CN117218688A - Fingerprint identification module with luminous pattern - Google Patents
Fingerprint identification module with luminous pattern Download PDFInfo
- Publication number
- CN117218688A CN117218688A CN202311014342.4A CN202311014342A CN117218688A CN 117218688 A CN117218688 A CN 117218688A CN 202311014342 A CN202311014342 A CN 202311014342A CN 117218688 A CN117218688 A CN 117218688A
- Authority
- CN
- China
- Prior art keywords
- light
- fingerprint
- chip
- cover plate
- packaging cover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 44
- 239000000463 material Substances 0.000 claims description 37
- 239000000758 substrate Substances 0.000 claims description 31
- 239000011521 glass Substances 0.000 claims description 21
- 230000006698 induction Effects 0.000 claims description 20
- 230000000903 blocking effect Effects 0.000 claims description 17
- 238000002834 transmittance Methods 0.000 claims description 12
- -1 polyethylene Polymers 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- 238000010146 3D printing Methods 0.000 claims description 4
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 4
- 239000004698 Polyethylene Substances 0.000 claims description 4
- 239000004743 Polypropylene Substances 0.000 claims description 4
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 4
- 238000007641 inkjet printing Methods 0.000 claims description 4
- 229920002530 polyetherether ketone Polymers 0.000 claims description 4
- 229920000573 polyethylene Polymers 0.000 claims description 4
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 4
- 229920001155 polypropylene Polymers 0.000 claims description 4
- 238000007650 screen-printing Methods 0.000 claims description 4
- 238000004544 sputter deposition Methods 0.000 claims description 4
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 4
- 239000011358 absorbing material Substances 0.000 claims description 3
- 229920001971 elastomer Polymers 0.000 claims description 3
- 239000000806 elastomer Substances 0.000 claims description 3
- 230000001788 irregular Effects 0.000 claims description 3
- 238000010147 laser engraving Methods 0.000 claims description 3
- 239000000049 pigment Substances 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 235000012239 silicon dioxide Nutrition 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 238000007747 plating Methods 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 230000006872 improvement Effects 0.000 description 9
- 230000000694 effects Effects 0.000 description 8
- 239000011324 bead Substances 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000005034 decoration Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000004020 luminiscence type Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 241000227425 Pieris rapae crucivora Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 230000001808 coupling effect Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Image Input (AREA)
Abstract
The application relates to the technical field of fingerprint identification modules, in particular to a fingerprint identification module with a luminous pattern, which comprises a circuit board, a fingerprint chip, a packaging cover plate and a light source, wherein the packaging cover plate is arranged between the fingerprint chip and the circuit board and is provided with a graphical light emitting area and a non-light emitting area, and light emitted by the light source passes through the graphical light emitting area of the packaging cover plate and is emitted from the contact surface of the fingerprint chip. The fingerprint identification module with the luminous patterns has low cost, and can guide a user to accurately press the fingerprint identification area, thereby improving the success rate of fingerprint unlocking.
Description
Technical Field
The application relates to the technical field of fingerprint identification modules, in particular to a fingerprint identification module with luminous patterns.
Background
The fingerprint identification technology is a biological identification technology for identifying and verifying the identity of an individual, and the fingerprint characteristics are converted into digital data by collecting and analyzing fingerprint images so as to realize accurate identification of the identity of the individual. The fingerprint identification module is widely applied to the fields of mobile phones, tablet computers, access control systems and the like, and provides a convenient and safe identity verification mode for users.
The light-emitting element is attached to the existing fingerprint identification module as indication and decoration, as shown in fig. 1 and 2, the existing fingerprint identification module comprises a circuit board 1, a fingerprint chip 2, a packaging cover plate 3, a light source 5 and a light guide ring 5, wherein the fingerprint chip 2 and the light source 5 are fixed on the circuit board 1, the packaging cover plate 3 is covered on the fingerprint chip 2, the light guide ring 5 is sleeved on the periphery of the fingerprint chip, the packaging cover plate 3 and the light source 5, and light emitted by the light source 5 is emitted from the light guide ring 5, namely, light rays are emitted around the periphery of the fingerprint chip 2. The existing luminous fingerprint identification module has the following defects: (1) the diaphragm needs to be added, and the cost is high: (2) light can only be emitted from the aperture; (3) The user cannot be guided to press on the fingerprint recognition area accurately.
Disclosure of Invention
The application aims to solve the technical problem of providing the fingerprint identification module with the luminous pattern, which does not need to be provided with the light guide ring, has low cost, can guide a user to accurately press the fingerprint identification area, and improves the success rate of fingerprint unlocking.
In order to solve the technical problems, the application provides a fingerprint identification module with a luminous pattern, which comprises a circuit board, a fingerprint chip, a packaging cover plate and a light source, wherein the packaging cover plate is arranged between the fingerprint chip and the circuit board and is provided with a graphical light emitting area and a non-light emitting area, and light emitted by the light source passes through the graphical light emitting area of the packaging cover plate and is emitted from the contact surface of the fingerprint chip.
As an improvement of the above scheme, the packaging cover plate is made of a light guide material, the patterned light-emitting area is provided with light guide points, and the light guide points are located in the patterned light-emitting area;
or the packaging cover plate is made of a light-transmitting material, a light blocking layer is arranged on one side of the packaging cover plate, facing the circuit board, and the light blocking layer is positioned in the non-light-emitting area;
or the patterned light emergent region of the packaging cover plate is made of a light-transmitting material, and the non-light emergent region of the packaging cover plate is made of a non-light-transmitting material.
As an improvement of the scheme, the size of the light guide points is 0.02-2.0 mu m, and the distance between the light guide points is 0.3-1.5 mm; wherein, a plurality of light guide points form a target graph;
and/or the shape of the light guide point is any one or a combination of at least two of a circle, an ellipse, a regular polygon and an irregular polygon;
and/or the light guide point is formed on one side of the packaging cover plate facing the fingerprint chip by adopting a laser engraving method.
As improvement of the scheme, the light transmittance of the packaging cover plate is more than or equal to 80%;
and/or the light blocking layer is made of a light reflecting material or a light absorbing material;
and/or the light blocking layer is formed by at least one of screen printing, 3D printing, ink-jet printing, dispensing, smearing, spraying, sputtering, vapor plating and bonding.
As an improvement of the scheme, the packaging cover plate is integrally formed by a light-transmitting material and a non-light-transmitting material;
and/or the light-transmitting material is at least one of polyethylene, polyethylene terephthalate, polypropylene, polyurethane, thermoplastic polyurethane elastomer, polyether-ether-ketone, glass, sapphire and silicon dioxide; the non-light-transmitting material is composed of the light-transmitting material and pigment.
As an improvement of the scheme, a groove for accommodating the protruding structure of the fingerprint chip is formed in one side, facing the fingerprint chip, of the packaging cover plate, and the groove is located in the non-light-emitting area.
As an improvement of the scheme, the fingerprint chip comprises an induction chip and an IC chip, the induction chip comprises a light-transmitting substrate and a fingerprint identification array, the light-transmitting substrate is provided with a contact surface and a non-contact surface which are arranged backwards, the fingerprint identification array and the IC chip are arranged on the non-contact surface, and the fingerprint identification array is in conductive connection with the IC chip.
As an improvement of the above scheme, the non-contact surface is divided into an induction area and a non-induction area, the fingerprint identification array is positioned in the induction area, and the IC chip is positioned in the non-induction area;
the light emitted by the light source sequentially passes through the patterned light emitting area and the sensing area of the packaging cover plate and is emitted from the contact surface of the light-transmitting substrate.
As improvement of the scheme, the light-transmitting substrate is a glass substrate, the dielectric constant of the glass substrate is more than or equal to 3, and the light transmittance is more than or equal to 85%; preferably, the dielectric constant of the glass substrate is not less than 5, and the light transmittance is not less than 90%.
As an improvement of the scheme, the light source is arranged on one surface of the circuit board facing the fingerprint chip;
alternatively, the light source is disposed on a side surface of the circuit board.
The implementation of the application has the following beneficial effects:
according to the application, the packaging cover plate with the graphical light emitting area and the non-light emitting area is arranged between the fingerprint chip and the circuit board, so that the fingerprint chip can be protected, the graphical light emission of the fingerprint module can be realized without affecting fingerprint identification, a user can be guided to accurately press in the fingerprint identification area through the graphical light emission, and the fingerprint unlocking success rate is improved.
In addition, the light emitted by the light source of the fingerprint identification module passes through the patterned light-emitting area of the packaging cover plate and is emitted from the contact surface of the light-transmitting substrate, so that the front light-emitting effect can be realized, no additional light guide ring is needed, and the cost is low.
The fingerprint chip is divided into the sensing chip and the IC chip to be arranged, so that light emitted by the light source is directly emitted from the sensing chip, and the sensing chip is directly contacted with a finger, thereby not only realizing the whole lighting of the fingerprint identification module, saving a light guide ring, reducing the cost, but also reducing the distance between the finger and the sensing chip and improving the identification sensitivity.
Drawings
FIG. 1 is a top view of a prior art fingerprint recognition module;
FIG. 2 is a cross-sectional view of the AA of FIG. 1;
FIG. 3 is a top view of the fingerprint recognition module of the present application;
FIG. 4 is a cross-sectional view of BB of FIG. 3;
FIG. 5 is a schematic view of the structure of a package cover plate according to the first aspect of the present application;
FIG. 6 is a schematic view of a package cover according to a second embodiment of the present application;
FIG. 7 is a schematic view of a package cover according to a third embodiment of the present application;
FIG. 8 is a schematic diagram of the structure of the sensing chip of the present application;
fig. 9 is a fingerprint signal collection image of a fingerprint recognition module that makes a patterned light blocking layer on a contact surface.
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings, for the purpose of making the objects, technical solutions and advantages of the present application more apparent. It is only stated that the terms of orientation such as up, down, left, right, front, back, inner, outer, etc. used in this document or the imminent present application, are used only with reference to the drawings of the present application, and are not meant to be limiting in any way.
Referring to fig. 3-7, the fingerprint identification module with luminous patterns provided by the application comprises a circuit board 1, a fingerprint chip 2, a packaging cover plate 3 and a light source 4, wherein the packaging cover plate 3 is arranged between the fingerprint chip 2 and the circuit board 1, the packaging cover plate 3 is provided with a patterned light emitting area 31 and a non-light emitting area 32, and light emitted by the light source 4 is emitted from a contact surface 2111 of the fingerprint chip 2 through the patterned light emitting area 31 of the packaging cover plate 3.
The contact surface 2111 of the fingerprint chip 2 is the surface that contacts the finger. The fingerprint chip 2 comprises an induction chip 21 and an IC chip 22, wherein the induction chip 21 is used for collecting fingerprint signals, and the IC chip 22 is used for receiving the fingerprint signals collected by the induction chip 21 and processing and analyzing the signals.
As shown in fig. 8, the sensing chip 21 includes a light-transmitting substrate 211 and a fingerprint recognition array 222, the light-transmitting substrate 211 has a contact surface 2111 and a non-contact surface 2112 which are disposed opposite to each other, the fingerprint recognition array 222 and the IC chip 22 are disposed on the non-contact surface 2112, and the fingerprint recognition array 222 is electrically connected to the IC chip 22, and a finger of a user presses on the contact surface 2111.
Specifically, the non-contact surface 2112 is divided into an induction area and a non-induction area, the fingerprint identification array 222 is located in the induction area, the IC chip 22 is located in the non-induction area, and the light emitted by the light source 4 sequentially passes through the patterned light-emitting area 31 of the package cover 3 and the induction area of the light-transmitting substrate 211, and finally is emitted from the contact surface 2111. Because the contact surface 2111 of the fingerprint module can directly display the luminous pattern, the fingerprint module can be guided to be directly pressed on the fingerprint identification array 222, and further the fingerprint unlocking success rate is improved. If the user does not have the guidance of the light emitting pattern, if the user presses the finger at will at a place other than the fingerprint recognition array 222, the number of the fingerprint feature points collected by the sensing chip 21 is too small, and the IC chip 22 easily determines the signal as an error signal, so that the unlocking rate of the fingerprint is reduced, which is also the cause of frequent failure of unlocking the fingerprint.
Preferably, the transparent substrate 211 is a glass substrate, and the glass substrate not only can be used as a carrier for manufacturing the fingerprint identification array 222, but also can be used as a protection structure of the fingerprint identification module for protecting the fingerprint identification array 222 and the IC chip 22.
Based on the working principle of the capacitive fingerprint identification module: capacitive coupling exists between the human skin and the fingerprint recognition array 222, which causes a change in the distribution of the electric field around the fingerprint recognition array 222, thereby producing a change in capacitance. Since the glass substrate of the present application is sandwiched between the human skin and the fingerprint recognition array 222, the higher the dielectric constant of the glass substrate, the smaller the capacitive coupling effect the glass substrate has on between the human skin and the fingerprint recognition array 222. Preferably, the dielectric constant of the glass substrate is 3 or more. More preferably, the transmittance of the glass substrate is not less than 85%.
The light transmittance of the common white glass is generally 82% -83%, and the fingerprint identification array 222 is arranged on the non-contact surface 2112 of the glass substrate, so that the overall light transmittance of the sensing chip 21 is reduced, and the glass substrate with the light transmittance being more than or equal to 85% is preferred for improving the front light emitting efficiency of the fingerprint identification module. More preferably, the dielectric constant of the glass substrate is not less than 5, and the light transmittance is not less than 90%.
It should be noted that, the fingerprint recognition array 222 of the present application is formed by an additive method, such as 3D printing, inkjet printing, screen printing, evaporation, sputtering, deposition, etc., and the raw material of the fingerprint recognition array 222 may be conductive paste, such as conductive silver paste, gold paste, copper paste, carbon paste, transparent oxide (ITO), graphene, etc. The fingerprint recognition array 222 of the present application may also be formed by subtractive methods, such as etching.
The package cover 3 of the present application is covered on the fingerprint recognition array 222 and the IC chip 22 for protecting the fingerprint recognition array 222 and the IC chip 22. The side of the encapsulation cover 3 facing the fingerprint chip 2 is provided with a recess 33 for accommodating the protruding structure of the fingerprint chip 2. That is, the side of the package cover 3 facing the fingerprint chip 2 is provided with a recess 33 for accommodating the IC chip 22, so that the overall volume of the fingerprint recognition module can be reduced. Correspondingly, the groove 33 is located in the non-light-emitting region 32 of the package cover 3, and this is because the position of the groove 33 corresponds to the position of the IC chip 22, and since the IC chip 22 is located in the non-sensing region, the non-sensing region does not need to emit light, and in order not to block the light-emitting effect of the sensing region, the position of the groove 33 is correspondingly located in the non-light-emitting region 32.
It was found that although the patterned light blocking layer is formed on the contact surface 2111 of the light-transmitting substrate 211 to achieve the patterned light-emitting effect, this affects the fingerprint recognition effect, and as shown in fig. 9, the pattern of the light blocking layer is easily misjudged as a fingerprint signal, and it is difficult for the fingerprint signal pressed against the light blocking layer to distinguish between "ridges" and "valleys" in the fingerprint.
In order not to affect the signal material of the fingerprint identification array 222, the front light of the fingerprint module can be realized, and the light-emitting pattern with guiding property and attractive appearance can be realized. The present application forms patterned light extraction regions 31 and non-light extraction regions 32 on the package cover 3 on the side remote from the contact surface 2111. There are 3 methods for forming the patterned light-emitting region 31 and the non-light-emitting region 32 on the package cover 3, including:
(1) The packaging cover plate 3 is made of light guide materials, and the patterned light emergent region 31 is provided with light guide points 34 as shown in fig. 5; that is, the package cover 3 is made of a light guiding material, and the light guiding points 34 are formed on the patterned light-emitting region 31 of the package cover 3.
The light guide plate has the function of converting the side light source into a surface light source and uniformly emitting light. The principle structure is that reflecting dots are printed or laser engraved on transparent acrylic or PC board or glass according to different sizes, areas and sharpness, and the light is uniformly diffused by utilizing the reflecting dots printed or engraved on the surface of the light guide plate, so that the line light source illumination is converted into a surface light source illumination mode.
The side of the packaging cover plate 3 facing the fingerprint chip 2 is provided with a plurality of light guide points 34, and the light guide points 34 form a target graph, namely a graphical light emitting area 31. If the size of the light guide point 34 is too small, light cannot be guided out, and if the size of the light guide point 34 is too large, the hiding effect of the target pattern becomes poor under the condition of no light emission; similarly, if the pitch between the light guide points 34 is too small, the hiding effect is deteriorated, and if the pitch between the light guide points 34 is too large, the resolution of the target pattern at the time of light emission is too low, and the visual effect is poor. Preferably, the size of the light guide points 34 is 0.02-2.0 μm, and the distance between the light guide points is 0.3-1.5 mm.
The shape of the light guide point 34 may be any one or a combination of at least two of a circle, an ellipse, a regular polygon, and an irregular polygon. In the present application, the light guide point 34 is formed on the side of the package cover 3 facing the fingerprint chip 2 by a laser engraving method.
(2) The package cover 3 is made of a light-transmitting material, and a light blocking layer 35 is arranged on the side of the package cover 3 facing the circuit board, as shown in fig. 6; that is, the package cover 3 is made of a light-transmitting material, and the light-blocking layer 35 is made on the side of the package cover 3 facing the circuit board, and the light-blocking layer 35 is located at the non-light-emitting region 32. In the research application, if the light blocking layer 35 is manufactured on the side of the packaging cover plate 3 facing the fingerprint chip 2, the pattern of the light blocking layer 35 is also easy to misjudge the fingerprint signal, and the IC chip 22 is required to remove background noise, so that the fingerprint unlocking success rate is affected.
In order to improve the light-emitting effect, the package cover 3 is made of a light-transmitting material. Preferably, the light transmittance of the encapsulation cover plate 3 is equal to or more than 80%. Since the package cover 3 of the present application does not need to be in contact with fingers, it can be made of inexpensive materials such as PC, acryl, PMMA, etc. In addition, the light blocking layer 35 may be made of a light reflecting material or a light absorbing material. The light blocking layer may be formed by at least one of screen printing, 3D printing, inkjet printing, dispensing, painting, spraying, sputtering, evaporation, and adhesion.
(3) The patterned light-emitting region 31 of the package cover 3 is made of a light-transmitting material, and the non-light-emitting region 32 of the package cover 3 is made of a non-light-transmitting material, as shown in fig. 7. Preferably, the encapsulation cover 3 is integrally formed of a light-transmitting material and a light-non-transmitting material. In addition, the light-transmitting material is at least one of Polyethylene (PE), polyethylene terephthalate (PET), polypropylene (PP), polyurethane (PU), thermoplastic polyurethane elastomer (TPU), polyether ether ketone (PEEK), glass, sapphire and silicon dioxide; the non-light-transmitting material is composed of the light-transmitting material and pigment. When the light-transmitting material and the non-light-transmitting material selected for the packaging cover plate 3 are of the same type, the overall strength can be improved.
The packaging cover plate 3 not only can protect the fingerprint chip 2, but also can realize the patterned luminescence of the fingerprint module without affecting fingerprint identification.
The circuit board is arranged on the side of the encapsulation cover plate 3 facing away from the fingerprint chip 2, i.e. the encapsulation cover plate 3 is arranged between the fingerprint chip 2 and the circuit board 1. The circuit board 1 of the present application includes PCB (Printed Circuit Board) and FPC (Flexible Printed Circuit), and an FPC for connecting the sense die 21 and the PCB. One end of the FPC can be connected with the IC chip in a conductive manner through a binding process or welding mode, and the other end of the FPC is fixedly or detachably connected with the PCB in a conductive manner.
The light source 4 is preferably an LED lamp bead, and the LED lamp bead has the characteristics of small volume and high brightness, and can be arranged on one surface of the PCB facing the sensing chip 21 or on the side surface of the PCB side. In order to improve the light emitting uniformity of the fingerprint identification module with the light emitting patterns, at least 2 LED lamp beads are arranged, and preferably 3 or 4 LED lamp beads are arranged; more preferably, the plurality of LED lamp beads are uniformly distributed.
The light source 4 of the application can be used as indication and decoration, specifically, when the user does not press the fingerprint identification module yet, the light source 4 can be used for indicating the pressed area; when the user presses the sensing area with the fingerprint recognition module, the light source 4 is turned on to indicate the fingerprint recognition state, for example, the light source 4 is turned on to light green to indicate that the fingerprint recognition is successful, and the light source 4 is turned on to light red to indicate that the fingerprint recognition is failed. In addition, the user can set the indication rule of the light source 4 according to the actual need.
The application arranges the packaging cover plate 3 with the graphical light-emitting area 31 and the non-light-emitting area 32 between the fingerprint chip 2 and the circuit board 1, which not only can protect the fingerprint chip 2, but also can realize the graphical light emission of the fingerprint module without affecting the fingerprint identification, and can guide the user to accurately press in the fingerprint identification area through the graphical light emission, thereby improving the fingerprint unlocking success rate.
In addition, the light emitted by the light source 4 of the fingerprint identification module of the application passes through the patterned light-emitting area 31 of the packaging cover plate 3 and is emitted from the contact surface 2111 of the light-transmitting substrate 21, so that the front light-emitting effect can be realized, no additional light guide ring is needed, and the cost is low.
The fingerprint chip 2 is divided into the sensing chip 21 and the IC chip 22 to be arranged, so that the light emitted by the light source 4 is directly emitted from the sensing chip 21, and the sensing chip 21 is directly contacted with a finger, thereby not only realizing the whole-surface luminescence of the fingerprint identification module, saving a light guide ring, reducing the cost, but also reducing the distance between the finger and the sensing chip 21 and improving the identification sensitivity.
The foregoing is a preferred embodiment of the present application and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present application and are intended to be comprehended within the scope of the present application.
Claims (10)
1. The fingerprint identification module with the luminous patterns is characterized by comprising a circuit board, a fingerprint chip, a packaging cover plate and a light source, wherein the packaging cover plate is arranged between the fingerprint chip and the circuit board and is provided with a graphical light-emitting area and a non-light-emitting area, and light emitted by the light source passes through the graphical light-emitting area of the packaging cover plate and is emitted from the contact surface of the fingerprint chip.
2. The fingerprint recognition module with the luminous pattern of claim 1, wherein the packaging cover plate is made of a light guide material, the patterned light-emitting area is provided with light guide points, and the light guide points are positioned in the patterned light-emitting area;
or the packaging cover plate is made of a light-transmitting material, a light blocking layer is arranged on one side of the packaging cover plate, facing the circuit board, and the light blocking layer is positioned in the non-light-emitting area;
or the patterned light emergent region of the packaging cover plate is made of a light-transmitting material, and the non-light emergent region of the packaging cover plate is made of a non-light-transmitting material.
3. The fingerprint identification module with luminous patterns according to claim 2, wherein the size of the light guide points is 0.02-2.0 μm, and the distance between the light guide points is 0.3 mm-1.5 mm; wherein, a plurality of light guide points form a target graph;
and/or the shape of the light guide point is any one or a combination of at least two of a circle, an ellipse, a regular polygon and an irregular polygon;
and/or the light guide point is formed on one side of the packaging cover plate facing the fingerprint chip by adopting a laser engraving method.
4. The fingerprint identification module with the luminous pattern according to claim 2, wherein the light transmittance of the packaging cover plate is more than or equal to 80%;
and/or the light blocking layer is made of a light reflecting material or a light absorbing material;
and/or the light blocking layer is formed by at least one of screen printing, 3D printing, ink-jet printing, dispensing, smearing, spraying, sputtering, vapor plating and bonding.
5. The fingerprint recognition module with the luminous pattern of claim 2, wherein the package cover is integrally formed of a light-transmitting material and a non-light-transmitting material;
and/or the light-transmitting material is at least one of polyethylene, polyethylene terephthalate, polypropylene, polyurethane, thermoplastic polyurethane elastomer, polyether-ether-ketone, glass, sapphire and silicon dioxide; the non-light-transmitting material is composed of the light-transmitting material and pigment.
6. The fingerprint recognition module with the luminous pattern according to claim 1 or 2, wherein a groove for accommodating the convex structure of the fingerprint chip is formed in one side of the packaging cover plate, which faces the fingerprint chip, and the groove is located in the non-light-emitting area.
7. The fingerprint recognition module with a luminous pattern of claim 1, wherein the fingerprint chip comprises an induction chip and an IC chip, the induction chip comprises a light-transmitting substrate and a fingerprint recognition array, the light-transmitting substrate has a contact surface and a non-contact surface which are arranged back, the fingerprint recognition array and the IC chip are arranged on the non-contact surface, and the fingerprint recognition array is electrically connected with the IC chip.
8. The fingerprint recognition module with the luminous pattern of claim 7, wherein the non-contact surface is divided into an induction area and a non-induction area, the fingerprint recognition array is positioned in the induction area, and the IC chip is positioned in the non-induction area;
the light emitted by the light source sequentially passes through the patterned light emitting area and the sensing area of the packaging cover plate and is emitted from the contact surface of the light-transmitting substrate.
9. The fingerprint recognition module with the luminous pattern according to claim 7 or 8, wherein the light-transmitting substrate is a glass substrate, the dielectric constant of the glass substrate is more than or equal to 3, and the light transmittance is more than or equal to 85%; preferably, the dielectric constant of the glass substrate is not less than 5, and the light transmittance is not less than 90%.
10. The fingerprint recognition module with the luminous pattern as claimed in claim 1, wherein the light source is arranged on one surface of the circuit board facing the fingerprint chip;
alternatively, the light source is disposed on a side surface of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311014342.4A CN117218688A (en) | 2023-08-14 | 2023-08-14 | Fingerprint identification module with luminous pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311014342.4A CN117218688A (en) | 2023-08-14 | 2023-08-14 | Fingerprint identification module with luminous pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN117218688A true CN117218688A (en) | 2023-12-12 |
Family
ID=89041547
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311014342.4A Pending CN117218688A (en) | 2023-08-14 | 2023-08-14 | Fingerprint identification module with luminous pattern |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN117218688A (en) |
-
2023
- 2023-08-14 CN CN202311014342.4A patent/CN117218688A/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP3396588B1 (en) | Display screen, display device and mobile terminal | |
| US11605238B2 (en) | Fingerprint identification module, fingerprint identification method, and display apparatus | |
| CN107832752B (en) | Fingerprint identification panel, full-screen fingerprint identification method and display device | |
| EP3605387B1 (en) | Optical fingerprint recognition assembly, display apparatus and mobile terminal | |
| CN109037474B (en) | OLED panel and display device | |
| CN107438852B (en) | Sensor device and mobile terminal | |
| EP3373039B1 (en) | Sensor assembly and terminal | |
| CN108596080B (en) | Fingerprint identification assembly, display device and electronic device | |
| US10915615B2 (en) | Sensing device and terminal device | |
| EP3489793B1 (en) | Electronic device with built-in proximity sensor | |
| CN112771484B (en) | Grain recognition device and manufacturing method thereof | |
| US10811545B2 (en) | Sensing module and image capturing apparatus | |
| US20110058092A1 (en) | Image-capturing module for simplifying optical component | |
| KR20200023567A (en) | Optical unit and display device including the optical unit | |
| CN220526363U (en) | Fingerprint module with luminous pattern | |
| CN220526362U (en) | Fingerprint module with luminous pattern | |
| CN117218688A (en) | Fingerprint identification module with luminous pattern | |
| CN220526361U (en) | Fingerprint identification module with luminous front pattern | |
| CN108960007B (en) | Optical fingerprint identification module | |
| CN220526364U (en) | Luminous fingerprint identification module | |
| CN220381614U (en) | Front-lighting fingerprint identification module | |
| CN106484164B (en) | touch panel | |
| CN116740773A (en) | Luminous fingerprint identification module | |
| CN116740772A (en) | Front-lighting fingerprint identification module | |
| CN216625710U (en) | Fingerprint switch light-emitting module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |