CN220532290U - Automatic picking device for semiconductor - Google Patents
Automatic picking device for semiconductor Download PDFInfo
- Publication number
- CN220532290U CN220532290U CN202322121631.6U CN202322121631U CN220532290U CN 220532290 U CN220532290 U CN 220532290U CN 202322121631 U CN202322121631 U CN 202322121631U CN 220532290 U CN220532290 U CN 220532290U
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- piece
- detection
- receiving frame
- pushing
- base
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 21
- 238000001514 detection method Methods 0.000 claims abstract description 56
- 239000000463 material Substances 0.000 claims abstract description 56
- 238000007599 discharging Methods 0.000 claims abstract description 21
- 238000003466 welding Methods 0.000 abstract description 26
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000008439 repair process Effects 0.000 abstract description 5
- 238000000034 method Methods 0.000 description 10
- 230000009471 action Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011895 specific detection Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The utility model provides an automatic semiconductor picking device, which relates to the technical field of semiconductor manufacturing and comprises a base and two supporting pieces arranged on the base, wherein a first connecting piece is arranged between the two supporting pieces, and a detecting piece is arranged on the first connecting piece; the base is provided with a discharging piece through a second connecting piece, and a detection groove is formed in the discharging piece and is used for placing diode materials; the detection piece comprises a first detection head and a second detection head; the first connecting piece is provided with a first pushing piece and a second pushing piece; the first pushing piece is driven by a first cylinder, and the second pushing piece is driven by a second cylinder; the first detection head is in signal connection with the first air cylinder, the second detection head is in signal connection with the second air cylinder, and the diode material can be rapidly sorted and discharged at the position of failed concrete welding through the arrangement of the first pushing piece and the second pushing piece, so that the subsequent repair welding operation on the portion of failed welding is facilitated.
Description
Technical Field
The utility model relates to the technical field of semiconductor manufacturing, in particular to an automatic semiconductor picking device.
Background
In the process of semiconductor production, samples after production need to be detected, wherein diode materials need to be detected on the welded parts of the diodes in the process of detection.
In the prior art, detection equipment is often adopted to detect two ends of diode welding, but after detection is completed, the diode welding parts cannot be further classified according to the specific problem of the diode, so that the problem of inconvenient subsequent production of the diode is caused.
For this purpose, an automatic semiconductor picking device is proposed.
Disclosure of Invention
(one) solving the technical problems
Aiming at the defects of the prior art, the utility model provides an automatic semiconductor picking device, which solves the problem that a diode cannot be further classified according to a welding part of the diode, which is particularly problematic, after the detection of the diode is completed.
(II) technical scheme
In order to achieve the above purpose, the utility model is realized by the following technical scheme:
the utility model discloses an automatic semiconductor picking device, which comprises a base and two supporting pieces arranged on the base, wherein a first connecting piece is arranged between the two supporting pieces, and a detecting piece is arranged on the first connecting piece;
the base is provided with a discharging piece through a second connecting piece, and a detection groove is formed in the discharging piece and is used for placing diode materials;
the detection piece comprises a first detection head and a second detection head;
the first connecting piece is provided with a first pushing piece and a second pushing piece;
the first pushing piece is driven by a first cylinder, and the second pushing piece is driven by a second cylinder;
the first detection head is in signal connection with the first air cylinder, and the second detection head is in signal connection with the second air cylinder.
Further, one of the support pieces is provided with a first support plate, the first support plate is provided with a first receiving frame, the other support piece is provided with a second support plate, the second support plate is provided with a second receiving frame, and the first receiving frame and the second receiving frame are all installed in a detachable mode.
Further, a third material receiving frame is placed on the base, and the third material receiving frame is located under the material discharging piece.
Further, the detection grooves are arranged in a plurality of groups, and the detection grooves are distributed on the discharging piece at equal intervals.
Further, the discharging piece is rotationally connected with the second connecting piece through a rotating shaft, the rotating shaft provides driving force through a driving motor, and the first pushing piece and the second pushing piece are both sleeved on the first connecting piece in a sliding mode.
Further, a controller is installed on the base and used for controlling the operation of the whole device.
(III) beneficial effects
The utility model provides an automatic semiconductor picking device. Compared with the prior art, the method has the following beneficial effects:
1. through the setting of first impeller and second impeller, can be fast with the specific disqualified position of welding of diode material quick sorting ejection of compact, be convenient for follow-up repair welding operation that welds disqualified part.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic view of a semiconductor automatic picking device;
fig. 2 is a schematic view of the placement member of fig. 1.
Reference numerals:
10. a base; 11. a support; 12. a first connector; 13. a first support plate; 131. a first material receiving frame; 14. a second support plate; 141. a second material receiving frame; 15. a third material receiving frame; 20. a discharging piece; 201. a rotating shaft; 202. a detection groove; 21. a second connector; 30. a first pusher; 31. a first cylinder; 40. a second pusher; 41. a second cylinder; 50. a diode material; 60. a detecting member; 601. a first detection head; 602. and a second detection head.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more clear, the technical solutions in the embodiments of the present utility model are clearly and completely described, and it is obvious that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
According to the semiconductor automatic picking device, the problem that after diode detection is completed, the diode cannot be further classified according to the welding part of the diode, which is particularly problematic, is solved.
The technical scheme in the embodiment of the application aims to solve the technical problems, and the overall thought is as follows:
1-2, the automatic semiconductor picking device comprises a base and two supporting pieces arranged on the base, wherein a first connecting piece is arranged between the two supporting pieces, and a detecting piece is arranged on the first connecting piece;
the base is provided with a discharging piece through a second connecting piece, and a detection groove is formed in the discharging piece and is used for placing diode materials;
the detection piece comprises a first detection head and a second detection head;
the first connecting piece is provided with a first pushing piece and a second pushing piece;
the first pushing piece is driven by a first cylinder, and the second pushing piece is driven by a second cylinder;
the first detection head is in signal connection with the first air cylinder, and the second detection head is in signal connection with the second air cylinder;
through the arrangement of the first pushing piece and the second pushing piece, the positions of the diode materials, which are unqualified in specific welding, can be quickly sorted and discharged, and the subsequent repair welding operation on the unqualified parts is convenient to carry out
In order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.
Examples:
1-2, the automatic semiconductor picking device comprises a base 10 and two supporting pieces 11 arranged on the base 10, wherein a controller is arranged on the base 10, a first connecting piece 12 is arranged between the two supporting pieces 11, and a detecting piece 60 is arranged on the first connecting piece 12;
the base 10 is provided with a discharging piece 20 through a second connecting piece 21, a detection groove 202 is formed in the discharging piece 20, and the detection groove 202 is used for placing the diode material 50;
the detecting member 60 includes a first detecting head 601 and a second detecting head 602;
the first connecting piece 12 is provided with a first pushing piece 30 and a second pushing piece 40
The first pushing member 30 is driven by a first cylinder 31, and the second pushing member 40 is driven by a second cylinder 41;
the first detection head 601 is in signal connection with the first cylinder 31, and the second detection head 602 is in signal connection with the second cylinder 41.
In use, the diode material 50 is placed in the detection groove 202, and at this time, as shown in fig. 2, the state of the detection groove 202 in the discharging part 20 is that the first detection head 601 on the detection part 60 is first located at the welding position of the diode material 50 below the first detection head 601 for detection.
The discharging part 20 is rotationally connected with the second connecting part 21 through a rotating shaft 201, and the rotating shaft 201 provides driving force through a driving motor;
the first pushing member 30 and the second pushing member 40 are both slidably sleeved on the first connecting member 12;
the detecting grooves 202 are provided with a plurality of groups, the detecting grooves 202 are distributed on the discharging piece 20 at equal intervals, and the detecting efficiency can be improved by arranging the detecting grooves 202.
One of the supporting pieces 11 is provided with a first supporting plate 13, the first supporting plate 13 is provided with a first material receiving frame 131, the other supporting piece 11 is provided with a second supporting plate 14, the second supporting plate 14 is provided with a second material receiving frame 141, and the first material receiving frame 131 and the second material receiving frame 141 are both detachably installed;
a third material receiving frame 15 is placed on the base 10, and the third material receiving frame 15 is located right below the discharging piece 20.
The results after specific detection are divided into the following conditions, the first: if the first detection head 601 detects that the left end portion is welded to be qualified, the second detection head 602 detects a welding position of the diode material 50 below the second detection head 602, if the detection is qualified, the welding positions of the two ends of the diode material 50 are qualified, at this time, the discharging part 20 is controlled to rotate, the detected diode material 50 falls into the third receiving frame 15, and the diode material 50 with the two ends being welded to be qualified is collected in the third receiving frame 15;
second case: if the first detection head 601 detects that the welding at the left end is unqualified, the second pushing member 40 pushes the detected diode material 50 under the action of the second cylinder 41, the diode material 50 with the unqualified welding at the left end falls into the first receiving frame 131, and the diode material 50 with the unqualified welding at the left end or the unqualified welding at both ends is collected in the first receiving frame 131;
in the third case, if the first detection head 601 detects that the welding of the left end portion is qualified, the second detection head 602 detects the welding portion of the diode material 50 located below the second detection head 602, if the second detection head 602 fails to pass the right end portion of the diode material 50, the first pushing member 30 pushes the detected diode material 50 under the action of the first cylinder 31 at this time, the diode material 50 whose right end portion fails to pass the welding of the left end portion falls into the second receiving frame 141, and the diode material 50 whose right end portion fails to pass the welding of the left end portion is collected in the second receiving frame 141.
Through the arrangement of the first pushing piece 30 and the second pushing piece 40, the positions of the diode materials 50, which are unqualified in specific welding, can be rapidly sorted and discharged, and the subsequent repair welding operation on the unqualified parts is facilitated.
On the basis of the second situation, after the detection of the diode material 50 to be detected is completed, after the diode material 50 collected in the second receiving frame 141 and the third receiving frame 15 is transferred, the unqualified left end part or both unqualified left end parts collected in the first receiving frame 131 are replaced in the detection groove 202 to detect, at this time, the diode materials 50 in the first receiving frame 131 are arranged in sequence, so that one end of the diode material 50 in the first receiving frame 131, which is not yet detected, can be quickly placed below the first detection head 601 to detect, and similarly, if the diode material 50 is not qualified, the second pushing member 40 pushes the diode material 50 into the first receiving frame 131, if the diode material 50 is qualified, the first pushing member 30 pushes the diode material 50 into the second receiving frame 141, at this time, the diode material 50 with both unqualified left end parts in the first receiving frame 131 is the unqualified diode material 50 in the first receiving frame 131.
Through the setting of first receipts material frame 131, second receipts material frame 141 and third receipts material frame 15, can control the putting that the material dropped, be convenient for follow-up arrangement work.
In summary, compared with the prior art, the method has the following beneficial effects:
1. through the arrangement of the first pushing piece 30 and the second pushing piece 40, the positions of the diode materials 50, which are unqualified in specific welding, can be rapidly sorted and discharged, and the subsequent repair welding operation on the unqualified parts is facilitated.
2. Through the setting of first receipts material frame 131, second receipts material frame 141 and third receipts material frame 15, can control the putting that the material dropped, be convenient for follow-up arrangement work.
It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.
The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (6)
1. The automatic semiconductor picking device is characterized by comprising a base (10) and two supporting pieces (11) arranged on the base (10), wherein a first connecting piece (12) is arranged between the two supporting pieces (11), and a detecting piece (60) is arranged on the first connecting piece (12);
the base (10) is provided with a discharging piece (20) through a second connecting piece (21), a detection groove (202) is formed in the discharging piece (20), and the detection groove (202) is used for placing a diode material (50);
the detecting piece (60) comprises a first detecting head (601) and a second detecting head (602);
the first connecting piece (12) is provided with a first pushing piece (30) and a second pushing piece (40);
the first pushing piece (30) is driven by a first air cylinder (31), and the second pushing piece (40) is driven by a second air cylinder (41);
the first detection head (601) is in signal connection with the first air cylinder (31), and the second detection head (602) is in signal connection with the second air cylinder (41).
2. A semiconductor automatic picking device according to claim 1, wherein one of the supporting members (11) is provided with a first supporting plate (13), the first supporting plate (13) is provided with a first receiving frame (131), the other supporting member (11) is provided with a second supporting plate (14), the second supporting plate (14) is provided with a second receiving frame (141), and the first receiving frame (131) and the second receiving frame (141) are both detachably mounted.
3. A semiconductor automatic picking device according to claim 1, characterized in that a third receiving frame (15) is placed on the base (10), the third receiving frame (15) being located directly under the discharging member (20).
4. A semiconductor automatic picking device according to any of claims 1-3, characterized in that the detection slots (202) are provided with a plurality of groups, the groups of detection slots (202) being equally distributed on the blanking member (20).
5. A semiconductor automatic picking device according to claim 4, wherein the discharging member (20) is rotatably connected with the second connecting member (21) through a rotating shaft (201), the rotating shaft (201) provides driving force through a driving motor, and the first pushing member (30) and the second pushing member (40) are both slidably sleeved on the first connecting member (12).
6. A semiconductor automatic picking device as claimed in claim 5, wherein said base (10) is provided with a controller for controlling the operation of the whole device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322121631.6U CN220532290U (en) | 2023-08-07 | 2023-08-07 | Automatic picking device for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322121631.6U CN220532290U (en) | 2023-08-07 | 2023-08-07 | Automatic picking device for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220532290U true CN220532290U (en) | 2024-02-27 |
Family
ID=89975062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322121631.6U Active CN220532290U (en) | 2023-08-07 | 2023-08-07 | Automatic picking device for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220532290U (en) |
-
2023
- 2023-08-07 CN CN202322121631.6U patent/CN220532290U/en active Active
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