CN220543900U - Packaging structure of semiconductor device - Google Patents
Packaging structure of semiconductor device Download PDFInfo
- Publication number
- CN220543900U CN220543900U CN202322223524.4U CN202322223524U CN220543900U CN 220543900 U CN220543900 U CN 220543900U CN 202322223524 U CN202322223524 U CN 202322223524U CN 220543900 U CN220543900 U CN 220543900U
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- Prior art keywords
- heat
- semiconductor device
- fixedly connected
- box
- box body
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 230000017525 heat dissipation Effects 0.000 claims abstract description 22
- 238000001816 cooling Methods 0.000 claims abstract description 16
- 238000013016 damping Methods 0.000 claims abstract description 15
- 230000035939 shock Effects 0.000 claims description 15
- 238000009434 installation Methods 0.000 claims description 10
- 238000005538 encapsulation Methods 0.000 claims description 7
- 230000005855 radiation Effects 0.000 abstract description 17
- 238000010521 absorption reaction Methods 0.000 description 5
- 238000007789 sealing Methods 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 2
- 239000012785 packaging film Substances 0.000 description 2
- 229920006280 packaging film Polymers 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of semiconductor devices and discloses a packaging structure of a semiconductor device, which comprises two supporting seats, wherein the tops of the two supporting seats are fixedly connected with a packaging box body, the front surface of the packaging box body is provided with a heat dissipation mechanism, and the bottom of the packaging box body is provided with a damping mechanism. The heat dissipation mechanism includes: the cooling box is fixedly connected to the front face of the packaging box body, the top of the cooling box is fixedly connected with an inclined mounting plate, two cooling fans are mounted on the top of the inclined mounting plate, and the front face of the cooling box is hinged with a sliding door through a hinge. According to the packaging structure of the semiconductor device, heat in the packaging box body can be effectively discharged through the heat radiation fan arranged on the inclined mounting plate in the heat radiation mechanism, and the heat conduction plate arranged on the inner wall of the mounting frame body can effectively conduct out the heat to the lower side of the mounting frame body through the heat radiation holes.
Description
Technical Field
The utility model relates to the technical field of semiconductor devices, in particular to a packaging structure of a semiconductor device.
Background
With the development of electronic technology, the requirements for the packaging process of semiconductor terminal products are increasing. In the prior art, the common packaging process includes: the chip is placed in the shell, and then sealing glue is injected into the shell through an opening in the shell to realize sealing.
According to the Chinese patent "a packaging structure of a semiconductor device", and the publication number is: the patent comprises a bottom plate, wherein a frame shell is formed on the upper side edge of the bottom plate, a semiconductor chip is fixedly installed on the bottom plate, sealing glue is filled between the frame shell, the bottom plate and the semiconductor chip, a top cover is installed in the frame shell in a clearance fit manner, a plastic packaging film is fixedly installed on the lower side edge of the top cover, packaging holes are formed in the bottom plate, the plastic packaging film covers the semiconductor chip and is arranged in the packaging holes, transverse grooves are formed on the left side and the right side of the upper end of the frame shell, a lettering plate is installed between the two transverse grooves in a clearance fit manner, a lettering convex edge is formed on the bottom side of the lettering plate, sliding grooves are formed on the left side and the right side of the top cover, and the lettering plate is inserted into the sliding grooves in a clearance fit manner; the beneficial effects are that: the method can realize lettering operation while filling and sealing, has simple steps and accelerates the production efficiency of the semiconductor device.
However, in practical use, the semiconductor chip needs to be effectively cooled in the packaging box to ensure that the semiconductor chip can normally run for a long time, and in order to prevent the semiconductor chip from being bumped and fallen, a shockproof mechanism needs to be arranged on the semiconductor chip to buffer the semiconductor chip, so that the situation that the semiconductor chip is damaged is achieved, and therefore, a packaging structure of a semiconductor device is needed.
Disclosure of Invention
(one) solving the technical problems
In order to overcome the defects in the prior art, the utility model provides a packaging structure of a semiconductor device.
(II) technical scheme
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a packaging structure of semiconductor device, includes the supporting seat, the supporting seat has two, and two the top fixedly connected with encapsulation box of supporting seat, the front of encapsulation box is provided with heat dissipation mechanism, the bottom of encapsulation box is provided with damper.
Preferably, the heat dissipation mechanism includes: the cooling box, cooling box fixed connection is in the front of encapsulation box, the top fixedly connected with of cooling box is put the mounting panel to one side, two radiator fan are installed at the top of putting the mounting panel to one side, the front of cooling box articulates through the hinge has the sliding door, a plurality of bar hole has been seted up in the front of sliding door. The heat in the packaging box body can be effectively discharged through the heat radiation fan arranged on the inclined mounting plate in the heat radiation mechanism.
