CN220511303U - Flexible circuit board and electronic equipment - Google Patents
Flexible circuit board and electronic equipment Download PDFInfo
- Publication number
- CN220511303U CN220511303U CN202321432148.3U CN202321432148U CN220511303U CN 220511303 U CN220511303 U CN 220511303U CN 202321432148 U CN202321432148 U CN 202321432148U CN 220511303 U CN220511303 U CN 220511303U
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- Prior art keywords
- flexible circuit
- circuit board
- bending
- section
- reinforcing sheet
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- 238000005452 bending Methods 0.000 claims abstract description 73
- 230000003014 reinforcing effect Effects 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 10
- 229920001721 polyimide Polymers 0.000 claims description 10
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 238000009413 insulation Methods 0.000 abstract description 19
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 37
- 230000002787 reinforcement Effects 0.000 description 7
- 239000002390 adhesive tape Substances 0.000 description 5
- 239000003292 glue Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000013039 cover film Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polyethylene terephthalate Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The application provides a flexible circuit board and electronic equipment, relates to flexible circuit board manufacturing technical field. The flexible circuit board includes: the insulation film comprises an insulation film and a flexible circuit, wherein the flexible circuit is arranged on the insulation film, the insulation film comprises a bending section and an extending section which are connected with each other, the bending section at least comprises a bending area, the thickness of the bending area is larger than that of other areas of the insulation film, and the corners of the bending area are provided with round chamfers. The method solves the problems that in the prior art, stress concentration occurs in bending areas of the flexible circuit board which is bent for many times, risks such as cracks and breakage occur easily, and the cost is high.
Description
Technical Field
The present disclosure relates to flexible circuit boards, and particularly to a flexible circuit board and an electronic device.
Background
The flexible printed circuit board (Flexible Printed Circuit, abbreviated as FPC) is a flexible printed circuit board which is made of polyimide or polyester film as a base material and has high reliability and excellent flexibility. The wiring density is high, the weight is light, the thickness is thin, the flexibility is good.
In the prior art, the flexible circuit board is adapted to the distribution of the connected electronic components or the layout of the electronic equipment, so that the flexible circuit board is often produced into a flexible circuit board with multiple bending according to the production requirement, and the flexible circuit board with multiple bending is easy to generate fatigue cracks and even fracture phenomena in the bending area due to stress concentration, so that the yield of the flexible circuit board is lower and the production cost is higher.
Disclosure of Invention
The technical problem to be solved by the embodiment of the utility model is to provide a flexible circuit board and electronic equipment, so as to solve the problems of high cost caused by the risks of cracks, breakage and the like which are easily generated due to stress concentration in a bending area of the flexible circuit board which is bent for many times in the prior art.
In a first aspect, an embodiment of the present utility model provides a flexible circuit board, including: the insulation film comprises an insulation film and a flexible circuit, wherein the flexible circuit is arranged on the insulation film, the insulation film comprises a bending section and an extending section which are connected with each other, the bending section at least comprises a bending area, the thickness of the bending area is larger than that of other areas of the insulation film, and the corner of the bending area is provided with a round chamfer.
Further, the extension section comprises a first extension section and a second extension section which are connected with each other, and the first extension section is connected with the bending section; the flexible circuit board further comprises an electromagnetic shielding film, and the electromagnetic shielding film is covered on the bending section and the first extension section.
Further, the flexible circuit board further comprises a first connecting terminal and a second connecting terminal, wherein the first connecting terminal is connected with the bending section, and the second connecting terminal is connected with the extending section.
Further, the second connection terminal is connected with the extension section through a connection section; the flexible circuit board further comprises an adhesive layer, and the adhesive layer is arranged on the second extension section and the connecting section.
Further, a first reinforcing sheet is arranged at the first connecting terminal.
Further, the flexible circuit board further comprises a second reinforcing sheet, and the second reinforcing sheet is arranged at the bending area.
Further, the materials of the first reinforcing sheet and the second reinforcing sheet are steel or polyimide.
Further, the thickness of the flexible circuit board is a; wherein, a is more than or equal to 230 μm and more than or equal to 130 μm.
Further, the thickness at the bending area is b; wherein, b is more than or equal to 75 μm and more than or equal to 25 μm.
In a second aspect, an embodiment of the present utility model provides an electronic device, including: the flexible circuit board is arranged in the machine body.
