CN220552127U - Water source heat pump unit with good heat dissipation effect - Google Patents

Water source heat pump unit with good heat dissipation effect Download PDF

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Publication number
CN220552127U
CN220552127U CN202322172599.4U CN202322172599U CN220552127U CN 220552127 U CN220552127 U CN 220552127U CN 202322172599 U CN202322172599 U CN 202322172599U CN 220552127 U CN220552127 U CN 220552127U
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fixedly connected
water source
plate
heat pump
source heat
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CN202322172599.4U
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Chinese (zh)
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邱桂花
冯永坚
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Foshan Guangteng New Energy Co ltd
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Foshan Guangteng New Energy Co ltd
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Abstract

The utility model discloses a water source heat pump unit with good heat dissipation effect, which comprises a case, wherein the back of the case is movably connected with a frame, the middle part of the inner side surface of the frame is fixedly connected with a baffle plate, the top of the inner side surface of the baffle plate is fixedly connected with a supporting plate, and the upper surface of the supporting plate is fixedly connected with a semiconductor refrigerator. This water source heat pump unit that radiating effect is good, through semiconductor refrigerator, the water pump, the conveyer pipe, the setting of condensate plate and back flow, cool down to the coolant liquid after the semiconductor refrigerator circular telegram, the conveyer pipe carries the inside of condensate plate with the coolant liquid after the cooling through the water pump, utilize the low temperature of coolant liquid to carry out cooling to the electrical components of quick-witted incasement portion and handle, open the back flow through the solenoid valve, make the inside that the coolant liquid returned the frame again, form a backward flow, can let the condensate plate keep the ice-cold always, carry out continuous cooling treatment to the quick-witted case, radiating efficiency has been improved greatly, and a long service life.

Description

Water source heat pump unit with good heat dissipation effect
Technical Field
The utility model relates to the technical field of water source heat pump units, in particular to a water source heat pump unit with good heat dissipation effect.
Background
The source heat pump is a technology for transferring low-level heat energy to high-level heat energy by utilizing a low-grade heat energy resource formed by solar energy and geothermal energy absorbed in water sources such as underground water, rivers and lakes on the surface of the earth and adopting a heat pump principle through a small amount of high-level electric energy input.
Through retrieving, chinese patent publication (bulletin) No. CN214536927U discloses a water source heat pump unit that radiating effect is good, including U-shaped unable adjustment base and the water storage tank of setting in U-shaped unable adjustment base upside, the fixed electronic box and the pump machine of being provided with of upper end of water storage tank, U-shaped unable adjustment base is hollow structure, the fixed biax motor that is provided with in horizontal part intermediate position of U-shaped unable adjustment base, the equal fixedly connected with bull stick of left and right sides both ends output shaft of biax motor, the one end fixedly connected with initiative bevel gear of biax motor is kept away from to the bull stick, the upper and lower opposite side inner wall of two vertical portions of U-shaped unable adjustment base all rotates through ball bearing and is connected with same root and rotates the screw rod, the lower extreme pole wall fixed cup joint of rotating the screw rod has driven bevel gear with initiative bevel gear meshing. The utility model can increase the overhaul space by lifting the bottom of the heat pump unit, thereby being convenient for people to overhaul and use.
The water source heat pump unit disclosed by the patent can radiate heat through the heat conducting plate and the radiating fins, but has small radiating area and poor radiating effect, and is easy to cause overheating phenomenon in the case, so that the service life of the case is shortened, and therefore, the water source heat pump unit with good radiating effect is required to be designed to solve the problems.
Disclosure of Invention
The utility model mainly aims to provide a water source heat pump unit with good heat dissipation effect, which can effectively solve the problems in the background technology.
In order to achieve the above purpose, the technical scheme adopted by the utility model is as follows:
the water source heat pump unit with good heat dissipation effect comprises a case, wherein the back of the case is movably connected with a frame, the middle of the inner side surface of the frame is fixedly connected with a baffle plate, the top of the inner side surface of the baffle plate is fixedly connected with a supporting plate, and the upper surface of the supporting plate is fixedly connected with a semiconductor refrigerator; the middle part fixedly connected with water pump of diapire in the frame, the output fixedly connected with conveyer pipe of water pump, the one end fixedly connected with condensing plate of conveyer pipe, the surface fixedly connected with connecting plate of condensing plate, the connecting plate is fixed connection with the frame, the last fixed surface of condensing plate is connected with the back flow, the surface fixedly connected with solenoid valve of back flow.
In order to achieve the effect of being convenient for installing the frame, the water source heat pump unit with good heat dissipation effect is characterized in that the back of the case is fixedly connected with a fixing frame, the inside of the fixing frame is movably connected with a fixing plate through bolts, and the fixing plate is fixedly connected with the frame.
In order to achieve the effect of being convenient for water supplementing, the water source heat pump unit with good heat dissipation effect is characterized in that a liquid level window is fixedly connected to the middle of the back surface of the frame, a water inlet pipe is fixedly connected to one side of the upper surface of the frame, and a plug is movably connected to the inside of the water inlet pipe.
In order to achieve the effect of being convenient for monitoring the temperature, the water source heat pump unit with good heat dissipation effect is used, and the temperature sensor is fixedly connected to the inner top wall of the case.
In order to achieve the effect of enhancing the heat radiation range, the water source heat pump unit with good heat radiation effect is characterized in that the middle part of the outer surface of the partition plate is fixedly connected with a heat radiation fan, and the inner wall of the case is provided with ventilation holes.
In order to achieve the effect of being convenient for ventilation, the water source heat pump unit with good heat dissipation effect is characterized in that heat dissipation grooves are formed in two sides of the outer surface of the case.
In order to achieve the dustproof effect, the water source heat pump unit with good heat dissipation effect is characterized in that U-shaped plates are fixedly connected to two sides of the outer surface of the case, and dustproof screen plates are inserted into the U-shaped plates.
In order to achieve the effect of convenient installation, as the water source heat pump unit with good heat dissipation effect, the lower surface of the case is fixedly connected with a water source heat pump, and both sides of the outer surface of the water source heat pump are fixedly connected with mounting plates.
Compared with the prior art, the utility model has the following beneficial effects:
1. according to the utility model, through the arrangement of the semiconductor refrigerator, the water pump, the conveying pipe, the condensing plate and the return pipe, the semiconductor refrigerator cools the cooling liquid after being electrified, the conveying pipe conveys the cooled cooling liquid to the inside of the condensing plate through the water pump, the electric elements in the chassis are cooled by utilizing the low temperature of the cooling liquid, the cooling efficiency is increased, the return pipe is opened through the electromagnetic valve, the cooling liquid returns to the inside of the frame again, a return flow is formed, the condensing plate can keep cool all the time, the chassis is subjected to continuous cooling treatment, the heat dissipation efficiency is greatly improved, and the service life is prolonged.
2. According to the utility model, through the arrangement of the fixing frame, the heat radiating fan, the heat radiating groove and the dustproof screen plate, the fixing plate is inserted into the fixing frame at the back of the chassis, and is fixed through the bolts, so that the frame is convenient to mount and dismount, convenient to replace and maintain when damaged, the heat radiating fan and the condensing plate are mutually matched for use, the generated cold air can be used for cooling electric elements in the chassis, the heat radiating range is enlarged, the heat radiating groove is of an inclined structure, the chassis can be kept in a ventilation state, dust entering is reduced, the dustproof screen plate is clamped in the U-shaped plate, external dust entering can be avoided, and cleaning and replacement after long-time use are convenient.
Drawings
FIG. 1 is a schematic diagram of a front view structure of an embodiment of the present utility model;
FIG. 2 is a schematic rear view of an embodiment of the present utility model;
FIG. 3 is a schematic view of a frame mounting structure according to an embodiment of the present utility model;
FIG. 4 is a schematic view of the internal structure of a frame according to an embodiment of the present utility model;
fig. 5 is a schematic diagram of an internal structure of a chassis according to an embodiment of the present utility model.
In the figure: 1. a chassis; 2. a frame; 3. a partition plate; 4. a support plate; 5. a semiconductor refrigerator; 6. a water pump; 7. a delivery tube; 8. a condensing plate; 9. a connecting plate; 10. a return pipe; 11. an electromagnetic valve; 12. a fixing frame; 13. a fixing plate; 14. a liquid level window; 15. a water inlet pipe; 16. a plug; 17. a temperature sensor; 18. a heat dissipation fan; 19. ventilation holes; 20. a heat sink; 21. a U-shaped plate; 22. a dust-proof screen; 23. a water source heat pump; 24. and (3) mounting a plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
As shown in fig. 1-5, the water source heat pump unit with good heat dissipation effect comprises a case 1, wherein the back surface of the case 1 is movably connected with a frame 2, the middle part of the inner side surface of the frame 2 is fixedly connected with a baffle plate 3, the top of the inner side surface of the baffle plate 3 is fixedly connected with a supporting plate 4, and the upper surface of the supporting plate 4 is fixedly connected with a semiconductor refrigerator 5; the middle part fixedly connected with water pump 6 of diapire in the frame 2, the output fixedly connected with conveyer pipe 7 of water pump 6, the one end fixedly connected with condensation plate 8 of conveyer pipe 7, the surface fixedly connected with connecting plate 9 of condensation plate 8, connecting plate 9 are fixed connection with frame 2, the last fixed surface of condensation plate 8 is connected with back flow 10, the surface fixedly connected with solenoid valve 11 of back flow 10.
When the refrigerator is specifically used, through the arrangement of the partition plate 3, the semiconductor refrigerator 5, the water pump 6, the conveying pipe 7, the condensation plate 8 and the return pipe 10, the partition plate 3 divides the interior of the frame 2 into two using spaces, the support plate 4 supports and fixes the semiconductor refrigerator 5, the bottom of the refrigerator is convenient for placing cooling liquid, the semiconductor refrigerator 5 is electrified and then cools the cooling liquid, the conveying pipe 7 conveys the cooled cooling liquid to the interior of the condensation plate 8 through the water pump 6, the electric elements in the refrigerator 1 are cooled by utilizing the low temperature of the cooling liquid, the cooling efficiency is improved, the interior of the condensation plate 8 is a bent pipeline, the heat exchange efficiency can be improved, the cold air loss is slow, the connecting plate 9 is used for supporting and fixing the condensation plate 8, the return pipe 10 is opened through the electromagnetic valve 11, the cooling liquid returns to the interior of the frame 2 again, a return flow is formed, the condensation plate 8 can keep cool all the time, the continuous cooling treatment is carried out on the refrigerator 1, the heat dissipation efficiency is greatly improved, and the service life is prolonged.
In this embodiment, the back of the chassis 1 is fixedly connected with a fixing frame 12, the inside of the fixing frame 12 is movably connected with a fixing plate 13 through bolts, and the fixing plate 13 is fixedly connected with the frame 2.
When the fixing frame is specifically used, the fixing plate 13 is inserted into the fixing frame 12 on the back of the chassis 1 through the fixing frame 12, and is fixed through bolts, so that the frame 2 is convenient to mount and dismount, and is convenient to replace and maintain when damaged.
In this embodiment, the middle part at the back of the frame 2 is fixedly connected with a liquid level window 14, one side of the upper surface of the frame 2 is fixedly connected with a water inlet pipe 15, and the inside of the water inlet pipe 15 is movably connected with a plug 16.
When the cooling device is specifically used, through the arrangement of the liquid level window 14, the state of change of the cooling liquid in the frame 2 can be conveniently checked through the liquid level window 14, the cooling liquid amount can be conveniently added when the cooling liquid amount is small, the adjustment is convenient, and when water is required to be supplemented into the frame 2, the plug 16 can be pulled out.
In this embodiment, the temperature sensor 17 is fixedly connected to the inner top wall of the chassis 1.
When the intelligent heat dissipation device is specifically used, the temperature sensor 17 is a commonly used non-contact sensor and is electrically connected with the water pump 6 and the heat dissipation fan 18 through the arrangement of the temperature sensor 17, and the temperature change inside the case 1 is monitored in real time through infrared rays, so that the control device dissipates heat, and the intelligent degree of the device is increased.
In this embodiment, a heat dissipation fan 18 is fixedly connected to the middle of the outer surface of the partition plate 3, and ventilation holes 19 are formed in the inner wall of the case 1.
When the cooling fan is specifically used, through the arrangement of the cooling fan 18, the cooling fan 18 is started to be matched with the condensing plate 8 for use, and the generated cold air can be used for cooling and cooling the electrical components in the case 1, so that the cooling speed is accelerated, the cooling range is enlarged, the ventilation holes 19 are convenient for the cold air to blow into the case 1, and the ventilation of the cold air is kept.
In this embodiment, heat dissipation grooves 20 are formed on both sides of the outer surface of the chassis 1.
When the fan is particularly used, through the arrangement of the heat dissipation groove 20, the heat dissipation groove 20 is of an inclined structure, so that the case 1 can keep a ventilation state, heat dissipation is facilitated, and meanwhile dust entering is reduced.
In this embodiment, both sides of the outer surface of the chassis 1 are fixedly connected with a U-shaped plate 21, and a dust-proof screen 22 is inserted into the U-shaped plate 21.
When the dust-proof screen plate 22 is specifically used, the dust-proof screen plate 22 is clamped in the U-shaped plate 21, so that external dust can be prevented from entering the U-shaped plate 21, the dust-proof screen plate 22 is convenient to mount and dismount, cleaning and replacement are convenient after long-time use, and the dust is prevented from adsorbing the dust-proof screen plate 22 to influence heat dissipation of the device.
In this embodiment, the lower surface of the chassis 1 is fixedly connected with a water source heat pump 23, and both sides of the outer surface of the water source heat pump 23 are fixedly connected with mounting plates 24.
When the water source heat pump device is particularly used, through the arrangement of the mounting plates 24, the two mounting plates 24 are convenient to mount and fix the water source heat pump 23, so that the firmness and stability of the structure are improved.
Working principle: in use, the water source heat pump 23 is installed and fixed through the two mounting plates 24, the fixing plate 13 is inserted into the fixing frame 12 at the back of the chassis 1, the plug 16 is pulled out through the bolt fixing, cooling liquid is added into the chassis 2 through the water inlet pipe 15, the heat dissipation groove 20 enables the chassis 1 to keep in a ventilation state, dust-proof screen 22 prevents external dust from entering, the temperature sensor 17 monitors the temperature change in the chassis 1 in real time, when the temperature reaches a set value, the semiconductor refrigerator 5 is electrified to cool the cooling liquid, the conveying pipe 7 conveys the cooled cooling liquid into the condensation plate 8 through the water pump 6, the electric components in the chassis 1 are cooled by the low temperature of the cooling liquid, the heat dissipation fan 18 is started, the generated cold air cools the electric components in the chassis 1, the heat dissipation range is enlarged, the return pipe 10 is opened through the electromagnetic valve 11, the cooling liquid returns to the interior of the chassis 2 again, the condensation plate 8 can keep cool all the time, the chassis 1 is continuously cooled, and the service life is prolonged.
The foregoing has shown and described the basic principles and main features of the present utility model and the advantages of the present utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims (8)

1. The utility model provides a water source heat pump unit that radiating effect is good, includes quick-witted case (1), its characterized in that: the back of the case (1) is movably connected with a frame (2), the middle part of the inner side surface of the frame (2) is fixedly connected with a partition plate (3), the top of the inner side surface of the partition plate (3) is fixedly connected with a supporting plate (4), and the upper surface of the supporting plate (4) is fixedly connected with a semiconductor refrigerator (5);
the middle part fixedly connected with water pump (6) of diapire in frame (2), the output fixedly connected with conveyer pipe (7) of water pump (6), the one end fixedly connected with condensation plate (8) of conveyer pipe (7), the surface fixedly connected with connecting plate (9) of condensation plate (8), connecting plate (9) are fixed connection with frame (2), the last surface fixedly connected with back flow (10) of condensation plate (8), the surface fixedly connected with solenoid valve (11) of back flow (10).
2. The water source heat pump unit with good heat dissipation effect according to claim 1, wherein: the back of machine case (1) fixedly connected with mount (12), the inside of mount (12) is through bolt swing joint has fixed plate (13), fixed plate (13) are fixed connection with frame (2).
3. The water source heat pump unit with good heat dissipation effect according to claim 1, wherein: the middle part fixedly connected with liquid level window (14) at frame (2) back, one side fixedly connected with inlet tube (15) of frame (2) upper surface, the inside swing joint of inlet tube (15) has end cap (16).
4. The water source heat pump unit with good heat dissipation effect according to claim 1, wherein: the inner top wall of the case (1) is fixedly connected with a temperature sensor (17).
5. The water source heat pump unit with good heat dissipation effect according to claim 1, wherein: the middle part of baffle (3) surface fixedly connected with radiator fan (18), bleeder vent (19) have been seted up to the inner wall of quick-witted case (1).
6. The water source heat pump unit with good heat dissipation effect according to claim 1, wherein: both sides of the outer surface of the case (1) are provided with heat dissipation grooves (20).
7. The water source heat pump unit with good heat dissipation effect according to claim 1, wherein: both sides of the outer surface of the case (1) are fixedly connected with U-shaped plates (21), and dustproof screen plates (22) are inserted into the U-shaped plates (21).
8. The water source heat pump unit with good heat dissipation effect according to claim 1, wherein: the water source heat pump (23) is fixedly connected to the lower surface of the case (1), and mounting plates (24) are fixedly connected to two sides of the outer surface of the water source heat pump (23).
CN202322172599.4U 2023-08-11 2023-08-11 Water source heat pump unit with good heat dissipation effect Active CN220552127U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322172599.4U CN220552127U (en) 2023-08-11 2023-08-11 Water source heat pump unit with good heat dissipation effect

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322172599.4U CN220552127U (en) 2023-08-11 2023-08-11 Water source heat pump unit with good heat dissipation effect

Publications (1)

Publication Number Publication Date
CN220552127U true CN220552127U (en) 2024-03-01

Family

ID=90008067

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322172599.4U Active CN220552127U (en) 2023-08-11 2023-08-11 Water source heat pump unit with good heat dissipation effect

Country Status (1)

Country Link
CN (1) CN220552127U (en)

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