Preferably, the back fixedly connected with installation framework of radiating box, a plurality of louvre has been seted up to the bottom of installation framework, the inner wall of installation framework installs the heat-conducting plate. The heat conduction plate arranged on the inner wall of the installation frame body can effectively conduct heat to the lower side of the installation frame body through the heat dissipation holes.
Preferably, an ash removing device is arranged in the heat dissipation box. The ash removal device is arranged, so that ash removal work can be effectively carried out inside the heat dissipation box.
Preferably, the damping mechanism includes: the positioning block penetrates through the bottom of the packaging box body, and the top of the positioning block is fixedly connected with a damping plate. The positioning blocks and the damping plates in the damping mechanism are matched with each other, so that the damping protection can be effectively carried out on the semiconductor chip, the semiconductor chip is prevented from being impacted, and the damage can be reduced through buffering.
Preferably, the top of shock attenuation board fixedly connected with overhead stake, the semiconductor chip is installed through the installation axle to the top of overhead stake. Can effectually aerial semiconductor chip through setting up shock attenuation board and installation axle mutually supporting for can cooperate louvre and heat conduction board to carry out heat conduction work, make the semiconductor chip bottom can obtain effectual heat dissipation.
(III) beneficial effects
Compared with the prior art, the utility model provides a packaging structure of a semiconductor device, which has the following beneficial effects:
1. according to the packaging structure of the semiconductor device, heat in the packaging box body can be effectively discharged through the heat radiation fan arranged on the inclined mounting plate in the heat radiation mechanism, and the heat conduction plate arranged on the inner wall of the mounting frame body can effectively conduct out the heat to the lower side of the mounting frame body through the heat radiation holes.
2. This packaging structure of semiconductor device, locating piece and shock attenuation board mutually support through setting up damper and can effectively carry out shock attenuation protection to the semiconductor chip, prevent that it from receiving the striking, can cushion and reduce the damage, and its shock attenuation board and installation axle mutually support can effectually aerial semiconductor chip for can cooperate louvre and heat conduction board to carry out heat conduction work, make the semiconductor chip bottom can obtain effectual heat dissipation.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a perspective view of the present utility model;
FIG. 2 is a front cross-sectional view of the present utility model;
fig. 3 is a top cross-sectional view of the present utility model.
In the figure: 1. a support base; 2. packaging the box body; 3. a heat dissipation mechanism; 4. a damping mechanism; 301. a heat radiation box; 302. a heat radiation fan; 303. a bar-shaped hole; 304. a mounting plate is obliquely arranged; 305. installing a frame body; 306. a heat radiation hole; 307. a heat conductive plate; 308. an ash removal device; 401. a positioning block; 402. a shock absorbing plate; 403. overhead piles; 404. a mounting shaft; 405. a semiconductor chip.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Example 1
As shown in fig. 1-3, the utility model provides a packaging structure of a semiconductor device, which comprises two supporting seats 1, wherein the top parts of the two supporting seats 1 are fixedly connected with a packaging box body 2, the front surface of the packaging box body 2 is provided with a heat dissipation mechanism 3, and the bottom of the packaging box body 2 is provided with a damping mechanism 4. Preferably, the heat dissipation mechanism 3 includes: the cooling box 301, cooling box 301 fixed connection is in the front of encapsulation box 2, and the top fixedly connected with of cooling box 301 is put mounting panel 304 to one side, and two radiator fan 302 are installed at the top of putting mounting panel 304 to one side, and the front of cooling box 301 has the sliding door through the hinge, and a plurality of bar hole 303 has been seted up in the front of sliding door. The heat in the package box 2 can be effectively discharged by providing the heat radiation fan 302 on the inclined mounting plate 304 in the heat radiation mechanism 3. Preferably, the back of the heat dissipation box 301 is fixedly connected with a mounting frame 305, a plurality of heat dissipation holes 306 are formed in the bottom of the mounting frame 305, and a heat conduction plate 307 is mounted on the inner wall of the mounting frame 305. The heat conduction plate 307 attached to the inner wall of the mounting frame 305 can effectively conduct heat to the lower side of the mounting frame 305 through the heat radiation holes 306. Preferably, the heat dissipation box 301 is provided with an ash removal device 308 inside. The ash removal device 308 can effectively remove ash from the heat dissipation case 301.
In this embodiment, the heat in the packaging box 2 can be effectively discharged by arranging the heat dissipating fan 302 on the inclined mounting plate 304 in the heat dissipating mechanism 3, and the heat conducting plate 307 mounted on the inner wall of the mounting frame 305 can effectively conduct out the heat to the lower side of the mounting frame 305 through the heat dissipating holes 306.
Example 2
As shown in fig. 1-3, on the basis of embodiment 1, the present utility model provides a technical solution: preferably, the damper mechanism 4 includes: the positioning block 401, the positioning block 401 is fixedly penetrated through the bottom of the packaging box body 2, and the top of the positioning block 401 is fixedly connected with a damping plate 402. The positioning block 401 and the damping plate 402 in the damping mechanism 4 are matched with each other, so that the semiconductor chip 405 can be effectively damped and protected, the semiconductor chip is prevented from being impacted, and the damage can be reduced through buffering. Preferably, the top of the shock absorbing plate 402 is fixedly connected with an overhead pile 403, and the top of the overhead pile 403 is mounted with a semiconductor chip 405 through a mounting shaft 404. Through setting up shock attenuation board 402 and installation axle 404 mutually support can effectually aerial semiconductor chip 405 for can cooperate louvre 306 and heat conduction board 307 to carry out heat conduction work, make the semiconductor chip 405 bottom can obtain effectual heat dissipation.
In this embodiment, the positioning block 401 and the damping plate 402 in the damping mechanism 4 are matched with each other to effectively damp and protect the semiconductor chip 405 from being impacted, so that the impact is buffered and damage is reduced, and the damping plate 402 and the mounting shaft 404 are matched with each other to effectively overhead the semiconductor chip 405, so that the heat conducting operation can be performed by matching the heat dissipation hole 306 and the heat conducting plate 307, and the bottom of the semiconductor chip 405 can be effectively dissipated.
The following specifically describes the operation of the package structure of the semiconductor device.
As shown in fig. 1-3, when in use, firstly, heat in the packaging box 2 can be effectively discharged by arranging the heat radiation fan 302 on the inclined mounting plate 304 in the heat radiation mechanism 3, and the heat conduction plate 307 arranged on the inner wall of the mounting frame 305 can effectively guide out heat to the lower side of the mounting frame 305 through the heat radiation holes 306; then, the shock absorption protection can be effectively carried out on the semiconductor chip 405 by arranging the positioning block 401 and the shock absorption plate 402 in the shock absorption mechanism 4 to be mutually matched, the shock absorption protection is prevented from being impacted, the damage can be reduced by buffering, the shock absorption plate 402 and the mounting shaft 404 can be mutually matched to effectively overhead the semiconductor chip 405, the heat conduction operation can be carried out by matching the heat dissipation holes 306 and the heat conduction plate 307, and the bottom of the semiconductor chip 405 can be effectively dissipated.
Claims (6)
1. The package structure of a semiconductor device, including the supporting seat (1), its characterized in that: the packaging box comprises two supporting seats (1), wherein the top of each supporting seat (1) is fixedly connected with a packaging box body (2), a heat dissipation mechanism (3) is arranged on the front surface of each packaging box body (2), and a damping mechanism (4) is arranged at the bottom of each packaging box body (2).
2. The package structure of a semiconductor device according to claim 1, wherein: the heat dissipation mechanism (3) includes: the cooling box (301), cooling box (301) fixed connection is in the front of encapsulation box (2), the top fixedly connected with of cooling box (301) put mounting panel (304) to one side, two radiator fan (302) are installed at the top of putting mounting panel (304) to one side, the front of cooling box (301) articulates through the hinge has the sliding door, a plurality of bar hole (303) have been seted up in the front of sliding door.
3. The package structure of a semiconductor device according to claim 2, wherein: the back of radiating box (301) fixedly connected with installs framework (305), a plurality of louvre (306) have been seted up to the bottom of installing framework (305), heat-conducting plate (307) are installed to the inner wall of installing framework (305).
4. A package structure of a semiconductor device according to claim 3, wherein: an ash removing device (308) is arranged in the heat dissipation box (301).
5. The package structure of a semiconductor device according to claim 1, wherein: the damper mechanism (4) includes: the positioning block (401), the bottom of encapsulation box (2) is run through to positioning block (401) is fixed, the top fixedly connected with shock attenuation board (402) of positioning block (401).
6. The package structure of a semiconductor device according to claim 5, wherein: the top of shock attenuation board (402) fixedly connected with overhead stake (403), semiconductor chip (405) are installed through installation axle (404) in the top of overhead stake (403).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322223524.4U CN220543900U (en) | 2023-08-18 | 2023-08-18 | Packaging structure of semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322223524.4U CN220543900U (en) | 2023-08-18 | 2023-08-18 | Packaging structure of semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220543900U true CN220543900U (en) | 2024-02-27 |
Family
ID=89965506
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322223524.4U Active CN220543900U (en) | 2023-08-18 | 2023-08-18 | Packaging structure of semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220543900U (en) |
-
2023
- 2023-08-18 CN CN202322223524.4U patent/CN220543900U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |