CN220635487U

CN220635487U - Even glue silicon chip cleaning device

Info

Publication number: CN220635487U
Application number: CN202322045102.2U
Authority: CN
Inventors: 常唯淑; 贾斌; 豆秀丽; 王奇
Original assignee: Minseoa Beijing Advanced Materials Development Co Ltd
Current assignee: Minseoa Beijing Advanced Materials Development Co Ltd
Priority date: 2023-08-01
Filing date: 2023-08-01
Publication date: 2024-03-22
Anticipated expiration: 2033-08-01

Abstract

The utility model discloses a spin-coating silicon wafer cleaning device, which comprises a silicon wafer loading device, an ultrasonic cleaning device and a flushing device, wherein the silicon wafer loading device comprises a silicon wafer support, a loading position is arranged on the silicon wafer support, a plurality of loading grooves are arranged on the side wall of the loading position, a rolling support is arranged on the silicon wafer support, the rolling support is connected to the silicon wafer support through a rotating rod, the rolling support rotates to be abutted against the upper end and the lower end of a silicon wafer on the silicon wafer loading device, the ultrasonic cleaning device and the flushing device are suitable for accommodating the silicon wafer loading device, a first driving piece and a second driving piece which are arranged corresponding to the two ends of the rolling support are respectively arranged in the ultrasonic cleaning device and the flushing device, and when the silicon wafer loading device is arranged in the ultrasonic cleaning device or the flushing device, the first driving piece or the second driving piece is suitable for driving the rolling support to rotate. Compared with the prior art, the semi-automatic cleaning device can realize semi-automatic cleaning of the silicon wafer, can effectively save labor cost, can effectively control the cleaning degree of the silicon wafer and reduce the damage quantity of the silicon wafer in the cleaning process.

Description

Even glue silicon chip cleaning device

Technical Field

The utility model relates to the technical field of silicon wafer cleaning, in particular to a spin-on silicon wafer cleaning device.

Background

The polymer material is one of the most rapidly developed industries in the world, and is widely applied to various fields of electronic information, biological medicine, aerospace, automobile industry, packaging, construction and the like. Photoresists play a significant role in the integrated circuit field. In the development process of photoresist, the photoresist homogenizing process is indispensable, and the silicon wafer as a substrate naturally plays a great role. As is well known, silicon wafers are costly to manufacture, so recycling of the silicon wafers is of great importance. After spin coating, the glue solution with higher viscosity remains on the silicon wafer. Therefore, cleaning the silicon wafer is an important process for recycling the silicon wafer.

At present, silicon wafer cleaning is mainly performed in a manual cleaning mode, but the cleaning degree of the silicon wafer is difficult to control during manual cleaning, and the silicon wafer is easy to damage during cleaning.

Disclosure of Invention

The utility model aims at: aiming at the defects in the prior art, the even glue silicon wafer cleaning device is provided, can realize semi-automatic cleaning of silicon wafers, can effectively save labor cost, and can effectively control the cleaning degree of the silicon wafers and reduce the damage quantity of the silicon wafers in the cleaning process.

In order to achieve the above purpose, the present utility model adopts the following technical scheme:

a spin-on silicon wafer cleaning device comprises:

the silicon wafer loading device comprises a silicon wafer support, wherein a loading position is arranged on the silicon wafer support, a plurality of loading grooves are formed in the side wall of the loading position, rolling supports are respectively arranged at the top end and the bottom end of the silicon wafer support, the rolling supports are connected to the silicon wafer support through rotating rods, and the rolling supports can rotate to be abutted against the upper end and the lower end of a silicon wafer on the silicon wafer loading device;

the ultrasonic cleaning device is suitable for accommodating the silicon wafer loading device, a first driving piece which is arranged corresponding to the two ends of the rolling support is arranged in the ultrasonic cleaning device, and the first driving piece is suitable for driving the rolling support to rotate when the silicon wafer loading device is arranged in the ultrasonic cleaning device;

the washing device is suitable for accommodating the silicon wafer loading device, a second driving piece which is arranged corresponding to the two ends of the rolling support is arranged in the washing device, and the second driving piece is suitable for driving the rolling support to rotate when the silicon wafer loading device is arranged in the washing device.

Preferably, the top end and the bottom end of the silicon wafer support are respectively provided with two rolling supports.

Preferably, the roller support is provided with a plurality of grooves which are arranged corresponding to the loading grooves.

Preferably, the ultrasonic cleaning device comprises a cleaning box, a first clamping position for fixing the silicon wafer loading device is arranged on the bottom wall of the cleaning box, the first driving piece is arranged on the side wall of the cleaning box, and when the silicon wafer loading device is arranged in the cleaning box, the first driving piece is suitable for being in butt joint with the rolling support.

Preferably, the cleaning tank is further provided with a tank cover, and the cleaning tank is made of a hollow double-layer material resistant to solvents.

Preferably, the purge bin is further connected with a filter assembly.

Preferably, the filter assembly comprises a washing liquid storage tank, a filter and a filtrate storage tank, wherein an inlet and an outlet of the washing liquid storage tank are respectively connected with the washing tank and the filter, a first valve is arranged between the washing liquid storage tank and the washing tank, a first delivery pump is arranged between the washing tank and the filter, an inlet and an outlet of the filtrate storage tank are respectively connected with the filter and the washing tank, a second valve is arranged between the filter and the filtrate storage tank, and a third valve and a second delivery pump are respectively arranged between the filtrate storage tank and the washing tank.

Preferably, the flushing device comprises a flushing box, a flushing assembly is arranged in the flushing box, a second clamping position for fixing the silicon wafer loading device is arranged on the bottom wall of the flushing box, a second driving piece is arranged on the side wall of the flushing box, and when the silicon wafer loading device is arranged in the flushing box, the second driving piece is suitable for being in butt joint with the rolling support.

Preferably, the flushing assembly comprises a main pipe rotatably arranged at the top end of the flushing box, a plurality of branch pipes arranged at intervals are arranged on the main pipe, and a plurality of flushing holes are formed in the branch pipes.

Preferably, the branch pipe is also provided with a cleaning brush.

Compared with the prior art, the utility model has the beneficial effects that:

(1) The utility model can realize semi-automatic cleaning of the silicon wafer and effectively save labor cost;

(2) The utility model can clean a plurality of silicon wafers at the same time, and avoid the problems of silicon wafer breakage and unclean cleaning caused by manual cleaning as much as possible, thereby further improving the cleaning efficiency of the silicon wafers;

(3) The utility model has simple structure, convenient operation and low manufacturing cost.

Drawings

In order to more clearly illustrate the embodiments of the present utility model, the drawings that are required to be used in the embodiments will be briefly described. It should be noted that in all the drawings, each element or portion is not necessarily drawn to actual scale.

FIG. 1 is a schematic diagram of the overall structure of a spin-on-silicon wafer cleaning device according to an embodiment of the present utility model;

FIG. 2 is a schematic view of the overall structure of a silicon wafer loading device of the spin-on-wafer cleaning device according to the embodiment of the present utility model;

FIG. 3 is a top view showing the overall structure of a wafer loading device of the spin-on-wafer cleaning device according to the embodiment of the present utility model;

fig. 4 is a top view of the overall structure of an ultrasonic flushing device of the spin-on silicon wafer cleaning device according to the embodiment of the utility model;

fig. 5 is a schematic diagram of the overall structure of a rinsing device of a spin-on-silicon wafer cleaning device according to an embodiment of the present utility model;

fig. 6 is a schematic diagram of silicon wafer rinsing of a spin-on-silicon wafer cleaning device according to an embodiment of the present utility model.

In the figure:

11. a silicon wafer support; 12. a loading position; 13. a loading groove; 14. a rolling support; 15. a rotating lever; 16. a groove; 21. a first driving member; 22. a cleaning box; 23. a first clamping position; 24. a filter assembly; 241. a wash tank; 242. a filter; 243. a filtrate storage tank; 244. a first valve; 245. a first transfer pump; 246. a second valve; 247. a third valve; 248. a second transfer pump; 31. a second driving member; 32. a flushing box; 33. a flushing assembly; 331. a main pipe; 332. a branch pipe; 333. a cleaning brush; 34. a waste liquid tank; 35. a liquid discharge valve; 36. and a second clamping position.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings. It will be apparent that the described embodiments are some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the azimuth or positional relationship indicated by the terms "upper", "lower", "inner", "outer", etc. are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the system or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present utility model. Moreover, the use of the terms first, second, etc. to define elements is merely for convenience in distinguishing the elements from each other, and the terms are not specifically meant to indicate or imply relative importance unless otherwise indicated.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

Because the glue solution with larger viscosity remains after the glue is evenly distributed on the silicon wafer, the silicon wafer needs to be cleaned before being reused. Currently, silicon wafer cleaning is mainly performed by a manual cleaning mode. However, the manual cleaning has high labor cost, and has the defects of difficulty in controlling the cleaning degree of the silicon wafer, easiness in damaging the silicon wafer and the like. Therefore, the utility model provides the spin-coating silicon wafer cleaning device which can realize semi-automatic cleaning of the silicon wafer, can effectively save labor cost, can effectively control the cleaning degree of the silicon wafer and reduce the damage quantity of the silicon wafer in the cleaning process.

Exemplary embodiments of the present utility model will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present utility model are shown in the drawings, it should be understood that the present utility model may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art.

As shown in fig. 1 to 6, an embodiment of the present utility model provides a spin-on silicon wafer cleaning device, including:

the silicon wafer loading device comprises a silicon wafer support 11, a loading position 12 is arranged on the silicon wafer support 11, a plurality of loading grooves 13 are formed in the side wall of the loading position 12, rolling supports 14 are respectively arranged at the top end and the bottom end of the silicon wafer support 11, the rolling supports 14 are connected to the silicon wafer support 11 through rotating rods 15, and the rolling supports 14 can rotate to be abutted with the upper end and the lower end of a silicon wafer on the silicon wafer loading device;

the ultrasonic cleaning device is suitable for accommodating a silicon wafer loading device, a first driving piece 21 is arranged in the ultrasonic cleaning device and corresponds to the two ends of the rolling support 14, and when the silicon wafer loading device is arranged in the ultrasonic cleaning device, the first driving piece 21 is suitable for driving the rolling support 14 to rotate;

and the flushing device is suitable for accommodating a silicon wafer loading device, the flushing device is internally provided with second driving parts 31 which are arranged corresponding to the two ends of the rolling support 14, and when the silicon wafer loading device is arranged in the flushing device, the second driving parts 31 are suitable for driving the rolling support 14 to rotate.

When the embodiment of the utility model is used for cleaning the spin-on silicon wafer, firstly, the silicon wafer is sequentially placed in the loading groove 13 of the silicon wafer loading device, the rotating rod 15 is rotated to enable the rolling support 14 to be abutted against the upper end and the lower end of the silicon wafer to be cleaned, after the silicon wafer device is completed, the silicon wafer loading device is integrally placed in the ultrasonic cleaning device, cleaning solvent is injected into the ultrasonic cleaning device, then the ultrasonic cleaning device is started to clean the silicon wafer, in the process of cleaning the silicon wafer, the first driving piece 21 on the ultrasonic cleaning device drives the rolling support 14 to rotate, friction force is generated between the rolling support 14 and the silicon wafer, the silicon wafer rotates under the action of the friction force to promote the cleaning effect, after the silicon wafer is cleaned, the second driving piece 31 on the silicon wafer loading device is transferred into the flushing device to be flushed, the flushing device drives the rolling support 14 to rotate, friction force is generated between the rolling support 14 and the silicon wafer, the silicon wafer rotates under the action of the friction force to promote the flushing effect, and the cleaning work of the silicon wafer is finished.

From the above, the embodiment can realize semi-automatic cleaning of the silicon wafer, which can effectively save labor cost, and can effectively control the cleaning degree of the silicon wafer and reduce the damage quantity of the silicon wafer in the cleaning process.

It should be noted that the number of the roll holders 14 at the top and bottom ends of the wafer holders 11 may be set according to actual needs, and the present embodiment is not limited in any way.

Preferably, the top and bottom ends of the wafer support 11 are provided with two rolling supports 14, respectively.

Further, the roller support 14 is provided with a plurality of grooves 16 which are arranged corresponding to the loading grooves 13. The grooves 16 can enable each silicon wafer on the silicon wafer loading device to be reliably abutted against the rolling support 14, so that the rolling coating can drive each silicon wafer to rotate in the cleaning and flushing processes, and the cleaning effect of the silicon wafers is improved.

In some alternative embodiments, the ultrasonic cleaning device comprises a cleaning tank 22, a first clamping position 23 for fixing the silicon wafer loading device is arranged on the bottom wall of the cleaning tank 22, a first driving member 21 is arranged on the side wall of the cleaning tank 22, and the first driving member 21 is suitable for being in butt joint with the rolling support 14 when the silicon wafer loading device is arranged in the cleaning tank 22.

Wherein, have a plurality of L shape spacing portions on wasing the case 22 diapire, a plurality of L shape spacing portions cooperate on wasing the case 22 diapire and form first screens 23, and silicon chip loading device can place in first screens 23 and spacing by L shape spacing portion, ensures that silicon chip loading device does not appear shifting at abluent in-process.

The first driving member 21 may be a driving rod or a driving wheel rotatably disposed on a side wall of the cleaning tank 22 and driven by a motor or other devices, and when the silicon wafer loading device is disposed in the cleaning tank 22, two ends of the rolling support 14 abutting against the upper and lower ends of the silicon wafer may be in transmission connection with the first driving member 21 through a connection manner such as a snap connection, and the first driving member 21 drives the rolling support 14 to rotate during the cleaning process so as to drive the silicon wafer on the silicon wafer support 11 to rotate.

Further, the cleaning tank 22 is further provided with a tank cover, the tank cover can prevent the cleaning solvent from splashing out of the cleaning tank 22 to pollute the environment in the cleaning process, the cleaning tank 22 is made of a hollow double-layer material resistant to the solvent, and the hollow tank body can be matched with the tank cover to effectively isolate noise.

Further, a filter assembly 24 is also connected to the purge bin 22. In this embodiment, after cleaning the silicon wafer, the cleaning solvent in the cleaning tank 22 may be filtered by the filter assembly 24, and the filtered cleaning solvent may be used for the next cleaning, so as to realize the recycling of the cleaning solvent, so as to save the cleaning solvent.

Specifically, the filtering component 24 includes a wash tank 241, a filter 242, and a filtrate tank 243, the inlet and outlet of the wash tank 241 is respectively connected with the wash tank 22 and the filter 242, a first valve 244 is disposed between the wash tank 241 and the wash tank 22, a first transfer pump 245 is disposed between the wash tank 22 and the filter 242, the inlet and outlet of the filtrate tank 243 is respectively connected with the filter 242 and the wash tank 22, a second valve 246 is disposed between the filter 242 and the filtrate tank 243, and a third valve 247 and a second transfer pump 248 are disposed between the filtrate tank 243 and the wash tank 22.

After the cleaning of the silicon wafer is completed in this embodiment, the cleaning solvent in the cleaning tank 22 can be discharged into the cleaning solution storage tank 241 by opening the first valve 244, after the cleaning solvent is settled in the cleaning solution storage tank 241 for a certain period of time, the cleaning solvent in the cleaning solution storage tank 241 is conveyed into the filter 242 by opening the first conveying pump 245 and the second valve 246 for filtering, the filtered cleaning solvent is stored in the filtrate storage tank 243, and the cleaning solution in the filtrate storage tank 243 is injected into the cleaning tank 22 for cleaning the silicon wafer through the third valve 247 and the second conveying pump 248 when the next cleaning is performed.

Alternatively, the ultrasonic cleaning device can adjust the ultrasonic frequency and control the ultrasonic time, and is provided with a temperature control system which can adjust the temperature of the cleaning solvent.

In some alternative embodiments, the rinsing device comprises a rinsing tank 32, a rinsing assembly 33 is arranged in the rinsing tank 32, the rinsing tank 32 is further connected with a waste liquid tank 34 for collecting rinsing waste liquid, a liquid draining valve 35 is arranged between the rinsing tank 32 and the waste liquid tank 34, a second clamping position 36 for fixing the silicon wafer loading device is arranged on the bottom wall of the rinsing tank 32, a second driving piece 31 is arranged on the side wall of the rinsing tank 32, and the second driving piece 31 is suitable for being in butt joint with the rolling support 14 when the silicon wafer loading device is arranged in the rinsing tank 32.

Wherein, have a plurality of L shape spacing portions on the washing case 32 diapire, a plurality of L shape spacing portions cooperate on the washing case 32 diapire to form second screens 36, and silicon chip loading device can be placed in second screens 36 and spacing by L shape spacing portion, ensures that silicon chip loading device does not appear shifting in the in-process of washing.

The second driving member 31 may be a driving rod or a driving wheel rotatably disposed on a side wall of the cleaning tank 22 and driven by a motor or other devices, and when the silicon wafer loading device is disposed in the cleaning tank 22, two ends of the rolling support 14 abutting against the upper and lower ends of the silicon wafer may be in transmission connection with the second driving member 31 through a connection manner such as a snap connection, and the second driving member 31 drives the rolling support 14 to rotate during the cleaning process so as to drive the silicon wafer on the silicon wafer support 11 to rotate.

Further, the flushing assembly 33 includes a main tube 331 rotatably disposed at the top end of the flushing tank 32, a plurality of branch tubes 332 disposed at intervals are disposed on the main tube 331, and a plurality of flushing holes are disposed on the branch tubes 332.

After the silicon wafer loading device of this embodiment is placed in the rinse tank 32, the rotatable main tube 331 places each branch tube 332 thereon between every two silicon wafers, then starts the second driving member 31 and introduces rinse liquid into the main tube 331, the second driving member 31 drives the rolling support 14 to rotate, the silicon wafers start to rotate under the friction force between the silicon wafers and the rolling support 14, and when the silicon wafers rotate, the rinse assembly 33 sprays rinse liquid to the silicon wafers through the rinse holes on the branch tubes 332 to rinse the cleaned silicon wafers.

Further, the branch pipe 332 is further provided with a cleaning brush 333, and the cleaning brush 333 can clean the silicon wafer synchronously when the cleaning assembly 33 is used for cleaning the silicon wafer, so as to further improve the cleaning effect on the silicon wafer.

It is appreciated that the cleaning brush 333 may be made of any dust-free ultrafine material that does not damage the silicon wafer, so as to effectively prevent the silicon wafer from being scratched and contaminants from being introduced.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.

Claims

1. A spin-on silicon wafer cleaning device is characterized by comprising:

the silicon wafer loading device comprises a silicon wafer support (11), wherein a loading position (12) is arranged on the silicon wafer support (11), a plurality of loading grooves (13) are formed in the side wall of the loading position (12), rolling supports (14) are respectively arranged at the top end and the bottom end of the silicon wafer support (11), the rolling supports (14) are connected to the silicon wafer support (11) through rotating rods (15), and the rolling supports (14) can rotate to be abutted to the upper end and the lower end of a silicon wafer on the silicon wafer loading device;

the ultrasonic cleaning device is suitable for accommodating the silicon wafer loading device, a first driving piece (21) which is arranged corresponding to the two ends of the rolling support (14) is arranged in the ultrasonic cleaning device, and when the silicon wafer loading device is arranged in the ultrasonic cleaning device, the first driving piece (21) is suitable for driving the rolling support (14) to rotate;

the washing device is suitable for accommodating the silicon wafer loading device, second driving parts (31) which are arranged corresponding to the two ends of the rolling support (14) are arranged in the washing device, and when the silicon wafer loading device is arranged in the washing device, the second driving parts (31) are suitable for driving the rolling support (14) to rotate.

2. The spin-on silicon wafer cleaning device according to claim 1, wherein the top and bottom ends of the silicon wafer support (11) are respectively provided with two rolling supports (14).

3. The spin-on silicon wafer cleaning device according to claim 1, wherein the roll support (14) is provided with a plurality of grooves (16) which are arranged corresponding to the loading grooves (13).

4. The spin wafer cleaning apparatus according to claim 1, wherein the ultrasonic cleaning apparatus comprises a cleaning tank (22), a first clamping position (23) for fixing the wafer loading apparatus is provided on a bottom wall of the cleaning tank (22), the first driving member (21) is provided on a side wall of the cleaning tank (22), and the first driving member (21) is adapted to be in butt joint with the roll holder (14) when the wafer loading apparatus is placed in the cleaning tank (22).

5. The spin-on silicon wafer cleaning apparatus as set forth in claim 4, wherein the cleaning tank (22) is further provided with a tank cover, and the cleaning tank (22) is made of a hollow double-layer material resistant to solvents.

6. The spin-on silicon wafer cleaning apparatus as set forth in claim 4 wherein the purge bin (22) is further coupled with a filter assembly (24).

7. The spin-on silicon wafer cleaning device according to claim 6, wherein the filter assembly (24) comprises a washing liquid storage tank (241), a filter (242) and a filtrate storage tank (243), an inlet and an outlet of the washing liquid storage tank (241) are respectively connected with the washing tank (22) and the filter (242), a first valve (244) is arranged between the washing liquid storage tank (241) and the washing tank (22), a first delivery pump (245) is arranged between the washing tank (22) and the filter (242), an inlet and an outlet of the filtrate storage tank (243) are respectively connected with the filter (242) and the washing tank (22), a second valve (246) is arranged between the filter (242) and the filtrate storage tank (243), and a third valve (247) and a second delivery pump (248) are respectively arranged between the filtrate storage tank (243) and the washing tank (22).

8. The spin-on silicon wafer cleaning device according to claim 1, wherein the rinsing device comprises a rinsing tank (32), a rinsing assembly (33) is arranged in the rinsing tank (32), a second clamping position (36) for fixing the silicon wafer loading device is arranged on the bottom wall of the rinsing tank (32), the second driving piece (31) is arranged on the side wall of the rinsing tank (32), and the second driving piece (31) is suitable for being in butt joint with the rolling support (14) when the silicon wafer loading device is arranged in the rinsing tank (32).

9. The spin-on silicon wafer cleaning device according to claim 8, wherein the rinsing assembly (33) comprises a main tube (331) rotatably disposed at the top end of the rinsing tank (32), the main tube (331) has a plurality of branched tubes (332) disposed at intervals, and the branched tubes (332) have a plurality of rinsing holes.

10. The spin-on silicon wafer cleaning apparatus according to claim 9, wherein a cleaning brush (333) is further provided on the branch pipe (332).