CN220481366U - Fixing device for semiconductor wafer processing - Google Patents
Fixing device for semiconductor wafer processing Download PDFInfo
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- CN220481366U CN220481366U CN202322097363.9U CN202322097363U CN220481366U CN 220481366 U CN220481366 U CN 220481366U CN 202322097363 U CN202322097363 U CN 202322097363U CN 220481366 U CN220481366 U CN 220481366U
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- fixedly connected
- semiconductor wafer
- bottom plate
- blocks
- dust collection
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 65
- 239000000428 dust Substances 0.000 claims description 50
- 238000004140 cleaning Methods 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 4
- 230000002457 bidirectional effect Effects 0.000 abstract description 6
- 235000012431 wafers Nutrition 0.000 description 63
- 238000000034 method Methods 0.000 description 10
- 238000000605 extraction Methods 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 5
- 239000013078 crystal Substances 0.000 description 3
- 238000005498 polishing Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The utility model discloses a fixing device for processing a semiconductor wafer, which comprises a fixing component, wherein the fixing component comprises a bottom plate, the middle part of the lower surface of the bottom plate is fixedly connected with a bidirectional telescopic cylinder, the output ends of the bidirectional telescopic cylinders are fixedly connected with moving blocks, lifting rods capable of lifting are arranged in the two moving blocks, the lifting component is arranged below the bottom plate, the lifting component comprises an electric telescopic rod fixedly connected to the lower surface of the bottom plate, the lower ends of the two electric telescopic rods are fixedly connected with mounting blocks, a positioning plate is fixedly connected between the two mounting blocks, and an extension plate is movably connected in the positioning plate, so that the electric telescopic rod works when the semiconductor wafer needs to be taken and placed, the lifting rods can be driven to lift by the cooperation of the positioning plate, the distance between the semiconductor wafer and the bottom plate is increased, and the semiconductor wafer is convenient for subsequent workers to take and place.
Description
Technical Field
The utility model belongs to the technical field of semiconductor wafer processing, and particularly relates to a fixing device for semiconductor wafer processing.
Background
The semiconductor wafer is a silicon wafer used for manufacturing a silicon semiconductor circuit, the original material is silicon, high-purity polycrystalline silicon is dissolved and then is doped with silicon crystal seeds, then the silicon crystal seeds are slowly pulled out to form cylindrical monocrystalline silicon, a silicon crystal bar is ground, polished and sliced to form a silicon wafer, namely the wafer, the main processing mode of the wafer is wafer processing and batch processing, namely 1 wafer or a plurality of wafers are processed simultaneously, the semiconductor wafer needs to be fixed in the processing process to prevent the semiconductor wafer from shifting, and the semiconductor wafer is fixed through a fixing device in the processing process of the semiconductor wafer so as to facilitate the processing of the semiconductor wafer.
As known from a fixing device for processing a semiconductor wafer with an authorized publication number CN218927561U, the fixing device moves through a bi-directional telescopic air pump to drive fixing plates to approach each other along a limit groove until a wafer is to be contacted, then starts an adjusting air pump to operate to drive an adjusting plate to press down, the adjusting plate presses down to drive a spring to press down, the spring presses down to apply pressure to the wafer, so that the wafer is fixed on a fixing disc, meanwhile, because the spring is a flexible device, when the fixing force of a fixing assembly to the wafer is larger, the excessive force is absorbed by the spring and converted into the elastic force of the spring, so that the problem that the semiconductor wafer is easily damaged due to larger fixing force in the fixing process of the processing, and the processing quality of the semiconductor wafer is reduced is solved.
In the use process of the semiconductor wafer processing fixing device proposed in the above-mentioned issued patent, the semiconductor wafer is fixed through the fixing component, and because the distance between the semiconductor wafer and the bottom plate affects the picking and placing of the semiconductor wafer by the subsequent staff, and the semiconductor wafer is easy to generate scraps in the polishing process, therefore we propose a fixing device for semiconductor wafer processing.
Disclosure of Invention
The present utility model is directed to a fixing device for semiconductor wafer processing, which solves the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a fixing device is used in semiconductor wafer processing, includes fixed subassembly, fixed subassembly includes the bottom plate, the middle part fixedly connected with two-way flexible cylinder of bottom plate lower surface, the equal fixedly connected with movable block of output of two-way flexible cylinder, two the inside of movable block all is equipped with the lifter of liftable, the below of bottom plate is equipped with lifting unit, lifting unit includes the electric telescopic handle of fixed connection at the bottom plate lower surface, and electric telescopic handle is equipped with two, two the equal fixedly connected with installation piece of lower extreme of electric telescopic handle, two fixedly connected with locating plate between the installation piece, the inside swing joint of locating plate has the extension board, and the extension board is equipped with two, two the lower extreme of lifter is fixed connection respectively in two the position that the locating plate was kept away from to the extension board upper surface, the outside of bottom plate is equipped with clean subassembly.
