CN220560632U - Gold-tin welding layer structure - Google Patents
Gold-tin welding layer structure Download PDFInfo
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- CN220560632U CN220560632U CN202322149498.5U CN202322149498U CN220560632U CN 220560632 U CN220560632 U CN 220560632U CN 202322149498 U CN202322149498 U CN 202322149498U CN 220560632 U CN220560632 U CN 220560632U
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- Prior art keywords
- gold
- tin
- welded
- layer
- welding
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- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 title claims abstract description 74
- 238000003466 welding Methods 0.000 title claims abstract description 34
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 25
- 238000000034 method Methods 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract 1
- 238000007747 plating Methods 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 6
- 229910000990 Ni alloy Inorganic materials 0.000 description 4
- CLDVQCMGOSGNIW-UHFFFAOYSA-N nickel tin Chemical compound [Ni].[Sn] CLDVQCMGOSGNIW-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 230000007704 transition Effects 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000037452 priming Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to the technical field of welded layer structures, in particular to a gold-tin welded layer structure which comprises a part to be welded and a mounting assembly; the installation component includes to-be-welded body, photoresist net and gold tin body, the photoresist net sets up the photoresist net of waiting to weld spare part and is provided with the position groove, gold tin body sets up to wait to weld spare part's one side, and place in the position groove, gold tin body's quantity is a plurality of, wait to weld the body butt on gold tin body, and lie in gold tin body's below, jin Xiti sets up respectively in the position groove of photoresist net, with this method can be effectual control technical index such as thickness, size of gold tin body, restrict the position that sets up to wait to weld spare part of a plurality of gold tin bodies, prevent that welding layer structure from appearing welding bad phenomenon in the welding, thereby improve welding layer structure's welding quality.
Description
Technical Field
The utility model relates to the technical field of welded layer structures, in particular to a gold-tin welded layer structure.
Background
The gold-tin welding is a common welding mode in the packaging process, the gold-tin welding layer is manufactured mainly in an electroplating mode and an evaporating mode, the common structure is easy to oxidize after being connected, the surface of a plating layer is covered by oxide after being oxidized, so that unstable and unstable welding is caused, the welding is difficult to realize welding connection with other electric devices, and the using effect of the welding layer structure is affected.
The prior art CN205443483U discloses a tin-nickel alloy plating layer structure with high weldability, which comprises a transition copper layer, a tin acid layer and a tin-nickel alloy plating layer, wherein the adhesiveness of metallic copper is very strong, the adhesion stability of a plating surface can be enhanced by using the tin acid layer as a substrate for plating, the tin acid layer is prevented from falling off and is a priming material with excellent performance, the tin acid layer is arranged on the transition copper layer, the tin acid layer is further plated with the tin-nickel alloy plating layer, and the tin acid layer and the tin-nickel alloy plating layer are matched, so that the welding layer structure has excellent weldability, and the use effect of the welding layer structure is improved.
In normal use, the distribution position of the gold-tin layer is not limited by a common welding layer structure, so that poor welding phenomenon easily occurs in welding of the welding layer structure, and even phenomena such as short circuit and burning of parts occur seriously, thereby influencing the welding quality of the welding layer structure.
Disclosure of Invention
The utility model aims to provide a gold-tin welding layer structure, which solves the problems that the distribution position of a gold-tin layer is not limited by a common welding layer structure, so that poor welding is easy to occur in welding of the welding layer structure, and even the phenomena of short circuit, burning and the like of parts are serious, thereby influencing the welding quality of the welding layer structure.
In order to achieve the above purpose, the present utility model provides a gold-tin soldering layer structure, comprising a part to be soldered and a mounting assembly; the mounting assembly comprises a body to be welded, a photoresist grid and gold tin bodies, wherein the photoresist grid is arranged on a part to be welded, a position groove is formed in the photoresist grid, jin Xiti is arranged on one side of the part to be welded and is arranged in the position groove, the number of the gold tin bodies is multiple, and the body to be welded is abutted to the gold tin bodies and is located below Jin Xiti.
Wherein the Jin Xiti thickness is 10+/-2 mu m.
Wherein the Jin Xiti includes a first tin-gold layer and a second Jin Xiceng, the first tin-gold layer being disposed below the component to be soldered; the second gold-tin layer is arranged below the first gold-tin layer and is abutted against the upper part of the tape welding body.
Wherein the thickness of the first gold-tin layer and the second gold-tin layer is 5+/-1 mu m respectively.
Wherein the thickness of the photoresist grid is 10+/-2 mu m.
Firstly, a photoresist grid is arranged at the bottom of a part to be welded, jin Xiti is a cuboid, the thickness of Jin Xiti is controlled to be between 10+/-2 mu m, each gold tin body is composed of a first gold tin layer and a second gold tin layer Jin Xiceng, the sizes of the first gold tin layer and the second gold tin layer Jin Xiceng are the same, the top of the first gold tin layer is connected with the bottom of the part to be welded, the bottom of the first gold tin layer is connected with the top of the second Jin Xiceng, the thickness of the first gold tin layer is controlled to be between 5+/-1 mu m, the thickness of the second gold tin layer is controlled to be between 5+/-1 mu m, a plurality of position grooves are formed in the photoresist grid, the spacing distance between each position groove is the same, and Jin Xiti is respectively arranged in the position grooves of the photoresist grid.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
Fig. 1 is a schematic diagram of the overall architecture of a gold-tin soldering layer structure according to a first embodiment of the present utility model.
FIG. 2 is a schematic diagram of the structure of a photoresist grid and position slots of the present utility model.
FIG. 3 is a schematic diagram of the structure of the first and second gold-tin layers according to the present utility model.
In the figure: 101-parts to be welded, 102-a body to be welded, 103-a photoresist grid, 104-a gold tin body, 105-a position groove, 106-a first gold tin layer, 107 a second Jin Xiceng.
Detailed Description
The following detailed description of embodiments of the utility model, examples of which are illustrated in the accompanying drawings and, by way of example, are intended to be illustrative, and not to be construed as limiting, of the utility model.
The first embodiment of the application is as follows:
referring to fig. 1-3, fig. 1 is a schematic diagram of the overall structure of a gold-tin soldering layer structure according to a first embodiment of the present utility model, fig. 2 is a schematic diagram of the structure of a photoresist grid and a position groove according to the present utility model, and fig. 3 is a schematic diagram of the structure of a first gold-tin layer and a second gold-tin layer according to the present utility model.
The utility model provides a gold-tin welding layer structure, which comprises a part 101 to be welded and a mounting assembly; the mounting assembly comprises a body to be welded 102, a photoresist grid 103 and a gold tin body 104, wherein the photoresist grid 103 is arranged on the part to be welded 101, the photoresist grid 103 is provided with a position groove 105, the Jin Xiti is arranged on one side of the part to be welded 101 and is arranged in the position groove 105, the Jin Xiti is a plurality of the bodies to be welded 102 are abutted to the gold tin body 104 and are positioned below the Jin Xiti 104;
the thickness of the Jin Xiti is 10+/-2 mu m;
the gold-tin body 104 comprises a first gold-tin layer 106 and a second gold-tin layer 107, and the first gold-tin layer 106 is arranged below the part 101 to be welded; the second gold-tin layer 107 is disposed below the first gold-tin layer 106 and abuts on the upper side of the tape welded body;
the thickness of the first gold-tin layer 106 and the second gold-tin layer Jin Xiceng 107 are 5+ -1 μm respectively;
the thickness of the photoresist mesh 103 is 10±2 μm.
When the gold-tin welding layer structure of the embodiment is used, firstly, the photoresist grid 103 is arranged at the bottom of the part 101 to be welded, jin Xiti is cuboid, the thickness of Jin Xiti 104 is controlled to be between 10+/-2 μm, jin Xiti 104 consists of a first gold-tin layer 106 and a second gold-tin layer 107, the first gold-tin layer 106 and the second Jin Xiceng are the same in size, the top of the first gold-tin layer 106 is connected with the bottom of the part 101 to be welded, the bottom of the first gold-tin layer 106 is connected with the top of the second Jin Xiceng, the thickness of the first gold-tin layer 106 is controlled to be between 5+/-1 μm, the thickness of the second gold-tin layer 107 is controlled to be between 5+/-1 μm, a plurality of position grooves 105 are formed in the photoresist grid 103, the distance between the position grooves 105 is the same, jin Xiti is respectively arranged at the positions 105 of the photoresist grid 103, the quality of the part is limited by the method of the position grooves 92, and the quality of the part is prevented from being welded by the method of Jin Xiti, and the quality of the part is prevented from being welded by the method of being limited.
The foregoing disclosure is only illustrative of one or more preferred embodiments of the present application and is not intended to limit the scope of the claims hereof, as it is to be understood by those skilled in the art that all or part of the process of implementing the described embodiment may be practiced otherwise than as specifically described and illustrated by the appended claims.
Claims (5)
1. A gold-tin welding layer structure comprises parts to be welded, and is characterized in that,
the device also comprises a mounting assembly;
the mounting assembly comprises a body to be welded, a photoresist grid and gold tin bodies, wherein the photoresist grid is arranged on a part to be welded, a position groove is formed in the photoresist grid, jin Xiti is arranged on one side of the part to be welded and is arranged in the position groove, the number of the gold tin bodies is multiple, and the body to be welded is abutted to the gold tin bodies and is located below Jin Xiti.
2. The gold-tin soldered layer structure of claim 1, wherein,
the Jin Xiti thickness is 10+/-2 mu m.
3. The gold-tin soldered layer structure of claim 1, wherein,
the Jin Xiti comprises a first gold-tin layer and a second Jin Xiceng, and the first gold-tin layer is arranged below the part to be welded; the second gold-tin layer is arranged below the first gold-tin layer and is abutted against the upper part of the tape welding body.
4. The gold-tin soldered layer structure of claim 1, wherein,
the thickness of the first gold tin layer and the second Jin Xiceng are 5±1 μm, respectively.
5. The gold-tin soldered layer structure of claim 1, wherein,
the thickness of the photoresist grid is 10+/-2 mu m.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322149498.5U CN220560632U (en) | 2023-08-10 | 2023-08-10 | Gold-tin welding layer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322149498.5U CN220560632U (en) | 2023-08-10 | 2023-08-10 | Gold-tin welding layer structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220560632U true CN220560632U (en) | 2024-03-08 |
Family
ID=90086903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322149498.5U Active CN220560632U (en) | 2023-08-10 | 2023-08-10 | Gold-tin welding layer structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220560632U (en) |
-
2023
- 2023-08-10 CN CN202322149498.5U patent/CN220560632U/en active Active
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