CN214266545U - An injection mold with good cooling effect - Google Patents
An injection mold with good cooling effect Download PDFInfo
- Publication number
- CN214266545U CN214266545U CN202023143232.2U CN202023143232U CN214266545U CN 214266545 U CN214266545 U CN 214266545U CN 202023143232 U CN202023143232 U CN 202023143232U CN 214266545 U CN214266545 U CN 214266545U
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- Prior art keywords
- water
- mold
- pipe
- storage tank
- water storage
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- 238000002347 injection Methods 0.000 title claims abstract description 31
- 239000007924 injection Substances 0.000 title claims abstract description 31
- 238000001816 cooling Methods 0.000 title claims abstract description 27
- 230000000694 effects Effects 0.000 title claims abstract description 27
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 105
- 238000003860 storage Methods 0.000 claims abstract description 47
- 239000004065 semiconductor Substances 0.000 claims abstract description 17
- 238000005057 refrigeration Methods 0.000 claims abstract description 13
- DNHVXYDGZKWYNU-UHFFFAOYSA-N lead;hydrate Chemical compound O.[Pb] DNHVXYDGZKWYNU-UHFFFAOYSA-N 0.000 claims abstract 4
- 230000017525 heat dissipation Effects 0.000 claims description 10
- 238000009529 body temperature measurement Methods 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract description 6
- 230000008901 benefit Effects 0.000 abstract description 5
- 238000001746 injection moulding Methods 0.000 description 7
- 238000007493 shaping process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
本实用新型公开了一种冷却效果好的注塑模具，包括下模具、蓄水箱和上模具，所述下模具顶部的中心处开设有模槽，所述下模具右侧的中心处固定连接有水泵，所述水泵的进水端连通有引水管，所述引水管远离水泵的一侧与蓄水箱内腔左侧的底部连通，所述水泵的出水端连通有下环形管。本实用新型通过设置导热块、集热板、水泵、引水管、半导体制冷片、蓄水箱、主散热片、控制器、回流管、横向伸缩软管、上环形管、下环形管、温度传感器和竖向伸缩软管配合使用，具有冷却效果好的优点，解决了现有的注塑模具冷却效果较差，原料成型速度较慢，且不具有测温制冷的功能，无法满足使用者需求，降低了注塑模具实用性的问题。
The utility model discloses an injection mold with good cooling effect, which comprises a lower mold, a water storage tank and an upper mold. A mold groove is opened at the center of the top of the lower mold, and a center of the right side of the lower mold is fixedly connected with a mold groove. A water pump, the water inlet end of the water pump is connected with a water lead pipe, the side of the water lead pipe away from the water pump is connected with the bottom of the left side of the inner cavity of the water storage tank, and the water outlet end of the water pump is connected with a lower annular pipe. The utility model is provided with a heat conducting block, a heat collecting plate, a water pump, a water diversion pipe, a semiconductor refrigerating sheet, a water storage tank, a main radiating fin, a controller, a return pipe, a horizontal telescopic hose, an upper annular pipe, a lower annular pipe, and a temperature sensor. Used in conjunction with a vertical telescopic hose, it has the advantages of good cooling effect, which solves the problem that the existing injection mold has poor cooling effect, slow raw material forming speed, and does not have the function of temperature measurement and refrigeration, which cannot meet the needs of users, reducing The problem of practicality of injection mold is solved.
Description
Technical Field
The utility model relates to an injection moulding processing technology field specifically is an injection mold that cooling effect is good.
Background
Injection molding is a method for producing and molding industrial products, and the products generally adopt rubber injection molding and plastic injection molding, and the injection molding can also be divided into injection molding and die casting methods.
In the injection molding process, the injection mold can be used for molding, the cooling effect of the existing injection mold is poor, the raw material molding speed is slow, the temperature measurement refrigeration function is not provided, the requirement of a user can not be met, and the practicability of the injection mold is reduced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an injection mold that cooling effect is good possesses the good advantage of cooling effect, and it is relatively poor to have solved current injection mold cooling effect, and raw materials shaping speed is slower, and does not have the refrigerated function of temperature measurement, can't satisfy the user demand, has reduced the problem of injection mold practicality.
In order to achieve the above object, the utility model provides a following technical scheme: an injection mold with good cooling effect comprises a lower mold, a water storage tank and an upper mold, wherein a mold groove is formed in the center of the top of the lower mold, a water pump is fixedly connected to the center of the right side of the lower mold, the water inlet end of the water pump is communicated with a water guide pipe, one side, away from the water pump, of the water guide pipe is communicated with the bottom of the left side of an inner cavity of the water storage tank, the water outlet end of the water pump is communicated with a lower annular pipe, one side, away from the water pump, of the lower annular pipe penetrates through the lower mold and is communicated with a vertical telescopic hose, the top of the vertical telescopic hose is communicated with an upper annular pipe, one side, away from the vertical telescopic hose, of the upper annular pipe penetrates through the upper mold and is communicated with a transverse telescopic hose, the right side of the transverse telescopic hose is communicated with a return pipe, one side, away from the transverse telescopic hose, of the return pipe is communicated with the top of the left side of the inner cavity of the water storage tank, and the top of the right side of the water storage tank is fixedly connected with a controller, the bottom fixedly connected with temperature sensor on water storage box inner chamber right side, the bottom of water storage box inner chamber is inlayed and is installed the semiconductor refrigeration piece, the surface of bed die and last mould is all inlayed and is installed the heat conduction piece, and one side fixedly connected with heat collection plate that vertical two heat conduction pieces are opposite, the surface of heat collection plate is connected with the fixed surface of lower ring venturi tube and last ring venturi tube respectively, the positive surface and the back surface of water storage box are all inlayed and are installed main radiating fin.
Preferably, the four corners of the bottom of the upper die are fixedly connected with positioning rods, and the top of the lower die is provided with positioning grooves matched with the positioning rods for use.
Preferably, the surfaces of the water conduit, the return conduit, the upper annular pipe and the lower annular pipe are fixedly sleeved with a plurality of radiating rings.
Preferably, the top on the right side of the inner cavity of the water storage tank is communicated with a water injection pipe, and the bottom on the right side of the inner cavity of the water storage tank is communicated with a water drainage valve pipe.
Preferably, the temperature sensor is electrically connected with the controller in a bidirectional mode, and the input ends of the water pump and the semiconductor refrigerating sheet are electrically connected with the output end of the controller.
Preferably, the bottom of the heat dissipation end of the semiconductor refrigeration piece penetrates through the water storage tank and is in contact with the placement surface, and the four corners of the bottom of the water storage tank are fixedly connected with anti-skidding support seats.
Compared with the prior art, the beneficial effects of the utility model are as follows:
1. the utility model discloses a set up heat conduction piece, thermal-arrest board, water pump, leading water pipe, semiconductor refrigeration piece, water storage box, main radiating fin, controller, back flow, horizontal expansion hose, go up the annular tube, the lower annular tube, temperature sensor and vertical expansion hose cooperation use, have the advantage that the cooling effect is good, it is relatively poor to have solved current injection mold cooling effect, raw materials shaping speed is slower, and does not have the refrigerated function of temperature measurement, can't satisfy the user demand, has reduced the problem of injection mold practicality.
2. The utility model discloses a set up the cooperation of heat conduction piece and heat collection plate and use, can conduct the heat fast, be convenient for follow-up cold and hot exchange that carries on, through setting up horizontal expansion hose and vertical expansion hose, can stretch or shorten the certain distance, thereby keep down the ring pipe and go up the ring pipe, go up the ring pipe and be in the intercommunication state with the back flow all the time, through setting up temperature sensor, can the temperature in the real-time detection water storage box, through setting up the cooling ring, can play supplementary radiating effect, with partial heat effluvium at rivers flow in-process.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic sectional view of the structure of the water storage tank of the present invention;
fig. 3 is a schematic bottom view of the lower ring-shaped pipe structure of the present invention.
In the figure: the device comprises a lower die 1, a die cavity 2, a heat conducting block 3, a heat collecting plate 4, a water pump 5, a water conduit 6, a semiconductor refrigerating sheet 7, a water storage tank 8, a main radiating sheet 9, a controller 10, a water injection pipe 11, a return pipe 12, a transverse telescopic hose 13, an upper die 14, an upper annular pipe 15, a positioning rod 16, a radiating ring 17, a positioning groove 18, a lower annular pipe 19, a temperature sensor 20, a drainage valve pipe 21 and a vertical telescopic hose 22.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-3, an injection mold with good cooling effect comprises a lower mold 1, a water storage tank 8 and an upper mold 14, positioning rods 16 are fixedly connected to four corners of the bottom of the upper mold 14, a positioning groove 18 matched with the positioning rods 16 is formed in the top of the lower mold 1, a mold cavity 2 is formed in the center of the top of the lower mold 1, a water pump 5 is fixedly connected to the center of the right side of the lower mold 1, a water inlet end of the water pump 5 is communicated with a water conduit 6, one side of the water conduit 6, away from the water pump 5, is communicated with the bottom of the left side of an inner cavity of the water storage tank 8, a water outlet end of the water pump 5 is communicated with a lower annular tube 19, one side of the lower annular tube 19, away from the water pump 5, penetrates through the lower mold 1 and is communicated with a vertical flexible tube 22, the top of the vertical flexible tube 22 is communicated with an upper annular tube 15, one side of the upper annular tube 15, away from the vertical flexible tube 22, penetrates through the upper mold 14 and is communicated with a transverse flexible tube 13, the right side of the transverse flexible hose 13 is communicated with a return pipe 12, one side of the return pipe 12, which is far away from the transverse flexible hose 13, is communicated with the top of the left side of the inner cavity of the water storage tank 8, a certain distance can be stretched or shortened by arranging the transverse flexible hose 13 and the vertical flexible hose 22, so that the lower annular pipe 19 and the upper annular pipe 15 and the return pipe 12 are always kept in a communicated state, the top of the right side of the water storage tank 8 is fixedly connected with a controller 10, the bottom of the right side of the inner cavity of the water storage tank 8 is fixedly connected with a temperature sensor 20, the water temperature in the water storage tank 8 can be detected in real time by arranging the temperature sensor 20, a semiconductor refrigerating sheet 7 is embedded and installed at the bottom of the inner cavity of the water storage tank 8, the bottom of the heat dissipation end of the semiconductor refrigerating sheet 7 penetrates through the water storage tank 8 and is contacted with a placing surface, the temperature sensor 20 is bidirectionally and electrically connected with the controller 10, the input ends of the water pump 5 and the semiconductor refrigerating sheet 7 are electrically connected with the output end of the controller 10, the heat-conducting blocks 3 are embedded and installed on the surfaces of the lower die 1 and the upper die 14, the heat-collecting plate 4 is fixedly connected to one side of each of the two vertical heat-conducting blocks 3, the surface of the heat-collecting plate 4 is fixedly connected with the surfaces of the lower annular tube 19 and the upper annular tube 15 respectively, heat can be quickly conducted by matching the heat-conducting blocks 3 and the heat-collecting plate 4, subsequent heat exchange is facilitated, the main radiating fins 9 are embedded and installed on the front surface and the back surface of the water storage box 8, the water guide tube 6, the return tube 12, the surfaces of the upper annular tube 15 and the lower annular tube 19 are fixedly sleeved with the radiating rings 17, the number of the radiating rings 17 is a plurality, the auxiliary radiating effect can be achieved by arranging the radiating rings 17, partial heat can be radiated in the water flowing process, the water injection tube 11 is communicated with the top on the right side of the inner cavity of the water storage box 8, and the bottom on the right side of the inner cavity of the water storage box 8 is communicated with the drainage valve tube 21, the equal fixedly connected with antiskid support in four corners of 8 bottoms on water storage box, through setting up heat conduction piece 3, thermal-arrest board 4, water pump 5, leading water pipe 6, semiconductor refrigeration piece 7, water storage box 8, main radiating fin 9, controller 10, back flow 12, horizontal flexible hose 13, go up the annular tube 15, lower annular tube 19, temperature sensor 20 and the cooperation of vertical flexible hose 22 are used, the advantage that the cooling effect is good has, it is relatively poor to have solved current injection mold cooling effect, raw materials shaping speed is slower, and do not have the refrigerated function of temperature measurement, can't satisfy the user demand, the problem of injection mold practicality has been reduced.
When the heat dissipation device is used, the temperature sensor 20 is set to sense the temperature, the water pump 5 is controlled to work, water in the water storage tank 8 sequentially passes through the water conduit 6, the water pump 5, the lower annular pipe 19, the vertical flexible pipe 22, the upper annular pipe 15, the transverse flexible pipe 13 and the return pipe 12 to circularly flow, wherein the upper annular pipe 15 and the lower annular pipe 19 can exchange heat conducted by the heat collection plate 4, so that heat on the lower die 1 and the upper die 14 is taken away, the heat dissipation ring 17 plays a role in auxiliary heat dissipation, the main heat dissipation sheet 9 can conduct the water temperature in the water storage tank 8 to the outside to dissipate, after long-time work, when the water temperature in the water storage tank 8 reaches a preset temperature value, the temperature sensor 20 sends a signal to the controller 10, the controller 10 automatically controls the semiconductor refrigeration sheet 7 to work, the water in the water storage tank 8 is cooled, and the bottom of the heat dissipation end of the semiconductor refrigeration sheet 7 is in contact with a placing surface, the heat on the semiconductor refrigeration sheet 7 can be conducted and dissipated, and the practicability is higher.
All kinds of parts used in this application file are standard parts, can purchase from the market, and the concrete connected mode of each part all adopts conventional means such as ripe bolt, rivet and welding among the prior art, and machinery, part and electrical equipment all adopt conventional model among the prior art, and circuit connection adopts conventional connected mode among the prior art, and electrical equipment all communicates with external safe power supply, does not make specific statement here again.
In summary, the following steps: this injection mold that cooling effect is good, through setting up heat conduction piece 3, thermal-arrest board 4, water pump 5, leading water pipe 6, semiconductor refrigeration piece 7, water storage box 8, main radiating fin 9, controller 10, back flow 12, horizontal expansion hose 13, go up annular tube 15, lower annular tube 19, temperature sensor 20 and the cooperation of vertical expansion hose 22 are used, the advantage that cooling effect is good has, it is relatively poor to have solved current injection mold cooling effect, raw materials shaping speed is slower, and do not have the refrigerated function of temperature measurement, can't satisfy the user's demand, the problem of injection mold practicality has been reduced.
In the description of the present invention, it should be understood that the indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the indicated device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present invention.
In the present invention, unless otherwise explicitly specified or limited, for example, it may be fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023143232.2U CN214266545U (en) | 2020-12-24 | 2020-12-24 | An injection mold with good cooling effect |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202023143232.2U CN214266545U (en) | 2020-12-24 | 2020-12-24 | An injection mold with good cooling effect |
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| Publication Number | Publication Date |
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| CN214266545U true CN214266545U (en) | 2021-09-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202023143232.2U Expired - Fee Related CN214266545U (en) | 2020-12-24 | 2020-12-24 | An injection mold with good cooling effect |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120901477A (en) * | 2025-10-09 | 2025-11-07 | 南通昕东燃机电科技有限公司 | Cooling device for semiconductor processing |
-
2020
- 2020-12-24 CN CN202023143232.2U patent/CN214266545U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120901477A (en) * | 2025-10-09 | 2025-11-07 | 南通昕东燃机电科技有限公司 | Cooling device for semiconductor processing |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210924 |
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| CF01 | Termination of patent right due to non-payment of annual fee |