CN220604678U - Power module - Google Patents

Abstract

The utility model discloses a power module, comprising: the power chip comprises a first substrate, a second substrate, at least one power chip, an external terminal and a conducting strip; the power chip, the external terminal and the conducting strip are all arranged between the first substrate and the second substrate; the conducting strip is arranged on the first surface, adjacent to the first substrate, of the power chip; the first pin of the first surface of the power chip is electrically connected with the external terminal through the conducting strip, or the external terminal is directly arranged on the first surface of the power chip adjacent to the first substrate and is electrically connected with the first pin; the second pins of the first surfaces of the different power chips are connected through the conductive sheet; the power chip, the external terminal and the conducting strip are mutually insulated from the first substrate. The utility model can simplify the structure of the power module and simplify the manufacturing process of the power module.

Description

Power module

Technical Field

The present disclosure relates to semiconductor technology, and more particularly, to a power module.

Background

In a traditional power module, power chips are arranged between an upper substrate and a lower substrate, interconnection of the power chips is realized through circuits on the surfaces of the upper substrate and the lower substrate, and external terminals are arranged on the surfaces of the upper substrate and the lower substrate and are connected with the power chips through the circuits on the surfaces of the upper substrate and the lower substrate. The existing power module is complex in structure and complex in assembly process.

Disclosure of Invention

The utility model provides a power module, which is used for simplifying the structure of the power module and simplifying the manufacturing process of the power module.

According to an aspect of the present utility model, there is provided a power module including:

the power chip comprises a first substrate, a second substrate, at least one power chip, an external terminal and a conducting strip;

the power chip, the external terminal and the conducting strip are all arranged between the first substrate and the second substrate;

the conducting strip is arranged on the first surface, adjacent to the first substrate, of the power chip;

the first pin of the first surface of the power chip is electrically connected with the external terminal through the conducting strip, or the external terminal is directly arranged on the first surface of the power chip adjacent to the first substrate and is electrically connected with the first pin;

the second pins of the first surfaces of the different power chips are connected through the conductive sheet; the power chip, the external terminal and the conducting strip are mutually insulated from the first substrate.

Optionally, part of the external terminal and part of the conductive sheet are in an integral connection structure.

Optionally, the first substrate includes a first ceramic substrate, a first heat conducting layer, and a second heat conducting layer;

the first ceramic substrate is arranged between the first heat conduction layer and the second heat conduction layer, and the first heat conduction layer is arranged on one side of the first ceramic substrate adjacent to the power chip;

the second substrate comprises a second ceramic substrate, a third heat conduction layer and a circuit layer;

the second ceramic substrate is arranged between the third heat conduction layer and the circuit layer, and the circuit layer is arranged on one side, adjacent to the power chip, of the second ceramic substrate;

the circuit layer is electrically connected with a third pin on the second surface of the power chip, wherein the second surface of the power chip is the surface, adjacent to the second substrate, of the power chip.

Optionally, one end of the conductive sheet connected with the external terminal is disposed on the first surface of the power chip, the other end of the conductive sheet is connected with the circuit layer, and the external terminal is electrically connected with the first pin on the first surface of the power chip through the circuit layer and the conductive sheet.

Optionally, the power module further includes:

the heat conduction support column is arranged between the first substrate and the second substrate.

Optionally, the heat conducting support column is an electric conducting support column, and the fourth pin on the first surface of the power chip is electrically connected with the third pin on the second surface of the power chip through the electric conducting sheet, the heat conducting support column and the circuit layer.

Optionally, the first heat conducting layer, the second heat conducting layer and the third heat conducting layer are all metal layers, the first heat conducting layer includes a plurality of isolation grooves, and the isolation grooves are used for insulating the power chip, the external terminal and the conductive sheet which are not electrically connected with each other after the first heat conducting layer is connected with the power chip, the external terminal and the conductive sheet.

Optionally, the power chip is electrically connected with the external terminal through a conductive material layer, and the power chip is electrically connected with the conductive sheet through a conductive material layer;

the power module comprises at least two power chips, and the at least two different power chips comprise a first chip and a second chip which are different in thickness;

the total thickness of the first chip and the conductive material layer on the surface thereof is equal to the total thickness of the second chip and the conductive material layer on the surface thereof.

Optionally, the power module further includes:

and the plastic sealing layer is used for coating all parts between the first ceramic substrate and the second ceramic substrate, and the part of the external terminal is exposed out of the plastic sealing layer.

Optionally, the power module further includes:

a first heat sink and a second heat sink;

the first radiator is arranged on one side of the first substrate, which is far away from the power chip, and the second radiator is arranged on one side of the second substrate, which is far away from the power chip.

According to the embodiment of the utility model, the external terminal and the conducting strip are directly arranged on the same surface of the power chip and are directly and electrically connected with the power chip, or the conducting strip is directly arranged on the surface of the power chip 30, the external terminal is electrically connected with the power chip through the conducting strip, and the external terminal and the conducting strip can be arranged on the surface of the power chip together in the same process or respectively arranged on the surface of the second substrate and the surface of the power chip in the same process, so that multiple processes are not needed to be respectively arranged, the process steps are reduced, and the process is simplified. And the conducting strip is used for realizing interconnection between adjacent power chips, and a circuit layer is not required to be arranged on the surface of the first substrate to realize interconnection of the power chips, so that the structure of the power module is simplified.

It should be understood that the description in this section is not intended to identify key or critical features of the embodiments of the utility model or to delineate the scope of the utility model. Other features of the present utility model will become apparent from the description that follows.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a top view of a power module according to an embodiment of the present utility model;

FIG. 2 is a schematic cross-sectional view of the power module of FIG. 1 along section line AA;

FIG. 3 is a top view of yet another power module provided by an embodiment of the present utility model;

FIG. 4 is a schematic cross-sectional view of the power module of FIG. 3 along section line BB;

FIG. 5 is a top view of yet another power module provided by an embodiment of the present utility model;

fig. 6 is a cross-sectional view of the power module of fig. 5 along section line CC;

FIG. 7 is a cross-sectional view of yet another power module provided by an embodiment of the present utility model;

FIG. 8 is a cross-sectional view of yet another power module provided by an embodiment of the present utility model;

fig. 9 is a cross-sectional view of yet another power chip provided by an embodiment of the present utility model.

Detailed Description

In order that those skilled in the art will better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in which it is apparent that the described embodiments are only some embodiments of the present utility model, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present utility model and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that the embodiments of the utility model described herein may be implemented in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

An embodiment of the present utility model provides a power module, fig. 1 is a top view of the power module provided by the embodiment of the present utility model, fig. 2 is a schematic cross-sectional view of the power module along a section line AA in fig. 1, fig. 3 is a top view of another power module provided by the embodiment of the present utility model, fig. 4 is a schematic cross-sectional view of the power module along a section line BB in fig. 3, and referring to fig. 1 to fig. 4, the power module includes:

the power chip comprises a first substrate 10, a second substrate 20, at least one power chip 30, an external terminal 40 and a conductive sheet 50;

the power chip 30, the external connection terminal 40 and the conductive sheet 50 are disposed between the first substrate 10 and the second substrate 20. The conductive sheet 50 is disposed on a first surface of the power chip 30 adjacent to the first substrate 10.

The first pins of the first surface of the power chip 30 are electrically connected to the external terminals 40 through the conductive sheet 50 (fig. 3 and 4), or the external terminals 40 are directly disposed on the first surface of the power chip 30 adjacent to the first substrate 10 and electrically connected to the first pins (fig. 1 and 2).

The second pins of the first surfaces of the different power chips 30 are connected through the conductive sheet 50; the power chip 30, the external connection terminal 40 and the conductive sheet 50 are insulated from the first substrate 10.

The first substrate 10 may be a heat dissipation substrate, and takes away heat generated in the working process of the power chip 40, so as to avoid the influence of excessive heat on the working of the power chip 40. The second substrate 20 may include a circuit layer, the power chip 40 may be disposed on the surface of the second substrate 20 by a conductive material, and pins on the power chip 40 may be electrically connected to the circuit layer. The specific type of the power chip 40 is not particularly limited in this embodiment, and the power chip 40 may include at least one of an IGBT power chip, a SiC power chip, a GaN power chip, and the like, by way of example. The external terminal 40 and the conductive sheet 50 may be made of the same conductive material, and in an exemplary embodiment, the external terminal 40 and the conductive sheet 50 may be metal sheets, and before the external terminal 40 and the conductive sheet 50 are placed on the surface of the power chip 30, all the external terminal 40 and all the conductive sheet 50 may be connected into an integral structure through a metal structure, after the external terminal 40 and the conductive sheet 50 are disposed on the surface of the power chip 30, the metal structure between different external terminals 40, the metal structure between different conductive sheets 50, and the metal structure between the conductive sheet 50 and the external terminal 40 are cut off, so that the different external terminals 40, the different conductive sheets 50, and the conductive sheet 50 and the external terminal 40 are insulated from each other.

Specifically, the power chip 30 is interconnected with the outside through the external connection terminal 40. The first surface may be a front surface of the power chip 30, the front surface of the power chip 30 may include a plurality of pins, the first pin may be a pin connected to a circuit outside the power chip 30 and the power module, the external terminal 40 is electrically connected to the first pin, and the power chip 30 may be electrically connected to an external circuit through the external terminal 40. The second pins are pins on the first surface of the power chip 30, the second pins are pins interconnected between different power chips 30, the second pins can include the first pins, and the second pins can also include pins other than the first pins, and the second pins specifically include which pins are determined according to specific types of the power chips 30. The conductive sheet 50 is used for connecting the second pins of the different power chips 30 to realize interconnection of the different power chips 30.

Referring to fig. 1 and 2, the external terminal 40 may be directly disposed on the surface of the power chip 30 together with the conductive sheet 50, the external terminal 40 is directly electrically connected with the first lead, and different power chips 30 are directly electrically connected through the conductive sheet 50. Referring to fig. 3 and 4, the external terminal 40 may also be disposed on the surface of the second substrate 20, and electrically connected to the first pin through the circuit on the surface of the second substrate 20 and the conductive sheet 50.

In the embodiment of the utility model, the external terminal 40 and the conductive sheet 50 are directly arranged on the same surface of the power chip 30 and are directly and electrically connected with the power chip 30, or the conductive sheet 50 is directly arranged on the surface of the power chip 30, the external terminal 40 is electrically connected with the power chip 30 through the conductive sheet 50, and the external terminal 40 and the conductive sheet 50 can be arranged on the surface of the power chip 30 together in the same process or respectively arranged on the surface of the second substrate 20 and the surface of the power chip 30 in the same process, so that the multiple processes are not needed to be respectively arranged, the process steps are reduced, and the process is simplified. And the conductive sheet 50 is used for realizing interconnection between the adjacent power chips 30, and no circuit layer is required to be arranged on the surface of the first substrate 10 to realize interconnection of the power chips, so that the structure of the power module is simplified.

Note that, the first substrate is not shown in fig. 1, and the present utility model is not limited thereto.

Alternatively, referring to fig. 3 and 4, a part of the external connection terminal 40 and a part of the conductive sheet 50 are integrally connected.

Specifically, when a certain number of pins are connected to the external terminal 40 through the conductive sheet 50, the conductive sheet 50 and the external terminal 40 may be manufactured as an integrally connected structure, and the integrally connected structure is directly disposed on the surface of the power chip 30 and connected to the power chip 30.

In addition, the size of the conductive sheet 50 is not limited in this embodiment, and a larger conductive sheet 50 may be provided when a plurality of pins of a plurality of different power chips need to be connected.

Fig. 5 is a top view of yet another power module according to an embodiment of the present utility model, and fig. 6 is a cross-sectional view of the power module of fig. 5 along a section line CC, and optionally, referring to fig. 5 and 6, the power module further includes:

the heat conductive support columns 60, the heat conductive support columns 60 are disposed between the first substrate 10 and the second substrate 20.

Specifically, the heat-conducting support columns 60 are used for supporting the first substrate 10 and the second substrate 20, so as to avoid damaging the power chip 30 when the pressure applied to the power module from the outside is high, in addition, the heat-conducting support columns 60 are also used for conducting heat, so that the heat dissipation speed is improved, and the heat-conducting support columns 60 can also be used for conducting electricity. Referring to fig. 3, the thermally conductive support columns 60 may be disposed at regions where the conductive sheets 30 are not disposed.

Fig. 7 is a cross-sectional view of yet another power module provided by an embodiment of the present utility model, and optionally, referring to fig. 7, the first substrate 10 includes a first ceramic substrate 11, a first heat conductive layer 12, and a second heat conductive layer 13;

the first ceramic substrate 11 is disposed between the first heat conductive layer 12 and the second heat conductive layer 13, and the first heat conductive layer 12 is disposed on a side of the first ceramic substrate 11 adjacent to the power chip 30.

Specifically, the first heat conducting layer 12 and the second heat conducting layer 13 may be made of an insulating heat conducting material with a relatively high heat conducting coefficient, or may be made of a heat conducting material such as metal. When the first heat conducting layer 12 is made of an insulating heat conducting material, the first heat conducting layer 12 can be directly contacted with the power chip 30, the external connection terminal 40 and the conductive sheet 50, when the first heat conducting layer 12 is made of a heat conducting material such as metal, the first heat conducting layer 12 can be patterned, and a plurality of isolation grooves are etched, so that after the power chip 30, the external connection terminal 40 and the conductive sheet 50 are connected with the first heat conducting layer 12, the power chip 30, the external connection terminal 40 and the conductive sheet 50 which are not electrically connected with each other are mutually insulated. Through setting up first base plate 10 and including first ceramic substrate 11, first heat conduction layer 12 and second heat conduction layer 13, first ceramic substrate 11, first heat conduction layer 12 and second heat conduction layer 13 can go out the heat quick conduction that produces in the power chip 30 working process, improves power module's radiating rate.

Optionally, the second substrate 20 includes a second ceramic substrate 21, a third heat conductive layer 23, and a circuit layer 22;

the second ceramic substrate 21 is disposed between the third heat conducting layer 23 and the circuit layer 22, and the circuit layer 22 is disposed on one side of the second ceramic substrate 21 adjacent to the power chip 30;

the circuit layer 22 is electrically connected to the third pin on the second surface of the power chip 30, where the second surface of the power chip 30 is a surface of the power chip 30 adjacent to the second substrate 20.

Specifically, the second surface may be a back surface of the power chip 30, the third pin is a pin on the back surface of the power chip 30, the power chip 30 may be fixed to the surface of the second substrate 20 by using a conductive material layer 80 such as a soldering layer, a eutectic layer or a silver layer, and the third pin is electrically connected to the circuit layer 22. The external leads 40 and the conductive sheet 50 may be electrically connected to the leads on the surface of the power chip 30 through a conductive material layer 80 such as a solder layer, a eutectic layer, or a silver layer.

By arranging the third heat conducting layer 23, heat generated by the power chip 30 can be quickly conducted to the outside of the power module through the third heat conducting layer 23, and the heat dissipation speed is further improved.

Fig. 8 is a cross-sectional view of another power module according to an embodiment of the present utility model, referring to fig. 8, one end of a conductive sheet 50 connected to an external terminal 40 is disposed on a first surface of a power chip 30, the other end is connected to a circuit layer 22, and the external terminal 40 is electrically connected to a first pin on the first surface of the power chip 30 through the circuit layer 22 and the conductive sheet 50.

Specifically, the external connection terminal 40 may be electrically connected to the power chip 30 through the wiring layer 22 and the conductive sheet.

Referring to fig. 6 and 7, optionally, the thermally conductive support columns 60 are electrically conductive support columns, and the fourth pins of the first surface of the power chip 30 are electrically connected to the third pins of the second surface of the power chip 30 through the electrically conductive sheet 50, the thermally conductive support columns 60, and the circuit layer 22.

Specifically, the fourth pin on the first surface of the power chip 30 is electrically connected to the surface of the heat-conducting support column 60 adjacent to the first substrate 10 through the conductive sheet 50, the surface of the heat-conducting support column 60 adjacent to the second substrate 20 is electrically connected to the circuit layer 22, and the circuit layer 22 is electrically connected to the third pin on the second surface of the power chip 30, so as to electrically connect different pins on the front and back surfaces of the power chip 30.

It should be noted that, the first pin, the second pin, the third pin and the fourth pin are not shown in the drawings, and the present utility model is not limited thereto. The first, second, third and fourth pins may be pads or solder balls on the surface of the power chip 30 for interconnection with the outside, or the like.

Optionally, the first heat conducting layer 12, the second heat conducting layer 12 and the third heat conducting layer 23 are all metal layers, and the first heat conducting layer 12 includes a plurality of isolation grooves 121, where the isolation grooves 121 are used for insulating the power chip 30, the external terminal 40 and the conductive sheet 50 that are not electrically connected with each other after the first heat conducting layer 12 is connected with the power chip 30, the external terminal 40 and the conductive sheet 50. Specifically, the first heat conducting layer 12, the second heat conducting layer 12 and the third heat conducting layer 23 can be all metal layers such as copper layers, and the heat dissipation speed of the power module can be further improved due to the fact that the heat dissipation speed and the heat conduction speed of the metal are high, and the first heat conducting layer 12, the second heat conducting layer 12 and the third heat conducting layer 23 are metal layers.

In addition, the depth of the isolation groove 121 is equal to the thickness of the second heat conducting layer 12, and the isolation groove 121 can physically isolate different areas of the second heat conducting layer 12, so as to realize insulation of different areas. For example, isolation trenches may be etched in the second heat-conducting layer 12, where a region of the second heat-conducting layer 12 in contact with one power chip 30 is a first region, and a region of the second heat-conducting layer 12 in contact with another power chip 30 is a second region, where the isolation trenches 121 isolate the first region from the second region, so as to achieve insulation between the two different power chips 30.

In addition, the circuit layer 22 may also include a plurality of isolation trenches to isolate different regions. The power chips 30 that are not electrically connected to each other may be respectively disposed in different regions of the wiring layer 22 that are isolated from each other by the isolation grooves, thereby achieving insulation between the power chips 30. The conductive sheet 50 and the external terminal 40 electrically connected to each other may overlap the same region of the circuit layer 22, so as to electrically connect the conductive sheet 50 and the external terminal 50. The conductive sheet 50 and the external terminal 40, which are not electrically connected to each other, may be disposed in different areas of the circuit layer 22, which are isolated from each other by the isolation groove, respectively, at one end of the circuit layer 22, which is required to be connected to other components, so as to insulate the conductive sheet 50 from the external terminal 50. By etching the whole copper layer and etching a plurality of isolation grooves, insulation of different areas is realized, so that more copper is reserved as much as possible, and better heat dissipation can be realized.

Fig. 9 is a cross-sectional view of yet another power chip provided in an embodiment of the present utility model, alternatively, referring to fig. 9, the power chip 30 is electrically connected to the external terminal 40 through the conductive material layer 80, and the power chip 30 is electrically connected to the conductive sheet 50 through the conductive material layer 80;

the power module comprises at least two power chips 30, and at least two different power chips 30 comprise a first chip 31 and a second chip 32 with different thicknesses;

the sum of the thicknesses of the first chip 31 and the conductive material layer 80 on the surface thereof is equal to the sum of the thicknesses of the second chip 32 and the conductive material layer 80 on the surface thereof.

Specifically, by adjusting the thickness of the conductive material layer 80, the sum of the thicknesses of the first chip 31 and the conductive material layer 80 located on the surface of the first chip is equal to the sum of the thicknesses of the second chip 33 and the conductive material layer 80 located on the surface of the second chip, so that the surfaces of the conductive material layers 80 adjacent to the external terminal 40 at different positions are located on the same plane, when the power module is subjected to external pressure, the stress at each position of the power module is relatively uniform, and uneven stress at different positions of the first substrate 10 and the second substrate 20 is avoided, so that the first substrate 10, the second substrate 20 and the power chip 30 are damaged. In addition, the two ends of the conductive sheet 50 connected with the first chip 31 and the second chip 32 are located at the same horizontal plane, so that the conductive sheet 50 is prevented from being damaged due to the fact that the two ends of the conductive sheet 50 are not located at the same horizontal plane.

Optionally, the power module further includes:

and a plastic layer 90, wherein the plastic layer 90 covers all parts between the first ceramic substrate 11 and the second ceramic substrate 21, and the plastic layer 90 is exposed from the external terminal 40.

Specifically, the plastic layer 90 is used for packaging each component between the first ceramic substrate 11 and the second ceramic substrate 21, referring to fig. 9, the second heat conducting layer 13 on the surface of the first ceramic substrate 11 may be exposed to the plastic layer 90, and the third heat conducting layer 23 on the surface of the second ceramic substrate 21 may also be exposed to the plastic layer 90, so that the second heat conducting layer 13 and the third heat conducting layer 23 may perform heat exchange with the outside of the power module faster, and the heat is dissipated outside the power module. In addition, a portion of the external terminal 40 exposes the plastic sealing layer 90, so that the external terminal 40 is connected to an external circuit when the power module is applied to the external circuit.

Optionally, the power module further includes:

a first heat sink 100 and a second heat sink 110;

the first heat sink 100 is disposed on a side of the first substrate 10 away from the power chip 30, and the second heat sink 110 is disposed on a side of the second substrate 20 away from the power chip 30.

