CN220674174U - Middle frame structural member and electronic equipment - Google Patents

Abstract

The application provides a middle frame structure and electronic equipment relates to electronic product technical field for solve the problem that the stability of sheetmetal at medium plate slot welding is low. Wherein, the middle frame structure piece can include: the middle plate comprises a first surface and a second surface which are opposite to each other, a mounting groove is formed in the middle plate, the mounting groove comprises an opening and a first side wall, the opening is positioned on the first surface, and the first side wall is connected to the first surface; the conductive piece is grounded, the conductive piece comprises a fixing plate and a connecting plate, the fixing plate is fixed on the first surface and is electrically connected with the first surface, one end of the connecting plate is connected with the fixing plate, the other end of the connecting plate is located in the mounting groove, and the connecting plate is arranged opposite to the first side wall. The middle frame structural member is used for improving stability of metal sheet in medium plate narrow slit welding.

Description

Middle frame structural member and electronic equipment

Technical Field

The application relates to the technical field of electronic products, in particular to a middle frame structural member and electronic equipment.

Background

The electronic device comprises a circuit board of an integrated electronic component, the circuit board of the integrated electronic component needs to be grounded, and in the prior art, a grounding circuit on the circuit board is electrically connected with a metal sheet through welding the metal sheet on the middle plate to realize the grounding of the circuit board.

However, the space layout of the electronic device is compact, the metal sheet for grounding needs to be welded in the narrow slit of the middle plate, the stability of welding the metal sheet to the inside of the narrow slit cannot be guaranteed due to the limitation of the conditions such as the width of the narrow slit, the welding angle and the like, the quality requirement of a product cannot be met, and the yield of the product is low.

Disclosure of Invention

The embodiment of the application provides a middle frame structural member and electronic equipment, which are used for improving the stability of welding of a metal sheet in a narrow slit of a middle plate.

In order to achieve the above purpose, the embodiments of the present application adopt the following technical solutions:

in a first aspect, a middle frame structure is provided, the middle frame structure comprising: the middle plate comprises a first surface and a second surface which are opposite to each other, a mounting groove is formed in the middle plate, the mounting groove comprises an opening and a first side wall, the opening is positioned on the first surface, and the first side wall is connected to the first surface; the conductive piece is grounded, the conductive piece comprises a fixed plate and a connecting plate, the fixed plate is fixed on the first surface, one end of the connecting plate is connected with the fixed plate, the other end of the connecting plate is positioned in the mounting groove, and the connecting plate is arranged opposite to the first side wall.

The fixing plate is fixed on the first surface, and the fixing position of the fixing plate is positioned outside the mounting groove, so that the fixing of the fixing plate is not limited by the mounting groove, and the stability of the fixing plate on the first surface can be ensured; therefore, the conductive sheet is arranged as a fixing plate and a connecting plate, and the fixing of the conductive piece is satisfied by arranging the fixing plate; the electric connection between the grounding contact and the conductive piece is realized by arranging the connecting plate, and the grounding treatment of the conductive piece is performed, so that the grounding of the grounding circuit on the circuit board is further satisfied.

In a possible implementation manner of the first aspect, the first surface includes a first ground area, and the fixing plate is electrically connected to the first ground area. In this way, the conductive member is grounded by the electrical connection of the fixing member to the first grounding region.

In a possible implementation manner of the first aspect, the first surface is provided with a positioning groove, a side of the positioning groove, which is close to the opening, is open, and the first grounding area is located on a bottom wall of the positioning groove, and the bottom wall and the first surface face the same direction. Like this, through setting up the fixed plate that the positioning groove provided the installation position for the electrically conductive piece, reach the effect of predetermined location, can guarantee the accuracy that the mounting welded to first grounding area position.

In a possible implementation manner of the first aspect, a surface of a side of the fixing plate facing away from the first ground area is flush with the first surface. Like this, can guarantee the whole roughness of medium plate at first surface, can provide comparatively smooth faying surface for the laminating of back of body lid.

In a possible implementation manner of the first aspect, the first side wall is provided with a second grounding region, and the connection plate is electrically connected to the second grounding region. Like this, through setting up the second ground region to with connecting plate and second ground region electricity connection, can increase the area of contact of electrically conductive piece and medium plate, and then improve the electric connection effect between electrically conductive piece and the medium plate, improve the electric connection effect between ground circuit and the medium plate on the circuit board.

In a possible implementation manner of the first aspect, the first side wall is provided with a conductive protrusion, the conductive protrusion protrudes from the first side wall, and the second grounding area is located on a side surface of the conductive protrusion facing away from the first side wall. Like this, through setting up conductive bulge, can reduce the distance between connecting plate and the circuit board, and then can increase the butt pressure between conductive shell fragment and the connecting plate, and then reduce the contact resistance between conductive shell fragment and the connecting plate.

In a possible implementation manner of the first aspect, the first surface includes a first grounding region, the fixing plate is electrically connected to the first grounding region, the first grounding region extends to the opening edge, a second grounding region is provided on the first side wall, and the first grounding region is connected to the second grounding region. Therefore, the contact area between the conductive piece and the middle plate can be increased to the greatest extent by connecting the first grounding area and the second grounding area, the electric connection effect between the conductive piece and the middle plate can be improved to the greatest extent, and the electric connection effect between the grounding circuit on the circuit board and the middle plate can be improved to the greatest extent.

In a possible implementation manner of the first aspect, the fixing plate is integrally formed with the connecting plate. Like this, with fixed plate and connecting plate integrated into one piece setting, can reduce the production line quantity of electrically conductive spare, reduce the production time of electrically conductive spare.

In a possible implementation manner of the first aspect, the connecting plate includes a fixed end and a free end, and the fixed end is connected to the fixed plate; the connection plate is inclined in a direction from the first surface to the second surface toward a direction away from the first side wall. Like this, through setting up the connecting plate slope, can replace the function of electrically conductive shell fragment for the free end of connecting plate is direct to be connected with the ground circuit electricity on the circuit board, reduces the quantity of spare part in the mounting groove.

In a possible implementation manner of the first aspect, a contact protrusion is provided on a side surface of the connection plate facing away from the first side wall, the contact protrusion being provided near the free end. Thus, the contact protrusion is arranged at the position of the connecting plate close to the free end and is used for abutting against the grounding contact on the circuit board.

In a possible implementation manner of the first aspect, the impedance of the conductive member is less than or equal to 0.5 ohm. Therefore, the impedance of the conductive member is smaller than or equal to 0.5 ohm, and the electric connection requirement of the grounding circuit on the circuit board can be met.

In a possible implementation manner of the first aspect, the conductive member includes a metal body and a metal film layer, the metal film layer covers an outer surface of the metal body, and an impedance of the metal film layer is smaller than an impedance of the metal body. The metal body can be set to be common metal with lower cost in order to control the cost of the conductive piece, and the metal film layer with lower impedance is arranged on the surface of the metal body.

In a possible implementation manner of the first aspect, the metal body is made of copper, or the metal body is made of stainless steel; the metal film layer is made of gold or nickel.

In a possible implementation manner of the first aspect, the middle frame structural member further includes: a circuit board; the mounting groove also comprises a second side wall opposite to the first side wall, and the circuit board is arranged on the second side wall.

In a possible implementation manner of the first aspect, the second side wall is provided with a groove, the groove is formed by recessing a portion of the second side wall towards a direction away from the first side wall, the groove is open towards one side of the first surface, and the circuit board is disposed in the groove. Thus, the mounting position is provided for the mounting of the circuit board by providing the recess in the second side wall.

In a possible implementation manner of the first aspect, a side surface of the circuit board facing away from the second side wall is provided with a ground contact; the middle frame structural member further comprises: the conductive spring piece is abutted between the grounding contact and the connecting plate. Thus, the electric connection between the grounding contact and the connecting plate is realized by arranging the conductive spring plate.

In a possible implementation manner of the first aspect, the method further includes: the frame is arranged on the periphery of the middle plate in a surrounding mode. Like this, through setting up the frame, the inner structure of protection electronic equipment can play shock attenuation buffering's effect when electronic equipment takes place unexpected striking, drops.

In a possible implementation manner of the first aspect, the middle frame structural member is provided with an equipment bin, and the mounting groove is located on the circumferential outer side of the equipment bin.

In a second aspect, there is further provided an electronic device, including a back cover and a middle frame structural member according to any one of the first aspect, where the back cover is assembled on the middle frame structural member.

Because the electronic equipment provided by the application comprises the middle frame structural part according to any one of the first technical schemes, the two structural parts can solve the same technical problems and achieve the same effects.

Drawings

Fig. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present application;

FIG. 2 is a partial schematic view of the middle frame structural member shown in FIG. 1;

FIG. 3 is a schematic view of the structure of the midplane shown in FIG. 2;

FIG. 4 is a partial schematic view of the midplane shown in FIG. 3;

FIG. 5 is a partial schematic view of the first sidewall shown in FIG. 4;

FIG. 6 is a schematic illustration of a metal sheet welded to a ground area in some embodiments of the present application;

FIG. 7 is a schematic illustration of laser welding in some embodiments of the present application;

FIG. 8 is a schematic view of a metal sheet welded to a grounding region according to other embodiments of the present application;

FIG. 9 is a schematic view of a midplane provided by further embodiments of the present application;

FIG. 10 is a schematic view of the assembly of the midplane and conductive members shown in FIG. 9;

FIG. 11 is a partial schematic view of the first ground region shown in FIG. 10;

FIG. 12 is a cross-sectional view of the conductive member shown in FIG. 11;

FIG. 13 is a schematic view of a groove in some embodiments of the present application;

FIG. 14 is a schematic view of a middle frame structure provided in further embodiments of the present application;

FIG. 15 is a schematic view of the conductive member shown in FIG. 14 in a free state;

fig. 16 is a schematic view of the conductive member shown in fig. 14 in a compressed state.

Reference numerals:

10. an electronic device;

100. a middle frame structural member; 110. a middle plate; 111. an equipment bin; 112. a first surface; 1121. a first ground region; 1122. a second ground region; 1123. a conductive bump; 1124. a positioning groove; 113. a second surface; 114. a mounting groove; 1141. an opening; 1142. a first sidewall; 1143. a second sidewall; 115. a ground region; 116. a metal sheet; 1161. a fixing piece; 1162. a connecting sheet; 120. a frame; 130. a circuit board; 131. a first panel; 140. a conductive spring plate; 141. a fixing part; 142. an abutting portion; 150. a conductive member; 151. a fixing plate; 152. a connecting plate; 1521. a contact protrusion; 1523. a free end; 1524. a fixed end; 160. a groove; 161. a first inner groove surface; 163. a third inner groove surface; 164. a fourth inner groove surface; 170. an adhesive layer; 180. welding spots;

200. a back cover;

300. and displaying the cover plate.

Detailed Description

In the present embodiments, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", or a third "may explicitly or implicitly include one or more such feature.

In the present embodiments, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In the embodiment of the present application, "and/or" is merely an association relationship describing an association object, and indicates that three relationships may exist, for example, a and/or B may indicate: a exists alone, A and B exist together, and B exists alone. In addition, the character "/" herein generally indicates that the front and rear associated objects are an "or" relationship.

In the embodiments of the present application, unless otherwise specified, the description "parallel" refers to substantially parallel within a range that allows for an error, which may be a range of less than or equal to 5 ° relative to an absolute parallel deviation angle. The description "vertical" all means substantially vertical within a range of errors that may be less than or equal to 5 ° relative to an absolute vertical deviation angle.

The application provides an electronic device which is provided with a middle frame structural member. For example, the electronic device may be a mobile terminal or a fixed terminal such as a tablet (portable android device, PAD), a personal digital assistant (personal digital assistant, PDA), a handheld device with wireless communication capability, a computing device, a vehicle-mounted device, a wearable device, a Virtual Reality (VR) terminal device, an augmented reality (augmented reality, AR) terminal device, a wireless terminal in industrial control (industrial control), a wireless terminal in unmanned driving (self driving), a wireless terminal in telemedicine (remote media), a wireless terminal in smart grid (smart grid), a wireless terminal in transportation security (transportation safety), a wireless terminal in smart city (smart city), a wireless terminal in smart home (smart home), or the like. The form of the electronic device in the embodiment of the present application is not particularly limited.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to some embodiments of the present application; the present embodiment and the following embodiments are described by taking the electronic device 10 as a mobile phone. The electronic device 10 has an approximately rectangular plate shape. On this basis, in order to facilitate the description of the embodiments below, an XYZ coordinate system is established, the width direction of the electronic apparatus 10 is defined as the X-axis direction, the length direction of the electronic apparatus 10 is defined as the Y-axis direction, and the thickness direction of the electronic apparatus 10 is defined as the Z-axis direction. It is to be understood that the coordinate system of the electronic device 10 may be flexibly set according to actual needs, which is not specifically limited herein.

In other embodiments, the shape of the electronic device 10 may be a square flat plate, a round flat plate, an oval flat plate, etc., which is not particularly limited herein.

In some embodiments of the present application, please continue to refer to fig. 1, the electronic device 10 may include a middle frame structure 100, a display cover 300 and a back cover 200, where the middle frame structure 100 is located between the display cover 300 and the back cover 200, the middle frame structure 100, the display cover 300 and the back cover 200 together define an internal space of the electronic device 10, for example, as shown in fig. 1, in the Z-axis direction, the display cover 300, the middle frame structure 100 and the back cover 200 are stacked, the display cover 300 is assembled on one side of the middle frame structure 100 in the positive Z-axis direction, and the back cover 200 is assembled on one side of the middle frame structure 100 in the negative Z-axis direction, where the middle frame structure 100 is a main body frame of the electronic device 10.

Referring to fig. 2, fig. 2 is a partial schematic view of the middle frame structural member shown in fig. 1; the middle frame structure 100 can include frame 120 and medium plate 110, and medium plate 110 can be the metal material, and the exemplary material of medium plate 110 is the aluminum alloy, is equipped with equipment bin 111 on the medium plate 110, and specifically, equipment bin 111 can be used for assembling the battery, or equipment bin 111 also can be used for assembling the module of making a video recording, and frame 120 encloses the periphery of establishing at medium plate 110, and exemplary, frame 120 injection molding is at the periphery of medium plate 110, and the display screen can be protected to the frame 120 of plastic material, and when electronic equipment dropped, the frame 120 of plastic material can increase the buffering in medium plate and the external environment, reduces the broken possibility of display screen.

The electronic device further comprises a functional circuit board of the integrated electronic element, and specifically, the functional circuit board can be a functional circuit board for power management, a functional circuit board for signal transmission, and a functional circuit board for storage. In order to ensure the stability of the circuit in the functional circuit board in the use process of the electronic equipment, the general functional circuit board needs to be provided with a grounding circuit, so that the floating potential and interference signals possibly occurring in the circuit can be effectively reduced by grounding the functional circuit board, electromagnetic interference can be effectively shielded, and the signals are prevented from being interfered by the outside and other systems. In general, a middle plate made of metal is used as a ground reference, and a grounding circuit on the functional circuit board is electrically connected with the middle plate to realize grounding arrangement.

Referring to fig. 3 and 4, fig. 3 is a schematic structural diagram of the middle plate shown in fig. 2; fig. 4 is a partial schematic view of the midplane shown in fig. 3. The midplane 110 includes opposing first and second surfaces 112, 113. Wherein, in some embodiments, the first surface 112 may be disposed toward the back cover and the second surface 113 may be disposed toward the display cover plate; in other embodiments, the first surface 112 may be disposed toward the display cover, and the second surface 113 may be disposed toward the back cover. The middle plate 110 is provided with a mounting groove 114, the mounting groove 114 is located on the circumferential outer side of the equipment bin 111 (for example, the mounting groove 114 is located on one side of the equipment bin 111 in the positive direction of the X axis as shown in fig. 4), the mounting groove 114 comprises an opening 1141, the opening 1141 is located on the first surface 112, the mounting groove 114 further comprises a first side wall 1142 and a second side wall 1143 which are oppositely arranged, the first side wall 1142 is connected to the first surface 112, the second side wall 1143 is close to the equipment bin 111, the second side wall 1143 is provided with a circuit board 130, a grounding circuit on the circuit board 130 comprises a grounding contact, the first side wall 1142 is provided with a grounding area, the grounding area is a metal surface of the middle plate exposed and a frame, and the grounding contact on the circuit board 130 is electrically connected with the grounding area on the first side wall 1142, so that the grounding of a circuit on the circuit board 130 is realized.

The grounding circuit of the circuit board 130 in the mounting slot 114 may be electrically connected to the grounding circuit of the functional circuit board, and further, the grounding of the grounding circuit in the functional circuit board is achieved by grounding the circuit board 130 in the mounting slot 114. The functional circuit board and the circuit board 130 in the mounting groove 114 provided in the application may be a printed circuit board (Print Circuit Board, PCB), and may also be a flexible circuit board (Flexible Printed Circuit, FPC).

Referring to fig. 4 and 5, fig. 5 is a partial schematic view of the first sidewall shown in fig. 4; in the process of electrically connecting the circuit board 130 of the mounting groove 114 with the grounding region 115 on the first side wall 1142, the conductive spring sheet 140 is generally disposed on the circuit board 130, the conductive spring sheet 140 generally includes a fixing portion 141 and an abutting portion 142, the fixing portion 141 is fixed on the circuit board 130 and is electrically connected with the grounding contact on the circuit board 130, specifically, the fixing portion 141 is electrically connected with the grounding contact through a surface mount technology (Surface Mounted Technology, SMT), the abutting portion 142 abuts against the grounding region 115, so as to electrically connect the grounding contact on the circuit board 130 with the grounding region 115, and further, the grounding circuit in the circuit board 130 is grounded.

However, in order to meet the requirement of electrically connecting the abutting portion 142 and the grounding region 115, the low-impedance metal sheet 116 needs to be spot-welded on the grounding region 115 corresponding to the abutting portion 142, please refer to fig. 6 and 7, fig. 6 is a schematic diagram of the metal sheet welded on the grounding region in some embodiments of the present application, and fig. 7 is a schematic diagram of the laser welding in some embodiments of the present application. Wherein the resistance of the metal sheet 116 is required to be less than 0.5 ohm. In an actual operation process, the metal sheet 116 is welded to the grounding region 115 of the first side wall 1142 generally by a laser welding method, and the laser welding is performed by emitting a high-energy laser beam to melt the corresponding positions of the metal sheet 116 and the grounding region 115, then the metal at the corresponding positions of the metal sheet 116 and the grounding region are mutually fused, and then cooled, so as to achieve the welding effect.

Because of the high space layout requirements of the present electronic device, the width of the mounting groove 114, i.e. the distance between the first side wall 1142 and the second side wall 1143, is smaller, and the laser welding cannot fully weld the metal sheet 116 on the first side wall 1142, but only locally weld the metal sheet 116 near the opening (for example, the position with the welding spot 180 on the metal sheet 116 shown in fig. 6), which results in unstable electrical connection between the metal sheet 116 and the grounding area 115 and affects the overall quality of the product.

For example, referring to fig. 6 and 7, in general, the welding angle (e.g. the included angle a shown in fig. 7) of the laser welding is 60 ° -70 °, the laser beam propagates along a straight line, and, taking the metal sheet 116 on the first side wall 1142 as an example, the laser beam is emitted from one side of the second side wall 1143, and only when the laser beam moves to the upper side of the second side wall 1143, the laser beam welds the metal sheet 116, so that the welding area on the metal sheet 116 is limited, and the stability of the connection between the metal sheet 116 and the grounding area 115 cannot be ensured.

For another example, in other embodiments of the present application, please refer to fig. 8, fig. 8 is a schematic diagram illustrating a metal sheet welded at a grounding area in other embodiments of the present application. The grounding area 115 is arranged at the bottom of the mounting groove 114, the metal sheet 116 comprises a fixing sheet 1161 and a connecting sheet 1162, the fixing sheet 1161 is welded on the grounding area 115 through laser welding, the connecting sheet 1162 is connected with the fixing sheet 1161, the connecting sheet 1162 is opposite to the first side wall 1142, and the connecting sheet 1162 and the first side wall 1142 cannot be fixed, so that in the process of assembling a circuit board, the connecting sheet 1162 is easy to tilt, the assembling efficiency is affected, and the yield of products cannot be guaranteed.

In order to solve the above-mentioned problems, please refer to fig. 9 and 10, fig. 9 is a schematic diagram of a middle board according to still another embodiment of the present application; fig. 10 is a schematic diagram illustrating the assembly of the middle plate and the conductive member shown in fig. 9. The application provides a conductive member 150 ground connection setting, and conductive member 150 includes fixed plate 151 and connecting plate 152, and fixed plate 151 is fixed at first surface 112, and connecting plate 152 one end is connected on fixed plate 151, and the other end is located mounting groove 114 to connecting plate 152 sets up with first side wall 1142 relatively.

The fixing plate 151 may be welded on the first surface 112, or may be glued on the first surface 112, where the fixing plate 151 is fixed on the first surface 112, and the fixing position of the fixing plate 151 is located outside the mounting groove 114, so that the fixing of the fixing plate 151 is not limited by the mounting groove 114, and the stability of the fixing plate 151 on the first surface 112 can be ensured; thereby, the conductive member 150 is fixed on the middle plate 110 through the fixing plate 151; by arranging the connecting plate 152, the electrical connection between the grounding contact and the conductive member 150 is realized, and the grounding of the grounding circuit on the circuit board 130 is further satisfied due to the grounding treatment of the conductive member 150. Thus, the grounding purpose of the circuit board 130 is satisfied, and the fixing difficulty of the conductive member 150 is reduced.

In some embodiments, the first surface 112 includes a first ground region 1121, and the fixed plate 151 is electrically connected to the first ground region 1121. The fixing plate 151 is electrically connected to the first ground region 1121 by laser welding, for example.

The first grounding area 1121 is located on the first surface 112, the first surface 112 is located outside the mounting groove 114, during the laser welding process, the laser beam may strike all positions of the first surface 112, so that the laser beam may strike all positions of the first grounding area 1121, the projection of the fixing plate 151 on the surface of the first grounding area 1121 is completely located in the first grounding area 1121, and the laser beam of the laser welding may cover the fixing plate 151.

It should be noted that, referring to fig. 9 and 10, the laser welding belongs to one of spot welding, the laser beam of the laser welding is applied to the fixing plate 151, the high energy laser beam melts the corresponding position on the fixing plate 151 and the corresponding position of the first grounding region 1121, fuses each other, and then cools to form the welding spot 180 on the fixing plate 151. By moving the laser beam of the laser welding, the welding spots 180 are formed at different positions on the fixing plate 151, and by forming a plurality of welding spots 180 at different positions of the fixing plate 151, the electrical connection and fixation between the fixing plate 151 and the first ground region 1121 are achieved. And further solves the problem of unstable fixation of the conductive member 150, and reduces the process difficulty of laser welding.

Thus, the conductive member 150 is electrically connected to the first grounding region 1121 by providing the fixing plate 151, and the conductive member 150 is electrically connected to the ground contact on the circuit board 130, and by providing the connection plate 152 opposite to the first side wall 1142, it is understood that the circuit board 130 is located on a side of the connection plate 152 facing away from the first side wall 1142, and the ground contact is located on a side surface of the circuit board 130 facing the first side wall 1142 (for example, a side surface of the circuit board 130 shown in fig. 9 in the positive X-axis direction), that is, the connection plate 152 is located opposite to the ground contact.

With continued reference to fig. 9 and fig. 10, the fixing plate 151 and the connecting plate 152 are integrally formed, so that the number of production lines of the conductive members 150 can be reduced and the production time of the conductive members 150 can be reduced by integrally forming the fixing plate 151 and the connecting plate 152.

In other embodiments of the present application, as shown in fig. 9 and 10, the first side wall 1142 is provided with a second grounding area 1122, the connection board 152 is electrically connected to the second grounding area 1122, wherein the second grounding area 1122 is a part of the metal surface of the middle board 110 exposed from the frame, the connection board 152 is in contact with the second grounding area 1122, and then the connection board 152 is electrically connected to the second grounding area 1122, and the area of the electrical connection between the conductive member 150 and the middle board 110 is: the sum of the contact area between the fixing plate 151 and the first ground region 1121 and the contact area between the connection plate 152 and the second ground region 1122 can greatly expand the area of the electrical connection between the conductive member 150 and the middle plate 110, wherein the area of the electrical connection between the conductive member 150 and the middle plate 110 is increased, the impedance between the conductive member 150 and the middle plate 110 can be reduced, and the electrical connection effect between the conductive member 150 and the middle plate 110 can be ensured.

In other embodiments of the present application, referring to fig. 9 and 10, the first side wall 1142 is provided with an electrically conductive protrusion 1123, the electrically conductive protrusion 1123 protrudes from the first side wall 1142, and a side surface of the electrically conductive protrusion 1123 facing away from the first side wall 1142 is the second grounding area 1122. The distance between the second grounding area 1122 and the second side wall 1143 is smaller than the distance between the first side wall 1142 and the second side wall 1143, the distance between the circuit board 130 and the connection board 152 can be reduced by providing the conductive protrusions 1123, the contact pressure between the grounding contact and the connection board 152 can be increased, the contact resistance between the grounding contact and the connection board 152 can be reduced, the impedance between the grounding contact and the connection board 152 can be further reduced, the effect of electrical connection between the grounding contact and the connection board 152 can be improved, and the grounding requirement of the grounding circuit on the circuit board can be met.

Specifically, when the electrical connection is achieved between the ground contact and the connection plate 152 through the conductive elastic sheet 140, the distance between the connection plate 152 and the ground contact is shortened due to the conductive protrusion 1123, so that the compression amount of the abutment portion 142 is increased, it can be understood that the abutment portion 142 is an elastic member, the greater the compression amount of the abutment portion 142, the greater the contact pressure between the abutment portion 142 and the connection plate 152, the smaller the contact resistance between the ground contact and the connection plate 152, and the better the electrical connection effect between the ground contact and the connection plate.

The first grounding area 1121 may extend to the edge of the opening of the mounting slot 114, and the first grounding area 1121 is connected to the second grounding area 1122, so that a side surface of the fixing plate 151 facing the first grounding area 1121 ensures that an area electrically connected to the first grounding area 1121 is maximized, a side surface of the connecting plate 152 facing the second grounding area 1122 ensures that an area electrically connected to the second grounding area 1122 is maximized, it is understood that the connection position of the fixing plate 151 and the connecting plate 152 is electrically connected to the middle plate 110, and further, an electrical contact area between the middle plate 110 and the conductive member 150 is ensured to be maximized, thereby achieving the purpose of improving an electrical connection effect between the conductive member 150 and the middle plate 110.

In some embodiments of the present application, referring to fig. 11, fig. 11 is a partial schematic view of the first grounding region shown in fig. 10. The first surface 112 is provided with a positioning groove 1124, and a side of the positioning groove 1124 adjacent to the mounting groove 114 is open, and the first grounding region 1121 is located on a bottom wall of the positioning groove 1124 (for example, on a bottom wall of the positioning groove 1124 facing the positive Z-axis direction side shown in fig. 11). Thus, when the fixing plate 151 of the conductive member 150 is welded, the fixing plate 151 is placed in the positioning groove 1124, so that the fixing plate 151 is positioned in advance, and the accuracy of the welding position of the fixing plate 151 is ensured.

Wherein a side surface of the fixing plate 151 facing away from the first ground region 1121 is flush with the first surface 112. It will be appreciated that the side surface of the fixed plate 151 facing away from the first ground region 1121 is flush with the first surface 112, "flush" means substantially flush within a range that allows for an error, which may be a range of less than or equal to 5 ° relative to absolute flush deviation angle, or a range of less than or equal to 0.02mm relative to absolute flush. It should be noted that, the surface of one side of the fixing plate 151 facing away from the first grounding area 1121 is flush with the first surface 112, so that the first surface 112 of the middle plate 110 can be smooth and beautiful, the overall product quality of the middle frame structure is improved, and a smooth bonding surface is provided for mounting the back cover.

In some implementations of the present application, the impedance of the conductive member 150 is less than 0.5 ohm, and it should be noted that satisfying the impedance of the conductive member 150 less than 0.5 ohm may satisfy the electrical connection requirement between the ground contact and the middle plate 110. Specifically, the impedance of the conductive member 150 may be 0.1 ohm, 0.2 ohm, 0.3 ohm, 0.4 ohm, or 0.5 ohm.

In some embodiments of the present application, referring to fig. 12, fig. 12 is a cross-sectional view of the conductive member shown in fig. 11. The conductive member 150 includes a metal body 153 and a metal film layer 154, the metal film layer 154 covers the outer surface of the metal body 153, and the impedance of the metal film layer 154 is smaller than that of the metal body 153. In order to consider the cost of the conductive member 150, the metal body 153 is generally a common metal, the material of the metal film 154 is generally a noble metal, for example, gold, and the impedance of the noble metal is small, so that the cost of the conductive member 150 can be reduced on the premise of meeting the impedance requirement of the conductive member 150 by matching the metal body 153 with the metal film 154.

In some embodiments, the conductive member 150 may be a gold-plated copper sheet, the metal body 153 is made of copper, and the metal film 154 is made of gold. The conductive member 150 may be nickel plated stainless steel, the metal body 153 is made of stainless steel, and the metal film 154 is made of nickel. The conductive member 150 is gold-plated stainless steel, the metal body 153 is made of stainless steel, and the metal film 154 is made of gold. The conductive member 150 is a nickel plated copper sheet, the metal body 153 is made of copper, and the metal film 154 is made of nickel.

In some implementations of the present application, referring to fig. 13, fig. 13 is a schematic diagram of a groove in some embodiments of the present application. The second side wall 1143 is provided with a groove 160, the groove 160 is formed by recessing a portion of the second side wall 1143 away from the first side wall 1142, the groove 160 is open towards one side of the first surface 112, and the circuit board 130 is disposed in the groove 160. Thus, by providing the recess 160 on the second side wall 1143, an assembling position is provided for the circuit board 130, and the predetermined position of the circuit board 130 is achieved, so that the accuracy of the assembling position of the circuit board 130 is ensured.

The groove 160 includes a first inner groove surface 161 and a second inner groove surface, the first inner groove surface 161 is connected to the second side wall 1143, the second inner groove surface is connected to the second side wall 1143, the circuit board 130 includes a first plate surface 131 opposite to the first inner groove surface 161 and a second plate surface opposite to the second inner groove surface, and a distance between the first inner groove surface 161 and the second inner groove surface is greater than a distance between the first plate surface 131 and the second plate surface; that is, the groove 160 is clearance fit with the circuit board 130 in a direction in which the first board surface 131 faces the second board surface. Thus, the difficulty of assembling the circuit board 130 to the mounting groove 114 can be reduced, the workload of an assembler can be reduced, and the yield of products can be improved.

The groove 160 may further include a third inner groove surface 163, the third inner groove surface 163 being parallel to the second side wall 1143, wherein "parallel" means substantially parallel within a tolerance range, which may be a range of less than or equal to 5 ° relative to an absolute parallel deviation angle. An adhesive layer 170 is disposed between the circuit board 130 and the third inner groove surface 163, and in particular, the adhesive layer 170 may be disposed on a surface of the circuit board 130 facing the third inner groove surface 163, or the adhesive layer 170 may be disposed on the third inner groove surface 163. Thus, the circuit board 130 is fixed to the third inner groove surface 163 by providing the adhesive layer 170 between the circuit board 130 and the third inner groove surface 163.

With continued reference to fig. 13, the groove 160 further includes a fourth inner groove surface 164, where the fourth inner groove surface 164 is respectively connected to the first inner groove surface 161, the second inner groove surface and the third inner groove surface 163, and when the circuit board 130 is assembled to the mounting groove 114, the bottom surface of the circuit board 130 abuts against the fourth inner groove surface 164, so as to ensure the positional accuracy of the circuit board 130 in the Z-axis direction.

In other embodiments of the present application, referring to fig. 14 to 16, fig. 14 is a schematic view of a middle frame structural member provided in other embodiments of the present application; FIG. 15 is a schematic view of the conductive member shown in FIG. 14 in a free state; fig. 16 is a schematic view of the conductive member shown in fig. 14 in a compressed state. The connection plate 152 includes a fixed end 1524 and a free end 1523, the fixed end 1524 being connected to the fixed plate 151.

In the direction from the first surface 112 to the second surface 113, the connection plate 152 is inclined toward a direction away from the first side wall 1142. Wherein the distance between the free end 1523 and the second side wall 1143 is less than the distance between the free end 1523 and the second side wall 1143; it will be appreciated that when the circuit board 130 is assembled to the second side wall 1143 through the opening of the mounting slot 114, the free end 1523 of the connection plate 152 abuts against a side surface of the circuit board 130 facing the first side wall 1142, and when the circuit board 130 is mounted to the predetermined position of the mounting slot 114, the free end 1523 abuts against the ground contact of the circuit board 130, and an electrical connection between the connection plate 152 and the ground contact is achieved, and the conductive member 150 is switched from a free state (e.g., the state of the conductive member 150 shown in fig. 15, in which the free end 1523 is not pressed) to a compressed state (e.g., the state of the conductive member 150 shown in fig. 16, in which the free end 1523 is pressed by the circuit board 130).

It should be noted that, when the circuit board 130 is mounted to the mounting slot 114, the free end 1523 of the connecting board 152 is pressed by the circuit board 130, and the free end 1523 of the connecting board 152 moves toward the first side wall 1142, and the connecting board 152 has a tendency to return to the free state, so that the free end 1523 of the connecting board 152 applies a pressure to the circuit board 130 toward the circuit board 130, so as to achieve the fit between the free end 1523 of the connecting board 152 and the ground contact, and further achieve the electrical connection between the free end 1523 of the connecting board 152 and the ground contact.

Thus, by providing the connection plate 152 with an inclined structure, the use of the conductive spring sheet can be saved, the number of parts in the mounting groove 114 can be reduced, and the structure in the mounting groove 114 can be simplified.

In some embodiments of the present application, referring to fig. 14 to 16, the connection plate 152 is provided with a contact protrusion 1521, the contact protrusion 1521 is disposed near the free end 1523, and the contact protrusion 1521 is disposed on a side surface of the connection plate 152 facing away from the first side wall 1142. Specifically, the contact protrusion 1521 may be hemispherical, semi-elliptical, etc., so that the contact protrusion 1521 may be electrically connected to the ground contact while avoiding the connection plate 152 from scratching the circuit board 130 during the assembly of the circuit board 130 to the mounting slot 114.

It is understood that the contact protrusions 1521 may also be provided in the other embodiments described above.

Referring to fig. 15 and 16, the contact protrusion 1521 is disposed near the free end 1523, which means that the distance between the free end 1523 and the contact protrusion 1521 is smaller than the distance between the fixed end 1524 and the contact protrusion 1521.

The first grounding area in the above embodiment may be a side surface of the antenna radiating portion, and the antenna signal inside the electronic device is electrically connected to the first grounding area through the conductive member, and the antenna signal is transmitted to the antenna radiating portion, and then is radiated through the side of the antenna radiating portion on the surface of the electronic device.

In the description of the present specification, a particular feature, structure, material, or characteristic may be combined in any suitable manner in one or more embodiments or examples.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and are not limiting thereof; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the corresponding technical solutions.

Claims (19)

1. A mid-frame structure comprising:

the device comprises a middle plate, a first connecting plate and a second connecting plate, wherein the middle plate comprises a first surface and a second surface which are opposite, a mounting groove is formed in the middle plate, the mounting groove comprises an opening and a first side wall, the opening is formed in the first surface, and the first side wall is connected to the first surface;

the conductive piece is grounded and comprises a fixed plate and a connecting plate, the fixed plate is fixed on the first surface, one end of the connecting plate is connected with the fixed plate, the other end of the connecting plate is positioned in the mounting groove, and the connecting plate and the first side wall are oppositely arranged.

2. The middle frame structure of claim 1, wherein the first surface includes a first ground region, the securing plate being electrically connected to the first ground region.

3. The middle frame structural member of claim 2 wherein the first surface is provided with a positioning groove, one side of the positioning groove adjacent to the opening is open, the first grounding region is located on a bottom wall of the positioning groove, and the bottom wall and the first surface face the same.

4. A mid-frame structure as claimed in claim 3, wherein a side surface of the fixing plate facing away from the first ground region is flush with the first surface.

5. The middle frame structure of any one of claims 1 to 4, wherein a second grounding region is provided on the first side wall, and the connection board is electrically connected to the second grounding region.

6. The middle frame structure of claim 5, wherein the first side wall is provided with a conductive protrusion, the conductive protrusion protrudes from the first side wall, and the second grounding region is located on a surface of the conductive protrusion facing away from the first side wall.

7. The middle frame structure of claim 5 or 6, wherein the first surface includes a first ground region, the securing plate is electrically connected to the first ground region, the first ground region extends to the opening edge, and the first ground region is connected to the second ground region.

8. The middle frame structure of any one of claims 1 to 7, wherein the fixing plate is integrally formed with the connection plate.

9. The middle frame structure according to any one of claims 1 to 4, wherein the connection plate includes a fixed end and a free end, the fixed end being connected to the fixed plate;

the connection plate is inclined in a direction from the first surface to the second surface toward a direction away from the first side wall.

10. The middle frame structural member of claim 9 wherein a contact protrusion is provided on a side surface of the connecting plate facing away from the first side wall, the contact protrusion being disposed proximate the free end.

11. The middle frame structure of any one of claims 1 to 10, wherein the impedance of the conductive member is less than or equal to 0.5 ohms.

12. The middle frame structure of claim 11, wherein the conductive member comprises a metal body and a metal film layer, the metal film layer coating an outer surface of the metal body, the metal film layer having a resistance less than a resistance of the metal body.

13. The middle frame structural member of claim 12 wherein the metal body is copper or stainless steel;

the metal film layer is made of gold or nickel.

14. The middle frame structure of claim 1, further comprising:

a circuit board;

the mounting groove further comprises a second side wall opposite to the first side wall, and the circuit board is arranged on the second side wall.

15. The middle frame structural member of claim 14, wherein a groove is formed in the second side wall, the groove being formed by recessing a portion of the second side wall away from the first side wall, the groove being open to a side of the first surface, the circuit board being disposed in the groove.

16. The middle frame structure of claim 14 or 15, wherein a side surface of the circuit board facing away from the second side wall is provided with a ground contact;

the middle frame structural member further comprises: the conductive spring piece is abutted between the grounding contact and the connecting plate.

17. The middle frame structure of any one of claims 1 to 16, further comprising:

the frame is arranged on the periphery of the middle plate in a surrounding mode.

18. The middle frame structure according to any one of claims 1 to 17, wherein an equipment compartment is provided on the middle plate, and the mounting groove is located on a circumferential outer side of the equipment compartment.

19. An electronic device, comprising:

a middle frame structure as claimed in any one of claims 1 to 18;

and the back cover is assembled on the middle frame structural member.