CN220526363U - Fingerprint module with luminous pattern - Google Patents
Fingerprint module with luminous pattern Download PDFInfo
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- CN220526363U CN220526363U CN202322167944.5U CN202322167944U CN220526363U CN 220526363 U CN220526363 U CN 220526363U CN 202322167944 U CN202322167944 U CN 202322167944U CN 220526363 U CN220526363 U CN 220526363U
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Abstract
The utility model relates to the technical field of fingerprint modules, in particular to a fingerprint module with a luminous pattern, which comprises a circuit board, a fingerprint chip, a packaging cover plate and a light source, wherein the packaging cover plate is arranged between the fingerprint chip and the circuit board and is provided with a graphical light emitting area and a non-light emitting area, and light emitted by the light source passes through the graphical light emitting area of the packaging cover plate and is emitted from the contact surface of the fingerprint chip; the packaging cover plate is made of a light-transmitting material, a light blocking layer is arranged on one side, facing the circuit board, of the packaging cover plate, and the light blocking layer is located in the non-light-emitting area. The fingerprint module with the luminous patterns has low cost, can guide a user to accurately press the fingerprint module in a fingerprint identification area, and improves the success rate of fingerprint unlocking.
Description
Technical Field
The utility model relates to the technical field of fingerprint modules, in particular to a fingerprint module with luminous patterns.
Background
The fingerprint identification technology is a biological identification technology for identifying and verifying the identity of an individual, and the fingerprint characteristics are converted into digital data by collecting and analyzing fingerprint images so as to realize accurate identification of the identity of the individual. The fingerprint module is widely applied to the fields of mobile phones, tablet computers, access control systems and the like, and provides a convenient and safe identity verification mode for users.
The light-emitting element is attached to the existing fingerprint module as indication and decoration, as shown in fig. 1 and 2, the existing fingerprint module comprises a circuit board 1, a fingerprint chip 2, a packaging cover plate 3, a light source 5 and a light guide ring 5, wherein the fingerprint chip 2 and the light source 5 are fixed on the circuit board 1, the packaging cover plate 3 is covered on the fingerprint chip 2, the light guide ring 5 is sleeved on the periphery of the fingerprint chip, the packaging cover plate 3 and the light source 5, and light emitted by the light source 5 is emitted from the light guide ring 5, namely, light rays are emitted around the periphery of the fingerprint chip 2. The existing luminous fingerprint module has the following defects: (1) the diaphragm needs to be added, and the cost is high: (2) light can only be emitted from the aperture; (3) The user cannot be guided to press on the fingerprint recognition area accurately.
Disclosure of Invention
The utility model aims to solve the technical problem of providing the fingerprint module with the luminous pattern, which does not need to arrange a light guide ring, has low cost, can guide a user to accurately press in a fingerprint identification area, and improves the fingerprint unlocking success rate.
In order to solve the technical problems, the utility model provides a fingerprint module with a luminous pattern, which is characterized by comprising a circuit board, a fingerprint chip, a packaging cover plate and a light source, wherein the packaging cover plate is arranged between the fingerprint chip and the circuit board and is provided with a graphical light emitting area and a non-light emitting area, and light emitted by the light source passes through the graphical light emitting area of the packaging cover plate and is emitted from the contact surface of the fingerprint chip;
the packaging cover plate is made of a light-transmitting material, a light blocking layer is arranged on one side, facing the circuit board, of the packaging cover plate, and the light blocking layer is located in the non-light-emitting area.
As an improvement of the scheme, the light transmittance of the packaging cover plate is more than or equal to 80 percent.
As an improvement of the scheme, the packaging cover plate is made of one of polycarbonate, polyethylene, acrylic, polyethylene terephthalate, polypropylene, polyurethane, thermoplastic polyurethane elastomer, polyether-ether-ketone, glass, sapphire and silicon dioxide.
As an improvement of the above, the light blocking layer is made of a light reflecting material or a light absorbing material.
As an improvement of the scheme, a groove for accommodating the protruding structure of the fingerprint chip is formed in one side, facing the fingerprint chip, of the packaging cover plate, and the groove is located in the non-light-emitting area.
As an improvement of the scheme, the fingerprint chip comprises an induction chip and an IC chip, the induction chip comprises a light-transmitting substrate and a fingerprint identification array, the light-transmitting substrate is provided with a contact surface and a non-contact surface which are arranged backwards, the fingerprint identification array and the IC chip are arranged on the non-contact surface, and the fingerprint identification array is in conductive connection with the IC chip.
As an improvement of the above scheme, the non-contact surface is divided into an induction area and a non-induction area, the fingerprint identification array is positioned in the induction area, and the IC chip is positioned in the non-induction area;
the light emitted by the light source sequentially passes through the patterned light emitting area and the sensing area of the packaging cover plate and is emitted from the contact surface of the light-transmitting substrate.
As improvement of the scheme, the light-transmitting substrate is a glass substrate, the dielectric constant of the glass substrate is more than or equal to 3, and the light transmittance is more than or equal to 85%.
As an improvement of the scheme, the light source is arranged on one surface of the circuit board facing the fingerprint chip;
alternatively, the light source is disposed on a side surface of the circuit board.
The implementation of the utility model has the following beneficial effects:
according to the utility model, the packaging cover plate with the graphical light emitting area and the non-light emitting area is arranged between the fingerprint chip and the circuit board, so that the fingerprint chip can be protected, the graphical light emission of the fingerprint module can be realized without affecting fingerprint identification, a user can be guided to accurately press in the fingerprint identification area through the graphical light emission, and the fingerprint unlocking success rate is improved.
In addition, the light emitted by the light source of the fingerprint module can be emitted from the contact surface of the light-transmitting substrate through the patterned light-emitting area of the packaging cover plate, so that the front light-emitting effect can be realized, and no additional light guide ring is needed, and the cost is low.
The fingerprint chip is divided into the sensing chip and the IC chip to be arranged, so that light emitted by the light source is directly emitted from the sensing chip, and the sensing chip is directly contacted with the finger, thereby not only realizing the whole-surface luminescence of the fingerprint module, saving the aperture, reducing the cost, but also reducing the distance between the finger and the sensing chip and improving the recognition sensitivity.
Drawings
FIG. 1 is a top view of a prior art fingerprint module;
FIG. 2 is a cross-sectional view of the AA of FIG. 1;
FIG. 3 is a top view of the fingerprint module of the present utility model;
FIG. 4 is a cross-sectional view of BB of FIG. 3;
FIG. 5 is a schematic view of the structure of the package cover of the present utility model;
FIG. 6 is a schematic diagram of the structure of the sensing chip of the present utility model;
fig. 7 is a fingerprint signal collection image of a fingerprint module with a patterned light blocking layer fabricated on the contact surface.
Description of the embodiments
The present utility model will be described in further detail with reference to the accompanying drawings, for the purpose of making the objects, technical solutions and advantages of the present utility model more apparent. It is only stated that the terms of orientation such as up, down, left, right, front, back, inner, outer, etc. used in this document or the imminent present utility model, are used only with reference to the drawings of the present utility model, and are not meant to be limiting in any way.
Referring to fig. 3-5, the fingerprint module with a light emitting pattern provided by the utility model comprises a circuit board 1, a fingerprint chip 2, a packaging cover plate 3 and a light source 4, wherein the packaging cover plate 3 is arranged between the fingerprint chip 2 and the circuit board 1, the packaging cover plate 3 is provided with a patterned light emitting area 31 and a non-light emitting area 32, and light emitted by the light source 4 passes through the patterned light emitting area 31 of the packaging cover plate 3 and is emitted from a contact surface 2111 of the fingerprint chip 2.
The contact surface 2111 of the fingerprint chip 2 is the surface that contacts the finger. The fingerprint chip 2 comprises an induction chip 21 and an IC chip 22, wherein the induction chip 21 is used for collecting fingerprint signals, and the IC chip 22 is used for receiving the fingerprint signals collected by the induction chip 21 and processing and analyzing the signals.
As shown in fig. 6, the sensing chip 21 includes a light-transmitting substrate 211 and a fingerprint recognition array 222, the light-transmitting substrate 211 has a contact surface 2111 and a non-contact surface 2112 which are disposed opposite to each other, the fingerprint recognition array 222 and the IC chip 22 are disposed on the non-contact surface 2112, and the fingerprint recognition array 222 is electrically connected to the IC chip 22, and a finger of a user presses on the contact surface 2111.
Specifically, the non-contact surface 2112 is divided into an induction area and a non-induction area, the fingerprint identification array 222 is located in the induction area, the IC chip 22 is located in the non-induction area, and the light emitted by the light source 4 sequentially passes through the patterned light-emitting area 31 of the package cover 3 and the induction area of the light-transmitting substrate 211, and finally is emitted from the contact surface 2111. Because the contact surface 2111 of the fingerprint module can directly display the luminous pattern, the fingerprint module can be guided to be directly pressed on the fingerprint identification array 222, and further the fingerprint unlocking success rate is improved. If the user does not have the guidance of the light emitting pattern, if the user presses the finger at will at a place other than the fingerprint recognition array 222, the number of the fingerprint feature points collected by the sensing chip 21 is too small, and the IC chip 22 easily determines the signal as an error signal, so that the unlocking rate of the fingerprint is reduced, which is also the cause of frequent failure of unlocking the fingerprint.
Preferably, the transparent substrate 211 is a glass substrate, and the glass substrate not only can be used as a carrier for manufacturing the fingerprint identification array 222, but also can be used as a protection structure of the fingerprint module for protecting the fingerprint identification array 222 and the IC chip 22.
Based on the working principle of the capacitive fingerprint module: capacitive coupling exists between the human skin and the fingerprint recognition array 222, which causes a change in the distribution of the electric field around the fingerprint recognition array 222, thereby producing a change in capacitance. Since the glass substrate of the present utility model is sandwiched between the human skin and the fingerprint recognition array 222, the higher the dielectric constant of the glass substrate, the smaller the capacitive coupling effect the glass substrate has on between the human skin and the fingerprint recognition array 222. Preferably, the dielectric constant of the glass substrate is 3 or more. More preferably, the transmittance of the glass substrate is not less than 85%.
The light transmittance of the common white glass is generally 82% -83%, and the fingerprint identification array 222 is arranged on the non-contact surface 2112 of the glass substrate, so that the overall light transmittance of the sensing chip 21 can be reduced, and the glass substrate with the light transmittance being more than or equal to 85% is preferred for improving the front light emitting efficiency of the fingerprint module. More preferably, the dielectric constant of the glass substrate is not less than 5, and the light transmittance is not less than 90%.
It should be noted that, the fingerprint recognition array 222 of the present utility model is formed by an additive method, such as 3D printing, inkjet printing, screen printing, evaporation, sputtering, deposition, etc., and the raw material of the fingerprint recognition array 222 may be conductive paste, such as conductive silver paste, gold paste, copper paste, carbon paste, transparent oxide (ITO), graphene, etc. The fingerprint recognition array 222 of the present utility model may also be formed by subtractive methods, such as etching.
The package cover 3 of the present utility model is covered on the fingerprint recognition array 222 and the IC chip 22 for protecting the fingerprint recognition array 222 and the IC chip 22. The side of the encapsulation cover 3 facing the fingerprint chip 2 is provided with a recess 33 for accommodating the protruding structure of the fingerprint chip 2. That is, the side of the package cover 3 facing the fingerprint chip 2 is provided with a recess 33 for accommodating the IC chip 22, so that the overall volume of the fingerprint module can be reduced. Correspondingly, the groove 33 is located in the non-light-emitting region 32 of the package cover 3, and this is because the position of the groove 33 corresponds to the position of the IC chip 22, and since the IC chip 22 is located in the non-sensing region, the non-sensing region does not need to emit light, and in order not to block the light-emitting effect of the sensing region, the position of the groove 33 is correspondingly located in the non-light-emitting region 32.
It was found that although the patterned light blocking layer is formed on the contact surface 2111 of the light-transmitting substrate 211 to achieve the patterned light-emitting effect, this affects the fingerprint recognition effect, and as shown in fig. 7, the pattern of the light blocking layer is easily misjudged as a fingerprint signal, and it is difficult for the fingerprint signal pressed against the light blocking layer to distinguish between "ridges" and "valleys" in the fingerprint.
In order not to affect the signal material of the fingerprint identification array 222, the front light of the fingerprint module can be realized, and the light-emitting pattern with guiding property and attractive appearance can be realized. The present application forms patterned light extraction regions 31 and non-light extraction regions 32 on the package cover 3 on the side remote from the contact surface 2111. The packaging cover plate 3 is made of a light-transmitting material, and a light blocking layer 35 is arranged on one side of the packaging cover plate 3 facing the circuit board, as shown in fig. 5; that is, the package cover 3 is made of a light-transmitting material, and the light-blocking layer 35 is made on the side of the package cover 3 facing the circuit board, and the light-blocking layer 35 is located at the non-light-emitting region 32. In the research utility model, if the light blocking layer 35 is manufactured on the side of the packaging cover plate 3 facing the fingerprint chip 2, the pattern of the light blocking layer 35 is also easy to misjudge the fingerprint signal, and the IC chip 22 is required to remove background noise, so that the fingerprint unlocking success rate is affected.
In order to improve the light-emitting effect, the package cover 3 is made of a light-transmitting material. Preferably, the light transmittance of the encapsulation cover plate 3 is equal to or more than 80%. Since the package cover 3 of the present utility model does not need to be in contact with fingers, it can be made of inexpensive PC, acryl, etc. In addition, the light blocking layer 35 may be made of a light reflecting material or a light absorbing material. The light blocking layer may be formed by at least one of screen printing, 3D printing, inkjet printing, dispensing, painting, spraying, sputtering, evaporation, and adhesion.
Preferably, the light-transmitting material used for manufacturing the packaging cover plate is selected from one of Polycarbonate (PC), polyethylene (PE), acrylic (PMMA), polyethylene terephthalate (PET), polypropylene (PP), polyurethane (PU), thermoplastic polyurethane elastomer (TPU), polyether ether ketone (PEEK), glass, sapphire and silicon dioxide.
The packaging cover plate 3 not only can protect the fingerprint chip 2, but also can realize the patterned luminescence of the fingerprint module without affecting fingerprint identification.
The circuit board is arranged on the side of the encapsulation cover plate 3 facing away from the fingerprint chip 2, i.e. the encapsulation cover plate 3 is arranged between the fingerprint chip 2 and the circuit board 1. The circuit board 1 of the present utility model includes PCB (Printed Circuit Board) and FPC (Flexible Printed Circuit), and an FPC for connecting the sense die 21 and the PCB. One end of the FPC can be connected with the IC chip in a conductive manner through a binding process or welding mode, and the other end of the FPC is fixedly or detachably connected with the PCB in a conductive manner.
The light source 4 is preferably an LED lamp bead, and the LED lamp bead has the characteristics of small volume and high brightness, and can be arranged on one surface of the PCB facing the sensing chip 21 or on the side surface of the PCB side. In order to improve the light emitting uniformity of the fingerprint module with the light emitting patterns, at least 2 LED lamp beads are arranged, and preferably 3 or 4 LED lamp beads are arranged; more preferably, the plurality of LED lamp beads are uniformly distributed.
The light source 4 of the utility model can be used as indication and decoration, specifically, when the user does not press the fingerprint module yet, the light source 4 can be used for indicating the pressed area; when the user presses the sensing area with the fingerprint module, the light source 4 is turned on to indicate the fingerprint identification state, for example, the light source 4 is turned on to light green to indicate that the fingerprint identification is successful, and the light source 4 is turned on to light red to indicate that the fingerprint identification is failed. In addition, the user can set the indication rule of the light source 4 according to the actual need.
The utility model arranges the packaging cover plate 3 with the graphical light-emitting area 31 and the non-light-emitting area 32 between the fingerprint chip 2 and the circuit board 1, which not only can protect the fingerprint chip 2, but also can realize the graphical light emission of the fingerprint module without affecting the fingerprint identification, and can guide the user to accurately press in the fingerprint identification area through the graphical light emission, thereby improving the fingerprint unlocking success rate.
In addition, the light emitted by the light source 4 of the fingerprint module of the utility model passes through the patterned light-emitting region 31 of the packaging cover plate 3 and is emitted from the contact surface 2111 of the light-transmitting substrate 21, so that the front light-emitting effect can be realized, and no additional light guide ring is required, thereby having low cost.
The fingerprint chip 2 is divided into the sensing chip 21 and the IC chip 22 to be arranged, so that the light emitted by the light source 4 is directly emitted from the sensing chip 21, and the sensing chip 21 is directly contacted with a finger, thereby not only realizing the whole-surface light emission of the fingerprint module, saving a light guide ring, reducing the cost, but also reducing the distance between the finger and the sensing chip 21 and improving the recognition sensitivity.
The foregoing is a preferred embodiment of the present utility model and it should be noted that modifications and adaptations to those skilled in the art may be made without departing from the principles of the present utility model and are intended to be comprehended within the scope of the present utility model.
Claims (9)
1. The fingerprint module with the luminous patterns is characterized by comprising a circuit board, a fingerprint chip, a packaging cover plate and a light source, wherein the packaging cover plate is arranged between the fingerprint chip and the circuit board and is provided with a graphical light emitting area and a non-light emitting area, and light emitted by the light source passes through the graphical light emitting area of the packaging cover plate and is emitted from the contact surface of the fingerprint chip;
the packaging cover plate is made of a light-transmitting material, a light blocking layer is arranged on one side, facing the circuit board, of the packaging cover plate, and the light blocking layer is located in the non-light-emitting area.
2. The fingerprint module with luminous pattern of claim 1, wherein the light transmittance of the packaging cover plate is greater than or equal to 80%.
3. The fingerprint module with a luminous pattern as claimed in claim 1 or 2, wherein the material of the encapsulation cover plate is one of polycarbonate, polyethylene, acryl, polyethylene terephthalate, polypropylene, polyurethane, thermoplastic polyurethane elastomer, polyether ether ketone, glass, sapphire and silicon dioxide.
4. The fingerprint module having a light emitting pattern as set forth in claim 1, wherein the light blocking layer is made of a light reflecting material or a light absorbing material.
5. The fingerprint module with luminous pattern of claim 1, wherein a side of the packaging cover plate facing the fingerprint chip is provided with a groove for accommodating the convex structure of the fingerprint chip, and the groove is positioned in the non-light-emitting area.
6. The fingerprint module with a light-emitting pattern according to claim 1, wherein the fingerprint chip comprises an induction chip and an IC chip, the induction chip comprises a light-transmitting substrate and a fingerprint recognition array, the light-transmitting substrate has a contact surface and a non-contact surface which are disposed back, the fingerprint recognition array and the IC chip are disposed on the non-contact surface, and the fingerprint recognition array is electrically connected with the IC chip.
7. The fingerprint module with luminous pattern of claim 6, wherein the non-contact surface is divided into a sensing area and a non-sensing area, the fingerprint identification array is positioned in the sensing area, and the IC chip is positioned in the non-sensing area;
the light emitted by the light source sequentially passes through the patterned light emitting area and the sensing area of the packaging cover plate and is emitted from the contact surface of the light-transmitting substrate.
8. The fingerprint module with a light-emitting pattern according to claim 6, wherein the light-transmitting substrate is a glass substrate, and the dielectric constant of the glass substrate is not less than 3 and the light transmittance is not less than 85%.
9. The fingerprint module with the luminous pattern as claimed in claim 1, wherein the light source is arranged on one surface of the circuit board facing the fingerprint chip;
alternatively, the light source is disposed on a side surface of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322167944.5U CN220526363U (en) | 2023-08-14 | 2023-08-14 | Fingerprint module with luminous pattern |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322167944.5U CN220526363U (en) | 2023-08-14 | 2023-08-14 | Fingerprint module with luminous pattern |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220526363U true CN220526363U (en) | 2024-02-23 |
Family
ID=89929289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322167944.5U Active CN220526363U (en) | 2023-08-14 | 2023-08-14 | Fingerprint module with luminous pattern |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220526363U (en) |
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2023
- 2023-08-14 CN CN202322167944.5U patent/CN220526363U/en active Active
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