Preferably, the upper ends of the lifting rods are fixedly connected with fixing blocks, the tops and the bottoms of the fixing blocks, which are close to the surfaces, are fixedly connected with limiting blocks, and the limiting blocks are provided with four limiting blocks.
Preferably, the lower surfaces of the two limiting blocks positioned above are fixedly connected with positioning springs, the lower ends of the two positioning springs are fixedly connected with positioning blocks, the middle parts of the upper surfaces of the positioning blocks are fixedly connected with connecting rods, the upper ends of the two connecting rods penetrate through the two positioning springs and the limiting blocks respectively and extend to the upper parts of the limiting blocks, and the upper ends of the two connecting rods are fixedly connected with stop blocks.
Preferably, the limiting grooves are formed in the bottom plate, two limiting plates are fixedly connected to the surfaces, close to each other, of the moving blocks, and the two limiting plates are movably connected to the inner portions of the limiting grooves respectively.
Preferably, the cleaning assembly comprises a dust collection ring fixedly connected to the edge of the upper surface of the bottom plate, dust collection nozzles are fixedly connected to the circumferential surface of the dust collection ring, which is close to the moving block, and the dust collection nozzles are provided with a plurality of dust collection nozzles.
Preferably, the outside of bottom plate is equipped with the collecting box, the middle part fixedly connected with dust extraction of collecting box upper surface, and dust extraction is linked together with the collecting box, be provided with into dirt pipe between dust extraction and the dust absorption ring, the positive surface rotation of collecting box is connected with clean door, and the air outlet has been seted up at the middle part of clean door positive surface, and the inside of air outlet is provided with the air-out sponge.
Preferably, the edge of bottom plate lower surface is fixedly connected with supporting leg, and the supporting leg is equipped with four, and the lower extreme of four supporting legs is all fixedly connected with supporting shoe.
Compared with the prior art, the utility model has the beneficial effects that:
(1) This fixing device is used in semiconductor wafer processing presss from both sides tightly fixedly through the fixed subassembly cooperation lifting unit that sets up to the semiconductor wafer, when the semiconductor wafer is got and is put to needs, makes electric telescopic handle work, can drive the lifter through locating plate cooperation extension board and rise to can drive the semiconductor wafer and rise, increase the distance between semiconductor wafer and the bottom plate, follow-up staff of being convenient for gets and puts the semiconductor wafer.
(2) This fixing device is used in semiconductor wafer processing cleans the piece that produces through the clean subassembly that sets up that semiconductor wafer polished, in the semiconductor wafer polishing process, makes dust extraction work, can store the piece that produces of semiconductor wafer polishing through the inside of advancing dust pipe cooperation dust absorption ring and dust absorption mouth suction collection box, and the follow-up staff of being convenient for handles the piece.
Drawings
FIG. 1 is a first perspective view of the present utility model;
FIG. 2 is a schematic view of a second perspective structure of the present utility model;
FIG. 3 is a schematic view of a front cut-away perspective structure of the present utility model;
fig. 4 is a schematic perspective view of a fixing assembly and a lifting assembly according to the present utility model.
In the figure:
1. a fixing assembly; 101. a bottom plate; 102. a bidirectional telescopic cylinder; 103. a moving block; 104. a lifting rod; 105. a limiting plate; 106. a limit groove; 107. a fixed block; 108. a limiting block; 109. a positioning spring; 110. a positioning block;
2. a lifting assembly; 201. an electric telescopic rod; 202. a mounting block; 203. a positioning plate; 204. an extension plate;
3. a cleaning assembly; 301. a dust collection ring; 302. a collection box; 303. a dust collection device; 304. dust inlet pipe.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the utility model provides a fixing device for processing a semiconductor wafer, which comprises a fixing component 1, wherein the fixing component 1 comprises a bottom plate 101, a bidirectional telescopic cylinder 102 is fixedly connected to the middle of the lower surface of the bottom plate 101, movable blocks 103 are fixedly connected to the output ends of the bidirectional telescopic cylinder 102, lifting rods 104 capable of lifting are arranged in the two movable blocks 103, lifting components 2 are arranged below the bottom plate 101, the lifting components 2 comprise electric telescopic rods 201 fixedly connected to the lower surface of the bottom plate 101, the electric telescopic rods 201 are provided with two, the lower ends of the two electric telescopic rods 201 are fixedly connected with mounting blocks 202, a positioning plate 203 is fixedly connected between the two mounting blocks 202, an extension plate 204 is movably connected to the inside of the positioning plate 203, the two extension plates 204 are provided with two, the lower ends of the two lifting rods 104 are respectively fixedly connected to the positions of the upper surfaces of the two extension plates 204 far away from the positioning plate 203, and a cleaning component 3 is arranged on the outer side of the bottom plate 101.
In this embodiment, preferably, the upper ends of the two lifting rods 104 are fixedly connected with fixing blocks 107, the top and the bottom of the two fixing blocks 107, which are close to each other, are fixedly connected with limiting blocks 108, and the limiting blocks 108 are provided with four limiting blocks, the limiting blocks 108 are installed through the fixing blocks 107, when the fixing blocks 107 fasten the semiconductor wafer clamp, the positions of the semiconductor wafer can be limited through the limiting blocks 108, the stability of the semiconductor wafer in the processing process is improved, and the falling of the semiconductor wafer is avoided.
In this embodiment, preferably, the lower surfaces of the two limiting blocks 108 located above are fixedly connected with positioning springs 109, the lower ends of the two positioning springs 109 are fixedly connected with positioning blocks 110, the middle parts of the upper surfaces of the two positioning blocks 110 are fixedly connected with connecting rods, the upper ends of the two connecting rods respectively penetrate through the two positioning springs 109 and the limiting block 108 and extend to the upper part of the limiting block 108, the upper ends of the two connecting rods are fixedly connected with stop blocks, in the process of fixing a semiconductor wafer, the positioning blocks 110 can be driven to move through the elasticity of the positioning springs 109, and the semiconductor wafer can be clamped and fixed by matching with the limiting blocks 108, so that the stability of the semiconductor wafer in the process of processing is further improved.
In this embodiment, preferably, the bottom plate 101 is provided with two limit grooves 106 in the bottom plate 101, the two limit grooves 106 are provided with two limit plates 105 fixedly connected to the surfaces of the two moving blocks 103, the two limit plates 105 are respectively movably connected to the inside of the two limit grooves 106, and the positions of the moving blocks 103 can be limited by matching the limit grooves 106 with the limit plates 105, so that the stability of the moving blocks 103 in the moving and using processes is increased.
In this embodiment, preferably, the cleaning assembly 3 includes a dust collection ring 301 fixedly connected to an edge of an upper surface of the base plate 101, a dust collection nozzle is fixedly connected to a circumferential surface of the dust collection ring 301, which is close to the moving block 103, and the dust collection nozzle is provided with a plurality of dust collection nozzles, so that chips generated by polishing a semiconductor wafer can be sucked through the dust collection ring 301 and the dust collection nozzle, and the influence of chip accumulation on the subsequent processing of the semiconductor wafer is avoided.
In this embodiment, preferably, the outside of bottom plate 101 is equipped with collecting box 302, collecting box 302 upper surface's middle part fixedly connected with dust extraction 303, and dust extraction 303 is linked together with collecting box 302, be provided with into dirt pipe 304 between dust extraction 303 and the dust absorption ring 301, collecting box 302's front surface rotates and is connected with clean door, and the air outlet has been seted up at the middle part of clean door front surface, and the inside of air outlet is provided with the air-out sponge, with dust extraction 303 and external power supply electric connection, make dust extraction 303 work, can store the inside of the piece suction collecting box 302 that semiconductor wafer polished and produced through the cooperation of dust inlet pipe 304 and dust absorption nozzle, open clean door and be convenient for the staff to handle the piece.
In this embodiment, preferably, the edge fixedly connected with supporting leg of bottom plate 101 lower surface, and the supporting leg is equipped with four, and the equal fixedly connected with supporting shoe of lower extreme of four supporting legs can support bottom plate 101 through supporting leg cooperation supporting shoe, increases the stability of bottom plate 101 in the use.
The working principle and the using flow of the utility model are as follows: when the device is used, the semiconductor wafer processing fixing device is electrically connected with an external power supply, when a semiconductor wafer needs to be replaced, the electric telescopic rod 201 is enabled to work, the lifting rod 104 can be driven to lift through the positioning plate 203 in cooperation with the extension plate 204, so that the fixing block 107 and the semiconductor wafer can be driven to lift, the distance between the semiconductor wafer and the bottom plate 101 is increased, the connecting rod is pulled to drive the positioning block 110 to lift, the fixing of the semiconductor wafer is relieved, a worker can take down the semiconductor wafer conveniently, the semiconductor wafer needing to be processed is placed between the two fixing blocks 107, the bidirectional telescopic cylinder 102 is enabled to work, the two moving blocks 103 and the fixing block 107 can be driven to move towards the direction close to the semiconductor wafer, the connecting rod is loosened, the positioning block 110 can be driven to move through the elastic force of the positioning spring 109, the fixing block 108 can be clamped and fixed by the cooperation of the positioning plate, the stability of the semiconductor wafer in the processing process is further increased, the electric telescopic rod 201 can be driven to lift the semiconductor wafer, the semiconductor wafer in the processing process is relieved, the dust collection device 303 is enabled to work, the dust collection device can be enabled to work through the dust collection pipe 301, and the dust collection pipe 302 can be cleaned, and the dust collection box can be stored inside the dust collection pipe 302 is opened, and the dust collection device is convenient for the dust collection device is opened.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a fixing device for semiconductor wafer processing, includes fixed subassembly (1), its characterized in that: the utility model provides a fixed subassembly (1) includes bottom plate (101), the middle part fixedly connected with two-way flexible cylinder (102) of bottom plate (101) lower surface, the equal fixedly connected with movable block (103) of output of two-way flexible cylinder (102), two the inside of movable block (103) all is equipped with lifter (104) of liftable, the below of bottom plate (101) is equipped with lifting assembly (2), lifting assembly (2) are including electric telescopic handle (201) of fixed connection at bottom plate (101) lower surface, and electric telescopic handle (201) are equipped with two, two equal fixedly connected with installation piece (202) of lower extreme of electric telescopic handle (201), two fixedly connected with locating plate (203) between installation piece (202), the inside swing joint of locating plate (203) has extension board (204), and extension board (204) are equipped with two, two the lower extreme of lifter (104) is fixed connection respectively in two extension board (204) upper surface is kept away from the position of locating plate (203), the outside of bottom plate (101) is equipped with clean subassembly (3).
2. The fixture for semiconductor wafer processing according to claim 1, wherein: the upper ends of the two lifting rods (104) are fixedly connected with fixed blocks (107), the top and the bottom of the two fixed blocks (107) close to the surface are fixedly connected with limiting blocks (108), and the limiting blocks (108) are provided with four limiting blocks.
3. The fixture for semiconductor wafer processing according to claim 2, wherein: the lower surfaces of the limiting blocks (108) are fixedly connected with positioning springs (109), the lower ends of the positioning springs (109) are fixedly connected with positioning blocks (110), the middle parts of the upper surfaces of the positioning blocks (110) are fixedly connected with connecting rods, the upper ends of the two connecting rods penetrate through the two positioning springs (109) and the limiting blocks (108) respectively and extend to the upper parts of the limiting blocks (108), and the upper ends of the two connecting rods are fixedly connected with stop blocks.
4. The fixture for semiconductor wafer processing according to claim 1, wherein: limiting grooves (106) are formed in the bottom plate (101), two limiting grooves (106) are formed in the two limiting grooves, limiting plates (105) are fixedly connected to the surfaces, close to each other, of the moving blocks (103), and the two limiting plates (105) are movably connected to the inner portions of the two limiting grooves (106) respectively.
5. The fixture for semiconductor wafer processing according to claim 1, wherein: the cleaning assembly (3) comprises a dust collection ring (301) fixedly connected to the edge of the upper surface of the base plate (101), dust collection nozzles are fixedly connected to the circumferential surface of the dust collection ring (301) close to the moving block (103), and the dust collection nozzles are provided with a plurality of dust collection nozzles.
6. The fixture for semiconductor wafer processing according to claim 5, wherein: the dust collection device is characterized in that a collecting box (302) is arranged on the outer side of the bottom plate (101), a dust collection device (303) is fixedly connected to the middle of the upper surface of the collecting box (302), the dust collection device (303) is communicated with the collecting box (302), a dust inlet pipe (304) is arranged between the dust collection device (303) and the dust collection ring (301), a cleaning door is rotatably connected to the front surface of the collecting box (302), an air outlet is formed in the middle of the front surface of the cleaning door, and an air outlet sponge is arranged in the air outlet.
7. The fixture for semiconductor wafer processing according to claim 1, wherein: the edge of bottom plate (101) lower surface is fixedly connected with supporting leg, and the supporting leg is equipped with four, and the lower extreme of four supporting legs is all fixedly connected with supporting shoe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322097363.9U CN220481366U (en) | 2023-08-03 | 2023-08-03 | Fixing device for semiconductor wafer processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322097363.9U CN220481366U (en) | 2023-08-03 | 2023-08-03 | Fixing device for semiconductor wafer processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220481366U true CN220481366U (en) | 2024-02-13 |
Family
ID=89825897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322097363.9U Active CN220481366U (en) | 2023-08-03 | 2023-08-03 | Fixing device for semiconductor wafer processing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220481366U (en) |
-
2023
- 2023-08-03 CN CN202322097363.9U patent/CN220481366U/en active Active
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