.
In some embodiments, on a first section of the evaporation mechanism along the radial direction of the main roller, the center of the main roller is connected with the center of the evaporation source to form a first connecting line, and the auxiliary roller is positioned on one side of the first connecting line; the center of the auxiliary roller is connected with the center of the main roller to form a second connecting line, and an included angle formed by the first connecting line and the second connecting line is smaller than 90 degrees.
Through setting up the auxiliary roller and being located one side of first link, and make the contained angle that first link and second link formed be less than 90 degrees, when can making the auxiliary roller be located one side that the main roll was towards the evaporation source and form the stopper, make gaseous molecule evaporation material can concentrate to the quilt plating object direction motion that laminates mutually with the main roll, and then improve the efficiency of evaporation.
In some embodiments, in the first cross-section, the auxiliary roller center is closer to the vapor deposition source than the main roller toward the lowest point of the vapor deposition source side in a first direction parallel to the first line.
Through setting up the center of auxiliary roller and compare the home roll and be close to the evaporation source towards the minimum of evaporation source one side, can make auxiliary roller towards the semicircle of evaporation source one side can be located between home roll and the evaporation source, and then make auxiliary roller can shelter from in a large number in the bottom of home roll towards the evaporation source, make gaseous molecule evaporation material concentrate fast to the quilt plating object direction motion that laminates mutually with the home roll, further improved evaporation material's utilization ratio and evaporation efficiency.
In some embodiments, in the first cross section, a first distance is formed between the center of the auxiliary roller and the lowest point of the main roller facing the evaporation source along the first direction, and the value of the first distance ranges from 15 mm to 20 mm.
The numerical range of the first interval is 15-20 mm, so that the semicircle of the auxiliary roller facing to one side of the evaporation source can be positioned between the main roller and the evaporation source, the contact area between the gas molecule evaporation material and a plated object on the auxiliary roller is further enlarged, and the utilization rate of the evaporation material is improved.
In some embodiments, in the first cross section, a second distance is formed between the lowest point of the auxiliary roller facing the vapor deposition source and the vapor deposition source along the first direction, and the value of the second distance is not less than 50 mm.
By setting the value of the second distance to be not smaller than 50 mm, the auxiliary roller and the vapor deposition source can be kept at a certain distance, and thus, the vapor deposition material can be smoothly released and concentrated to the main roller under the shielding guide of the auxiliary roller.
In some embodiments, the radial gap between the auxiliary roller and the main roller is between 5 mm and 8 mm.
Through setting up the radial clearance of auxiliary roller and main roller to be 5 millimeters ~ 8 millimeters, can make the auxiliary roller press close to the main roller setting, and reduce gas molecule evaporation material and escape in this radial clearance, make gas molecule evaporation material can fully evaporate on the plated object that laminates mutually with main roller and auxiliary roller, and then promote the utilization ratio of evaporation material.
In some embodiments, the diameter value of the auxiliary roller is 30% to 38% of the diameter value of the main roller.
By setting the diameter value of the auxiliary roller to 30% -38% of the diameter value of the main roller, the space near the main roller can be fully utilized, and the plated object on the auxiliary roller has a larger plating area.
In some embodiments, the auxiliary rollers include at least two, all of which are distributed on opposite sides of the evaporation source.
All auxiliary rollers are distributed on two opposite sides of the evaporation source, so that the two opposite sides of the evaporation source can be shielded, and the gas molecule evaporation material can be attached to a plated object attached to the auxiliary rollers on the two sides, so that the utilization rate of the evaporation material is further improved.
In some embodiments, the winding assembly further comprises a chill roll positioned between the main roll and the auxiliary roll.
The temperature of the film plating surface of the object to be plated is relatively high after a certain amount of gas molecule vapor plating material is vapor plated from the main roller or the auxiliary roller, and if the object to be plated enters the auxiliary roller or the main roller again for vapor plating, the temperature of the object to be plated is higher, and the film plating surface is easy to burn through.
Therefore, by arranging the cooling roller between the main roller and the auxiliary roller, the plated object can be cooled, the burning-through of the film surface is reduced, and the reliability of the film plating is improved.
In some embodiments, the upper film wrap angle value of the auxiliary roller is greater than 280 degrees.
Through setting up the last membrane wrap angle value of auxiliary roller and being greater than 280 degrees, can make the plated object have sufficient area and auxiliary roller contact, and then improve the cooling effect.
In some embodiments, the auxiliary rollers include at least two, all of which are distributed on opposite sides of the evaporation source, and the cooling rollers include at least two, each of which is located between the main roller and a corresponding one of the auxiliary rollers.
Therefore, the temperature of the plated objects at two sides of the evaporation source can be cooled by the cooling roller, so that the burning-through of the film surface is reduced, and the reliability of the film plating is improved.
In some embodiments, the auxiliary roller has cooling channels inside.
Through setting up cooling channel, can carry out cooling to the auxiliary roller, and then carry out cooling to the plated object of laminating on it, reduced the membrane face and burnt through, improved the reliability of coating film.
In some embodiments, the surface of the auxiliary roller is coated with a ceramic layer.
The ceramic layer can provide a certain bias voltage for the plated object attached to the auxiliary roller, and the bias voltage is similar to electrostatic adsorption, so that the plated object is attached to the auxiliary roller, and the cooling effect of the plated object is better.
In some embodiments, the winding assembly further comprises an unwind roller and a wind-up roller, with the auxiliary roller being located between the unwind roller and the main roller, or between the wind-up roller and the main roller.
By arranging the placing roller and the winding roller, the object to be plated can be arranged on two sides of the auxiliary roller and the main roller to form a smooth coating surface, so that the coating quality is improved.
In some embodiments, the winding assembly further comprises a conductive roller positioned between the unwind roller and the auxiliary roller or between the wind-up roller and the auxiliary roller.
The transfer direction of the plated object can be changed by arranging the transmission roller between the unreeling roller and the auxiliary roller or between the reeling roller and the auxiliary roller, and the effect of increasing the upper film wrap angle value of the auxiliary roller can be achieved.
In a second aspect, the present application further provides an evaporation device, including the evaporation mechanism in any of the above embodiments.
Above-mentioned evaporation equipment is through setting up the auxiliary roller to define an evaporation zone jointly between main roll, auxiliary roller and evaporation source, make evaporation source can act on the evaporation zone simultaneously and main roll and auxiliary roller laminating mutually on the plated object, so the auxiliary roller can replace the evaporation baffle to shelter from gaseous molecule evaporation material, gaseous molecule evaporation material can be attached to and be laminated mutually on the plated object with the auxiliary roller, consequently, evaporation material can make full use of, thereby improved evaporation material's utilization ratio. In addition, the plated objects can pass through the main roller and the auxiliary roller respectively, and the plated objects on the main roller and the auxiliary roller can be evaporated, so that the thickness of the plated film is also increased.
In some embodiments, the vapor deposition apparatus includes at least two sets of vapor deposition mechanisms, one for vapor deposition on one side of the object to be plated, and the other for vapor deposition on the opposite side of the object to be plated.
By arranging two sets of vapor plating mechanisms, the two sides of the plated object can be plated.
In a third aspect, the present application further provides a battery production system, including the vapor deposition apparatus in any of the above embodiments.
According to the battery production system, the auxiliary roller is arranged, the evaporation area is defined among the main roller, the auxiliary roller and the evaporation source, so that the evaporation source can act on an object to be plated, which is attached to the main roller and the auxiliary roller, at the same time, the auxiliary roller can replace the evaporation baffle to shield the gas molecule evaporation material, and the gas molecule evaporation material can be attached to the object to be plated, which is attached to the auxiliary roller, so that the evaporation material can be fully utilized, and the utilization rate of the evaporation material is improved. In addition, the plated objects can pass through the main roller and the auxiliary roller respectively, and the plated objects on the main roller and the auxiliary roller can be evaporated, so that the thickness of the plated film is also increased.
The foregoing description is only an overview of the technical solutions of the present application, and may be implemented according to the content of the specification in order to make the technical means of the present application more clearly understood, and in order to make the above-mentioned and other objects, features and advantages of the present application more clearly understood, the following detailed description of the present application will be given.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the application. Also, like reference numerals are used to designate like parts throughout the accompanying drawings. In the drawings:
fig. 1 is a schematic cross-sectional structural view of an evaporation mechanism according to one or more embodiments.
Reference numerals in the specific embodiments are as follows:
a vapor deposition mechanism 100;
a vapor deposition source 10;
a winding assembly 20;
a main roller 21, an auxiliary roller 22, a cooling roller 23, an unreeling roller 24, a wind-up roller 25 and a conducting roller 26;
a plating object 200;
second distance L2
A first pitch L1;
radial gap L3.
Detailed Description
Embodiments of the technical solutions of the present application will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical solutions of the present application, and thus are only examples, and are not intended to limit the scope of protection of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description and claims of the present application and in the description of the figures above are intended to cover non-exclusive inclusions.
In the description of the embodiments of the present application, the technical terms "first," "second," etc. are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present application, the meaning of "plurality" is two or more unless explicitly defined otherwise.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the present application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
In the description of the embodiments of the present application, the term "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, 1 and/or 2 may indicate: there are three cases where 1 alone exists, 1 and 2 exist at the same time, and 2 exist alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.
In the description of the embodiments of the present application, the term "plurality" refers to two or more (including two), and similarly, "plural sets" refers to two or more (including two), and "plural sheets" refers to two or more (including two).
In the description of the embodiments of the present application, the orientation or positional relationship indicated by the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of describing the embodiments of the present application and for simplifying the description, rather than indicating or implying that the apparatus or element referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of the present application.
In the description of the embodiments of the present application, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; or may be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the embodiments of the present application will be understood by those of ordinary skill in the art according to the specific circumstances.
Vacuum deposition is a method of forming a thin film by heating a metal or nonmetal material under high vacuum conditions, evaporating the material, and condensing the evaporated material on the surface of a workpiece (metal, semiconductor, or insulator). For example, vacuum aluminizing, vacuum copper plating, and the like. Specifically, the vapor deposition material is converted into a gas molecule vapor deposition material, and then the gas molecule vapor deposition material moves in a vacuum environment to be attached to the surface of the object to be plated, so that a film is formed on the surface of the object to be plated.
In the evaporation equipment, a winding mechanism is commonly used for conveying a plated object, namely a tape, the winding mechanism at least comprises an unreeling roller, a winding roller and a main roller, the main roller is positioned between the unreeling roller and the winding roller, and an evaporation source is mainly used for evaporating the plated object attached to the main roller.
In order to concentrate the vapor deposition material of the gas molecules as much as possible on the object to be plated attached to the main roller, a vapor deposition baffle plate is provided in the vicinity of the main roller. In the related art, the vapor deposition barrier is required to have a certain adhesion force that can adhere residues of the vapor deposition material thereto, and prevent the residues from falling down, causing an abnormal phenomenon such as electrode short-circuiting, sputtering, and the like. However, a certain adhesive force also causes a problem of low utilization rate of the vapor deposition material.
In order to alleviate the low problem of coating by vaporization material utilization ratio, designed a coating by vaporization mechanism, including coating by vaporization source and winding subassembly, the coating by vaporization source has the evaporation side, and winding subassembly is used for transporting the thing that is plated, and winding subassembly is located the evaporation side, and sets up with the coating by vaporization source interval each other, and wherein, winding subassembly includes main roll and auxiliary roll, and a coating by vaporization district is defined jointly to main roll, auxiliary roll and coating by vaporization source, and the coating by vaporization source can act on the thing that is plated of laminating mutually with main roll and auxiliary roll in the coating by vaporization district.
Therefore, the auxiliary roller can replace the vapor deposition baffle to shield the gas molecule vapor deposition material, and the gas molecule vapor deposition material can be attached to the plated object attached to the auxiliary roller, so that the vapor deposition material can be fully utilized, and the utilization rate of the vapor deposition material is improved. In addition, the plated objects can pass through the main roller and the auxiliary roller respectively, and the plated objects on the main roller and the auxiliary roller can be evaporated, so that the thickness of the plated film is also increased.
Fig. 1 is a schematic perspective view of an evaporation mechanism according to one or more embodiments. Referring to fig. 1, an embodiment of the present application provides an evaporation mechanism 100. The vapor deposition mechanism 100 includes a vapor deposition source 10 and a winding assembly 20. The winding assembly 20 is located on the evaporation side of the evaporation source 10 and is spaced apart from the evaporation source 10. Wherein the winding assembly 20 includes a main roller 21 and an auxiliary roller 22. The main roller 21, the auxiliary roller 22 and the vapor deposition source 10 together define a vapor deposition area, and the vapor deposition source 10 can act on the object 200 attached to the main roller 21 and the auxiliary roller 22 in the vapor deposition area.
The vapor deposition source 10 is a device that converts a vapor deposition material into a gaseous molecular vapor deposition material and releases the gaseous molecular vapor deposition material. The vapor deposition source 10 may include a vapor deposition crucible, a vapor deposition tray, a vapor deposition boat, and the like.
The evaporation side of the vapor deposition source 10 is the side from which the vapor deposition source releases the vapor molecular deposition material. In general, the evaporation side of the vapor deposition source 10 is the side facing the top of the vapor deposition source 10. For example, when the vapor deposition source 10 includes a vapor deposition crucible having a vapor deposition outlet at the top of the vapor deposition crucible, the vapor deposition side of the vapor deposition source 10 is the side facing the top of the vapor deposition source 10 having the vapor deposition outlet. Specifically, in the embodiment of the present application, the evaporation side of the vapor deposition source 10 is the upper side in the Z direction shown in fig. 1.
The main roller 21 is a roller body structure capable of being brought into contact with the object 200 to be plated, and forming a main plating region on the opposite side of the contact with the object 200 to be plated. Specifically, the vapor deposition source 10 can apply a molecular vapor deposition material mainly to the object 200 to be plated that is in contact with the main roller 21.
The main roller 21 is disposed generally directly above the vapor deposition source 10 and facing the vapor deposition source 10, so that the vapor deposition material of gas molecules can be directly deposited on the object 200 in contact with the main roller 21, thereby reducing the loss due to diffusion of the vapor deposition material to other positions. Specifically, the symmetry center plane of the vapor deposition source 10 coincides with the axis of the main roller 21. In other embodiments, the symmetry center plane of the vapor deposition source 10 may be offset from the axis of the main roller 21.
The fact that the main roller 21, the auxiliary roller 22 and the vapor deposition source 10 together define a vapor deposition region means that the main roller 21, the auxiliary roller 22 and the vapor deposition source 10 can be surrounded by each other to form a region through which the vapor molecular vapor deposition material flows to perform vapor deposition. Note that, when there is a space between any two of the main roller 21, the auxiliary roller 22, and the vapor deposition source 10, the vapor deposition region will not have a clear boundary line in the space, but may be roughly delimited, for example, when there is a space between the auxiliary roller 22 and the vapor deposition source 10, the nearest bus bar of the auxiliary roller 22 toward the vapor deposition source 10 and the nearest edge line of the vapor deposition source 10 toward the auxiliary roller 22 may be connected to form an interface.
The vapor deposition source 10 being able to act on the object 200 to be plated that is bonded to the main roller 21 and the auxiliary roller 22 means that the vapor deposition source 10 is able to vapor deposit the released gas molecular vapor deposition material on the object 200 to be plated that is bonded to the main roller 21 and the auxiliary roller 22. Specifically, the vapor deposition material of the gas molecules released from the vapor deposition source 10 can be deposited on the opposite side of the object 200 to be plated that is attached to the main roller 21, and on the opposite side of the object 200 to be plated that is attached to the auxiliary roller 22.
It should be noted here that the axes of the various rollers in the winding mechanism are generally parallel to each other to keep the transported object flat, and therefore, in the embodiment of the present application, the axes of the main roller 21 and the auxiliary roller 22 are disposed parallel to each other.
In this way, by providing the auxiliary roller 22 and defining a vapor deposition area between the main roller 21, the auxiliary roller 22 and the vapor deposition source 10, the vapor deposition source 10 can act on the object to be plated 200 attached to the main roller 21 and the auxiliary roller 22 at the same time, so that the auxiliary roller 22 can replace the vapor deposition baffle plate to shield the vapor deposition material of gas molecules, and the vapor deposition material of gas molecules can be attached to the object to be plated 200 attached to the auxiliary roller 22, thereby fully utilizing the vapor deposition material and improving the utilization rate of the vapor deposition material. In addition, since the object 200 passes through the main roller 21 and the auxiliary roller 22, respectively, the object 200 on the main roller 21 and the auxiliary roller 22 can be vapor-deposited, and thus, the thickness of the film is also increased.
According to some embodiments of the present application, on the first cross section AA of the vapor deposition mechanism 100 in the radial direction of the main roller 21, in the first cross section AA, the center O of the main roller 21 1 Center O of vapor deposition source 10 2 Connected to form a first connection line O 1 O 2 The auxiliary roller 22 is located at the first line O 1 O 2 Is provided. Center O of auxiliary roller 22 3 With the centre O of the main roller 21 1 Connected to form a second connection line O 3 O 1 First connecting line O 1 O 2 With a second connecting line O 3 O 1 The included angle alpha is less than 90 degrees.
The first cross section AA of the vapor deposition mechanism 100 in the radial direction of the main roller 21 is a first cross section AA obtained by cutting a cross section of any one of the vapor deposition mechanisms 100 in the radial direction of the main roller 21.
Center O of main roller 21 1 Is the intersection of the axis of the main roller 21 with the first section AA. Center O of vapor deposition source 10 2 Is the geometric center of the cross-sectional shape of the vapor deposition source 10 formed on the first cross-section AA. Center O of auxiliary roller 22 3 Is the intersection of the axis of the auxiliary roller 22 with the first section AA.
The auxiliary roller 22 is positioned at the first connecting line O 1 O 2 Is that the sectional shape of the auxiliary roller 22 formed on the first section AA is located on the first line O 1 O 2 Is connected with the first connecting line O 1 O 2 Without intersecting.
By arranging auxiliaryThe auxiliary roller 22 is positioned at the first connecting line O 1 O 2 And make the first connection line O 1 O 2 With a second connecting line O 3 O 1 The included angle alpha formed is smaller than 90 degrees, so that the auxiliary roller 22 is positioned on one side of the main roller 21 facing the vapor deposition source 10 to form a barrier, and simultaneously, the gas molecular vapor deposition material can intensively move towards the direction of the plated object 200 attached to the main roller 21, thereby improving the vapor deposition efficiency.
According to some embodiments of the present application, in the first section AA, along a line parallel to the first line O 1 O 2 Center O of auxiliary roller 22 in the first direction 3 The vapor deposition source 10 is closer than the lowest point B of the main roller 21 toward the vapor deposition source 10 side.
Parallel to first O 1 O 2 Specifically, the first direction of (2) may be the Z direction shown in fig. 1.
Center O of auxiliary roller 22 3 The center O of the auxiliary roller 22 being closer to the vapor deposition source 10 than the lowest point B of the main roller 21 toward the vapor deposition source 10 side means 3 The distance from the vapor deposition source 10 is smaller than the distance between the lowest point B of the main roller 21 facing the vapor deposition source 10 and the vapor deposition source 10.
Thus, by setting the center O of the auxiliary roller 22 3 Compared with the lowest point B of the main roller 21, which faces the vapor deposition source 10, is closer to the vapor deposition source 10, the semicircle of the auxiliary roller 22, which faces the vapor deposition source 10, can be positioned between the main roller 21 and the vapor deposition source 10, so that the auxiliary roller 22 can largely shield the bottom of the main roller 21, which faces the vapor deposition source 10, and the gas molecular vapor deposition material can be quickly concentrated to move towards the direction of the plated object 200 attached to the main roller 21, thereby further improving the utilization rate and the vapor deposition efficiency of the vapor deposition material.
In other embodiments, only the lowest point C of the auxiliary roller 22 on the vapor deposition source 10 side may be provided closer to the vapor deposition source 10 than the lowest point B of the main roller 21 on the vapor deposition source 10 side.
According to some embodiments of the present application, in the first cross section AA, a first distance L1 is formed between the center O3 of the auxiliary roller 22 and the lowest point B of the main roller 21 on the side facing the vapor deposition source 10 in the first direction, and the value of the first distance L1 ranges from 15 mm to 20 mm.
By setting the value range of the first pitch L1 to 15 to 20 mm, the semicircle of the auxiliary roller 22 facing the vapor deposition source 10 can be located between the main roller 21 and the vapor deposition source 10, and the contact area between the vapor deposition material of gas molecules and the object 200 to be plated on the auxiliary roller 22 can be increased, thereby improving the utilization ratio of the vapor deposition material.
According to some embodiments of the present application, in the first cross section AA, a second distance L2 is formed between the lowest point C of the auxiliary roller 22 facing the vapor deposition source 10 and the vapor deposition source 10 in the first direction, and the value of the second distance L2 is not less than 50 mm.
By setting the value of the second distance L2 to be not less than 50 mm, the auxiliary roller 22 and the vapor deposition source 10 can be kept at a constant distance, and thus the gas molecular vapor deposition material can be smoothly released and concentrated on the main roller 21 under the shielding guide of the auxiliary roller 22.
According to some embodiments of the present application, the radial clearance L3 of the auxiliary roller 22 from the main roller 21 is 5-8 mm.
The radial gap between the auxiliary roller 22 and the main roller 21 means a distance value between an intersection point of a center line of the auxiliary roller 22 and the outer contour of the auxiliary roller 22 and an intersection point of the center line and the outer contour of the main roller 21 on a radial cross section, for example, on the first radial cross section AA.
By providing the radial gap between the auxiliary roller 22 and the main roller 21 of 5 to 8 mm, the auxiliary roller 22 can be disposed close to the main roller 21, and the escape of the gas molecular vapor deposition material from the radial gap can be reduced, so that the gas molecular vapor deposition material can be sufficiently deposited on the object 200 bonded to the main roller 21 and the auxiliary roller 22, and the utilization rate of the vapor deposition material can be improved.
According to some embodiments of the present application, the diameter value of the auxiliary roller 22 is 30% -38% of the diameter value of the main roller 21.
By setting the diameter value of the auxiliary roller 22 to 30% to 38% of the diameter value of the main roller 21, the space near the main roller 21 can be fully utilized, and the object 200 on the auxiliary roller 22 can have a larger plating area.
According to some embodiments of the present application, the auxiliary rollers 22 include at least two, and all of the auxiliary rollers 22 are distributed on opposite sides of the evaporation source 10.
The fact that all of the auxiliary rolls 22 are distributed on opposite sides of the vapor deposition source 10 means that a part of all of the auxiliary rolls 22 are distributed on one side of the vapor deposition source 10 and the rest of the auxiliary rolls 22 are distributed on the opposite side of the vapor deposition source 10. In the embodiment of the present application, the opposite sides of the vapor deposition source 10 refer to opposite sides of the vapor deposition source 10 along the second direction X, where the first direction Z is perpendicular to the second direction X.
In practice, the object 200 can bypass all the auxiliary rollers 22 on one side of the vapor deposition source 10, and then bypass all the auxiliary rollers 22 on the opposite side of the vapor deposition source 10 via the main roller 21.
By providing all the auxiliary rollers 22 distributed on opposite sides of the vapor deposition source 10, the vapor deposition source 10 can be shielded on both opposite sides, and the gas molecular vapor deposition material can be attached to the object 200 attached to the auxiliary rollers 22 on both sides, thereby further improving the utilization rate of the vapor deposition material.
In particular, in the embodiment of the present application, the auxiliary rollers 22 include two, and the two auxiliary rollers 22 are distributed on opposite sides of the vapor deposition source 10. Specifically, the two auxiliary rollers 22 are symmetrically disposed along the symmetry center plane of the vapor deposition source 10. In this way, the gas molecular deposition material can be distributed more uniformly on the object 200 to be plated.
According to some embodiments of the present application, the winding assembly 20 further comprises a cooling roller 23, the cooling roller 23 being located between the main roller 21 and the auxiliary roller 22.
The cooling roller 23 is located between the main roller 21 and the auxiliary roller 22, and means that the order in which the object 200 is wound around the winding unit 20 is the main roller 21, the cooling roller 23, and the auxiliary roller 22, or the auxiliary roller 22, the cooling roller 23, and the main roller 21.
Since the object 200 is first vapor-deposited with a certain amount of gas molecules from the main roller 21 or the auxiliary roller 22, the temperature of the film surface of the object 200 is relatively high, and when the object enters the auxiliary roller 22 or the main roller 21 again for vapor deposition, the temperature of the object 200 is higher, and the film surface is liable to burn through.
Therefore, by providing the cooling roller 23 between the main roller 21 and the auxiliary roller 22, the object 200 to be coated can be cooled, the burning-through of the film surface can be reduced, and the reliability of the coating film can be improved.
In particular to the embodiment of the present application, the cooling rollers 23 comprise two, each cooling roller 23 being located between the main roller 21 and a corresponding auxiliary roller 22. The two cooling rolls 23 are symmetrically arranged with respect to the symmetry center plane of the vapor deposition source 10.
In addition, when the radial gap between the auxiliary roller 22 and the main roller 21 is 5 mm to 8 mm, the radial gap between the auxiliary roller 22 and the main roller 21 is small, and if the auxiliary roller 22 is directly wound to the main roller 21, the contact area between the object 200 to be plated and the roller is reduced, and the coating efficiency is further reduced, so the cooling roller 23 is arranged between the main roller 21 and the auxiliary roller 22, the object 200 to be plated can bypass the radial gap between the main roller 21 and the auxiliary roller 22, the upper film wrap angle value between the main roller 21 and the auxiliary roller 22 is increased, the contact area between the object 200 to be plated and the roller is increased, and the coating efficiency is improved.
According to some embodiments of the present application, the upper film wrap angle value of the auxiliary roller 22 is greater than 280 degrees.
The upper film wrapping angle of the auxiliary roller 22 is the maximum central angle formed by the object 200 attached to the auxiliary roller 22 in the coating region of the auxiliary roller 22 in the radial cross section, for example, the first radial cross section AA.
By setting the upper film wrap angle value of the auxiliary roller 22 to be larger than 280 degrees, the object 200 to be plated can have a sufficient area to contact with the auxiliary roller 22, thereby improving the cooling effect.
In particular, in the embodiment of the present application, the auxiliary rollers 22 include at least two, all of the auxiliary rollers 22 are distributed on opposite sides of the evaporation source 10, and the cooling rollers 23 include at least two, and each cooling roller 23 is located between the main roller 21 and a corresponding one of the auxiliary rollers 22.
In this way, the temperature of the object 200 at both sides of the vapor deposition source 10 can be cooled by the cooling roller 23, so that the film surface burn-through is reduced, and the reliability of the film coating is improved.
According to some embodiments of the present application, the interior of the auxiliary roller 22 has cooling channels.
The cooling passage is a passage through which a cooling medium can flow. Specifically, the cooling channel may be communicated with a cold source, and may specifically be a water pump, a radiator fan, etc. The cooling medium may circulate between the cold source and the cooling channel, whereby a continuous supply of the cooling medium is achieved. Specifically, cooling water, liquid nitrogen, or the like may be circulated in the cooling passage.
Through setting up cooling channel, can cool down auxiliary roller 22, and then cool down the plated object 200 of laminating on it, reduced the membrane face and burnt through, improved the reliability of coating film.
Further, the surface of the auxiliary roller 22 is covered with a ceramic layer.
The ceramic layer is a layer made of a ceramic material, and the ceramic layer may be uniformly provided on the surface of the auxiliary roller 22 by coating, spraying, or the like.
By providing the ceramic layer, a certain bias voltage can be provided for the object 200 attached to the auxiliary roller 22, and the bias voltage acts like electrostatic adsorption, so that the object 200 can be attached to the auxiliary roller 22 more closely, and the cooling effect of the object 200 can be better.
According to some embodiments of the present application, the winding assembly 20 further comprises an unwind roller 24 and a wind-up roller 25, the auxiliary roller 22 being located between the unwind roller 24 and the main roller 21, or between the wind-up roller 25 and the main roller 21.
The unreeling roller 24 is used for installing the plated object 200 in a roll shape, and the reeling roller 25 is used for reeling the plated object 200 which is completely evaporated.
The auxiliary roller 22 being located between the unreeling roller 24 and the main roller 21 means that the object 200 passes through the unreeling roller 24, the auxiliary roller 22 and the main roller 21 in order, and the auxiliary roller 22 being located between the wind-up roller 25 and the main roller 21 means that the object 200 passes through the main roller 21, the auxiliary roller 22 and the wind-up roller 25 in order.
By providing the placement roller 24 and the take-up roller 25, the object 200 to be coated can be stretched on both sides of the auxiliary roller 22 and the main roller 21 to form a smooth coating surface, thereby improving the coating quality.
According to some embodiments of the present application, the winding assembly 20 further comprises a conductive roller 26, the conductive roller 26 being located between the unwind roller 24 and the auxiliary roller 22, or the conductive roller 26 being located between the wind-up roller 25 and the auxiliary roller 22.
The guide roller 26 is a roller for conveying and guiding the object 200 to be plated.
The transfer direction of the object 200 to be plated can be changed by providing the transfer roller 26 between the unwinding roller 24 and the auxiliary roller 22 or between the winding roller 25 and the auxiliary roller 22, and the function of increasing the upper film wrap angle value of the auxiliary roller 22 can be also achieved.
In particular to the embodiment of the present application, the conductive rollers 26 comprise two, two conductive rollers 26 being respectively located between the unwind roller 24 and the auxiliary roller 22 and the conductive roller 26 being located between the wind-up roller 25 and the auxiliary roller 22. The two conductive rollers 26 are symmetrically disposed with respect to the symmetry center plane of the vapor deposition source 10.
According to some embodiments of the present application, referring to fig. 1, there is provided a vapor deposition mechanism 100, the vapor deposition mechanism 100 including a vapor deposition source 10 and a winding assembly 20. The winding assembly 20 is located on the evaporation side of the evaporation source 10 and is spaced apart from the evaporation source 10. The winding assembly 20 includes an unreeling roller 24, one of the conductive rollers 26, one of the auxiliary rollers 22, one of the cooling rollers 23, a main roller 21, the other of the cooling rollers 23, the other of the auxiliary rollers 22, the other of the conductive rollers 26, and a reeling roller 25, which sequentially winds the plated object. The main roller 21, the auxiliary roller 22 and the vapor deposition source 10 together define a vapor deposition area, and the vapor deposition source 10 can act on the object 200 attached to the main roller 21 and the auxiliary roller 22 in the vapor deposition area. The diameter value of each auxiliary roller 22 is 30% -38% of the diameter value of the main roller 21. The vapor deposition mechanism 100 has a first cross section AA along the radial direction of the main roller 21, in which the center O of the main roller 21 is located 1 Center O of vapor deposition source 10 2 Connected to form a first connection line O 1 O 2 Two auxiliary rollers 22 are located on the first line O 1 O 2 Is provided. Center O of each auxiliary roller 22 3 With the centre O of the main roller 21 1 Connected to form a second connection line O 3 O 1 First connecting line O 1 O 2 With a second connecting line O 3 O 1 The included angle alpha is less than 90 degrees. Along parallel to first line O 1 O 2 Is formed between the center O3 of each auxiliary roller 22 and the lowest point B of the main roller 21 on the side facing the vapor deposition source 10The first spacing L1 is formed, and the value range of the first spacing L1 is 15 mm-20 mm. A second distance L2 is formed between the lowest point B of each auxiliary roller 22 facing the vapor deposition source 10 and the vapor deposition source 10, and the value of the second distance L2 is not less than 50 mm. The radial clearance L3 between each auxiliary roller 22 and the main roller 21 is 5 mm to 8 mm. The upper film wrap angle value of each auxiliary roller 22 is greater than 280 degrees. The inside of each auxiliary roller 22 has a cooling passage. The surface of each auxiliary roller 22 is covered with a ceramic layer.
In addition, the embodiment of the application also provides a vapor deposition device, which comprises the vapor deposition mechanism 100 in any embodiment.
By arranging the auxiliary roller 22 and jointly defining a vapor deposition area among the main roller 21, the auxiliary roller 22 and the vapor deposition source 10, the vapor deposition source 10 can act on a plated object 200 attached to the main roller 21 and the auxiliary roller 22 at the same time, so that the auxiliary roller 22 can replace a vapor deposition baffle plate to shield a gas molecule vapor deposition material, and the gas molecule vapor deposition material can be attached to the plated object 200 attached to the auxiliary roller 22, so that the vapor deposition material can be fully utilized, and the utilization rate of the vapor deposition material is improved. In addition, since the object 200 passes through the main roller 21 and the auxiliary roller 22, respectively, the object 200 on the main roller 21 and the auxiliary roller 22 can be vapor-deposited, and thus, the thickness of the film is also increased.
According to some embodiments of the present application, the vapor deposition apparatus includes two sets of vapor deposition mechanisms 100, wherein one vapor deposition mechanism 100 is used for vapor deposition of one surface of the object 200, and wherein the other vapor deposition mechanism 100 is used for vapor deposition of the opposite surface of the object 200.
Thus, by providing two sets of vapor deposition mechanisms 100, both sides of the object 200 can be coated.
Of course, in other embodiments, only one set of vapor deposition mechanism 100 may be provided to perform vapor deposition on one side of the object 200 to be plated.
According to some embodiments of the present application, the evaporation device further comprises a vacuum chamber and a vacuum device in communication with the vacuum chamber, the vacuum device is used for vacuumizing the vacuum, and the evaporation mechanism 100 is disposed in the vacuum chamber.
In addition, the embodiment of the application also provides a battery production system, which comprises the evaporation equipment in any embodiment.
By arranging the auxiliary roller 22 and jointly defining a vapor deposition area among the main roller 21, the auxiliary roller 22 and the vapor deposition source 10, the vapor deposition source 10 can act on a plated object 200 attached to the main roller 21 and the auxiliary roller 22 at the same time, so that the auxiliary roller 22 can replace a vapor deposition baffle plate to shield a gas molecule vapor deposition material, and the gas molecule vapor deposition material can be attached to the plated object 200 attached to the auxiliary roller 22, so that the vapor deposition material can be fully utilized, and the utilization rate of the vapor deposition material is improved. In addition, since the object 200 passes through the main roller 21 and the auxiliary roller 22, respectively, the object 200 on the main roller 21 and the auxiliary roller 22 can be vapor-deposited, and thus, the thickness of the film is also increased.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the embodiments, and are intended to be included within the scope of the claims and description. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present application is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.
