CN220545186U

CN220545186U - Improve circuit board structure that leads to the fact rosin joint easily in power brick welding

Info

Publication number: CN220545186U
Application number: CN202321453448.XU
Authority: CN
Inventors: 吴辉; 李麟
Original assignee: Changsha Quanbo Electronic Technology Co ltd
Current assignee: Changsha Quanbo Electronic Technology Co ltd
Priority date: 2023-06-08
Filing date: 2023-06-08
Publication date: 2024-02-27
Anticipated expiration: 2033-06-08

Abstract

The utility model discloses a circuit board structure for improving the easiness in causing virtual soldering in power brick soldering, which comprises a drilling structure, wherein the drilling structure comprises a drilling hole and a bonding pad, a through hole is arranged at the joint of the drilling hole and the bonding pad, the through hole is connected with the drilling hole, and the through hole is used for increasing the perimeter of the drilling hole and exhausting air flow generated during wave soldering. According to the utility model, the through hole is added at the joint of the drilling hole and the bonding pad, so that the perimeter of the drilling hole can be increased, the current carrying of the drilling structure is improved to a certain extent, the area of the solder paste can be increased, more solder paste can be obtained during wave soldering, and the welding reject ratio can be reduced; the via hole can also be used as an exhaust hole, heat generated by welding the solder paste without Kong Bofeng during wave soldering and air flow can be discharged upwards through the drill hole, so that the solder paste at the welding position is reduced and air bubbles are generated, and therefore virtual soldering is caused.

Description

Improve circuit board structure that leads to the fact rosin joint easily in power brick welding

Technical Field

The utility model relates to the field of power supplies, in particular to a circuit board structure for improving the easiness in causing virtual welding in power brick welding.

Background

With the development of high-performance computing and GPU applications, server power consumption is continuously increased, and a 48V power supply scheme of the board card is put into use. As server power design demands become larger, component densities become higher, and there is an increasing trend toward smaller and smaller size demands, 48V brick power supplies are increasingly being used. The brick power supply is a modularized power supply which is similar to brick and sealed and filled with glue, the packaging size of the full brick power supply in the prior art is 116.8X161×12.7mm, the packaging size of the half brick power supply (1/2 brick) is 61×57.9X12.7 mm, and the packaging size of the 1/4 brick power supply is 57.9X136.8X12.7 mm. The application of the DC/DC brick module with small volume, high power and high efficiency can simplify the design of the product and improve the reliability of the product. The welding effect of the brick can directly influence the performance of the brick module, and then the quality of the server is influenced.

In the prior art, the drilling structure connected with the power brick is easy to generate bubbles in the welding process to cause cold joint, and the cold joint can lead to the increase of welding reject ratio and has a certain influence on welding.

Disclosure of Invention

In order to solve the problems that the existing drilling structure for connecting the power bricks is easy to generate bubbles to cause cold joint in the welding process, the cold joint can cause the increase of welding reject ratio and has a certain influence on welding, the utility model provides a circuit board structure for improving the cold joint in the welding of the power bricks.

The technical scheme of the utility model is as follows:

a circuit board structure for improving the easy virtual welding in the welding of power bricks comprises a drilling structure connected with the power bricks, wherein the drilling structure comprises a drilling hole arranged in the middle and a bonding pad arranged at the periphery of the drilling hole,

and a through hole is arranged at the joint of the drilling hole and the bonding pad, the through hole is connected with the drilling hole, and the through hole is used for increasing the circumference of the drilling hole and exhausting air flow generated during wave soldering.

The utility model according to the above scheme is characterized in that the center of the through hole is arranged on the edge of the drilling hole.

The utility model according to the above scheme is characterized in that the number of the through holes is two.

The utility model according to the above scheme is characterized in that the two through holes are equally arranged at the joint of the drilling hole structure and the bonding pad.

The utility model according to the above scheme is characterized in that the number of the through holes is three.

The utility model according to the above aspect is characterized in that the diameter of the via hole is not less than 16mil.

The utility model according to the above scheme is characterized in that the diameter of the via hole is 18mil.

According to the scheme, the through holes are added at the connection positions of the drilling holes and the bonding pads, so that the perimeter of the drilling holes can be increased, the current carrying of the drilling structure is improved to a certain extent, the area of solder paste can be increased, more solder paste can be obtained during wave soldering, and the welding reject ratio can be reduced; the via hole can also be used as an exhaust hole, if the heat generated by welding the solder paste through Kong Bofeng is not set and the air flow can be discharged upwards through the drill hole during wave soldering, the solder paste at the welding position is reduced and the air bubble is generated, so that the virtual welding is caused, if the via hole is set, the air flow can be discharged through the via hole during wave soldering, the solder paste at the welding position cannot be lost, and the welding reject ratio can be reduced.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

fig. 2 is a top view of the present utility model.

