CN220604674U - Chip packaging structure capable of enhancing heat dissipation - Google Patents
Chip packaging structure capable of enhancing heat dissipation Download PDFInfo
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- CN220604674U CN220604674U CN202322175815.0U CN202322175815U CN220604674U CN 220604674 U CN220604674 U CN 220604674U CN 202322175815 U CN202322175815 U CN 202322175815U CN 220604674 U CN220604674 U CN 220604674U
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- heat dissipation
- upper cover
- radiator
- pcb panel
- chip
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 79
- 230000002708 enhancing effect Effects 0.000 title claims abstract description 18
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 238000010586 diagram Methods 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000009434 installation Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a chip packaging structure for enhancing heat dissipation, which comprises: a chip heat dissipation body; the chip heat dissipation body comprises a first radiator, a first PCB panel, an electronic chip, a T-shaped radiator, a second PCB panel and an upper cover; the first radiator, the first PCB panel, the electronic chip, the T-shaped radiator, the second PCB panel and the upper cover are sequentially arranged from bottom to top; the first radiator is fixedly connected with the upper cover; the transverse part of the T-shaped radiator is arranged between the electronic chip and the second PCB panel, and the longitudinal part of the T-shaped radiator is fixed on one side of the upper cover; the upper surface of the first radiator is provided with a heat conduction point structure contacted with the first PCB panel, and the heat conduction point structure is positioned below the electronic chip. According to the utility model, the T-shaped radiator and the first radiator are arranged on the upper side and the lower side of the electronic chip, so that the radiating efficiency is further improved.
Description
Technical Field
The present utility model relates to the field of chip heat dissipation technologies, and in particular, to a chip package structure for enhancing heat dissipation.
Background
At present, a conventional heat dissipation structure of an electronic chip is mainly arranged right above the chip, and heat is transferred to the outside through the heat dissipation structure; but to the structure that two-layer PCB board overlaps, main core electronic chip is in the centre of two-layer PCB again, can't satisfy at this moment and set up the radiator in order to reach the radiating effect directly over the electronic chip. And along with the higher and higher functional integration of electronic chip, also accompanying a plurality of problems, wherein, electronic chip self calorific capacity also increases along with this, under the condition that the function is completely started, electronic chip needs to transfer the heat more fast in order to guarantee safe and reliable of electronic chip, but just dispel the heat to electronic chip by the radiator on electronic chip surface, can't satisfy its heat dissipation demand yet.
Disclosure of Invention
The embodiment of the utility model provides a chip packaging structure for enhancing heat dissipation, which aims to solve the problem that the chip packaging structure in the prior art cannot meet the heat dissipation requirement.
In order to solve the above-mentioned problems, the present utility model provides a chip package structure for enhancing heat dissipation, comprising: a chip heat dissipation body; the chip heat dissipation body comprises a first radiator, a first PCB panel, an electronic chip, a T-shaped radiator, a second PCB panel and an upper cover; the first radiator, the first PCB panel, the electronic chip, the T-shaped radiator, the second PCB panel and the upper cover are sequentially arranged from bottom to top; the first radiator is fixedly connected with the upper cover; the transverse part of the T-shaped radiator is arranged between the electronic chip and the second PCB panel, and the longitudinal part of the T-shaped radiator is fixed on one side of the upper cover; the upper surface of the first radiator is provided with a heat conduction point structure contacted with the first PCB panel, and the heat conduction point structure is positioned below the electronic chip.
Further, a plurality of rows of first heat radiation fins for accelerating heat radiation are arranged on the side wall, far away from the upper cover, of the longitudinal part of the T-shaped radiator, and the first heat radiation fins included in each row of the plurality of rows of first heat radiation fins are parallel to each other.
Further, one end of the transverse portion of the T-shaped radiator, which is far away from the longitudinal portion, is provided with a first spiral through hole, and the first spiral through hole is used for connecting the upper cover.
Further, one end of the first radiating fin is provided with a first fixing hole for connecting the upper cover.
Further, a plurality of rows of second heat dissipation fins for accelerating heat dissipation are arranged on the lower surface of the first heat sink, and each row of second heat dissipation fins in the plurality of rows of second heat dissipation fins are parallel to each other.
Further, a plurality of first fixing columns are arranged on the upper surface of the first radiator and are used for being fixedly connected with the upper cover.
Further, the upper surface of the first radiator is further provided with a plurality of limiting columns, and the limiting columns are used for guiding the first PCB panel to be arranged at a fixed installation position.
Further, the upper cover is provided with a second fixed column corresponding to the first spiral through hole, and the second fixed column is provided with a stud cavity matched with the first spiral through hole; the upper cover further comprises a stud, and the stud sequentially penetrates through the first spiral through hole, the second PCB panel and the stud cavity to be used for fixing the T-shaped radiator and the second PCB panel on the upper cover.
Further, the upper cover is provided with a third fixing column matched with the first fixing hole.
Further, the upper cover is further provided with a plurality of fixing cavities, and the plurality of fixing cavities are matched with the plurality of first fixing columns.
The utility model discloses a chip packaging structure for enhancing heat dissipation, which comprises: a chip heat dissipation body; the chip heat dissipation body comprises a first radiator, a first PCB panel, an electronic chip, a T-shaped radiator, a second PCB panel and an upper cover; the first radiator, the first PCB panel, the electronic chip, the T-shaped radiator, the second PCB panel and the upper cover are sequentially arranged from bottom to top; the first radiator is fixedly connected with the upper cover; the transverse part of the T-shaped radiator is arranged between the electronic chip and the second PCB panel, and the longitudinal part of the T-shaped radiator is fixed on one side of the upper cover; the upper surface of the first radiator is provided with a heat conduction point structure contacted with the first PCB panel, and the heat conduction point structure is positioned below the electronic chip. According to the utility model, the T-shaped radiator and the first radiator are arranged on the upper side and the lower side of the electronic chip, so that the radiating efficiency is further improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a chip package structure for enhancing heat dissipation according to an embodiment of the present utility model;
FIG. 2 is an exploded view of the heat dissipation enhanced chip package structure provided in FIG. 1;
fig. 3 is a schematic structural diagram of a T-shaped radiator in a chip package structure for enhancing heat dissipation according to an embodiment of the present utility model;
fig. 4 is a schematic structural diagram of a first radiator in a chip package structure for enhancing heat dissipation according to an embodiment of the present utility model;
fig. 5 is a schematic structural diagram of an upper cover in a chip package structure for enhancing heat dissipation according to an embodiment of the present utility model.
Wherein, each reference sign is as follows in the figure:
1. a chip package structure for enhancing heat dissipation; 10. a chip heat dissipation body; 100. a first heat sink; 110. a heat conduction point structure; 120. a second heat sink fin; 130. a first fixing column; 140. a limit column; 200. a first PCB panel; 300. an electronic chip; 400. a T-shaped radiator; 410. a first heat sink fin; 411. a first fixing hole; 420. a first spiral through hole; 500. a second PCB panel; 600. an upper cover; 610. a second fixing column; 611. a stud cavity; 620. a stud; 630. a third fixing column; 640. the cavity is fixed.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be understood that the terms "comprises" and "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used in this specification and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in the present specification and the appended claims refers to any and all possible combinations of one or more of the associated listed items, and includes such combinations.
Referring to fig. 1 and 2, the present utility model provides a chip package structure 1 for enhancing heat dissipation, comprising: a chip heat dissipation body 10; the chip heat dissipation body 10 includes a first heat sink 100, a first PCB panel 200, an electronic chip 300, a T-shaped heat sink 400, a second PCB panel 500, and an upper cover 600; the first heat sink 100, the first PCB panel 200, the electronic chip 300, the T-shaped heat sink 400, the second PCB panel 500, and the upper cover 600 are sequentially disposed from bottom to top; the first radiator 100 is fixedly connected with the upper cover 600; a lateral portion of the T-shaped heat sink 400 is disposed between the electronic chip 300 and the second PCB panel 500, and a longitudinal portion of the T-shaped heat sink 400 is fixed to one side of the upper cover 600; the upper surface of the first heat sink 100 is provided with a heat conducting point structure 110 contacting the first PCB panel 200, and the heat conducting point structure 110 is located below the electronic chip 300.
In this embodiment, a chip package structure 1 for enhancing heat dissipation includes a chip heat dissipation body 10, where the chip heat dissipation body 10 includes a first heat sink 100, a first PCB panel 200, an electronic chip 300, a T-shaped heat sink 400, a second PCB panel 500, and an upper cover 600 sequentially disposed from bottom to top. Wherein, the first heat spreader 100 is fixedly connected with the upper cover 600 to form a basic frame of the chip package structure; and the electronic chip 300 is attached to the upper surface of the first PCB panel 200. The lateral part of the T-shaped heat sink 400 is disposed between the electronic chip 300 and the second PCB panel 500, and the longitudinal part of the T-shaped heat sink 400 is fixed to the right outer side of the upper cover 600, so that the temperature of the surface of the electronic chip 300 is transferred to the longitudinal part of the T-shaped heat sink 400 through the lateral part of the T-shaped heat sink 400 and is transferred to the outer side of the chip package structure through the longitudinal part of the T-shaped heat sink 400. In addition, the upper surface of the first heat sink 100 is provided with a heat conducting point structure 110, the heat conducting point structure 110 is in contact with the first PCB panel 200, and the heat conducting point structure 110 is located below the electronic chip 300, so that the heat of the electronic chip 300 is rapidly transferred to the outside by reducing the temperature of the first PCB panel 200 to dissipate the heat of the bottom surface of the electronic chip 300.
According to the chip packaging structure 1 for enhancing heat dissipation, the T-shaped radiator 400 is arranged on the upper surface of the electronic chip 300, and the first radiator 100 is arranged below the electronic chip 300, so that heat inside the electronic chip 300 is transferred to the outside of the chip packaging structure, and heat dissipation efficiency is further improved.
In an embodiment, as shown in fig. 2 and 3, a plurality of rows of first heat dissipating fins 410 for accelerating heat dissipation are disposed on a sidewall of the longitudinal portion of the T-shaped heat sink 400 away from the upper cover 600, and the first heat dissipating fins 410 included in each of the plurality of rows of first heat dissipating fins 410 are parallel to each other.
In this embodiment, in order to accelerate the heat transfer from the electronic chip 300 to the outside, a plurality of rows of first heat dissipation fins 410 are disposed on the side wall of the longitudinal portion of the T-shaped heat sink 400 away from the upper cover 600, that is, the plurality of rows of first heat dissipation fins 410 are disposed on the outer side surface of the longitudinal portion of the T-shaped heat sink 400, and the first heat dissipation fins 410 included in each of the plurality of rows of first heat dissipation fins are parallel to each other, and the intervals between the first heat dissipation fins 410 of each row are equal, so that the heat dissipation surface area is increased and the heat dissipation capability is further improved by the plurality of rows of first heat dissipation fins 410 disposed on the outer side surface of the longitudinal portion of the T-shaped heat sink 400.
In one embodiment, as shown in fig. 2 and 3, one end of the lateral part of the T-shaped heat sink 400, which is far from the longitudinal part, is provided with a first screw through hole 420, and the first screw through hole 420 is used to connect the upper cover 600.
In this embodiment, in order to achieve the fixed connection between the T-shaped radiator 400 and the upper cover 600, a first screw through hole 420 is provided at one end of the transverse portion of the T-shaped radiator 400, which is far away from the longitudinal portion, and the first screw through hole 420 may be adapted to a stud 620, and the T-shaped radiator 400 and the upper cover 600 are locked and fixed by the stud 620, so that the T-shaped radiator 400 and the upper cover 600 are fixedly connected together through the first screw through hole 420.
In an embodiment, as shown in fig. 2 and 3, one end of the first heat sink fin 410 is provided with a first fixing hole 411 for connecting to the upper cover 600.
In this embodiment, the first heat sink fins 410 are provided with first fixing holes 411, and the first fixing holes 411 are located at the front ends of the first heat sink fins 410, so that the first fixing holes 411 are fixedly connected with the upper cover 600.
In an embodiment, as shown in fig. 2 and 4, a plurality of rows of second heat dissipation fins 120 for accelerating heat dissipation are disposed on the lower surface of the first heat sink 100, and each of the plurality of rows of second heat dissipation fins 120 is parallel to each other.
In this embodiment, in order to accelerate the heat transfer from the electronic chip 300 to the outside, a plurality of rows of second heat dissipation fins 120 for accelerating heat dissipation are disposed on the lower surface of the first heat sink 100, each of the plurality of rows of second heat dissipation fins 120 is parallel to each other, and the spacing between each row of second heat dissipation fins 120 is equal, so that the heat dissipation capacity is further improved by disposing a plurality of rows of second heat dissipation fins 120 on the lower surface of the first heat sink 100 to increase the heat dissipation surface area.
In an embodiment, as shown in fig. 2 and 4, the upper surface of the first heat sink 100 is provided with a plurality of first fixing posts 130, and the plurality of first fixing posts 130 are used for fixedly connecting the upper cover 600.
In this embodiment, the upper surface of the first heat sink 100 is provided with a plurality of first fixing columns 130, the plurality of first fixing columns 130 is preferably 3 in this embodiment, one of the 3 first fixing columns 130 is located on the left front end of the upper surface of the first heat sink 100, one of the 3 first fixing columns 130 is located on the left rear end of the upper surface of the first heat sink 100, and one of the 3 first fixing columns 130 is located on the right front end of the upper surface of the first heat sink 100, so that the plurality of first fixing columns 130 disposed on the upper surface of the first heat sink 100 realize a fixed connection with the upper cover 600.
In an embodiment, as shown in fig. 2 and 4, the upper surface of the first heat sink 100 is further provided with a plurality of limiting posts 140, and the plurality of limiting posts 140 are used for guiding the first PCB panel 200 to be disposed in a fixed mounting position.
In this embodiment, the upper surface of the first heat sink 100 is further provided with a plurality of limiting posts 140, where the plurality of limiting posts 140 is preferably 3 in this embodiment, and one of the 2 limiting posts 140 is located at the front left side of the first heat sink 100, and another one of the 2 limiting posts 140 is located at the rear right side of the first heat sink 100; and the first PCB panel 200 is provided with a plurality of limiting holes corresponding to the plurality of limiting posts 140 one by one, and the plurality of limiting holes can guide the fixed installation of the first PCB panel 200 according to the positions of the plurality of limiting posts 140, thereby ensuring that the first PCB panel 200 is installed on the correct position of the first heat sink 100.
In an embodiment, as shown in fig. 2-3 and fig. 5, the upper cover 600 is provided with a second fixing post 610 corresponding to the first spiral through hole 420, and the second fixing post 610 is provided with a stud cavity 611 adapted to the first spiral through hole 420; the upper cover 600 further includes a stud 620, and the stud 620 sequentially passes through the first screw through hole 420, the second PCB panel 500 and the stud cavity 611 for fixing the T-shaped heat sink 400 and the second PCB panel 500 to the upper cover 600.
In this embodiment, in order to achieve the fixed connection between the T-shaped radiator 400 and the upper cover 600, a second fixing post 610 corresponding to the first spiral through hole 420 is provided on the lower surface of the upper cover 600, and a stud cavity 611 adapted to the first spiral through hole 420 is provided on the second fixing post 610; in addition, the upper cover 600 further includes a stud 620, the stud 620 may match the first screw through hole 420, the stud cavity 611, and a second screw through hole on the second PCB panel 500; the stud 620 sequentially passes through the first screw through hole 420, the second screw through hole and the stud cavity 611, so that the T-shaped heat sink 400 and the second PCB panel 500 can be fixed on the upper cover 600 by the stud 620, and the T-shaped heat sink 400 and the second PCB panel 500 can be fixedly mounted.
In an embodiment, as shown in fig. 2, 3 and 5, the upper cover 600 is provided with a third fixing post 630 adapted to the first fixing hole 411.
In this embodiment, in order to further strengthen the upper cover 600 and the T-shaped radiator 400, a third fixing post 630 is disposed on the right front side of the upper cover 600, where the third fixing post 630 is adapted to the first fixing hole 411, and the third fixing post 630 is clamped to the first fixing hole 411, so as to realize the fixed connection between the upper cover 600 and the T-shaped radiator 400.
In an embodiment, as shown in fig. 2, 4 and 5, the upper cover 600 is further provided with a plurality of fixing cavities 640, and the plurality of fixing cavities 640 are adapted to the plurality of first fixing columns 130.
In this embodiment, the upper cover 600 is further provided with a plurality of fixing cavities 640, the plurality of fixing cavities 640 is preferably 3 in this embodiment, one of the 3 fixing cavities 640 is located on the left front end of the lower surface of the upper cover 600, one of the 3 fixing cavities 640 is located on the left rear end of the lower surface of the upper cover 600, and one of the 3 fixing cavities 640 is located on the right front end of the lower surface of the upper cover 600. The plurality of fixing cavities 640 are adapted to and correspond to the plurality of first fixing columns 130 one by one, so that the plurality of first fixing columns 130 are clamped with the plurality of fixing cavities 640 to realize the fixed connection between the upper cover 600 and the first heat sink 100.
In summary, the present utility model discloses a chip package structure for enhancing heat dissipation, comprising: a chip heat dissipation body; the chip heat dissipation body comprises a first radiator, a first PCB panel, an electronic chip, a T-shaped radiator, a second PCB panel and an upper cover; the first radiator, the first PCB panel, the electronic chip, the T-shaped radiator, the second PCB panel and the upper cover are sequentially arranged from bottom to top; the first radiator is fixedly connected with the upper cover; the transverse part of the T-shaped radiator is arranged between the electronic chip and the second PCB panel, and the longitudinal part of the T-shaped radiator is fixed on one side of the upper cover; the upper surface of the first radiator is provided with a heat conduction point structure contacted with the first PCB panel, and the heat conduction point structure is positioned below the electronic chip. According to the utility model, the T-shaped radiator and the first radiator are arranged on the upper side and the lower side of the electronic chip, so that the radiating efficiency is further improved.
While the utility model has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.
Claims (10)
1. A chip package structure for enhancing heat dissipation, comprising: a chip heat dissipation body; the chip heat dissipation body comprises a first radiator, a first PCB panel, an electronic chip, a T-shaped radiator, a second PCB panel and an upper cover; the first radiator, the first PCB panel, the electronic chip, the T-shaped radiator, the second PCB panel and the upper cover are sequentially arranged from bottom to top; the first radiator is fixedly connected with the upper cover; the transverse part of the T-shaped radiator is arranged between the electronic chip and the second PCB panel, and the longitudinal part of the T-shaped radiator is fixed on one side of the upper cover; the upper surface of the first radiator is provided with a heat conduction point structure contacted with the first PCB panel, and the heat conduction point structure is positioned below the electronic chip.
2. The heat dissipation enhanced chip package structure according to claim 1, wherein a plurality of rows of first heat dissipation fins for accelerating heat dissipation are provided on a side wall of the longitudinal portion of the T-shaped heat sink away from the upper cover, the first heat dissipation fins included in each of the plurality of rows of first heat dissipation fins being parallel to each other.
3. The heat dissipation enhanced chip package structure according to claim 2, wherein one end of the lateral portion of the T-shaped heat sink, which is far from the longitudinal portion, is provided with a first screw through hole for connecting the upper cover.
4. The heat dissipation enhanced chip package structure of claim 2, wherein one end of the first heat dissipation fin is provided with a first fixing hole for connecting the upper cover.
5. The heat dissipation enhanced chip package structure of claim 1, wherein a plurality of rows of second heat dissipation fins for accelerating heat dissipation are provided on a lower surface of the first heat sink, each of the plurality of rows of second heat dissipation fins being parallel to each other.
6. The heat dissipation enhanced chip package structure according to claim 2, wherein a plurality of first fixing columns are provided on an upper surface of the first heat sink, and the plurality of first fixing columns are used for fixedly connecting the upper cover.
7. The enhanced heat dissipation chip package structure of claim 2, wherein the upper surface of the first heat spreader is further provided with a plurality of spacing posts for guiding the first PCB panel to be disposed in a fixed mounting position.
8. The chip packaging structure for enhancing heat dissipation according to claim 3, wherein the upper cover is provided with a second fixing column corresponding to the first spiral through hole, and the second fixing column is provided with a stud cavity adapted to the first spiral through hole; the upper cover further comprises a stud, and the stud sequentially penetrates through the first spiral through hole, the second PCB panel and the stud cavity to be used for fixing the T-shaped radiator and the second PCB panel on the upper cover.
9. The heat dissipation enhanced chip package structure according to claim 4, wherein the upper cover is provided with a third fixing post adapted to the first fixing hole.
10. The heat dissipation enhanced chip package structure of claim 6, wherein the upper cover is further provided with a plurality of fixing cavities, and the plurality of fixing cavities are adapted to the plurality of first fixing columns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322175815.0U CN220604674U (en) | 2023-08-11 | 2023-08-11 | Chip packaging structure capable of enhancing heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322175815.0U CN220604674U (en) | 2023-08-11 | 2023-08-11 | Chip packaging structure capable of enhancing heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220604674U true CN220604674U (en) | 2024-03-15 |
Family
ID=90165907
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322175815.0U Active CN220604674U (en) | 2023-08-11 | 2023-08-11 | Chip packaging structure capable of enhancing heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220604674U (en) |
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2023
- 2023-08-11 CN CN202322175815.0U patent/CN220604674U/en active Active
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