Specifically, the first radiator 100 and the second radiator 110 may be air-cooled radiators or liquid-cooled radiators, or may be other heat dissipation structures, and the embodiment is not limited specifically. By providing the first heat sink 100 and the second heat sink 110, the heat dissipation speed of the power module can be further improved.

It should be appreciated that various forms of the flows shown above may be used to reorder, add, or delete steps. For example, the steps described in the present utility model may be performed in parallel, sequentially, or in a different order, so long as the desired results of the technical solution of the present utility model are achieved, and the present utility model is not limited herein.

The above embodiments do not limit the scope of the present utility model. It will be apparent to those skilled in the art that various modifications, combinations, sub-combinations and alternatives are possible, depending on design requirements and other factors. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included in the scope of the present utility model.

Claims (10)

1. A power module, comprising:

the power chip comprises a first substrate, a second substrate, at least one power chip, an external terminal and a conducting strip;

the power chip, the external terminal and the conducting strip are all arranged between the first substrate and the second substrate;

the conducting strip is arranged on the first surface, adjacent to the first substrate, of the power chip;

the first pin of the first surface of the power chip is electrically connected with the external terminal through the conducting strip, or the external terminal is directly arranged on the first surface of the power chip adjacent to the first substrate and is electrically connected with the first pin;

the second pins of the first surfaces of the different power chips are connected through the conductive sheet; the power chip, the external terminal and the conducting strip are mutually insulated from the first substrate.

2. The power module of claim 1, wherein:

part of the external terminals and part of the conductive sheets are of an integral connection structure.

3. The power module of claim 1, wherein:

the first substrate comprises a first ceramic substrate, a first heat conduction layer and a second heat conduction layer;

the first ceramic substrate is arranged between the first heat conduction layer and the second heat conduction layer, and the first heat conduction layer is arranged on one side of the first ceramic substrate adjacent to the power chip;

the second substrate comprises a second ceramic substrate, a third heat conduction layer and a circuit layer;

the second ceramic substrate is arranged between the third heat conduction layer and the circuit layer, and the circuit layer is arranged on one side, adjacent to the power chip, of the second ceramic substrate;

the circuit layer is electrically connected with a third pin on the second surface of the power chip, wherein the second surface of the power chip is the surface, adjacent to the second substrate, of the power chip.

4. The power module of claim 3, wherein the power module comprises a power supply,

one end of the conducting strip connected with the external terminal is arranged on the first surface of the power chip, the other end of the conducting strip is connected with the circuit layer, and the external terminal is electrically connected with the first pin of the first surface of the power chip through the circuit layer and the conducting strip.

5. A power module in accordance with claim 3, further comprising:

the heat conduction support column is arranged between the first substrate and the second substrate.

6. The power module of claim 5, wherein:

the heat conduction support column is an electric conduction support column, and a fourth pin on the first surface of the power chip is electrically connected with a third pin on the second surface of the power chip through the electric conduction sheet, the heat conduction support column and the circuit layer.

7. A power module according to claim 3, characterized in that:

the first heat conduction layer, the second heat conduction layer and the third heat conduction layer are all metal layers, the first heat conduction layer comprises a plurality of isolation grooves, and the isolation grooves are used for insulating the power chip, the external terminal and the electric conduction sheet which are not electrically connected after the first heat conduction layer is connected with the power chip, the external terminal and the electric conduction sheet.

8. The power module of claim 1, wherein:

the power chip is electrically connected with the external terminal through the conductive material layer, and the power chip is electrically connected with the conductive sheet through the conductive material layer;

the power module comprises at least two power chips, and the at least two different power chips comprise a first chip and a second chip which are different in thickness;

the total thickness of the first chip and the conductive material layer on the surface thereof is equal to the total thickness of the second chip and the conductive material layer on the surface thereof.

9. A power module in accordance with claim 3, further comprising:

and the plastic sealing layer is used for coating all parts between the first ceramic substrate and the second ceramic substrate, and the part of the external terminal is exposed out of the plastic sealing layer.

10. The power module of claim 1, further comprising:

a first heat sink and a second heat sink;

the first radiator is arranged on one side of the first substrate, which is far away from the power chip, and the second radiator is arranged on one side of the second substrate, which is far away from the power chip.