CN220526364U - Luminous fingerprint identification module - Google Patents
Luminous fingerprint identification module Download PDFInfo
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- CN220526364U CN220526364U CN202321850249.2U CN202321850249U CN220526364U CN 220526364 U CN220526364 U CN 220526364U CN 202321850249 U CN202321850249 U CN 202321850249U CN 220526364 U CN220526364 U CN 220526364U
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- 238000004020 luminiscence type Methods 0.000 abstract description 5
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Abstract
The utility model relates to the technical field of fingerprint identification modules, in particular to a luminous fingerprint identification module which comprises a circuit board, an induction chip, an IC chip and a light source, wherein the IC chip is fixed on a non-contact surface of the induction chip, the induction chip is arranged on the circuit board, and light emitted by the light source passes through the induction chip and is emitted from a contact surface. The luminous fingerprint identification module does not need to be provided with a light guide ring, and can realize whole-surface luminescence.
Description
Technical Field
The utility model relates to the technical field of fingerprint identification modules, in particular to a luminous fingerprint identification module.
Background
The fingerprint identification technology is a biological identification technology for identifying and verifying the identity of an individual, and the fingerprint characteristics are converted into digital data by collecting and analyzing fingerprint images so as to realize accurate identification of the identity of the individual. The fingerprint identification module is widely applied to the fields of mobile phones, tablet computers, access control systems and the like, and provides a convenient and safe identity verification mode for users.
The light-emitting element is attached to the existing fingerprint identification module as indication and decoration, as shown in fig. 1 and 2, the existing fingerprint identification module comprises a circuit board 1, a fingerprint chip 2, a packaging cover plate 3, a light source 4 and a light guide ring 5, wherein the fingerprint chip 2 and the light source 4 are fixed on the circuit board 1, the packaging cover plate 3 is covered on the fingerprint chip 2, the light guide ring 5 is sleeved on the periphery of the fingerprint chip, the packaging cover plate 3 and the light source 4, and light emitted by the light source 4 is emitted from the light guide ring 5, namely, light rays are emitted around the periphery of the fingerprint chip 2. The existing luminous fingerprint identification module has the following defects: (1) the diaphragm needs to be added, and the cost is high: (2) light can only be emitted from the aperture.
Disclosure of Invention
The utility model aims to solve the technical problem of providing a luminous fingerprint identification module which does not need to be provided with a light guide ring and realizes whole-surface luminescence.
In order to solve the technical problems, the utility model provides a luminous fingerprint identification module which comprises a circuit board, an induction chip, an IC chip and a light source, wherein the IC chip is fixed on a non-contact surface of the induction chip, the induction chip is arranged on the circuit board, and light emitted by the light source passes through the induction chip and is emitted from a contact surface.
As an improvement of the above scheme, the sensing chip comprises a light-transmitting substrate and a fingerprint identification array, wherein the light-transmitting substrate is provided with a contact surface and a non-contact surface which are arranged back, and the fingerprint identification array is arranged on the non-contact surface and is in conductive connection with the IC chip.
As an improvement of the scheme, the non-contact surface is provided with an induction area and a non-induction area, the fingerprint identification array is arranged in the induction area, the IC chip is arranged in the non-induction area, and light emitted by the light source is emitted from the induction area.
As an improvement of the scheme, the non-sensing area is provided with a light blocking layer, and the light blocking layer is made of light absorbing materials or light reflecting materials.
As improvement of the scheme, the light-transmitting substrate is a glass substrate, the dielectric constant of the glass substrate is more than or equal to 3, and the light transmittance is more than or equal to 85%; preferably, the dielectric constant of the glass substrate is not less than 5, and the light transmittance is not less than 90%.
As an improvement of the scheme, a protective layer is arranged on the contact surface, and the light transmittance of the protective layer is more than or equal to 40%; preferably, the light transmittance of the protective layer is 40% -70%;
and/or sealing materials are filled between the induction chip and the circuit board, and the sealing materials have a light guide effect.
As an improvement of the above scheme, the fingerprint identification array is formed by an additive method;
and/or the fingerprint identification array is made of conductive paste.
As an improvement of the scheme, the conductive paste is selected from one of conductive silver paste, gold paste, copper paste, carbon paste, transparent oxide and graphene.
As an improvement of the above scheme, the fingerprint identification array is provided with a first connection point connected with the IC chip, and the IC chip forms a fixed conductive connection with the first connection point through a binding process;
and/or, the fingerprint identification array is provided with a second connection point connected with the FPC, one end of the FPC is fixedly and conductively connected with the second connection point in a binding process or welding mode, and the other end of the FPC is fixedly or detachably conductively connected with the PCB.
As an improvement of the above scheme, the light source is arranged on one surface of the circuit board facing the induction chip;
alternatively, the light source is disposed on a side surface of the circuit board.
The implementation of the utility model has the following beneficial effects:
the luminous fingerprint identification module is arranged by dividing the fingerprint chip into the induction chip and the IC chip, so that light emitted by the light source is directly emitted from the induction chip, and the induction chip is directly contacted with fingers, thereby not only realizing the whole-surface luminescence of the fingerprint identification module, but also saving the diaphragm and reducing the cost. Further, the distance between the finger and the sensing chip is reduced, and the recognition sensitivity is improved.
Drawings
FIG. 1 is a top view of a prior art fingerprint recognition module;
FIG. 2 is a cross-sectional view of the AA of FIG. 1;
FIG. 3 is a schematic diagram of a first structure of a light-emitting fingerprint module according to the present utility model;
FIG. 4 is a schematic diagram of the structure of the sensing chip of the present utility model;
fig. 5 is a schematic diagram of a second structure of the luminous fingerprint module of the present utility model.
Detailed Description
The present utility model will be described in further detail with reference to the accompanying drawings, for the purpose of making the objects, technical solutions and advantages of the present utility model more apparent. It is only stated that the terms of orientation such as up, down, left, right, front, back, inner, outer, etc. used in this document or the imminent present utility model, are used only with reference to the drawings of the present utility model, and are not meant to be limiting in any way.
Referring to fig. 3, the utility model discloses a luminous fingerprint identification module, which comprises a circuit board 1, an induction chip 2, an IC chip 3 and a light source 4, wherein the IC chip 3 is fixed on a non-contact surface of the induction chip 2, and light emitted by the light source 4 is emitted through the induction chip 2.
The sensing chip 2 is used for collecting fingerprint signals, and the IC chip 3 is used for receiving the fingerprint signals collected by the sensing chip 2 and performing signal processing and analysis.
As shown in fig. 4, the sensing chip 2 includes a light-transmitting substrate 21 and a fingerprint recognition array 22, the light-transmitting substrate 21 has a contact surface 221 and a non-contact surface 222 disposed backward, the fingerprint recognition array 22 is disposed on the non-contact surface 222 and is electrically connected to the IC chip 3, and a finger of a user is pressed against the contact surface 221.
Specifically, the non-contact surface 222 is provided with an induction area in which the fingerprint recognition array 22 is disposed and a non-induction area in which the IC chip 3 is disposed, and light emitted from the light source 4 is emitted from the induction area.
Preferably, the transparent substrate 21 is a glass substrate, which can be used as a carrier for manufacturing the fingerprint identification array 22 and also can be used as a packaging cover plate of the fingerprint identification module.
Based on the working principle of the capacitive fingerprint identification module: capacitive coupling exists between the human skin and the fingerprint recognition array 22, which causes a change in the distribution of the electric field around the fingerprint recognition array 22, thereby producing a change in capacitance. Since the glass substrate of the present utility model is sandwiched between the human skin and the fingerprint recognition array 22, the higher the dielectric constant of the glass substrate, the less the glass substrate affects the capacitive coupling between the human skin and the fingerprint recognition array 22. Preferably, the dielectric constant of the glass substrate is 3 or more. More preferably, the transmittance of the glass substrate is not less than 85%.
The light transmittance of the common white glass is generally 82% -83%, and the fingerprint identification array 22 is arranged on the non-contact surface 222 of the glass substrate, so that the overall light transmittance of the sensing chip 2 is reduced, and the glass substrate with the light transmittance of more than or equal to 85% is preferred for improving the front light emitting efficiency of the light emitting fingerprint identification module. More preferably, the dielectric constant of the glass substrate is not less than 5, and the light transmittance is not less than 90%.
It should be noted that, the fingerprint identification array 22 of the present utility model is formed by an additive method, such as 3D printing, inkjet printing, screen printing, etc., and the raw material of the fingerprint identification array 22 may be conductive paste, such as conductive silver paste, gold paste, copper paste, carbon paste, transparent oxide (ITO), graphene, etc.
Specifically, the fingerprint identification array 22 of the present utility model is provided with a first connection point 221 connected to the IC chip 3, and the IC chip 3 is fixedly and electrically connected to the first connection point 221 through a bonding process, so as to be fixed on the non-contact surface 222 and form an electrically conductive connection with the sensing chip 2.
The inductive chip 2 and the IC chip 3 are arranged on the circuit board 1 and form an electrically conductive connection with the circuit board 1. The circuit board 1 of the present utility model includes PCB (Printed Circuit Board) and FPC (Flexible Printed Circuit). Specifically, the sensing chip 2 and the IC chip 3 are disposed on a PCB, and an FPC is used to connect the sensing chip 2 and the PCB. The fingerprint identification array 22 of the present utility model is provided with a second connection point 222 connected with the FPC, one end of the FPC may form a fixed conductive connection with the second connection point 222 by a binding process or a soldering manner, and the other end of the FPC may be fixedly or detachably connected with the PCB.
The light source 4 of the present utility model is preferably an LED light bulb, which has the characteristics of small volume and high brightness, and can be disposed on one surface of the PCB facing the sensing chip 2 (as shown in fig. 3) or on a side surface of the PCB (as shown in fig. 5).
In order to improve the light emitting uniformity of the light emitting fingerprint identification module, at least 2 LED lamp beads are arranged, and preferably 3 or 4 LED lamp beads are arranged; more preferably, the plurality of LED lamp beads are uniformly distributed.
It should be noted that, the light emitted by the light source of the present utility model is directly emitted through the sensing chip 2, so as to realize the whole surface luminescence of the luminous fingerprint identification module.
The light is not uniform due to the inconsistent light transmittance of the fingerprint recognition array 22 and the IC chip 3, and the user can see the internal structure of the luminous fingerprint recognition module from the contact surface 221 of the glass substrate.
Preferably, the contact surface 221 is provided with a protective layer 5, and the light transmittance of the protective layer 5 is more than or equal to 40%. The protective layer 5 of the utility model can protect the glass substrate on one hand and can shield the internal structure of the luminous fingerprint identification module on the other hand. More preferably, the light transmittance of the protective layer 5 is 40% -70%. Under the condition that the lamp is not turned on, the user cannot see the internal structure of the luminous fingerprint identification module, only see the color of the protective layer 5, the color of the protective layer 5 can be consistent with the application environment of the luminous fingerprint identification module, for example, the luminous fingerprint identification module is applied to a door lock, and the color of the protective layer 5 is consistent with the color of the door lock; in the case of lighting, light can be emitted through the protective layer 5.
Preferably, the non-sensing region is provided with a light blocking layer 6, and the light blocking layer 6 is made of a light absorbing material or a light reflecting material. The light blocking layer 6 is arranged in the non-sensing area, so that the light emitting uniformity of the sensing area can be improved, and the integral light emitting aesthetic feeling of the luminous fingerprint identification module can be improved. Specifically, the light emitted from the light source 4 is emitted from the sensing region of the glass substrate, and the light emitted from the sensing region is uniform.
In order to further protect the circuit board 1, the sense die 2 and the IC die 3, a sealing material 7 is filled between the sense die 2 and the circuit board 1. Preferably, the sealing material of the present utility model also has a light guiding effect. That is, the sealing material 7 of the present utility model may be used not only as a sealing layer but also as a light guiding layer to emit light emitted from the light source 4 uniformly through the sensor chip 2.
The light source 4 of the utility model can be used as indication and decoration, specifically, when the user does not press the luminous fingerprint identification module yet, the light source 4 can be used for indicating the pressed area; however, after the user's finger presses the sensing area of the luminous fingerprint recognition module, the light source 4 may be turned on to indicate the fingerprint recognition state, for example, the light source 4 is turned on to light green to indicate that the fingerprint recognition is successful, and the light source 4 is turned on to light red to indicate that the fingerprint recognition is failed. In addition, the user can set the indication rule of the light source 4 according to the actual need.
The luminous fingerprint identification module is arranged by dividing the fingerprint chip into the induction chip and the IC chip, so that light emitted by the light source is directly emitted from the induction chip, and the induction chip is directly contacted with fingers, thereby not only realizing the whole-surface luminescence of the fingerprint identification module, but also saving the diaphragm and reducing the cost. Further, the distance between the finger and the sensing chip is reduced, and the recognition sensitivity is improved.
The foregoing is a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model and are intended to be comprehended within the scope of the present utility model.
Claims (12)
1. The luminous fingerprint identification module is characterized by comprising a circuit board, an induction chip, an IC chip and a light source, wherein the IC chip is fixed on a non-contact surface of the induction chip, the induction chip is arranged on the circuit board, and light emitted by the light source passes through the induction chip and is emitted from the contact surface.
2. The illuminated fingerprint identification module of claim 1, wherein the sensing chip comprises a light transmissive substrate having a contact surface disposed rearwardly and a non-contact surface, and a fingerprint identification array disposed on the non-contact surface and in conductive communication with the IC chip.
3. The luminous fingerprint recognition module of claim 2, wherein the non-contact surface is provided with an induction area and a non-induction area, the fingerprint recognition array is arranged in the induction area, the IC chip is arranged in the non-induction area, and the light emitted by the light source is emitted from the induction area.
4. A luminous fingerprint recognition module according to claim 3, wherein the non-sensing area is provided with a light blocking layer, and the light blocking layer is made of light absorbing material or light reflecting material.
5. The luminous fingerprint recognition module according to claim 2, wherein the light-transmitting substrate is a glass substrate, and the dielectric constant of the glass substrate is not less than 3 and the light transmittance is not less than 85%.
6. The luminous fingerprint recognition module according to claim 5, wherein the dielectric constant of the glass substrate is equal to or more than 5, and the light transmittance is equal to or more than 90%.
7. The luminous fingerprint identification module according to any one of claims 1 to 5, wherein a protective layer is arranged on the contact surface, and the light transmittance of the protective layer is more than or equal to 40%;
and/or sealing materials are filled between the induction chip and the circuit board, and the sealing materials have a light guide effect.
8. The luminous fingerprint recognition module according to claim 7, wherein the light transmittance of the protective layer is 40% -70%.
9. The illuminated fingerprint identification module of claim 2, wherein the fingerprint identification array is formed by an additive process;
and/or the fingerprint identification array is made of conductive paste.
10. The luminous fingerprint recognition module of claim 9, wherein the conductive paste is one of conductive silver paste, gold paste, copper paste, carbon paste, transparent oxide and graphene.
11. The luminous fingerprint recognition module according to claim 2, wherein the fingerprint recognition array is provided with a first connection point connected with the IC chip, and the IC chip forms a fixed conductive connection with the first connection point through a binding process;
and/or, the fingerprint identification array is provided with a second connection point connected with the FPC, one end of the FPC is fixedly and conductively connected with the second connection point in a binding process or welding mode, and the other end of the FPC is fixedly or detachably conductively connected with the PCB.
12. The luminous fingerprint recognition module according to claim 1, wherein the light source is arranged on one surface of the circuit board facing the induction chip;
alternatively, the light source is disposed on a side surface of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321850249.2U CN220526364U (en) | 2023-07-14 | 2023-07-14 | Luminous fingerprint identification module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321850249.2U CN220526364U (en) | 2023-07-14 | 2023-07-14 | Luminous fingerprint identification module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220526364U true CN220526364U (en) | 2024-02-23 |
Family
ID=89934913
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321850249.2U Active CN220526364U (en) | 2023-07-14 | 2023-07-14 | Luminous fingerprint identification module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220526364U (en) |
-
2023
- 2023-07-14 CN CN202321850249.2U patent/CN220526364U/en active Active
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