CN220652003U - Integrated circuit packaging shell - Google Patents

Abstract

The utility model discloses an integrated circuit packaging shell which comprises a shell body, wherein a plurality of radiating fins are fixedly arranged at the top in the shell body, a buffer frame is fixedly arranged at the outer side of the shell body, a plurality of radiating holes are formed in the side wall of the buffer frame, first ventilation holes are respectively formed in two sides of the lower end of the shell body, second ventilation holes are respectively formed in two sides of the lower end of the buffer frame and are communicated with the first ventilation holes, a mounting plate is arranged below the shell body, a buffer sleeve is fixedly arranged at the top of the mounting plate, the top of the buffer sleeve is fixedly connected with the shell body, positioning blocks are respectively fixedly arranged at four corners of the mounting plate, positioning screws are arranged at the top of the positioning blocks, and the positioning blocks are fixed by screwing the positioning screws.

Description

Integrated circuit packaging shell

Technical Field

The utility model relates to the technical field of integrated circuits, in particular to an integrated circuit packaging shell.

Background

An integrated circuit is a type of microelectronic device or component. The components of transistors, resistors, capacitors, inductors and the like required in a circuit and wiring are interconnected together by adopting a certain process, are manufactured on a small or a few small semiconductor wafers or dielectric substrates and then are packaged in a tube shell to form a microstructure with the required circuit function, wherein all the components structurally form a whole, so that the electronic component has a great step toward microminiaturization, low power consumption, intellectualization and high reliability. It is indicated in the circuit by the letter "IC".

The existing integrated circuit packaging shell is poor in installation buffer effect, so that the utility model provides the integrated circuit packaging shell to solve the problems.

Disclosure of Invention

In view of the foregoing drawbacks of the prior art, an object of the present utility model is to provide an integrated circuit package.

In order to achieve the above purpose, the utility model provides an integrated circuit packaging shell, which comprises a shell, wherein a plurality of radiating fins are fixedly arranged at the inner top of the shell, a buffer frame is fixedly arranged at the outer side of the shell, a plurality of radiating holes are formed in the side wall of the buffer frame, first ventilation holes are respectively formed in two sides of the lower end of the shell, second ventilation holes are respectively formed in two sides of the lower end of the buffer frame, the second ventilation holes are communicated with the first ventilation holes, a mounting plate is arranged below the shell, a buffer sleeve is fixedly arranged at the top of the mounting plate, and the top of the buffer sleeve is fixedly connected with the shell.

Further, positioning blocks are fixedly arranged at four corners of the mounting plate respectively, positioning screws are arranged at the tops of the positioning blocks, and the positioning blocks are fixed by screwing the positioning screws.

Further, a plurality of buffer mechanisms are arranged in the buffer sleeve, the buffer mechanisms are fixedly arranged at the top of the mounting plate, and the tops of the buffer mechanisms are fixedly connected with the shell.

Further, the buffer mechanism comprises a telescopic column, the telescopic column is fixedly arranged between the mounting plate and the shell, and a buffer spring is sleeved on the telescopic column.

Further, the side wall of the shell is fixedly provided with pins, and the pins penetrate through the buffer frame and extend outwards.

Further, the top of the buffer sleeve is detachably mounted with the shell, and the bottom of the buffer sleeve is detachably mounted with the mounting plate.

Further, a sealing ring is sleeved on the positioning screw, the sealing ring is arranged above the positioning block, and the thickness of the sealing ring is 2-3cm.

Further, the buffer sleeve is made of rubber materials, four rows of buffer springs are arranged, and fourteen buffer springs are arranged in each row.

Compared with the prior art, the utility model has the beneficial effects that:

through the structures of the radiating fin, the first vent hole, the second vent hole, the radiating hole and the like, the heat inside the shell can be radiated under the action of the radiating fin, and the heat can also be discharged from the first vent hole, the second vent hole and the radiating hole, so that the radiating performance of the integrated circuit packaging shell is improved;

through the buffer frame, the buffer sleeve, the telescopic column and the buffer spring and other structures that set up, the buffer frame can be to the outer wall self buffer protection of encapsulation shell, when encapsulation shell received the striking, under buffer sleeve, telescopic column and buffer spring's effect, can wholly play buffer protection's effect to the encapsulation shell, solved the poor problem of current integrated circuit encapsulation shell installation buffer effect.

Drawings

In order to more clearly illustrate the solution of the present utility model, a brief description will be given below of the drawings required for the description of the embodiments of the present utility model, it being apparent that the drawings in the following description are some embodiments of the present utility model, and that other drawings may be obtained from these drawings without the exercise of inventive effort for a person of ordinary skill in the art.

FIG. 1 is a front view of the present utility model;

FIG. 2 is a cross-sectional view provided by the present utility model;

FIG. 3 is a top view provided by the present utility model;

fig. 4 is a schematic structural diagram of a buffering mechanism provided by the utility model.

Reference numerals illustrate:

1. a buffer frame; 2. a housing; 3. a second vent hole; 4. a first vent; 5. a heat radiation hole; 6. a set screw; 7. a positioning block; 8. a mounting plate; 9. a heat sink; 10. a buffer mechanism; 101. a buffer spring; 102. a telescopic column; 11. pins; 12. and a buffer sleeve.

Detailed Description

The preferred embodiments of the present utility model will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present utility model can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present utility model. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.

The terms "comprising" and "having" and any variations thereof in the description of the utility model and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.

Referring to fig. 1-4, an integrated circuit package shell comprises a shell 2, a plurality of cooling fins 9 are fixedly arranged at the top in the shell 2, a buffer frame 1 is fixedly arranged at the outer side of the shell 2, a plurality of cooling holes 5 are formed in the side wall of the buffer frame 1, first ventilation holes 4 are respectively formed in two sides of the lower end of the shell 2, second ventilation holes 3 are respectively formed in two sides of the lower end of the buffer frame 1, the second ventilation holes 3 are communicated with the first ventilation holes 4, a mounting plate 8 is arranged below the shell 2, a buffer sleeve 12 is fixedly arranged at the top of the mounting plate 8, the top of the buffer sleeve 12 is fixedly connected with the shell 2, a plurality of buffer mechanisms 10 are arranged in the buffer sleeve 12, the buffer mechanisms 10 are fixedly arranged at the top of the mounting plate 8, the buffer mechanisms 10 are fixedly connected with the shell 2, the buffer mechanisms 102 comprise telescopic columns 102, the telescopic columns 102 are fixedly arranged between the mounting plate 8 and the shell 2, buffer springs 101 are sleeved on the telescopic columns 102, pins 11 are fixedly arranged on the side wall of the shell 2, penetrate through the buffer frame 1 and extend outwards, the tops of the buffer sleeve 12 are detachably mounted with the first ventilation holes 4, the mounting plate 8 are detachably arranged, the bottom of the buffer sleeve 12 is fixedly arranged on the mounting plate 8, a sealing ring 6 is detachably mounted on the mounting plate 6, the sealing ring is arranged above the positioning block 7, the thickness of the sealing ring is 2-3cm, the buffer sleeve 12 is made of rubber material, four rows of buffer springs 101 are arranged, each row of buffer springs 101 is provided with fourteen, by the structures of the radiating fin 9, the first ventilation hole 4, the second ventilation hole 3, the radiating hole 5 and the like, under the action of the radiating fins 9, the interior of the shell 2 can be radiated, and heat can also be discharged from the first vent hole 4, the second vent hole 3 and the radiating holes 5, so that the radiating performance of the integrated circuit packaging shell is improved; through the structures such as the buffer frame 1, the buffer sleeve 12, the telescopic column 102 and the buffer spring 101, the buffer frame 1 can buffer and protect the outer wall of the packaging shell, when the packaging shell is impacted, the buffer protection effect can be integrally achieved on the packaging shell under the action of the buffer sleeve 12, the telescopic column 102 and the buffer spring 101, and the problem that the installation buffer effect of the traditional integrated circuit packaging shell is poor is solved;

referring to fig. 2, positioning blocks 7 are fixedly arranged at four corners of a mounting plate 8 respectively, positioning screws 6 are arranged at the tops of the positioning blocks 7, the positioning blocks 7 are fixed by screwing the positioning screws 6 through the arranged positioning blocks 7 and the positioning screws 6, and the mounting plate 8 is convenient to mount and dismount.

The working principle and the using method of the utility model are as follows:

during the use, under the effect of fin 9, can dispel the heat to casing 2 inside, the heat also can be gone out from first ventilation hole 4, second ventilation hole 3 and louvre 5, improved integrated circuit package shell's heat dispersion, buffer frame 1 can be to package shell's outer wall self buffering protection, when package shell received the striking, under buffer cover 12, telescopic column 102 and buffer spring 101's effect, can play buffering protection's effect to the whole casing, locating piece 7 is fixed through screwing set screw 6, mounting panel 8 installation dismantles conveniently.

The foregoing is merely illustrative of the present utility model and is not to be construed as limiting thereof; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced with equivalents; all equivalent structures or equivalent flow changes made by the specification and the attached drawings of the utility model or directly or indirectly applied to other related technical fields are included in the protection scope of the utility model.

Claims (8)

1. An integrated circuit package housing, characterized by: including casing (2), the fixed a plurality of fin (9) that are provided with in casing (2), casing (2) outside is fixed to be provided with buffer frame (1), a plurality of louvre (5) have been seted up to buffer frame (1) lateral wall, first ventilation hole (4) have been seted up respectively to casing (2) lower extreme both sides, second ventilation hole (3) have been seted up respectively to buffer frame (1) lower extreme both sides, second ventilation hole (3) with first ventilation hole (4) communicate with each other, the below of casing (2) is provided with mounting panel (8), the fixed buffer jacket (12) that is provided with in mounting panel (8) top, buffer jacket (12) top with casing (2) fixed connection.

2. An integrated circuit package as recited in claim 1, wherein: the four corners of the mounting plate (8) are respectively fixedly provided with a positioning block (7), the top of the positioning block (7) is provided with a positioning screw (6), and the positioning block (7) is fixed by screwing the positioning screw (6).

3. An integrated circuit package as recited in claim 2, wherein: a plurality of buffer mechanisms (10) are arranged in the buffer sleeve (12), the buffer mechanisms (10) are fixedly arranged at the top of the mounting plate (8), and the tops of the buffer mechanisms (10) are fixedly connected with the shell (2).

4. An integrated circuit package as recited in claim 3, wherein: the buffer mechanism (10) comprises a telescopic column (102), the telescopic column (102) is fixedly arranged between the mounting plate (8) and the shell (2), and the telescopic column (102) is sleeved with a buffer spring (101).

5. The integrated circuit package as recited in claim 4, wherein: the side wall of the shell (2) is fixedly provided with pins (11), and the pins (11) penetrate through the buffer frame (1) and extend outwards.

6. The integrated circuit package as recited in claim 5, wherein: the top of the buffer sleeve (12) is detachably mounted with the shell (2), and the bottom of the buffer sleeve (12) is detachably mounted with the mounting plate (8).

7. The integrated circuit package as recited in claim 6, wherein: the positioning screw (6) is sleeved with a sealing ring, the sealing ring is arranged above the positioning block (7), and the thickness of the sealing ring is 2-3cm.

8. The integrated circuit package as recited in claim 7, wherein: the buffer sleeve (12) is made of rubber materials, four rows of buffer springs (101) are arranged, and fourteen buffer springs (101) are arranged in each row.