CN220491167U - Camera module - Google Patents

Abstract

The present disclosure relates to a camera module and a method of manufacturing a housing of the camera module. The camera module includes: a lens barrel; a driver configured to move the lens barrel; and a housing in which the lens barrel is disposed, wherein the driver includes: a wiring layer configured to transmit an electrical signal; a driving circuit section electrically connected to the wiring layer; a coil electrically connected to the wiring layer; and a magnet electromagnetically coupled to the coil, and the wiring layer is a stamped metal part integrally bonded with the housing.

Description

Camera module

Technical Field

The present disclosure relates to a camera module and a method of manufacturing a housing of the camera module.

Background

With the remarkable development of information and communication technologies and semiconductor technologies, the supply and use of electronic devices is also rapidly increasing. These electronic devices tend to provide integration of various functions rather than stay in their conventional, inherent fields.

Recently, cameras have become a basic configuration in portable electronic devices such as smartphones, tablet PCs, and laptop computers, and cameras in these portable electronic devices have added an Auto Focus (AF) function and an Image Stabilization (IS) function, as well as a zoom function.

When various functions are added to the camera module, the manufacturing process of the camera module becomes complicated, the manufacturing cost is increased, and when different parts are separately formed and then assembled with each other, the quality of the product is deteriorated due to occurrence of an assembly process error.

The above information disclosed in this background section is only for enhancement of understanding of the background of the technology and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.

Disclosure of Invention

This summary is provided to introduce a selection of concepts in a simplified form that are further described below in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

In one general aspect, a camera module includes: a lens barrel; a driver configured to move the lens barrel; and a housing in which the lens barrel is disposed, wherein the driver includes: a wiring layer configured to transmit an electrical signal; a driving circuit section electrically connected to the wiring layer; a coil electrically connected to the wiring layer; and a magnet electromagnetically coupled to the coil, and the wiring layer is a stamped metal part integrally bonded with the housing.

The housing may include a base housing and a base portion, the wiring layer may be mounted on the base portion, and the base housing and the base portion may be integrally combined in the injection-molded part.

The curing temperature of the material of the base shell may be substantially the same as the curing temperature of the material of the base portion.

The wiring layer may be surface-mounted on the base portion.

The wiring layer and the coil may be integrally combined with the housing.

The coil may be a stamped metal part.

The case may include a base case and a base part, the wiring layer and the coil may be mounted on the base part, and the base case and the base part may be integrally combined in the injection-molded part.

The wiring layer and the coil may be surface-mounted on the base portion.

The wiring layer, the coil, and the driving circuit portion may be integrally combined with the housing.

The case may include a base case and a base portion, the wiring layer, the coil, and the driving circuit portion may be surface-mounted on the base portion, and the base case and the base portion may be integrally incorporated in the injection-molded part.

The driver may include: a focus adjustment driver configured to move the lens barrel in an optical axis direction of the lens barrel, and including a first wiring layer; and a shake correction driver configured to move the lens barrel in a direction perpendicular to the optical axis direction, and including a second wiring layer, and the first wiring layer of the focus adjustment driver and the second wiring layer of the shake correction driver may be stamped metal members integrally combined with the housing.

The shake correction driver may include a first shake correction driver and a second shake correction driver, the second wiring layer of the shake correction driver may include a second wiring layer of the first shake correction driver and a second wiring layer of the second shake correction driver, and the second wiring layer of the first shake correction driver and the second wiring layer of the second shake correction driver may be electrically connected to each other.

The coils of the driver may include a first coil of the focus adjustment driver and a second coil of the shake correction driver, and the first coil of the focus adjustment driver and the second coil of the shake correction driver may be stamped metal parts integrally combined with the housing.

In another general aspect, a method of manufacturing a housing of a camera module includes: forming a wiring layer of a driver configured to drive the lens barrel by a metal stamping method; mounting a wiring layer on the base portion; combining the base portion with the base housing by an injection molding method to form an injection molded component; and curing the injection molded part.

Mounting the wiring layer may include surface-mounting the wiring layer on the base portion by a surface mounting method.

The method may further comprise: forming a coil of the driver; and mounting the coil on the base portion.

Forming the coil may include forming the coil by a metal stamping method.

In another general aspect, a camera module includes: an injection molded housing; a lens barrel provided in the injection-molded housing; and a driver configured to move the lens barrel, and including: an injection molded base integrally combined with the injection molded housing; a stamped metal wiring layer integrally bonded with the injection molded base portion; a driving circuit portion electrically connected to the stamped metal wiring layer; a coil electrically connected to the stamped metal wiring layer; and a magnet electromagnetically coupled to the coil.

The coil may be mounted on an injection molded base.

The driving circuit part may be surface-mounted on the injection-molded base part.

The injection molded housing may include a base housing integrally combined with the injection molded base portion to form the injection molded housing.

Other features and aspects will be apparent from the following detailed description, the accompanying drawings, and the claims.

Drawings

Fig. 1 shows a schematic exploded perspective view of a camera module according to an embodiment.

Fig. 2 shows a perspective view of a housing of the camera module of fig. 1.

Fig. 3 shows an exploded perspective view of the housing of fig. 2.

Fig. 4 shows a perspective view of a first wiring layer and a second wiring layer of the housing of fig. 3.

Fig. 5 shows a perspective view of a third wiring layer of the housing of fig. 3.

Fig. 6 shows a perspective view of the first, second and third driving parts of the housing of fig. 3.

Fig. 7 to 17 illustrate a method of manufacturing a housing of the camera module of fig. 1.

Like numbers refer to like elements throughout the drawings and detailed description. The drawings may not be to scale and the relative sizes, proportions and descriptions of elements in the drawings may be exaggerated for clarity, illustration and convenience.

Detailed Description

The following detailed description is provided to assist the reader in obtaining a comprehensive understanding of the methods, apparatus, and/or systems described herein. However, various changes, modifications, and equivalents of the methods, devices, and/or systems described herein will be apparent after an understanding of the present disclosure. For example, the order of operations described herein is merely an example and is not limited to the order set forth herein, but may be altered as will become apparent after an understanding of the disclosure of the application, except for operations that must occur in a certain order. In addition, descriptions of features known in the art may be omitted for the sake of clarity and conciseness.

The features described herein may be implemented in different forms and are not to be construed as limited to the examples described herein. Rather, the examples described herein are provided merely to illustrate some of the many possible ways to implement the methods, devices, and/or systems described herein that will be apparent upon an understanding of the present disclosure.

Throughout the specification, when an element (such as a layer, region or substrate) is referred to as being "on," "connected to" or "coupled to" another element, it can be directly on, connected to or coupled to the other element or one or more other elements intervening therebetween. In contrast, when an element is referred to as being "directly on," "directly connected to," or "directly coupled to" another element, there may be no other element intervening elements present.

As used herein, the term "and/or" includes any one of the listed items associated and any combination of any two or more of the listed items associated.

Although terms such as "first," "second," and "third" may be used herein to describe various elements, components, regions, layers or sections, these elements, components, regions, layers or sections should not be limited by these terms. Rather, these terms are only used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first member, first component, first region, first layer, or first portion mentioned in examples described herein may also be referred to as a second member, second component, second region, second layer, or second portion without departing from the teachings of the examples.

Spatially relative terms, such as "above," "upper," "lower," and "lower," may be used herein for ease of description to describe one element's relationship to another element as illustrated in the figures. Such spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "upper" relative to another element would then be "below" or "lower" relative to the other element. Thus, the term "above" includes both above and below orientations, depending on the spatial orientation of the device. The device may also be oriented in other ways (e.g., rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing various examples only and is not intended to be limiting of the disclosure. The articles "a," "an," and "the" are intended to also include the plural forms unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" specify the presence of stated features, amounts, operations, components, elements, and/or combinations thereof, but do not preclude the presence or addition of one or more other features, amounts, operations, components, elements, and/or groups thereof.

The phrase "in a plan view" or "on a plane" means that the target portion is viewed from the top, and the phrase "in a sectional view" or "on a section" means that a section formed by vertically cutting the target portion is viewed from the side.

Hereinafter, various embodiments and modified examples will be described in detail with reference to the accompanying drawings.

A camera module according to an embodiment will be described with reference to fig. 1. Fig. 1 shows a schematic exploded perspective view of a camera module according to an embodiment.

Referring to fig. 1, a camera module 100 according to an embodiment may include a lens barrel 120, a lens driving device (hereinafter, may also be referred to as a driver) 150 that moves the lens barrel 120, an image sensor unit 160 that converts light incident through the lens barrel 120 into an electrical signal, a housing 1000 that accommodates the lens barrel 120 and the lens driving device 150, and a cover 113.

The lens driving apparatus 150 is an apparatus for moving the lens barrel 120, and may include a focus adjustment unit 130 for adjusting focus and a shake correction unit 140 for correcting shake.

The lens barrel 120 may be accommodated in the lens holder 142, and the lens holder 142 and the guide member 131 may be accommodated in the focus adjustment unit 130.

The focus adjustment unit 130 may include a bearing portion 1300 accommodating the lens barrel 120, and a focus adjustment driver generating a driving force to move the lens barrel 120 and the bearing portion 1300 in the optical axis direction.

The focus adjustment driver may include a first lens driver 201, the first lens driver 201 including a focus adjustment magnet 232 and a focus adjustment coil 233.

The focus adjustment magnet 232 of the first lens driver 201 may be mounted on one side surface of the carrier 1300.

The focus adjustment coil 233 of the first lens driver 201 may be a stamped metal part formed by a metal stamping method, and may be integrally combined with the housing 1000 by an injection molding method to form an injection molded part. Although not shown in fig. 1, a wiring layer transmitting the driving current to the focus adjustment coil 233 may be a stamped metal part formed by a metal stamping method, and may be electrically connected to the focus adjustment coil 233, and the wiring layer may be integrally combined with the housing 1000 by an injection molding method to form an injection molded part.

When a driving current is applied to the focus adjustment coil 233 through the wiring layer, the bearing portion 1300 may be moved in the optical axis direction by an electromagnetic force generated between the focus adjustment magnet 232 and the focus adjustment coil 233. Since the lens barrel 120 is accommodated in the bearing portion 1300, the lens barrel 120 is also moved in the optical axis direction by the movement of the bearing portion 1300.

The first ball member 170 may be disposed between the bearing 1300 and the housing 1000 to reduce friction between the bearing 1300 and the housing 1000 when the bearing 1300 moves. The first ball member 170 may include a plurality of ball members disposed on both sides of the focus adjustment magnet 232. A guide groove may be formed in the bearing portion 1300 on both sides of the focus adjustment magnet 232 such that the first ball member 170 is received therein to guide the bearing portion 1300 in the optical axis direction.

The shake correction unit 140 includes a guide member 131 for guiding movement of the lens barrel 120, and a shake correction driver for generating a driving force to move the guide member 131 in a direction perpendicular to the optical axis direction.

The guide member 131 and the lens holder 142 are inserted into the bearing portion 1300 such that they are disposed in the optical axis direction, and serve to guide movement of the lens barrel 120 in a direction perpendicular to the optical axis direction.

The lens holder 142 may have a substantially quadrangular frame shape. The shake correction magnets 244a and 245a may be disposed on two adjacent side surfaces of the lens holder 142. The stopper 114 may be disposed above the lens barrel 120 to prevent the lens holder 142 from being separated from the inner space of the bearing 1300, and the stopper 114 may be fastened to the bearing 1300.

The shake correction driver may include the second lens driver 202, and the second lens driver 202 may include shake correction magnets 244a and 245a and shake correction coils 244b and 245b facing the shake correction magnets 244a and 245a, respectively, wherein the shake correction magnets 244a and the shake correction coils 244b may form a first shake correction driver, and the shake correction magnets 245a and the shake correction coils 245b may form a second shake correction driver.

The shake correction magnets 244a and 245a of the second lens driver 202 may be mounted on the lens holder 142.

The shake correction coils 244b and 245b of the second lens driver 202 facing the shake correction magnets 244a and 245a, respectively, may be stamped metal parts formed by a metal stamping method, and may be integrally combined with the housing 1000 by an injection molding method to form injection molded parts. Although not shown in fig. 1, two wiring layers that transmit driving currents to the shake correction coils 244b and 245b, respectively, may also be stamped metal members formed by a metal stamping method, and may be electrically connected to the shake correction coils 244b and 245b, respectively, and the two wiring layers may be integrally combined with the housing 1000 by an injection molding method to form an injection molded member.

When a driving current is applied to the shake correction coils 244b and 245b through the wiring layer, the lens holder 142 may be moved in a direction perpendicular to the optical axis direction by an electromagnetic force generated between the shake correction magnets 244a and 245a and the shake correction coils 244b and 245 b. Since the lens barrel 120 is accommodated in the lens holder 142, the lens barrel 120 is also moved in a direction perpendicular to the optical axis direction by the movement of the lens holder 142.

A plurality of second ball members 172a may be provided to support the guide member 131 on the bearing part 1300 and maintain a space between the guide member 131 and the bearing part 1300, and a plurality of third ball members 172b may be provided to support the lens holder 142 on the guide member 131 and maintain a space between the lens holder 142 and the guide member 131. The plurality of second ball members 172a and the plurality of third ball members 172b serve to guide the lens holder 142 during a shake correction operation.

The image sensor unit 160 is a device that converts light incident through the lens barrel 120 into an electrical signal. For example, the image sensor unit 160 may include an image sensor 161 and a printed circuit board 163 electrically connected to the image sensor 161, and may further include an infrared filter. The infrared filter blocks light in an infrared region among light incident through the lens barrel 120.

The image sensor 161 converts light incident through the lens barrel 120 into an electrical signal. For example, the image sensor 161 may be a Charge Coupled Device (CCD) or a Complementary Metal Oxide Semiconductor (CMOS) device. The electric signal converted by the image sensor 161 is output as an image through a display unit of the portable electronic device. The image sensor 161 is mounted on the printed circuit board 163, and may be electrically connected to the printed circuit board 163.

At least a portion of the lens barrel 120 and the lens driving apparatus 150 are accommodated in a space within the housing 1000. For example, the case 1000 may have a box shape having openings in upper and lower surfaces thereof. The image sensor unit 160 is disposed on the lower surface of the housing 1000.

The cover 113 is fastened to the housing 1000 to cover an outer surface of the housing 1000 and serves to protect internal components of the camera module 100. In addition, the cover 113 may function to shield electromagnetic waves. For example, the cover 113 may shield electromagnetic waves generated by the camera module 100 so that the electromagnetic waves do not affect other electronic components in the portable electronic device in which the camera module 100 is mounted.

In addition, the cover 113 may shield electromagnetic waves generated by other electronic components in the portable electronic device so that the electromagnetic waves generated by the other electronic components do not affect the camera module 100.

The cover 113 may be made of a metal material and may be grounded to a ground pad of the printed circuit board 163 to shield electromagnetic waves generated by the camera module 100 and electromagnetic waves generated by other electronic components of the portable electronic device.

Further, each of the focus adjustment driver and the shake correction driver may further include a sensing portion for sensing movement of the lens barrel 120, and each of the sensing portion of the focus adjustment driver and the sensing portion of the shake correction driver may be in the form of an IC package that may be controlled by a controller included in the printed circuit board 163 electrically connected to the image sensor 161.

Hereinafter, the coil and the wiring layer, which are stamped metal parts formed by a metal stamping method and integrally combined with the housing 1000 by an injection molding method, as described above, will be described in more detail.

First, referring to fig. 2 to 6, a housing 1000 of the camera module 100 of fig. 1 will be described in more detail. Fig. 2 illustrates a perspective view of a housing of the camera module of fig. 1, fig. 3 illustrates an exploded perspective view of the housing of fig. 2, fig. 4 illustrates a perspective view of a first wiring layer and a second wiring layer of the housing of fig. 3, fig. 5 illustrates a perspective view of a third wiring layer of the housing of fig. 3, and fig. 6 illustrates a perspective view of a first driving part, a second driving part, and a third driving part of the housing of fig. 3.

Referring to fig. 2 and 3, the housing 1000 of the camera module 100 may include a base housing BH and first, second and third driving parts OD1, OD2 and AD, wherein the first, second and third driving parts OD1, OD2 and AD are all integrally combined with the base housing BH by an injection molding method to form an injection molded part.

The first driving part OD1 and the second driving part OD2 may be part of a shake correction driver, and the third driving part AD may be part of a focus adjustment driver. The first driving part OD1 and the second driving part OD2 may function as shake correction drivers together with the shake correction magnets 244a and 245a mounted on the lens holder 142, and the third driving part AD may function as a focus adjustment driver together with the focus adjustment magnet 232 mounted on the carrier part 1300.

The first driving part OD1 may be substantially parallel to the first direction DR1, and the second driving part OD2 may be substantially parallel to the second direction DR2. The third driving part AD may be substantially parallel to the first direction DR1, and may face the first driving part OD1 in the second direction DR2. The first direction DR1 and the second direction DR2 may be directions perpendicular to a third direction DR3, wherein the third direction DR3 is parallel to an optical axis of the lens barrel 120 of the camera module 100.

The first driving part OD1 may include a first base part OD1a, a first wiring layer OD1b, a first coil OD1c, and a first driving circuit part OD1d.

The second driving part OD2 may include a second base part OD2a, a second wiring layer OD2b, a second coil OD2c, and a second driving circuit part OD2d.

The third driving part AD may include a third base part ADa, a third wiring layer ADb, a third coil ADc, and a third driving circuit part ADd.

Referring to fig. 4 and 5 together with fig. 2 and 3, the first and second wiring layers OD1b and OD2b may include a plurality of layers ODb1 and ODb2, which are at least partially overlapped with each other and may be stamped metal parts formed by a metal stamping method. The third wiring layer ADb can include a plurality of layers ADb and ADb, which at least partially overlap each other and can be a stamped metal part formed by a metal stamping method.

The first wiring layer OD1b of the first driving part OD1 and the second wiring layer OD2b of the second driving part OD2 may be electrically connected to each other through a connection part ODb extending between the first wiring layer OD1b parallel to the first direction DR1 and the second wiring layer OD2b parallel to the second direction DR2. The connection portion ODb may be bent to extend parallel to the first direction DR1 to be connected to the first wiring layer OD1b and to extend parallel to the second direction DR2 to be connected to the second wiring layer OD2b. The connection portion ODb may also include a plurality of layers ODb1 and ODb2.

Referring to fig. 6 together with fig. 2 to 5, the first wiring layer OD1b and the first coil OD1c of the first driving part OD1 may be stamped metal parts formed by a metal stamping method. The first wiring layer OD1b, the first coil OD1c, and the first driving circuit portion OD1d may be surface-mounted on the first base portion OD1a by a surface mounting method of a Surface Mounting Technology (SMT).

The second wiring layer OD2b and the second coil OD2c of the second driving part OD2 may be a stamped metal member formed by a metal stamping method. The second wiring layer OD2b, the second coil OD2c, and the second driving circuit portion OD2d may be surface-mounted on the second base portion OD2a by a surface mounting method of a Surface Mounting Technology (SMT).

The third wiring layer ADb and the third coil ADc of the third driving part AD may be stamped metal members formed by a metal stamping method. The third wiring layer ADb, the third coil adcs and the third driving circuit portion ADd can be surface-mounted on the third base portion ADa by a surface mounting method of a Surface Mounting Technology (SMT).

The first, second and third base portions OD1a, OD2a and ADa of the first, second and third driving portions OD1, OD2 and AD may include a material having a curing temperature substantially the same as that of the material included in the base case BH, and the material of the first, second and third base portions OD1a, OD2a and ADa may be the same as that of the base case BH. For example, the materials of the first, second and third base portions OD1a, OD2a and ADa may be resins, and the material of the base case BH may be the same resin as that of the first, second and third base portions OD1a, OD2a and ADa.

The first, second and third base portions OD1a, OD2a and Ada may be integrally combined with the base housing BH by curing the first, second and third base portions OD1a, OD2a and Ada together with the base housing BH to prevent the first, second and third base portions OD1a, OD2a and Ada from being separated from the base housing BH. Accordingly, the first wiring layer OD1b, the first coil OD1c, the first driving circuit portion OD1d, the second wiring layer OD2b, the second coil OD2c, the second driving circuit portion OD2d, the third wiring layer ADb, the third coil ADc and the third driving circuit portion ADd, which are all surface-mounted on the first, second and third base portions OD1a, OD2a and Ada by the surface mounting method, may be mounted on the base housing BH without an additional assembly process.

The first, second and third wiring layers OD1b, OD2b and ADb may be electrically connected to the printed circuit board 163 to receive an electrical signal from the printed circuit board 163 and transmit the electrical signal to the first, second and third coils OD1c, OD2c, ADc, OD1d, OD2d and ADd through the first, second and third wiring layers OD1b, OD2b and ADb.

The housing 1000 of the camera module 100 may include a base housing BH, and the first driving part OD1, the second driving part OD2, and the third driving part AD are all integrally combined with the base housing BH by an injection molding method to form an injection molded part. The first, second and third driving parts OD1, OD2 and AD may include first, second and third base parts OD1a, OD2a and Ada, respectively, wherein the first, second and third base parts OD1a, OD2a and Ada are cured together with the base case BH to prevent the first, second and third base parts OD1a, OD2a and Ada from being separated from the base case BH, and the first, second and third driving parts OD1, OD2 and AD may further include first, second, third, and third wiring layers OD1b, OD1d, OD2b, OD2c, OD2d, ADb, and third wiring parts ADc and ADd, respectively, which are surface-mounted on the first, second and third base parts OD1a, OD2a and Ada by a surface mounting method.

Therefore, by forming the wiring layer and the coil of the driving part as stamped metal parts via a metal stamping method, surface-mounting the wiring layer, the coil, and the driving circuit part on the base part by a surface mounting method, and then curing the base part together with the base housing, it is possible to form a housing including a plurality of driving parts without an additional assembly process, thereby reducing manufacturing costs.

As described above, by forming the wiring layer of the driving part as a stamped metal part via a metal stamping method and surface-mounting the wiring layer on the base part by a surface mounting method, a process of assembling an additional flexible circuit board for driving the carrying part and the lens holder is not required, thereby simplifying a manufacturing process and reducing manufacturing costs. Further, since the wiring layer and the coil of the driving portion are integrally coupled with the housing, deterioration in product quality due to positional variation of the wiring layer and the coil can be prevented.

Accordingly, an increase in manufacturing costs due to an additional assembly process can be prevented, and deterioration in product quality due to an assembly process error can be prevented.

Hereinafter, a manufacturing method of the housing 1000 of the camera module 100 of fig. 1 will be described with reference to fig. 7 to 17 together with fig. 1 to 6. Fig. 7 to 17 illustrate a method of manufacturing the housing 1000 of the camera module 100 of fig. 1.

Referring to fig. 7, a plurality of metal layers PWa, PWb, PWc and PWd are formed as stamped metal parts by a metal stamping method.

Among the plurality of metal layers PWa, PWb, PWc and PWd, the first metal layer PWa includes a first wiring layer OD1b, a second wiring layer OD2b, and a layer ODb1 of the connection portion ODb, and the second metal layer PWb includes a first wiring layer OD1b, a second wiring layer OD2b, and a layer ODb2 of the connection portion ODb. Further, among the plurality of metal layers PWa, PWb, PWc and PWd, the third metal layer PWc includes the layer ADb1 of the third wiring layer ADb, and the fourth metal layer PWd includes the layer ADb2 of the third wiring layer ADb.

A plurality of metal layers PWa, PWb, PWc and PWd are then electroplated. For example, the plurality of metal layers PWa, PWb, PWc and PWd may be plated using nickel (Ni) or gold (Au).

Next, as shown in fig. 8 and 9, the first and second metal layers PWa and PWb are surface-mounted on the first and second base portions PW1a and PW1b by a surface mounting method to form a plurality of first constituent portions PW1, and the third and fourth metal layers PWc and PWd are surface-mounted on the third base portion PW2a by a surface mounting method to form a plurality of second constituent portions PW2. However, for one housing 1000, only one of the first components PW1 in fig. 8 and one of the second components PW2 in fig. 9 are required. Thus, the other of the first constituent PW1 in fig. 8 and the other of the second constituent PW2 in fig. 9 may be used for the other housing 1000.

Each of the plurality of first constituent parts PW1 may include a first wiring layer OD1b of the first driving part OD1 and a second wiring layer OD2b of the second driving part OD2, and each of the plurality of second constituent parts PW2 may include a third wiring layer ADb of the third driving part AD.

Next, as shown in fig. 10, a plurality of connection terminals SL for electrically connecting with the third driving circuit portion ADd are formed on each of the plurality of second constituent portions PW2. For example, each of the connection terminals SL may be a solder terminal and may include tin (Sn), but is not limited thereto.

Although only the plurality of second constituent parts PW2 are shown in fig. 10, the same process may be performed for the plurality of first constituent parts PW 1. Specifically, a plurality of connection terminals SL for electrically connecting the first driving circuit portion OD1d and the second driving circuit portion OD2d are formed on each of the plurality of first constituent portions PW 1.

Referring to fig. 11, the electronic component EC corresponding to the third driving circuit portion ADd is connected to and mounted on the plurality of connection terminals SL of each of the plurality of second constituent portions PW2.

Although only the plurality of second constituent parts PW2 are shown in fig. 11, the same process may be performed for the plurality of first constituent parts PW 1. Specifically, the electronic components EC corresponding to the first driving circuit portion OD1d and the second driving circuit portion OD2d are connected to and mounted on the plurality of connection terminals SL of each of the plurality of first constituent portions PW 1.

Next, as shown in fig. 12, an adhesive layer BD is formed in a region in which the third coil ADc is to be mounted on each of the plurality of second constituent parts PW2.

Although only the plurality of second constituent portions PW2 are shown in fig. 12, the same process may be performed for the plurality of first constituent portions PW 1. Specifically, the adhesive layer BD is formed in a region in which the first coil OD1c and the second coil OD2c are to be mounted on each of the plurality of first constituent portions PW 1.

Next, referring to fig. 13, a coil CI corresponding to the third coil ADc is mounted on the adhesive layer BD of each of the plurality of second constituent parts PW2. The coil CI may also be formed as a stamped metal part by a metal stamping method, but is not limited thereto.

Although only the plurality of second constituent portions PW2 are shown in fig. 13, the same process may be performed for the plurality of first constituent portions PW 1. Specifically, the coil CI corresponding to the first coil OD1c and the second coil OD2c is mounted on the adhesive layer BD of each of the plurality of first constituent parts PW 1.

Next, as shown in fig. 14, a connection portion SLa for electrically connecting with the third coil ADc is formed on each of the plurality of second constituent portions PW2.

Although only the plurality of second constituent portions PW2 are shown in fig. 14, the same process may be performed for the plurality of first constituent portions PW 1. Specifically, a connection portion SLa for electrically connecting the first coil OD1c and the second coil OD2c is formed on each of the plurality of first constituent portions PW 1.

Next, unnecessary edge portions of the first and second components PW1 and PW2 that do not overlap the first, second and third base portions PW1a, PW1b and PW2a are processed by a shape process such as cutting and bending, as necessary, so that a third component PW3 corresponding to the first, second and connecting portions OD1, OD2 and ODb and a fourth component PW4 corresponding to the third driving portion AD are formed as shown in fig. 15 and 16.

Fig. 15 shows a third constituent portion PW3 corresponding to the first driving portion OD1, the second driving portion OD2, and the connection portion ODb, and fig. 16 shows a fourth constituent portion PW4 corresponding to the third driving portion AD.

Referring to fig. 17, after the third and fourth components PW3 and PW4 are bonded to the injection-molded part MD corresponding to the base housing BH, the first, second, third and third base portions PW1a, PW1b, PW2a are cured together with the injection-molded part MD to prevent the first, second and third base portions PW1a, PW1b and PW2a from being separated from the injection-molded part MD.

Thereafter, the remaining unnecessary edge portions of the plurality of first and second constituent parts PW1 and PW2 are removed, and an electrical test is performed, thereby completing the case 1000 of the camera module 100 as shown in fig. 2.

As described above, according to the manufacturing method of the camera module according to the present embodiment, after forming the wiring layer of the driving part of the camera module into the punched metal part by the metal punching method, and after surface-mounting the wiring layer, the driving circuit part, and the coil on the base part by the surface mounting method, the base part and the injection-molded part forming the base case are bonded to each other and cured together, thereby forming the driving part integrally bonded with the injection-molded part. Accordingly, the housing including the driving part can be formed without an additional assembly process, thereby reducing manufacturing costs. Further, by forming the wiring layer and the coil of the driving portion integrally with the housing, deterioration in product quality due to positional variation of the wiring layer and the coil of the driving portion can be prevented.

While this disclosure includes particular examples, it will be apparent, after an understanding of the disclosure of the present application, that various changes in form and details may be made therein without departing from the spirit and scope of the claims and their equivalents. The examples described herein are to be considered as illustrative only and not for the purpose of limitation. The descriptions of features or aspects in each example are considered to be applicable to similar features or aspects in other examples. Suitable results may also be obtained if the described techniques are performed in a different order and/or if components in the described systems, architectures, devices or circuits are combined in a different manner and/or are replaced or supplemented by other components or their equivalents. The scope of the disclosure is, therefore, not to be limited by the detailed description, but by the claims and their equivalents, and all changes that come within the scope of the claims and their equivalents are to be interpreted as being included in the disclosure.

Claims (17)

1. A camera module, comprising:

a lens barrel;

a driver configured to move the lens barrel; and

a housing in which the lens barrel is disposed,

wherein the driver comprises:

a wiring layer configured to transmit an electrical signal;

a driving circuit section electrically connected to the wiring layer;

a coil electrically connected to the wiring layer; and

a magnet electromagnetically coupled to the coil, an

Wherein the wiring layer is a stamped metal component integrally bonded to the housing.

2. The camera module of claim 1, wherein the housing comprises a base housing and a base portion,

the wiring layer is mounted on the base portion, and

the base housing and the base portion are integrally incorporated in an injection molded component.

3. The camera module of claim 2, wherein a curing temperature of the material of the base housing is the same as a curing temperature of the material of the base portion.

4. The camera module of claim 2, wherein the wiring layer is surface-mounted on the base portion.

5. The camera module of claim 1, wherein the wiring layer and the coil are integrally bonded with the housing.

6. The camera module of claim 5, wherein the coil is a stamped metal part.

7. The camera module of claim 6, wherein the housing comprises a base housing and a base portion,

the wiring layer and the coil are mounted on the base portion, an

The base housing and the base portion are integrally incorporated in an injection molded component.

8. The camera module of claim 7, wherein the wiring layer and the coil are surface-mounted on the base portion.

9. The camera module according to claim 5, wherein the wiring layer, the coil, and the driving circuit portion are integrally combined with the housing.

10. The camera module of claim 9, wherein the housing comprises a base housing and a base portion,

the wiring layer, the coil, and the driving circuit portion are surface-mounted on the base portion, an

The base housing and the base portion are integrally incorporated in an injection molded component.

11. The camera module of claim 1, wherein the driver comprises:

a focus adjustment driver configured to move the lens barrel in an optical axis direction of the lens barrel, and including a first wiring layer; and

a shake correction driver configured to move the lens barrel in a direction perpendicular to the optical axis direction, and including a second wiring layer, and

wherein the first wiring layer of the focus adjustment driver and the second wiring layer of the shake correction driver are stamped metal parts integrally bonded to the housing.

12. The camera module of claim 11, wherein the shake correction driver includes a first shake correction driver and a second shake correction driver,

the second wiring layer of the shake correction driver includes a second wiring layer of the first shake correction driver and a second wiring layer of the second shake correction driver, and

the second wiring layer of the first shake correction driver and the second wiring layer of the second shake correction driver are electrically connected to each other.

13. The camera module of claim 11, wherein the coil of the driver comprises a first coil of the focus adjustment driver and a second coil of the shake correction driver, and

the first coil of the focus adjustment driver and the second coil of the shake correction driver are stamped metal parts integrally combined with the housing.

14. A camera module, comprising:

an injection molded housing;

a lens barrel provided in the injection-molded housing; and

a driver configured to move the lens barrel, and comprising:

an injection molded base integrally bonded with the injection molded housing;

a stamped metal wiring layer integrally bonded with the injection molded base portion;

a driving circuit portion electrically connected to the stamped metal wiring layer;

a coil electrically connected to the stamped metal wiring layer; and

a magnet electromagnetically coupled to the coil.

15. The camera module of claim 14, wherein the coil is mounted on the injection molded base.

16. The camera module of claim 14, wherein the driving circuit portion is superficially mounted on the injection molded base portion.

17. The camera module of claim 14, wherein the injection molded housing comprises a base housing integrally joined with the injection molded base portion to form the injection molded housing.