Claims (18)
1. An evaporation mechanism, comprising:
a vapor deposition source; and
the winding assembly is used for transporting the plated object, is positioned on the evaporation side of the evaporation source and is arranged at intervals with the evaporation source;
the winding assembly comprises a main roller and an auxiliary roller, wherein the main roller, the auxiliary roller and the evaporation source jointly define an evaporation area, and the evaporation source can act on the plated object attached to the main roller and the auxiliary roller in the evaporation area.
2. The vapor deposition mechanism according to claim 1, wherein on a first cross section of the vapor deposition mechanism in a radial direction of the main roller, a center of the main roller is connected with a center of the vapor deposition source to form a first line, and the auxiliary roller is located on one side of the first line; the center of the auxiliary roller is connected with the center of the main roller to form a second connecting line, and an included angle formed by the first connecting line and the second connecting line is smaller than 90 degrees.
3. The vapor deposition mechanism according to claim 2, wherein in the first cross section, in a first direction parallel to the first line, the auxiliary roller center is closer to the vapor deposition source than the lowest point of the main roller toward the vapor deposition source side.
4. A vapor deposition mechanism according to claim 3, wherein in the first cross section, a first distance is formed between a center of the auxiliary roller and a lowest point of the main roller toward the vapor deposition source in the first direction, and a value of the first distance is in a range of 15 mm to 20 mm.
5. A vapor deposition mechanism according to claim 3, wherein in the first cross section, a second distance is formed between a lowest point of the auxiliary roller toward the vapor deposition source and the vapor deposition source in the first direction, and a value of the second distance is not less than 50 mm.
6. The vapor deposition mechanism according to claim 1, wherein a radial gap between the auxiliary roller and the main roller is 5 to 8 mm.
7. The vapor deposition mechanism according to claim 1, wherein the diameter of the auxiliary roller is 30 to 38% of the diameter of the main roller.
8. The vapor deposition mechanism according to any one of claims 1 to 7, wherein the auxiliary rollers include at least two, all of which are distributed on opposite sides of the vapor deposition source.
9. The vapor deposition mechanism according to any one of claims 1 to 7, wherein the winding assembly further comprises a cooling roller that is located between the main roller and the auxiliary roller.
10. The vapor deposition mechanism of claim 9, wherein the upper film wrap angle value of the auxiliary roller is greater than 280 degrees.
11. The vapor deposition mechanism of claim 9, wherein said auxiliary rollers comprise at least two, all of said auxiliary rollers being disposed on opposite sides of said vapor deposition source, said cooling rollers comprising at least two, each cooling roller being disposed between said main roller and a corresponding one of said auxiliary rollers.
12. The vapor deposition mechanism according to any one of claims 1 to 7, wherein the auxiliary roller has a cooling passage therein.
13. The vapor deposition mechanism according to claim 12, wherein a surface of the auxiliary roller is covered with a ceramic layer.
14. The vapor deposition mechanism according to any one of claims 1 to 7, wherein the winding assembly further comprises an unwind roller and a wind-up roller, and the auxiliary roller is located between the unwind roller and the main roller or between the wind-up roller and the main roller.
15. The vapor deposition mechanism of claim 14, wherein the winding assembly further comprises a conductive roller positioned between the unwind roller and the auxiliary roller or between the wind-up roller and the auxiliary roller.
16. A vapor deposition apparatus comprising the vapor deposition mechanism according to any one of claims 1 to 15.
17. The vapor deposition apparatus according to claim 16, wherein the vapor deposition apparatus comprises at least two sets of the vapor deposition mechanisms, one of the vapor deposition mechanisms being configured to vapor deposit one surface of the object to be plated, and the other of the vapor deposition mechanisms being configured to vapor deposit the other, opposite surface of the object to be plated.
18. A battery production system comprising the vapor deposition apparatus according to claim 16 or 17.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322065256.8U CN220685227U (en) | 2023-08-02 | 2023-08-02 | Evaporation mechanism, evaporation equipment and battery manufacturing system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322065256.8U CN220685227U (en) | 2023-08-02 | 2023-08-02 | Evaporation mechanism, evaporation equipment and battery manufacturing system |
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| Publication Number | Publication Date |
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| CN220685227U true CN220685227U (en) | 2024-03-29 |
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| CN202322065256.8U Active CN220685227U (en) | 2023-08-02 | 2023-08-02 | Evaporation mechanism, evaporation equipment and battery manufacturing system |
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| Country | Link |
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| CN (1) | CN220685227U (en) |
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2023
- 2023-08-02 CN CN202322065256.8U patent/CN220685227U/en active Active
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