In the drawings, the respective reference numerals are as follows:

1. drilling a hole structure; 11. drilling holes; 12. a bonding pad; 13. and (5) a via hole.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments.

It should be noted that the terms "comprising" and "having" and any variations thereof in the description and claims of the present utility model are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus. The term "disposed" and like terms are to be broadly interpreted, and may be fixedly connected, detachably connected, or integrally formed, for example; can be mechanically or electrically connected; either directly or indirectly, through intermediaries, or both, may be in communication with each other or in interaction with each other, unless expressly defined otherwise. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "rear", "bottom", etc. are directions or positions based on those shown in the drawings, and are merely for convenience of description, and are not to be construed as limiting the present technical solution.

As shown in fig. 1-2, a circuit board structure for improving the easiness of cold joint in power brick welding comprises a drilling structure 1 connected with a power brick, wherein the drilling structure 1 comprises a drilling hole 11 arranged in the middle and a bonding pad 12 arranged at the periphery of the drilling hole 11, a through hole 13 is arranged at the joint of the drilling hole 11 and the bonding pad 12, the through hole 13 is connected with the drilling hole 11, and the through hole 13 is used for increasing the circumference of the drilling hole 11 and exhausting air flow generated during wave soldering.

The drilling structure 1 with the same size as the pins of the power brick is easy to generate bubbles to cause cold joint in the welding process, the welding is influenced to a certain extent, the perimeter of the drilling structure 1 can be increased by adding the through holes 13 at the joint of the drilling 11 and the bonding pad 12, the current carrying of the drilling structure 1 is improved to a certain extent, the area of solder paste can be increased, more solder paste can be obtained during wave-soldering, and the welding reject ratio can be reduced.

The via hole 13 can also be used as an exhaust hole, if the via hole 13 is not arranged during wave soldering, heat generated by wave soldering solder paste and air flow can be discharged upwards through the drill hole 11, so that solder paste at a soldering position is reduced and air bubbles are generated, and therefore virtual soldering is caused, if the via hole 13 is arranged, air flow can be discharged through the via hole 13 during wave soldering, as shown in fig. 1, the solder paste at the soldering position cannot be lost due to the air bubbles and the solder paste, and the welding failure rate can be reduced.

The flow direction of hot gas flows from the bottom of the drilling structure 1 to the top of the drilling structure 1 in the wave soldering process, so that the exhaust effect is achieved, and the influence of cold joint caused by bubbles can be reduced.

In this embodiment, the center of the via hole 13 is disposed on the edge of the drill hole 11, which is set to increase the perimeter of the drill hole 11, improve the current carrying of the drill hole structure 11, increase the area of solder paste, obtain more solder paste during wave soldering, and reduce the reject ratio of soldering.

In the preferred embodiment, the number of the through holes 13 in the drilling structure 1 is two, that is, two through holes 13 are arranged on one drilling hole 11, and the through holes 13 are uniformly distributed at the connection position of the drilling hole 11 and the bonding pad 12. The two through holes 13 are added on the drilling holes 11 and the bonding pads 12, which is equivalent to reducing the size of part of the bonding pads 12 and changing the original packaging form.

In other alternative embodiments, the number of the through holes is three, so that the defective rate of welding can be improved better.

In this embodiment, the diameter of the via hole 13 is not smaller than 16mil, and too small a diameter of the via hole 13 may affect the up-down reflow, resulting in poor up-down reflow effect. In a preferred embodiment, the diameter of the via is 18 mils.

It will be understood that modifications and variations will be apparent to those skilled in the art from the foregoing description, and it is intended that all such modifications and variations be included within the scope of the following claims.

While the utility model has been described above with reference to the accompanying drawings, it will be apparent that the implementation of the utility model is not limited by the above manner, and it is within the scope of the utility model to apply the inventive concept and technical solution to other situations as long as various improvements made by the inventive concept and technical solution are adopted, or without any improvement.

Claims

1. A circuit board structure for improving the easy virtual welding in the welding of power bricks comprises a drilling structure connected with the power bricks, wherein the drilling structure comprises a drilling hole arranged in the middle and a bonding pad arranged at the periphery of the drilling hole,

2. The circuit board structure of claim 1, wherein the center of the via is disposed on the edge of the borehole.

3. The circuit board structure of claim 1, wherein the number of said vias is two.

4. A circuit board structure for improving easiness in cold joint in power brick bonding according to claim 3, wherein two through holes are equally arranged at the connection of said drilling holes and said bonding pads of said drilling structure.

5. The circuit board structure of claim 1, wherein the number of said vias is three.

6. The circuit board structure of claim 1, wherein said vias have a diameter of not less than 16 mils.

7. The circuit board structure of claim 6, wherein said vias have a diameter of 18 mils.