CN220658959U - SMD carrier band mould - Google Patents
SMD carrier band mould Download PDFInfo
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- CN220658959U CN220658959U CN202322078885.4U CN202322078885U CN220658959U CN 220658959 U CN220658959 U CN 220658959U CN 202322078885 U CN202322078885 U CN 202322078885U CN 220658959 U CN220658959 U CN 220658959U
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 57
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 238000001816 cooling Methods 0.000 claims abstract description 15
- 238000005485 electric heating Methods 0.000 claims description 12
- 238000010438 heat treatment Methods 0.000 claims description 10
- 230000002457 bidirectional effect Effects 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 abstract description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 210000004877 mucosa Anatomy 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses an SMD carrier band die which comprises an upper die and a lower die, wherein a first cavity is formed in the top of the lower die, dampers are fixedly connected to four corners of the bottom of an inner cavity of the first cavity, a die cavity is fixedly connected to the top of the dampers, a cooling pipe is fixedly connected to the bottom of the die cavity, a first box body is fixedly connected to the bottom of the inner cavity of the first cavity, a first water pump is connected to the left side of the top of the first box body through bolts, a semiconductor refrigerator is arranged at the bottom of the first box body in a penetrating manner, and a second box body is arranged at the right side of the first cavity in a penetrating manner. According to the utility model, through the cooperation of the cooling pipe, the first cavity, the first water pump, the semiconductor refrigerator and the first telescopic hose, the mold cooling device has the advantage of being capable of radiating heat, so that the mold is cooled more uniformly and rapidly, the subsequent use of the mold is facilitated, and convenience is provided for operators.
Description
Technical Field
The utility model relates to the technical field of SMD carrier tapes, in particular to an SMD carrier tape die.
Background
The SMD carrier tape is mainly used for packaging the IC chip and electronic components such as a capacitor, an inductor and the like, and the material of the SMD carrier tape is mainly PC and PS materials, and an SMD carrier tape mould is required to be used for producing the SMD carrier tape.
The utility model patent of patent application publication No. CN216611902U discloses a carrier tape die convenient for product packaging, which comprises a bottom fixing plate, wherein the left side of the bottom fixing plate is provided with a left trapezoid slot, the left trapezoid slot is connected with a left flat slot, the left trapezoid slot is communicated with a left Ping Chacao, the right side of the bottom fixing plate is provided with a right trapezoid slot, the right trapezoid slot is connected with a right flat slot, the right trapezoid slot is communicated with the right flat slot, the left trapezoid slot is internally provided with a left trapezoid insert block in a tight fit manner, the left trapezoid insert block is connected with a flat insert block, the left side of the flat insert block is inserted into the left flat slot in a tight fit manner, the right side of the flat insert block is inserted into the right flat slot in a tight fit manner, the flat insert block is connected with a right trapezoid insert block, and the right trapezoid insert block is inserted into the right trapezoid slot in a tight fit manner.
However, the device still has some disadvantages in practical use, namely the device is obviously not provided with a function of facilitating heat dissipation of the die, the surface and the inside of the die are high in temperature after the die is used, if the die cannot be cooled rapidly, adverse effects can be brought to subsequent use of the die, the service life of the die can be reduced, the device is not provided with a function of preheating the die, and if the die is not preheated before use, the defects of difficult molding, mucosa and the like are easily caused, and on the other hand, the die is easily damaged due to too large temperature change of the die, so that inconvenience is brought to operators.
Therefore, it is necessary to invent an SMD carrier tape die to solve the above problems.
Disclosure of Invention
The utility model aims to provide an SMD carrier tape die which has the advantages of being capable of radiating heat and preheating the die, and solves the problems that the die is not usually provided with the function of radiating heat and the die cannot be preheated.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a SMD carrier band mould, includes mould and lower mould, first cavity has been seted up at the top of lower mould, the equal fixedly connected with attenuator in four corners of first cavity inner chamber bottom, the top fixedly connected with die cavity of attenuator, the bottom fixedly connected with cooling tube of die cavity, the bottom fixedly connected with first box of first cavity inner chamber, the left side at first box top is through bolted connection has first water pump, the bottom of first box is run through and is provided with semiconductor refrigerator, the right side of first cavity is run through and is provided with the second box, the inner chamber of second box is through bolted connection has heating mechanism, the second cavity has been seted up to the front side of going up the mould, the right side fixedly connected with controller of second box.
Preferably, the heating mechanism comprises an electric heating wire, two sides of the electric heating wire are connected with an inner cavity of a second box body through bolts, a second water pump is connected to the right side of the top of the second box body through bolts, a water inlet pipe of the second water pump is communicated with a water diversion pipe, the left side of the water diversion pipe is communicated with the second box body, a water outlet pipe of the second water pump is communicated with a second telescopic hose, the left side of the second telescopic hose penetrates through an upper die and is communicated with a second cavity, and the output end of the controller is respectively connected with the electric heating wire and the second water pump in a unidirectional mode.
Preferably, the left side of the second box body inner cavity is connected with a temperature sensor through a bolt, and the controller is in bidirectional electric connection with the temperature sensor.
Preferably, the top of the upper die is connected with an oil cylinder through a bolt, the top of the oil cylinder is connected with a mounting plate through a bolt, and the output end of the controller is electrically connected with the oil cylinder in a one-way manner.
Preferably, a preheating pipe is fixedly connected to the bottom of the inner cavity of the second cavity, and the right side of the preheating pipe is communicated with the second telescopic hose.
Preferably, springs are fixedly connected to four corners of the bottom of the die cavity, and the bottoms of the springs are fixedly connected with the bottoms of the inner cavities of the first cavity.
Preferably, the bottom of the semiconductor refrigerator penetrates through the lower die, the four corners of the bottom of the lower die are fixedly connected with supporting columns, and the right side of the second box body penetrates through the lower die.
Preferably, the both sides of cooling tube all communicate there is first flexible hose, the inlet tube of first water pump runs through first box and extends to the bottom of first box inner chamber, the outlet pipe of first water pump is linked together with left first flexible hose, the top of second box is linked together with right first flexible hose, the output of controller is connected with first water pump and semiconductor refrigerator unidirectional electricity respectively.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, through the cooperation of the cooling pipe, the first cavity, the first water pump, the semiconductor refrigerator and the first telescopic hose, the mold cooling device has the advantage of being capable of radiating heat, so that the mold is cooled more uniformly and rapidly, the subsequent use of the mold is facilitated, and convenience is provided for operators.
2. The utility model has the advantage of preheating the die through the cooperation of the electric heating wire, the second water pump, the water conduit, the second telescopic hose, the temperature sensor and the preheating pipe, thereby enabling the die to be formed faster and the die to be demoulded more conveniently and being beneficial to the production process of the SMD carrier tape die.
Drawings
FIG. 1 is a schematic view of a structural section of the present utility model;
FIG. 2 is a schematic diagram of a front view axis side explosion of a partial structure of the present utility model;
FIG. 3 is a schematic view of a partial structure of the present utility model in section with an axial side exploded view;
FIG. 4 is a schematic exploded view of the heating mechanism of the present utility model in cross-section on the axial side.
In the figure: 1. an upper die; 2. a lower die; 3. a first cavity; 4. a damper; 5. a mold cavity; 6. a cooling tube; 7. a first case; 8. a first water pump; 9. a semiconductor refrigerator; 10. a second case; 11. a heating mechanism; 12. a second cavity; 13. a controller; 14. heating wires; 15. a second water pump; 16. a water conduit; 17. a second telescoping hose; 18. a temperature sensor; 19. an oil cylinder; 20. a mounting plate; 21. a preheating tube; 22. a spring; 23. a first telescoping hose.
Detailed Description
Referring to fig. 1-4, an SMD carrier tape die comprises an upper die 1 and a lower die 2, wherein a first cavity 3 is provided at the top of the lower die 2, dampers 4 are fixedly connected to four corners of the bottom of the cavity of the first cavity 3, a die cavity 5 is fixedly connected to the top of the dampers 4, a cooling pipe 6 is fixedly connected to the bottom of the die cavity 5, a first box 7 is fixedly connected to the bottom of the cavity of the first cavity 3, a first water pump 8 is connected to the left side of the top of the first box 7 through a bolt, a semiconductor refrigerator 9 is provided at the bottom of the first box 7 in a penetrating manner, a second box 10 is provided at the right side of the first cavity 3 in a penetrating manner, a heating mechanism 11 is provided at the inner cavity of the second box 10 through a bolt, a second cavity 12 is provided at the front side of the upper die 1, and a controller 13 is fixedly connected to the right side of the second box 10.
The heating mechanism 11 comprises an electric heating wire 14, both sides of the electric heating wire 14 are connected with an inner cavity of the second box body 10 through bolts, a second water pump 15 is connected to the right side of the top of the second box body 10 through bolts, a water inlet pipe of the second water pump 15 is communicated with a water conduit 16, the left side of the water conduit 16 is communicated with the second box body 10, a water outlet pipe of the second water pump 15 is communicated with a second telescopic hose 17, and a die can be preheated through the arrangement of the electric heating wire 14, the second water pump 15, the water conduit 16 and the second telescopic hose 17, so that the molding process is facilitated, the left side of the second telescopic hose 17 penetrates through the upper die 1 and is communicated with the second cavity 12, and the output end of the controller 13 is respectively connected with the electric heating wire 14 and the second water pump 15 in a unidirectional mode.
The left side of the inner cavity of the second box body 10 is connected with a temperature sensor 18 through a bolt, the temperature sensor 18 is arranged, the water temperature in the second box body 10 can be sensed, signals are transmitted to the controller 13, and the controller 13 is in bidirectional electric connection with the temperature sensor 18.
The top of the upper die 1 is connected with an oil cylinder 19 through a bolt, the movement of the die is facilitated by arranging the oil cylinder 19, so that the production of the SMD carrier tape die is facilitated, the top of the oil cylinder 19 is connected with a mounting plate 20 through a bolt, and the output end of the controller 13 is electrically connected with the oil cylinder 19 in a one-way manner.
The bottom of the inner cavity of the second cavity 12 is fixedly connected with a preheating pipe 21, and the preheating pipe 21 is arranged to play a role in preheating, so that the use of a die is facilitated, and the right side of the preheating pipe 21 is communicated with the second telescopic hose 17.
The four corners of die cavity 5 bottom all fixedly connected with spring 22, through setting up attenuator 4 and spring 22, can play the absorbing effect to protect the mould, the bottom of spring 22 and the bottom fixed connection of first cavity 3 inner chamber.
The bottom of the semiconductor refrigerator 9 penetrates through the lower die 2, and the semiconductor refrigerator 9 is arranged to cool the die, so that support columns are fixedly connected to four corners of the bottom of the lower die 2, and the right side of the second box 10 penetrates through the lower die 2.
The both sides of cooling tube 6 all communicate there is first flexible hose 23, the inlet tube of first water pump 8 runs through first box 7 and extends to the bottom of first box 7 inner chamber, the rear side intercommunication at first box 7 top has the delivery pipe, the rear side of delivery pipe runs through first cavity 3 and is linked together with lower mould 2, the outlet pipe of first water pump 8 is linked together with left first flexible hose 23, the top of second box 10 is linked together with right first flexible hose 23, the output of controller 13 is connected with first water pump 8 and semiconductor refrigerator 9 unidirectional electricity respectively.
When the device is used, an operator controls the controller 13 to control the first water pump 8 to work, so that water in the first box 7 enters the second box 10, the controller 13 controls the second water pump 15 and the electric heating wire 14 to work, so that heated water enters the preheating pipe 21 through the second telescopic hose 17, the preheating pipe 21 is used for preheating a die, the use of the die is facilitated, the controller 13 controls the oil cylinder 19 to work, the upper die 1 is lowered, the lower die 2 is matched for forming, when the die needs to be cooled, the controller 13 controls the first water pump 8 and the semiconductor refrigerator 9 to work, so that the water in the first box 7 is cooled, and the heated water enters the cooling pipe 6 through the first telescopic hose 23, and the die is cooled.
To sum up: the SMD carrier band die solves the problems that the die is not usually provided with a heat dissipation function and cannot be preheated by matching the cooling pipe 6, the first cavity 3, the first water pump 8, the semiconductor refrigerator 9, the first telescopic hose 23, the heating wire 14, the second water pump 15, the water conduit 16, the second telescopic hose 17, the temperature sensor 18 and the preheating pipe 21.
Claims (8)
1. The utility model provides a SMD carrier band mould, includes mould (1) and lower mould (2), its characterized in that: the top of lower mould (2) has seted up first cavity (3), the equal fixedly connected with attenuator (4) in four corners of first cavity (3) inner chamber bottom, the top fixedly connected with die cavity (5) of attenuator (4), the bottom fixedly connected with cooling tube (6) of die cavity (5), the bottom fixedly connected with first box (7) of first cavity (3) inner chamber, the left side at first box (7) top is through bolted connection has first water pump (8), the bottom of first box (7) is run through and is provided with semiconductor refrigerator (9), the right side of first cavity (3) is run through and is provided with second box (10), the inner chamber of second box (10) is through bolted connection have heating mechanism (11), second cavity (12) have been seted up to the front side of last mould (1), the right side fixedly connected with controller (13) of second box (10).
2. The SMD carrier tape die of claim 1, wherein: the heating mechanism (11) comprises an electric heating wire (14), two sides of the electric heating wire (14) are connected with an inner cavity of a second box body (10) through bolts, a second water pump (15) is connected to the right side of the top of the second box body (10) through bolts, a water inlet pipe of the second water pump (15) is communicated with a water conduit (16), the left side of the water conduit (16) is communicated with the second box body (10), a water outlet pipe of the second water pump (15) is communicated with a second telescopic hose (17), the left side of the second telescopic hose (17) penetrates through the upper die (1) and is communicated with a second cavity (12), and the output end of the controller (13) is respectively connected with the electric heating wire (14) and the second water pump (15) in a unidirectional mode.
3. The SMD carrier tape die of claim 1, wherein: the left side of the inner cavity of the second box body (10) is connected with a temperature sensor (18) through a bolt, and the controller (13) is in bidirectional electric connection with the temperature sensor (18).
4. The SMD carrier tape die of claim 1, wherein: the top of the upper die (1) is connected with an oil cylinder (19) through a bolt, the top of the oil cylinder (19) is connected with a mounting plate (20) through a bolt, and the output end of the controller (13) is electrically connected with the oil cylinder (19) in a unidirectional mode.
5. The SMD carrier tape die of claim 1, wherein: the bottom of the inner cavity of the second cavity (12) is fixedly connected with a preheating pipe (21), and the right side of the preheating pipe (21) is communicated with a second telescopic hose (17).
6. The SMD carrier tape die of claim 1, wherein: springs (22) are fixedly connected to four corners of the bottom of the die cavity (5), and the bottoms of the springs (22) are fixedly connected with the bottoms of the inner cavities of the first cavity (3).
7. The SMD carrier tape die of claim 1, wherein: the bottom of the semiconductor refrigerator (9) penetrates through the lower die (2), supporting columns are fixedly connected to four corners of the bottom of the lower die (2), and the right side of the second box body (10) penetrates through the lower die (2).
8. The SMD carrier tape die of claim 1, wherein: the utility model discloses a semiconductor refrigerator, including cooling tube (6), first flexible hose (23) are all linked together to both sides of cooling tube (6), the inlet tube of first water pump (8) runs through first box (7) and extends to the bottom of first box (7) inner chamber, the outlet pipe of first water pump (8) is linked together with left first flexible hose (23), the top of second box (10) is linked together with right first flexible hose (23), the output of controller (13) is connected with first water pump (8) and semiconductor refrigerator (9) one-way electricity respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322078885.4U CN220658959U (en) | 2023-08-03 | 2023-08-03 | SMD carrier band mould |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322078885.4U CN220658959U (en) | 2023-08-03 | 2023-08-03 | SMD carrier band mould |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220658959U true CN220658959U (en) | 2024-03-26 |
Family
ID=90333062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322078885.4U Active CN220658959U (en) | 2023-08-03 | 2023-08-03 | SMD carrier band mould |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220658959U (en) |
-
2023
- 2023-08-03 CN CN202322078885.4U patent/CN220658959U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |