CN220536668U - Semiconductor conveying unit module - Google Patents
Semiconductor conveying unit module Download PDFInfo
- Publication number
- CN220536668U CN220536668U CN202322268218.2U CN202322268218U CN220536668U CN 220536668 U CN220536668 U CN 220536668U CN 202322268218 U CN202322268218 U CN 202322268218U CN 220536668 U CN220536668 U CN 220536668U
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- Prior art keywords
- unit module
- semiconductor
- cam follower
- module according
- placing
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 238000001179 sorption measurement Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000009434 installation Methods 0.000 claims description 10
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000000429 assembly Methods 0.000 abstract description 3
- 230000000712 assembly Effects 0.000 abstract description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 101000838411 Homo sapiens Tubulin epsilon chain Proteins 0.000 description 1
- 102100028984 Tubulin epsilon chain Human genes 0.000 description 1
- 238000007792 addition Methods 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005056 compaction Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides a semiconductor conveying unit module, which comprises a mounting cross rod, and is characterized in that an annular conveying belt capable of rotating is arranged on the mounting cross rod, a plurality of placing die holders for placing chips are detachably arranged on the annular conveying belt and are uniformly distributed, vacuum adsorption holes for adsorbing semiconductors are formed in the placing die holders, and a plurality of pressing assemblies for assisting in pressing the placing die holders are further arranged on the mounting cross rod.
Description
Technical Field
The utility model belongs to the technical field of semiconductors, and relates to a semiconductor conveying unit module.
Background
In the semiconductor field, output modes of chips generally adopt TUBE TUBEs, TRAY discs, braids and the like; according to different product output requirements, when the product output mode is TRAY disk, the product is accurately placed in the corresponding position of TRAY disk by using a transfer module or a transfer gripper; in the turret type semiconductor sorting machine, a specific module is needed to connect the turret and the TRAY by adopting a turret mode, so that a semiconductor conveying unit module is designed, and the semiconductor conveying unit module can convey products with larger sizes, can realize long-distance operation and can meet the requirement of switching product models with different sizes.
Disclosure of Invention
The present utility model is directed to solving the above-mentioned problems of the prior art and providing a semiconductor transportation unit module.
The aim of the utility model can be achieved by the following technical scheme: the utility model provides a semiconductor conveying unit module, includes the installation horizontal pole, its characterized in that, be provided with rotatable annular conveyer belt on the installation horizontal pole, a plurality of die holders of placing that are used for placing the chip are installed through detachable mode on the annular conveyer belt, and place the die holder and be evenly distributed, place the vacuum adsorption hole that has to be used for adsorbing the semiconductor on the die holder, still be provided with on the installation horizontal pole and be used for assisting compressing tightly a plurality of compression components of placing the die holder.
The pressing assembly comprises a cam follower, a cam follower support, a sliding block, a guide rail and a spring, wherein the sliding block is arranged on the mounting cross rod through a fixed seat, the guide rail is vertically and slidably connected to the guide rail, the cam follower support is connected with the guide rail, the cam follower is rotatably arranged on the cam follower support, the spring is arranged between the fixed seat and the cam follower support, the upper end of the spring abuts against the fixed seat, and the lower end of the spring abuts against the cam follower support; under the action of the elastic force of the spring, the cam follower can be propped against the placing die holder.
The device is characterized in that a power motor is arranged at one end of the mounting cross rod, the end part of an output shaft of the power motor is connected with the driving wheel, the other end of the mounting cross rod is connected with the driven wheel through a tensioning and adjusting mechanism, and the annular conveying belt is sleeved between the driving wheel and the driven wheel.
The mounting plate is installed to installation horizontal pole one end, install the sensor on the mounting plate.
The sensor is a correlation sensor.
The tensioning adjustment mechanism comprises a connecting guide seat, an adjusting support and an adjusting bolt, wherein the connecting guide seat is fixed at the other end of the mounting cross rod, the driven wheel is rotatably mounted at one end of the adjusting support, the other end of the adjusting support is connected with the connecting guide seat in a sliding mode, the adjusting bolt is in threaded connection with the connecting guide seat, and the end portion of the adjusting bolt abuts against the end face of the other end of the adjusting support.
The other end of the adjusting bracket is also provided with a strip-shaped hole, the connecting guide seat is well provided with a threaded hole, and the strip-shaped hole and the threaded hole are internally provided with fastening bolts.
And one end of the mounting cross rod is also connected with a base.
The base is a position-adjustable base.
And the middle part of the mounting cross rod is also connected with supporting legs.
Compared with the prior art, the semiconductor conveying unit module has the advantages that:
1. vacuum adsorption and high stability;
2. different types of products can be switched according to different products;
3. the annular conveying belt is adopted for conveying the semiconductors, so that the efficiency is high;
4. and the laser sensor is adopted, so that the in-place precision is high.
Drawings
FIG. 1 is a schematic plan view of the present utility model;
FIG. 2 is a schematic perspective view of the present utility model;
FIG. 3 is a schematic perspective view of a removed portion of the present utility model;
FIG. 4 is a schematic perspective view of the tensioning adjustment mechanism of the present utility model;
FIG. 5 is an exploded view of the compression assembly of the present utility model;
FIG. 6 is a schematic perspective view of a placement die holder according to the present utility model;
in the figure, 1, a cross bar is installed; 2. a mounting plate; 3. placing a die holder; 3a, vacuum adsorption holes; 3b, vacuum flow channel; 4. driven wheel; 5. adjusting the bracket; 5a, a strip-shaped hole; 6. an endless conveyor belt; 7. a connecting guide seat; 7a, a threaded hole; 8. a base; 9. support legs; 10. a power motor; 11. a driving wheel; 12. a cam follower support; 13. a cam follower; 14. a sensor; 15. a fixing seat; 16. a slide block; 17. a guide rail; 18. a fastening bolt; 19. an adjusting bolt; 20. and (3) a spring.
Detailed Description
The following are specific embodiments of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these embodiments.
As shown in fig. 1-6, the semiconductor conveying unit module comprises a mounting cross rod 1, wherein an annular conveying belt 6 capable of rotating is arranged on the mounting cross rod 1, a plurality of placing die holders 3 for placing chips are detachably arranged on the annular conveying belt 6, the placing die holders 3 can be conveniently disassembled and assembled, and different types of products can be switched according to different products; in this embodiment, the semiconductor is placed in the placement die holder 3 upside down; the placing die holder 3 is uniformly distributed, the placing die holder 3 is provided with vacuum adsorption holes 3a for adsorbing the semiconductor, in practice, the vacuum adsorption holes 3a can realize a vacuum state by adopting the prior art, the inside of the placing die holder 3 is also provided with a vacuum runner 3b communicated with the vacuum adsorption holes 3a, and the vacuum adsorption holes 3a can firmly adsorb the product through vacuum, so that the adsorption stability of the product is high; the installation cross bar 1 is also provided with a plurality of compaction components for assisting in compacting and placing the die holder 3.
The pressing assembly comprises a cam follower 13, a cam follower support 12, a sliding block 16, a guide rail 17 and a spring 20, wherein the sliding block 16 is arranged on the mounting cross rod 1 through a fixed seat 15, the guide rail 17 is vertically and slidably connected to the guide rail 17, the cam follower support 12 is connected with the guide rail 17, the cam follower 13 is rotatably arranged on the cam follower support 12, the spring 20 is arranged between the fixed seat 15 and the cam follower support 12, the upper end of the spring 20 is abutted against the fixed seat 15, and the lower end of the spring 20 is abutted against the cam follower support 12; under the action of the elasticity of the spring 20, the cam follower 13 can be propped against the placing die holder 3; in practice, a group of pressing assemblies is arranged at the placing position, and the material taking position is arranged at the position, because a plurality of semiconductors are sucked at the same time, a plurality of groups of pressing assemblies are arranged at the position, and the material taking position are provided with pressing devices which adopt a sliding block 16, a guide rail 17, a spring 20 and a cam follower 13 to enable the placing die holder 3 at the position to be in a fixed state; the attachment of the placement die holder 3 to the endless conveyor 6 inevitably generates a jump.
One end of the mounting cross bar 1 is provided with a power motor 10, and in practice, the power motor 10 is a servo motor; the end part of the output shaft of the power motor 10 is connected with a driving wheel 11, the other end of the mounting cross rod 1 is connected with a driven wheel 4 through a tensioning and adjusting mechanism, and the annular conveying belt 6 is sleeved between the driving wheel 11 and the driven wheel 4.
One end of the mounting cross bar 1 is provided with a mounting plate 2, and the mounting plate 2 is provided with a sensor 14; the sensor 14 is an correlation sensor, and in this embodiment, the correlation sensor is an existing product, so that the accuracy of each discharging position is ensured.
The tensioning and adjusting mechanism comprises a connecting guide seat 7, an adjusting bracket 5 and an adjusting bolt 19, wherein the connecting guide seat 7 is fixed at the other end of the mounting cross rod 1, the driven wheel 4 is rotatably mounted at one end of the adjusting bracket 5, the other end of the adjusting bracket 5 is slidably connected with the connecting guide seat 7, the adjusting bolt 19 is in threaded connection with the connecting guide seat 7, and the end part of the adjusting bolt 19 abuts against the end surface of the other end of the adjusting bracket 5; the other end of the adjusting bracket 5 is also provided with a bar-shaped hole 5a, the connecting guide seat 7 is provided with a threaded hole 7a, and the bar-shaped hole 5a and the threaded hole 7a are internally provided with a fastening bolt 18; with the adoption of the structure, the position of the driven wheel 4 can be adjusted by rotating the adjusting bolt 19, so that the annular conveyer belt 6 can be conveniently tensioned; in the present embodiment, the primary pulley 11 and the secondary pulley 4 are both synchronous pulleys.
The installation horizontal pole 1 one end still is connected with base 8, and base 8 is the adjustable base of position, and in practice, this can adopt current structure, can be according to the blowing position, the front and back left and right sides position of adjustment semiconductor transport unit module.
The middle part of the installation cross bar 1 is also connected with supporting legs 9, which carry out certain auxiliary supporting operation.
In practice, the semiconductor transport unit module is connected to the frame of the whole apparatus via a base 8 and is supported to the ground via support legs 9.
Working principle: the turret suction nozzle discharges materials to the discharging position of the annular conveying belt 6, the annular conveying belt 6 is driven by the power motor 10, products are moved to a certain position, and the chips are placed in the TRAY disc by the transfer grippers; the correlation sensor is adopted, so that the precision of each discharging position is ensured; the reciprocating type conveying device has the advantages that the reciprocating type conveying device is annular in motion, products can be conveyed all the time, and the problem of low production efficiency of reciprocating motion is solved greatly.
All the components are general standard components or components known to the person skilled in the art, and the structures and principles of the components are known to the person skilled in the art through technical manuals or through routine experimental methods.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the utility model. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the utility model or exceeding the scope of the utility model as defined in the accompanying claims.
Claims (10)
1. The utility model provides a semiconductor conveying unit module, includes installation horizontal pole (1), its characterized in that, be provided with on installation horizontal pole (1) annular conveyer belt (6) that can rotate, install a plurality of die holders (3) of placing that are used for placing the chip through detachable mode on annular conveyer belt (6), and place die holder (3) and be evenly distributed, place have on die holder (3) and be used for adsorbing vacuum adsorption hole (3 a) of semiconductor, still be provided with on installation horizontal pole (1) and be used for assisting compressing tightly a plurality of compression components of placing die holder (3).
2. A semiconductor transfer unit module according to claim 1, wherein the pressing assembly comprises a cam follower (13), a cam follower support (12), a slider (16), a guide rail (17) and a spring (20), wherein the slider (16) is mounted on the mounting cross bar (1) through a fixing seat (15), the guide rail (17) is vertically and slidingly connected on the guide rail (17), the cam follower support (12) is connected with the guide rail (17), the cam follower (13) is rotatably mounted on the cam follower support (12), the spring (20) is mounted between the fixing seat (15) and the cam follower support (12), the upper end of the spring (20) is abutted against the fixing seat (15), and the lower end of the spring (20) is abutted against the cam follower support (12); under the elastic force of the spring (20), the cam follower (13) can be propped against the placing die holder (3).
3. The semiconductor conveying unit module according to claim 1, wherein a power motor (10) is installed at one end of the mounting cross bar (1), the end part of an output shaft of the power motor (10) is connected with the driving wheel (11), the other end of the mounting cross bar (1) is connected with the driven wheel (4) through a tensioning and adjusting mechanism, and the annular conveying belt (6) is sleeved between the driving wheel (11) and the driven wheel (4).
4. A semiconductor transfer unit module according to claim 1, characterized in that the mounting rail (1) is provided with a mounting plate (2) at one end, and that the mounting plate (2) is provided with a sensor (14).
5. A semiconductor transfer unit module according to claim 4, wherein the sensor (14) is an correlation sensor.
6. A semiconductor conveying unit module according to claim 3, characterized in that the tensioning adjustment mechanism comprises a connecting guide seat (7), an adjusting bracket (5) and an adjusting bolt (19), the connecting guide seat (7) is fixed at the other end of the mounting cross bar (1), the driven wheel (4) is rotatably mounted at one end of the adjusting bracket (5), the other end of the adjusting bracket (5) is slidably connected with the connecting guide seat (7), the adjusting bolt (19) is in threaded connection with the connecting guide seat (7), and the end part of the adjusting bolt (19) abuts against the end surface of the other end of the adjusting bracket (5).
7. The semiconductor conveying unit module according to claim 6, wherein a strip-shaped hole (5 a) is further formed in the other end of the adjusting bracket (5), a threaded hole (7 a) is formed in the connecting guide seat (7), and a fastening bolt (18) is arranged in the strip-shaped hole (5 a) and the threaded hole (7 a).
8. A semiconductor transfer unit module according to claim 1, wherein one end of the mounting rail (1) is further connected with a base (8).
9. A semiconductor transfer unit module according to claim 8, wherein the base (8) is a position-adjustable base.
10. A semiconductor transfer unit module according to claim 9, characterized in that the middle part of the mounting rail (1) is further connected with support legs (9).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322268218.2U CN220536668U (en) | 2023-08-22 | 2023-08-22 | Semiconductor conveying unit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322268218.2U CN220536668U (en) | 2023-08-22 | 2023-08-22 | Semiconductor conveying unit module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220536668U true CN220536668U (en) | 2024-02-27 |
Family
ID=89964629
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322268218.2U Active CN220536668U (en) | 2023-08-22 | 2023-08-22 | Semiconductor conveying unit module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220536668U (en) |
-
2023
- 2023-08-22 CN CN202322268218.2U patent/CN220536668U/en active Active
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