Compared with the prior art, the flexible circuit board provided by the embodiment of the utility model has the beneficial effects that the flexible circuit board provided by the embodiment of the utility model comprises: the insulation film comprises an insulation film and a flexible circuit, wherein the flexible circuit is arranged on the insulation film, the insulation film comprises a bending section and an extending section which are connected with each other, the bending section at least comprises a bending area, the thickness of the bending area is larger than that of other areas of the insulation film, and the corners of the bending area are provided with round chamfers. The round chamfer is arranged at the corner of the bending area, so that the phenomenon that the flexible circuit board is cracked or even broken due to stress concentration caused by sharp right-angle corners is avoided; and increase the thickness of the insulating film of the bending region department of bending section to this makes the structural strength of bending region department higher, makes the thicker material thickness of insulating film of bending region can offset the concentration of here stress, avoids causing the damage to bending region in follow-up processing, installation, thereby has improved the yields of product, has reduced manufacturing cost.
Drawings
The utility model will now be described in further detail with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic plan view of a flexible circuit board according to an embodiment of the present utility model;
fig. 2 is a schematic plan view of a flexible circuit board according to a second embodiment of the present utility model;
fig. 3 is a schematic cross-sectional structure of a flexible circuit board according to an embodiment of the present utility model;
fig. 4 is a schematic cross-sectional structure of a flexible circuit board with an electromagnetic shielding film, an adhesive layer and a first reinforcing sheet according to an embodiment of the present utility model;
fig. 5 is a schematic cross-sectional structure of a flexible circuit board with an electromagnetic shielding film, an adhesive layer, a first reinforcing sheet and a second reinforcing sheet according to an embodiment of the present utility model.
The accompanying drawings: 1000. a flexible circuit board; 100. an insulating film; 101. bending sections; 1011. a bending region; 102. an extension section; 1021. a first extension; 1022. a second extension; 200. a flexible circuit; 300. an electromagnetic shielding film; 400. a first connection terminal; 500. a second connection terminal; 600. an adhesive layer; 700. a first reinforcing sheet; 800. a second reinforcing sheet; 900. and a connecting section.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments may be combined with each other. Preferred embodiments of the present utility model will now be described in detail with reference to the accompanying drawings.
An embodiment of the present utility model provides a flexible circuit board 1000, as shown in fig. 1 to 5, the flexible circuit board 1000 includes: the insulation film 100 and the flexible circuit 200, the flexible circuit 200 is arranged on the insulation film 100, the insulation film 100 comprises a bending section 101 and an extension section 102 which are connected with each other, the bending section 101 at least comprises a bending region 1011, the thickness of the bending region 1011 is larger than that of other regions of the insulation film 100, and the corner of the bending region 1011 is provided with a round chamfer.
The round chamfer is arranged at the corner of the bending region 1011, so that the phenomenon that the flexible circuit board 1000 is cracked or even broken due to stress concentration caused by sharp right-angle corners is avoided; and increase the thickness of the insulating film 100 at the bending region 1011 of the bending section 101, so as to make the structural strength at the bending region 1011 higher, so that the thicker material thickness of the insulating film 100 at the bending region 1011 can counteract the concentration of stress at the bending region, and avoid damaging the bending region 1011 in the subsequent processing and mounting processes, thereby improving the yield of products and reducing the production cost.
Specifically, there are various ways in which the thickness of the insulating film 100 at the bending region 1011 of the bending section 101 may be increased, for example, a difference in thickness is formed for the bending region 1011 and other regions during the production of the insulating film 100; for another example, a thinner insulating film 100 is produced and the bent regions 1011 are stacked such that the insulating film 100 of the bent regions 1011 is thicker than other regions.
Referring to fig. 1 to 3, the extension 102 includes a first extension 1021 and a second extension 1022 connected to each other, the first extension 1021 being connected to the bending section 101; the flexible circuit board 1000 further includes an electromagnetic shielding film 300, and the electromagnetic shielding film 300 is covered on the bending section 101 and the first extension section 1021.
The flexible circuit board 1000 is also provided with an electromagnetic shielding film 300, the electromagnetic shielding film 300 is formed by processing PET (polyethylene terephthalate) material and coated nano silver wires, and has the characteristics of low resistance and high conductivity, and the electromagnetic shielding film 300 used on the flexible circuit board 1000 can be transparent or semitransparent, so that the flexible circuit board 1000 can be observed conveniently; the electromagnetic shielding film 300 covers the whole bending section 101 and the first extension section 1021, so that the circuit of a part of the area on the flexible circuit board 1000 can be protected from being interfered by external electromagnetic signals, and the normal use of the flexible circuit board 1000 is ensured.
Referring to fig. 1 to 3, the flexible circuit board 1000 further includes a first connection terminal 400 and a second connection terminal 500, the first connection terminal 400 is connected to the bending section 101, and the second connection terminal 500 is connected to the extension section 102.
Specifically, the first connection terminal 400 and the second connection terminal 500 are used for exchanging electrical signals of the flexible circuit board 1000, the first connection terminal 400 and the second connection terminal 500 are composed of a plurality of golden conductive contacts, and the arrangement mode of the conductive contacts can be set according to the requirement; in this embodiment, the conductive contacts on the first connection terminal 400 and the second connection terminal 500 (as shown in fig. 1) are arranged in a side-by-side and uniform manner, and are also called "gold finger" pads because their surfaces are plated with gold and arranged like fingers.
Referring to fig. 2 and 4, the second connection terminal 500 is connected with the extension 102 through the connection section 900; the flexible circuit board 1000 further includes an adhesive layer 600, where the adhesive layer 600 is disposed on the second extension 1022 and the connection 900.
The adhesive layer 600 is used for adhering and fixing the flexible circuit board 1000 at a design position in the electronic device, so as to ensure the stability of the flexible circuit board 1000 at the design position, and the adhesive layer 600 is arranged on the second extension 1022 and the connection 900 and is used for fixing the area on the flexible circuit board 1000.
Specifically, the adhesive layer 600 of the flexible circuit board 1000 is generally applied in two modes, for example, a single-sided adhesive tape is selected for fixing, and the four sides of the flexible circuit board 1000 are fixed on the carrier board by using a thin high-temperature resistant single-sided adhesive tape, so that the flexible circuit board 1000 is not offset and tilted; for example, the double-sided adhesive tape is selected for fixing, the high-temperature-resistant double-sided adhesive tape is firstly used for pasting on the carrier plate, and then the flexible circuit board 1000 is pasted on the carrier plate, so that the double-sided or single-sided adhesive tape has the advantages of extremely strong adhesive force, high temperature resistance, large tensile force, light weight, corrosion resistance, regular appearance and the like.
Referring to fig. 1 and 4, a first reinforcing sheet 700 is provided at the first connection terminal 400.
Specifically, since the first connection terminal 400 is disposed on the flexible circuit board 1000, and the flexible circuit board 1000 is soft and easy to deform, the provision of such a hard element as the first connection terminal 400 directly on the flexible circuit board 1000 is equivalent to providing a rigid constraint place on the flexible circuit board 1000, and the stress concentration of the flexible circuit board 1000 at the first connection terminal 400 is easy to occur, thereby causing the problems of cold joint, short circuit, poor contact, etc. of the first connection terminal 400 on the flexible circuit board 1000. In order to solve the above-mentioned problem, the first reinforcing sheet 700 is added to the flexible circuit board 1000 at the first connection terminal 400 in this embodiment, and the first reinforcing sheet 700 has a certain supporting force on the flexible circuit board 1000, so that the stress concentration of the rigid first connection terminal 400 on the flexible circuit board 1000 is effectively eliminated, and the first connection terminal 400 is kept stable on the flexible circuit board 1000. Of course, there are other methods to eliminate stress concentration of the flexible circuit board 1000 besides reinforcement at rigid constraints as in the present embodiment, such as surface strengthening of the flexible circuit board 1000, optimizing design of structures or wirings within the flexible circuit board 1000, and the like.
In an alternative embodiment of the present application, as shown in fig. 2 and 5, the flexible circuit board 1000 further includes a second reinforcing sheet 800, where the second reinforcing sheet 800 is disposed at the bending region 1011.
The second reinforcing sheet 800 is disposed at the bending region 1011, and the second reinforcing sheet 800 in this embodiment may laminate and reinforce the bending region 1011 by using the same material as the insulating film 100 in the production process, for example, a polyimide material, or may select other reinforcing materials to reinforce the bending region 1011, so as to improve the structural strength of the bending region 1011, avoid the cracking or even breaking phenomenon of the insulating film 100 of the bending region 1011 due to the stress concentration occurring at the bending corner, and avoid the damage to the bending region 1011 in the subsequent processing and mounting processes, thereby improving the yield of the product and reducing the production cost.
In an alternative embodiment of the present application, the material of the first reinforcing sheet 700 and the second reinforcing sheet 800 is steel or polyimide.
Specifically, the first reinforcing sheet 700 and the second reinforcing sheet 800 may be reinforced by a steel sheet or a reinforcing sheet of polyimide material. Selecting a steel sheet for reinforcement, wherein the steel sheet can be etched, and has stronger hardness and supporting strength; polyimide reinforcement, also called PI reinforcement, is the same as a cover film, and consists of three parts, namely polyimide and glue release paper, wherein the polyimide layer is thicker, the polyimide has flame retardance, high temperature resistance and low temperature resistance, the long-term use temperature can be between-200 ℃ and 426 ℃, and a steel plate or PI material is generally selected to reinforce the first connecting terminal 400.
In addition to the two reinforcing materials, the reinforcing sheet of the flexible circuit board 1000 is selected, for example, FR4 is selected for reinforcement, FR4 is a code of a flame-retardant material grade, which means a material specification that the resin material must be able to self-extinguish when in a burning state, it is not a material name, but a material grade, and FR4 is composed of glass fiber cloth and epoxy resin glue as main components, and its mechanical properties, dimensional stability, impact resistance, and moisture resistance are high.
It should be noted that, the reinforcement may not be too thick, which may increase the difficulty of assembling the flexible circuit board 1000, and the reinforcement of the bending region 1011 may be made of a thin material, for example, PI, FP4 or steel sheet with a thickness of 0.1mm-0.2mm, which is selected as much as possible, and the specific requirement is determined according to the actual situation.
In an alternative embodiment of the present application, the flexible circuit board 1000 has a thickness a; wherein, a is more than or equal to 230 μm and more than or equal to 130 μm. The thickness of the bent region 1011 is b; wherein, b is more than or equal to 75 μm and more than or equal to 25 μm.
The flexible circuit board 1000 thickens the laminated base material, so that the structural strength of the flexible circuit board 1000 can be improved, the anti-tearing capability of the flexible circuit board 1000 can be effectively improved, the concentration of stress at the position can be counteracted by the thicker material thickness of the insulating film 100 of the bending region 1011, the bending region 1011 is prevented from being damaged in the subsequent processing and mounting processes, the yield of products is improved, and the production cost is reduced.
The embodiment of the utility model provides electronic equipment, which comprises: a body and the flexible circuit board 1000 according to any one of the above, the flexible circuit board 1000 being provided in the body.
The electronic device includes the same structure and advantageous effects as the flexible circuit board 1000 in the foregoing embodiment. The structure and the advantages of the flexible circuit board 1000 have been described in detail in the foregoing embodiments, and are not described herein.
It should be understood that the foregoing embodiments are merely illustrative of the technical solutions of the present utility model, and not limiting thereof, and that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art; all such modifications and substitutions are intended to be included within the scope of this disclosure as defined in the following claims.
Claims (10)
1. A flexible circuit board, comprising:
an insulating film;
the flexible circuit is arranged on the insulating film, the insulating film comprises a bending section and an extending section which are connected with each other, the bending section at least comprises a bending area, the thickness of the bending area is larger than that of other areas of the insulating film, and the corner of the bending area is provided with a round chamfer.
2. The flexible circuit board of claim 1 wherein: the extending section comprises a first extending section and a second extending section which are connected with each other, and the first extending section is connected with the bending section; the flexible circuit board further comprises an electromagnetic shielding film, and the electromagnetic shielding film is covered on the bending section and the first extension section.
3. The flexible circuit board of claim 2 wherein: the flexible circuit board further comprises a first connecting terminal and a second connecting terminal, wherein the first connecting terminal is connected with the bending section, and the second connecting terminal is connected with the extending section.
4. A flexible circuit board according to claim 3, wherein: the second connecting terminal is connected with the extension section through a connecting section; the flexible circuit board further comprises an adhesive layer, and the adhesive layer is arranged on the second extension section and the connecting section.
5. A flexible circuit board according to claim 3, wherein: the first connecting terminal is provided with a first reinforcing sheet.
6. The flexible circuit board of claim 5 wherein: the flexible circuit board further comprises a second reinforcing sheet, and the second reinforcing sheet is arranged at the bending area.
7. The flexible circuit board of claim 6 wherein: the materials of the first reinforcing sheet and the second reinforcing sheet are steel or polyimide.
8. The flexible circuit board of any of claims 1-4, wherein: the thickness of the flexible circuit board is a;
wherein, a is more than or equal to 230 μm and more than or equal to 130 μm.
9. A flexible circuit board according to any one of claims 1-6, wherein: the thickness of the bending area is b;
wherein, b is more than or equal to 75 μm and more than or equal to 25 μm.
10. An electronic device, the electronic device comprising: a body and the flexible circuit board of any one of claims 1-9;
the flexible circuit board is arranged in the machine body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321432148.3U CN220511303U (en) | 2023-06-06 | 2023-06-06 | Flexible circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321432148.3U CN220511303U (en) | 2023-06-06 | 2023-06-06 | Flexible circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220511303U true CN220511303U (en) | 2024-02-20 |
Family
ID=89866776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321432148.3U Active CN220511303U (en) | 2023-06-06 | 2023-06-06 | Flexible circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220511303U (en) |
-
2023
- 2023-06-06 CN CN202321432148.3U patent/CN220511303U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |