CN112969350A - Heat dissipation device for SVG equipment box - Google Patents

Heat dissipation device for SVG equipment box Download PDF

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Publication number
CN112969350A
CN112969350A CN202110220035.6A CN202110220035A CN112969350A CN 112969350 A CN112969350 A CN 112969350A CN 202110220035 A CN202110220035 A CN 202110220035A CN 112969350 A CN112969350 A CN 112969350A
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CN
China
Prior art keywords
box
heat dissipation
svg equipment
screw connection
radiator fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110220035.6A
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Chinese (zh)
Inventor
李稳良
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Feilai Electric Shanghai Co ltd
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Feilai Electric Shanghai Co ltd
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Publication date
Application filed by Feilai Electric Shanghai Co ltd filed Critical Feilai Electric Shanghai Co ltd
Priority to CN202110220035.6A priority Critical patent/CN112969350A/en
Publication of CN112969350A publication Critical patent/CN112969350A/en
Pending legal-status Critical Current

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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20281Thermal management, e.g. liquid flow control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0213Venting apertures; Constructional details thereof
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/0217Mechanical details of casings
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • H05K5/03Covers
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20209Thermal management, e.g. fan control
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20263Heat dissipaters releasing heat from coolant
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

The invention discloses a heat dissipation device for an SVG (static var generator) equipment box, relates to the technical field of SVG equipment boxes, and aims to solve the problems that convection heat dissipation is adopted for realizing, the efficiency of convection heat dissipation is reduced when the temperature difference between the inside and the outside of the SVG equipment box is small when the heat dissipation device is used in a high-temperature environment, the heat dissipation effect of the heat dissipation device is greatly reduced, the temperature in the SVG equipment box can be sharply increased when the SVG equipment box works in the environment for a long time, and the normal work of internal electric devices is influenced. The below of box is provided with the shock attenuation mount pad, and the shock attenuation mount pad passes through screw connection with the box, the inside of box is provided with the SVG equipment, and the SVG equipment passes through screw connection with the box, be provided with the radiating groove on the box, the inside of radiating groove is provided with second radiator fan, one side of radiating groove is provided with porous thermal-arrest board, porous thermal-arrest board passes through screw connection with the box, one side of second radiator fan is provided with the dust screen, the top of box is provided with the apron.

Description

Heat dissipation device for SVG equipment box
Technical Field
The invention relates to the technical field of SVG equipment boxes, in particular to a heat dissipation device for an SVG equipment box.
Background
SVG is a typical power electronic device, and is composed of three basic functional modules: the device comprises a detection module, a control operation module and a compensation output module. The working principle is that current information of an external CT detection system is used, and then current information such as PF, S, Q and the like is analyzed through a control chip; then the controller gives out a compensating driving signal, and finally an inversion loop formed by the power electronic inversion circuit gives out compensating current. Protective equipment is then installed with the SVG device to the equipment box, and heat abstractor is the heat release with SVG equipment box inside to control SVG equipment box inside temperature equipment, the indirect SVG equipment box inside electrical part normal use of having ensured.
At present, the heat abstractor that SVG equipment box used all adopts convection current heat dissipation to realize, uses under high temperature environment, and the inside and outside difference in temperature of SVG equipment box is less can reduce convection current radiating efficiency, and heat abstractor's radiating effect greatly reduced is in the temperature of work SVG equipment box inside under this environment for a long time will sharply rise, influences the normal work of inside electrical part, can not satisfy the user demand. Therefore, a heat dissipation device for an SVG equipment box is urgently needed in the market to solve the problems.
Disclosure of Invention
The invention aims to provide a heat dissipation device for an SVG equipment box, and aims to solve the problems that the heat dissipation devices in the background technology are all realized by convection heat dissipation, when the heat dissipation device is used in a high-temperature environment, the temperature difference between the inside and the outside of the SVG equipment box is small, the convection heat dissipation efficiency is reduced, the heat dissipation effect of the heat dissipation device is greatly reduced, the temperature in the SVG equipment box can be sharply increased when the heat dissipation device works in the environment for a long time, the normal work of electric devices in the SVG equipment box is influenced, and the use requirements cannot be met.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a heat abstractor for SVG equipment box, includes the box, the below of box is provided with the shock attenuation mount pad, and shock attenuation mount pad and box pass through the screw connection, the inside of box is provided with the SVG equipment, and the SVG equipment passes through the screw connection with the box, be provided with the radiating groove on the box, and radiating groove and box punching press structure as an organic whole, the inside of radiating groove is provided with second radiator fan, and second radiator fan passes through the screw connection with the box, one side of radiating groove is provided with porous thermal-arrest board, and porous thermal-arrest board setting is in the inside of box, porous thermal-arrest board passes through the screw connection with the box, one side of second radiator fan is provided with the dust screen, and the dust screen is connected with the inner wall laminating of radiating groove, the top of box is provided with the apron.
Preferably, the box body is provided with a plurality of radiating fins outside, the radiating fins are arranged outside the box body in sequence, and the radiating fins and the box body are arranged into an integral structure.
Preferably, the upper end of box is provided with first radiator fan, and first radiator fan passes through the screw connection with the box, first radiator fan's top is provided with the dust falling net frame, and the dust falling net frame passes through the screw connection with the box.
Preferably, be provided with electric telescopic handle between apron and the box, electric telescopic handle is provided with two, and two electric telescopic handle settings are in the both sides of dust falling rack, electric telescopic handle's both ends pass through the screw connection with apron and box respectively, the upper end of box is provided with the rubber pad, and the rubber pad passes through the screw connection with the box, the rubber pad is laminated with the apron mutually.
Preferably, the inside of box casing is provided with the condensation duct, and condensation duct sets up structure as an organic whole with the box, the condensation duct is cyclic annular setting in the inside of box casing, the inside of shock attenuation mount pad is provided with the water tank, and the water tank passes through screw connection with the shock attenuation mount pad, one side of box is provided with the water pump, and the water pump passes through screw connection with the shock attenuation mount pad, the one end of water pump and the one end sealing connection of condensation duct, and the other end of condensation duct extends to the inside of water tank, one side of the water pump other end is provided with the water pipe, and water pipe and water pump sealing connection, the one end of water pipe extends to the inside of water tank, the outside of water pipe is provided with the solenoid valve, and solenoid valve and water pipe.
Preferably, the semiconductor refrigerator is arranged inside the damping mounting seat and connected with the damping mounting seat through screws, the semiconductor refrigerator is arranged below the water tank, and the semiconductor refrigerator is attached to the water tank.
Preferably, the below and the top of SVG equipment are provided with first temperature sensor and second temperature sensor respectively, and first temperature sensor and second temperature sensor all pass through the screw connection with the inner wall of box, first temperature sensor is connected with semiconductor cooler, water pump and the equal electricity of solenoid valve, second temperature sensor is connected with the equal electricity of first radiator fan and electric telescopic handle.
Preferably, one side of box is provided with the chamber door, and the chamber door rotates with the box to be connected, be provided with the visual window on the chamber door, and visual window sets up structure as an organic whole with the chamber door, the top of visual window is provided with the display screen, one side of visual window is provided with the handle, and display screen and handle all pass through screw connection with the chamber door, the display screen is connected with semiconductor cooler, water pump, solenoid valve, SVG equipment, first temperature sensor, first radiator fan, second temperature sensor and the equal electricity of electric telescopic handle.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the device, through the arrangement of the first temperature sensor, the semiconductor refrigerator, the water pump and the condensation pipeline, the first temperature sensor can indirectly detect the temperature of the shell of the equipment box, the water body in the water tank can be extracted and injected into the condensation pipeline to flow and flow back to the water tank under the action of the water pump, the heat on the shell can be absorbed and transferred into the water tank to be neutralized by the water body flowing in the condensation pipeline, the shell can be quickly cooled, the semiconductor refrigerator can cool the water tank, the temperature of the water body is reduced, the heat absorption capacity of the water body is improved, and the heat dissipation effect is indirectly improved. The problem of rely on the convection current radiating effect not good under high temperature environment is solved.
2. According to the device, through the arrangement of the radiating fins, the porous heat collecting plate and the second radiating fan, the porous heat collecting plate can quickly absorb heat inside the equipment box to form a high-temperature area around the equipment box, air flow is accelerated under the action of the second radiating fan, so that the heat absorbed by the porous heat collecting plate can be guided and released more quickly, the radiating fins can generate vortex outside the equipment box, air flow movement can be accelerated under the action of the vortex, heat on the outer wall of the equipment box is carried and released, and the use and radiating requirements of the conventional equipment box are met. The problem of the inside heat release of equipment box under conventional environment untimely, the higher influence of inside temperature is used is solved.
3. According to the device, the cover plate is driven to lift under the action of the electric telescopic rod through the arrangement of the first cooling fan, the electric telescopic rod, the rubber pad and the second temperature sensor, when the cover plate rises to a certain height, air flow is accelerated under the action of the first cooling fan, so that heat on the upper layer of the equipment box can be released, the cooling effect of the equipment box is improved, the second temperature sensor can detect the temperature on the upper layer of the equipment box, and the rubber pad can play a certain protection role when the cover plate falls and is closed. The problem of the inside heat that does not in time dredge of equipment box pile up in the upper end of equipment box, lead to upper temperature too high is solved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a front view of the present invention;
FIG. 3 is a rear view of the present invention;
FIG. 4 is a cross-sectional view of the case of the present invention;
fig. 5 is a partially enlarged view of the area a of fig. 1 according to the present invention.
In the figure: 1. a box body; 2. a shock-absorbing mounting seat; 3. a water tank; 4. a semiconductor refrigerator; 5. a water pump; 6. a water pipe; 7. an electromagnetic valve; 8. an SVG device; 9. a first temperature sensor; 10. a condensing duct; 11. heat dissipation fins; 12. a cover plate; 13. a first heat dissipation fan; 14. a box door; 15. a visual window; 16. a display screen; 17. a rubber pad; 18. a handle; 19. a heat sink; 20. a second heat dissipation fan; 21. a dust screen; 22. a porous heat collecting plate; 23. a dust falling net rack; 24. a second temperature sensor; 25. an electric telescopic rod.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.
Referring to fig. 1-5, an embodiment of the present invention is shown: a heat dissipation device for an SVG equipment box comprises a box body 1, a shock absorption mounting seat 2 is arranged below the box body 1, the shock absorption mounting seat 2 is connected with the box body 1 through a screw, an SVG equipment 8 is arranged inside the box body 1, the SVG equipment 8 is connected with the box body 1 through a screw, a heat dissipation groove 19 is arranged on the box body 1, the heat dissipation groove 19 and the box body 1 are punched into an integral structure, a second heat dissipation fan 20 is arranged inside the heat dissipation groove 19, the second heat dissipation fan 20 is connected with the box body 1 through a screw, a porous heat collection plate 22 is arranged on one side of the heat dissipation groove 19, the porous heat collection plate 22 is arranged inside the box body 1, the porous heat collection plate 22 is connected with the box body 1 through a screw, the porous heat collection plate 22 can absorb heat and form a high-temperature area around the porous heat collection plate, the heat absorbed by the porous heat collection plate 22 can be quickly conducted and released under the action of the second, one side of the second heat dissipation fan 20 is provided with a dust screen 21, the dust screen 21 is attached to the inner wall of the heat dissipation groove 19, the dust screen 21 can play a role in dust prevention during ventilation and heat dissipation, and a cover plate 12 is arranged above the box body 1.
Further, the external portion of the box body 1 is provided with a plurality of heat dissipation fins 11, the heat dissipation fins 11 are sequentially arranged outside the box body 1, and the heat dissipation fins 11 and the box body 1 are arranged into an integral structure. Vortex can be formed on the outer surface of the box body 1 through the radiating fins 11, and heat on the shell of the box body 1 can be released more quickly under the action of the vortex to assist in heat dissipation.
Further, the upper end of the box body 1 is provided with a first cooling fan 13, the first cooling fan 13 is connected with the box body 1 through screws, a dust falling net rack 23 is arranged above the first cooling fan 13, and the dust falling net rack 23 is connected with the box body 1 through screws. The heat release with the 1 upper strata of box that can be quick is gone out through first radiator fan 13 to avoid 1 upper strata of box high temperature, improved the radiating effect.
Further, be provided with electric telescopic handle 25 between apron 12 and the box 1, electric telescopic handle 25 is provided with two, and two electric telescopic handle 25 sets up in the both sides of dust falling rack 23, and electric telescopic handle 25's both ends pass through the screw connection with apron 12 and box 1 respectively, and the upper end of box 1 is provided with rubber pad 17, and rubber pad 17 passes through the screw connection with box 1, and rubber pad 17 is laminated with apron 12 mutually. The electric telescopic rod 25 drives the cover plate 12 to lift, the cover plate 12 is lifted by a certain height so as to dredge and release heat, and the rubber pad 17 can protect the cover plate 12 when the cover plate 12 is lowered.
Further, the inside of 1 casing of box is provided with condensation duct 10, and condensation duct 10 sets up to a body structure with box 1, condensation duct 10 is cyclic annular setting in the inside of 1 casing of box, the inside of shock attenuation mount pad 2 is provided with water tank 3, and water tank 3 passes through screw connection with shock attenuation mount pad 2, one side of box 1 is provided with water pump 5, and water pump 5 passes through screw connection with shock attenuation mount pad 2, the one end of water pump 5 and the one end sealing connection of condensation duct 10, and the other end of condensation duct 10 extends to the inside of water tank 3, one side of the water pump 5 other end is provided with water pipe 6, and water pipe 6 and water pump 5 sealing connection, the one end of water pipe 6 extends to the inside of water tank 3, the outside of water pipe 6 is provided with solenoid valve 7, and solenoid valve 7 sets up to a body. The water stored in the water tank 3 can be pumped and injected into the condensation duct 10 by the water pump 5 and flows back into the water tank 3, and the water flowing in the condensation duct 10 is used to absorb heat on the housing.
Further, the inside of shock attenuation mount pad 2 is provided with semiconductor refrigerator 4, and semiconductor refrigerator 4 passes through screw connection with shock attenuation mount pad 2, and semiconductor refrigerator 4 sets up in the below of water tank 3, and semiconductor refrigerator 4 and water tank 3 laminate mutually. The water tank 3 can be cooled through the semiconductor refrigerator 4, and the temperature of the water body is reduced, so that the heat absorption capacity of the water body is improved, and the heat dissipation effect is indirectly improved.
Further, the below and the top of SVG equipment 8 are provided with first temperature sensor 9 and second temperature sensor 24 respectively, and first temperature sensor 9 and second temperature sensor 24 all pass through the screw connection with the inner wall of box 1, and first temperature sensor 9 all is connected with semiconductor cooler 4, water pump 5 and solenoid valve 7 are all electrically connected, and second temperature sensor 24 is connected with first radiator fan 13 and electric telescopic handle 25 is all electrically connected. The temperature of the upper layer of the box body 1 and the temperature of the shell can be detected through the first temperature sensor 9 and the second temperature sensor 24, so that corresponding heat dissipation equipment is started spontaneously to copy and dissipate heat, and quick heat dissipation is achieved.
Further, one side of box 1 is provided with chamber door 14, and chamber door 14 rotates with box 1 to be connected, be provided with visual window 15 on the chamber door 14, and visual window 15 sets up structure as an organic whole with chamber door 14, the top of visual window 15 is provided with display screen 16, one side of visual window 15 is provided with handle 18, and display screen 16 and handle 18 all pass through screw connection with chamber door 14, display screen 16 and semiconductor cooler 4, water pump 5, solenoid valve 7, SVG equipment 8, first temperature sensor 9, first radiator fan 13, second radiator fan 20, second temperature sensor 24 and the equal electricity of electric telescopic handle 25 are connected. The condition inside the box body 1 can be observed from the outside through the visual window 15, and the display screen 16 can display the working data of all electric devices, so that the working personnel can conveniently and correspondingly regulate and control the operation.
The working principle is as follows: when the heat dissipation device is used, the porous heat collection plate 22 can absorb heat inside the box body 1 and form a high-temperature region around the heat collection plate under the conventional environment, the air flow is accelerated under the action of the second cooling fan 20, the heat absorbed by the porous heat collection plate 22 can be quickly conducted and released, the cooling fins 11 can form a vortex on the outer surface of the box body 1, the heat on the box body 1 can be quickly transferred and released under the action of the vortex, and the heat dissipation requirement at normal temperature is met. When the temperature that second temperature sensor 24 detected was too high, spontaneous drive electric telescopic handle 25 rose apron 12 to certain height, opened first radiator fan 13, can be faster release away the accumulational heat in box 1 upper strata under first radiator fan 13's effect to control box 1 upper strata temperature, improved the radiating effect. When the temperature of first temperature sensor 9 detection box 1 casing is too high, open solenoid valve 7 and open water pump 5, can pour into condensing tube 10 into with the water extraction of storage in water tank 3 under water pump 5's effect and flow back to in water tank 3, utilize the heat absorption neutralization on the water with the casing that flows, thereby the temperature of quick reduction casing, play radiating effect, semiconductor cooler 4 carries out cooling treatment to water tank 3, the temperature of greatly reduced water, increase the difference in temperature between water and the casing, the heat absorption capacity of water has been improved, the indirect radiating effect that has improved.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims (8)

1. The utility model provides a heat abstractor for SVG equipment box, includes box (1), its characterized in that: the utility model discloses a solar water heater, including box (1), the below of box (1) is provided with shock attenuation mount pad (2), and shock attenuation mount pad (2) and box (1) pass through screw connection, the inside of box (1) is provided with SVG equipment (8), and SVG equipment (8) pass through screw connection with box (1), be provided with radiating groove (19) on box (1), and radiating groove (19) and box (1) punching press integrated into one piece structure, the inside of radiating groove (19) is provided with second radiator fan (20), and second radiator fan (20) passes through screw connection with box (1), one side of radiating groove (19) is provided with porous thermal-arrest board (22), and porous thermal-arrest board (22) set up the inside at box (1), porous thermal-arrest board (22) pass through screw connection with box (1), one side of second radiator fan (20) is provided with dust screen (21), and the dustproof net (21) is attached to the inner wall of the heat dissipation groove (19), and a cover plate (12) is arranged above the box body (1).
2. The heat dissipating device for an SVG equipment box according to claim 1, wherein: the heat dissipation device is characterized in that a plurality of heat dissipation fins (11) are arranged outside the box body (1), the heat dissipation fins (11) are sequentially arranged outside the box body (1), and the heat dissipation fins (11) and the box body (1) are arranged into an integral structure.
3. The heat dissipating device for an SVG equipment box according to claim 1, wherein: the upper end of box (1) is provided with first radiator fan (13), and first radiator fan (13) pass through screw connection with box (1), the top of first radiator fan (13) is provided with dust falling net rack (23), and dust falling net rack (23) pass through screw connection with box (1).
4. The heat dissipating device for an SVG equipment box according to claim 1, wherein: be provided with electric telescopic handle (25) between apron (12) and box (1), electric telescopic handle (25) are provided with two, and two electric telescopic handle (25) set up the both sides at dust falling rack (23), the both ends of electric telescopic handle (25) pass through the screw connection with apron (12) and box (1) respectively, the upper end of box (1) is provided with rubber pad (17), and rubber pad (17) pass through the screw connection with box (1), rubber pad (17) and apron (12) laminate mutually.
5. The heat dissipating device for an SVG equipment box according to claim 1, wherein: the water tank is characterized in that a condensation pipeline (10) is arranged in a shell of the tank body (1), the condensation pipeline (10) and the tank body (1) are arranged into a whole, the condensation pipeline (10) is arranged in the shell of the tank body (1) in an annular mode, a water tank (3) is arranged in the shock absorption mounting seat (2), the water tank (3) is connected with the shock absorption mounting seat (2) through screws, a water pump (5) is arranged on one side of the tank body (1), the water pump (5) is connected with the shock absorption mounting seat (2) through screws, one end of the water pump (5) is hermetically connected with one end of the condensation pipeline (10), the other end of the condensation pipeline (10) extends into the water tank (3), a water pipe (6) is arranged on one side of the other end of the water pump (5), the water pipe (6) is hermetically connected with the water pump (5), and one end of the water pipe (6) extends into the water tank (, the electromagnetic valve (7) is arranged outside the water pipe (6), and the electromagnetic valve (7) and the water pipe (6) are arranged into an integral structure.
6. The heat dissipating device for an SVG equipment box according to claim 1, wherein: the semiconductor refrigerator is characterized in that a semiconductor refrigerator (4) is arranged inside the damping mounting seat (2), the semiconductor refrigerator (4) is connected with the damping mounting seat (2) through screws, the semiconductor refrigerator (4) is arranged below the water tank (3), and the semiconductor refrigerator (4) is attached to the water tank (3).
7. The heat dissipating device for an SVG equipment box according to claim 1, wherein: the below and the top of SVG equipment (8) are provided with first temperature sensor (9) and second temperature sensor (24) respectively, and first temperature sensor (9) and second temperature sensor (24) all pass through the screw connection with the inner wall of box (1), first temperature sensor (9) are connected with semiconductor cooler (4), water pump (5) and solenoid valve (7) are equal electrically, second temperature sensor (24) are connected with first radiator fan (13) and electric telescopic handle (25) are equal electrically.
8. The heat dissipating device for an SVG equipment box according to claim 1, wherein: one side of box (1) is provided with chamber door (14), and chamber door (14) rotates with box (1) and is connected, be provided with visual window (15) on chamber door (14), and visual window (15) set up structure as an organic whole with chamber door (14), the top of visual window (15) is provided with display screen (16), one side of visual window (15) is provided with handle (18), and display screen (16) and handle (18) all pass through the screw connection with chamber door (14), display screen (16) and semiconductor refrigerator (4), water pump (5), solenoid valve (7), SVG equipment (8), first temperature sensor (9), first radiator fan (13), second radiator fan (20), second temperature sensor (24) and the equal electricity of electric telescopic handle (25) are connected.
CN202110220035.6A 2021-02-27 2021-02-27 Heat dissipation device for SVG equipment box Pending CN112969350A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110220035.6A CN112969350A (en) 2021-02-27 2021-02-27 Heat dissipation device for SVG equipment box

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110220035.6A CN112969350A (en) 2021-02-27 2021-02-27 Heat dissipation device for SVG equipment box

Publications (1)

Publication Number Publication Date
CN112969350A true CN112969350A (en) 2021-06-15

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Application Number Title Priority Date Filing Date
CN202110220035.6A Pending CN112969350A (en) 2021-02-27 2021-02-27 Heat dissipation device for SVG equipment box

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CN (1) CN112969350A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113623762A (en) * 2021-08-05 2021-11-09 合肥创科电子工程科技有限责任公司 Air conditioner outdoor unit with automatic temperature control function and temperature control method thereof

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CN211982425U (en) * 2020-06-16 2020-11-20 安徽恒能信息科技有限公司 Power equipment monitor with stable installation
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CN205142756U (en) * 2015-10-20 2016-04-06 安徽正飞机电设备有限公司 Heat dissipation device of electromechanical equipment
CN205902296U (en) * 2016-06-29 2017-01-18 余谦 Heat abstractor for electronic equipment
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Application publication date: 20210615