CN220475978U - Printed circuit board and electronic device - Google Patents
Printed circuit board and electronic device Download PDFInfo
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- CN220475978U CN220475978U CN202223404416.9U CN202223404416U CN220475978U CN 220475978 U CN220475978 U CN 220475978U CN 202223404416 U CN202223404416 U CN 202223404416U CN 220475978 U CN220475978 U CN 220475978U
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- 238000001514 detection method Methods 0.000 claims abstract description 137
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 56
- 239000010410 layer Substances 0.000 claims description 134
- 239000012790 adhesive layer Substances 0.000 claims description 35
- 238000012360 testing method Methods 0.000 claims description 14
- 238000000034 method Methods 0.000 abstract description 13
- 239000000758 substrate Substances 0.000 description 11
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 4
- 239000000523 sample Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The application provides a printed circuit board and an electronic device, wherein the printed circuit board comprises at least one conductive layer, and the printed circuit board is provided with a functional area and a detection area which are connected; in the functional area, part of the conductive layer forms a conductive pattern so as to electrically connect components through the conductive pattern; in the detection area, part of the conductive layer forms an impedance line and a filling part, the impedance line, the filling part and the conductive pattern are arranged on the same layer, and the impedance line is provided with a detection part so as to be electrically connected with the detection piece through the detection part; the difference between the copper residue rate of the conductive layer in the detection area and the copper residue rate of the conductive layer in the functional area is less than or equal to 20%. The method and the device can solve the problem that the impedance detection value of the conductive pattern has large error, thereby influencing the quality of the printed circuit board.
Description
Technical Field
The present application relates to the field of printed circuit board manufacturing technology, and in particular, to a printed circuit board and an electronic device.
Background
A printed circuit board is an electronic component that can replace complex wiring to achieve electrical connection between elements in a circuit. The printed circuit board can reduce the whole volume, reduce the product cost and improve the quality and reliability of the electronic device.
The printed circuit board comprises a plurality of layers of core boards which are arranged in a stacked manner, and at least one layer of core boards is provided with conductive patterns so as to realize the electrical connection between different components through the conductive patterns. However, in the printed circuit board, the impedance detection value of the conductive pattern is large in error, thereby affecting the quality of the printed circuit board.
Disclosure of Invention
The embodiment of the application provides a printed circuit board and an electronic device, which are used for solving the problem that the impedance detection value of a conductive pattern has large error, thereby influencing the quality of the printed circuit board.
The printed circuit board provided by the embodiment of the application comprises at least one conductive layer, wherein the printed circuit board is provided with a functional area and a detection area which are connected;
in the functional area, part of the conductive layer forms a conductive pattern so as to electrically connect components through the conductive pattern; in the detection area, part of the conductive layer forms an impedance line and a filling part, the impedance line and the filling part are arranged on the same layer as the conductive pattern, and the impedance line is provided with a detection part so as to be electrically connected with a detection piece through the detection part;
the difference between the copper residue rate of the conductive layer in the detection region and the copper residue rate of the conductive layer in the functional region is less than or equal to 20%.
By adopting the technical scheme, the impedance line is formed by utilizing part of the conductive layer in the detection area, wherein the impedance line is provided with the detection part, and the detection part is electrically connected with the detection piece, so that the detection piece can detect the impedance of the impedance line; and, through utilizing the conductive layer to form the filling portion for the difference of the copper rate of remaining of conductive layer in the detection zone and the copper rate of remaining of conductive layer in the functional zone is less than or equal to 20%, thereby makes the impedance line in the detection zone and the conductive pattern in the filling portion can simulate the conductive pattern in the functional zone, and the impedance detection value error of the conductive pattern of printed circuit board that this application embodiment provided is little for the printed circuit board among the related art, thereby has improved the processingquality of printed circuit board.
In some possible embodiments, the copper residue of the conductive layer in the detection zone is equal to the copper residue of the conductive layer in the functional zone.
In some possible embodiments, the number of the filling parts is set to be plural in the detection area, and a gap is provided between every two adjacent filling parts.
In some possible embodiments, in the detection area, the impedance line is disposed in a middle portion of the detection area, and the plurality of filling portions are disposed at edges of the detection area.
In some possible embodiments, each of the filling portions is provided as one of a fold line type filling portion, a linear type filling portion, a square filling portion, and a circular filling portion among the plurality of filling portions.
In some possible embodiments, the number of the impedance lines is set to be plural, and plural of the impedance lines are arranged in the detection area.
In some possible embodiments, the printed circuit board further comprises an adhesive layer, the adhesive layer connecting the conductive layers;
at least part of the bonding layer is filled between the impedance line and the filling part, and at least part of the bonding layer is filled in the gap.
In some possible embodiments, the printed circuit board further comprises a plurality of shield layers, wherein a plurality of the shield layers are stacked with the conductive layer;
the conducting layers are accommodated between two adjacent shielding layers, the shielding layers are provided with shielding parts, and the shielding parts are correspondingly arranged on the conducting layers in the detection areas.
In some possible embodiments, the printed circuit board is provided with a test hole, and the test hole is correspondingly arranged on the detection part; and an electroplated layer is arranged in the test hole and is electrically connected with the impedance line.
The embodiment of the application also provides an electronic device, which comprises the printed circuit board.
By adopting the technical scheme, the impedance line is formed by utilizing part of the conductive layer in the detection area of the printed circuit board, wherein the impedance line is provided with the detection part, and the detection part is electrically connected with the detection piece, so that the detection piece can detect the impedance of the impedance line; and, through utilizing the conductive layer to form the filling portion for the difference of the copper rate of remaining of conductive layer in the detection zone and the copper rate of remaining of conductive layer in the functional zone is less than or equal to 20%, thereby makes the impedance line in the detection zone and the conductive pattern in the filling portion can simulate the conductive pattern in the functional zone, and the impedance detection value error of the conductive pattern of printed circuit board that this application embodiment provided is little for the printed circuit board among the related art, thereby has improved the processingquality of printed circuit board.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the application and together with the description, serve to explain the principles of the application.
Fig. 1 is a cross-sectional view of a printed circuit board provided in an embodiment of the present application;
fig. 2 is a schematic structural diagram of a conductive layer located in a detection area according to an embodiment of the present application;
fig. 3 is a cross-sectional view of a printed circuit board provided in an embodiment of the present application, which is intended to show a shielding portion.
Reference numerals illustrate:
100. a core plate; 110. a substrate; 120. a conductive layer; 121. a conductive pattern; 122. an impedance line; 1221. a detection unit; 123. a filling part; 124. a gap; 130. a detection zone; 140. a functional area; 200. an adhesive layer; 300. a shielding part; 400. a test well; 410. plating layers; 500. and a grounding hole.
Specific embodiments thereof have been shown by way of example in the drawings and will herein be described in more detail. These drawings and the written description are not intended to limit the scope of the inventive concepts in any way, but to illustrate the concepts of the present application to those skilled in the art by reference to specific embodiments.
Detailed Description
The printed circuit board comprises a plurality of layers of core boards which are arranged in a stacked manner, and at least one layer of core boards is provided with conductive patterns so as to realize the electrical connection between different components through the conductive patterns. In the process of manufacturing a printed circuit board, it is generally necessary to detect the impedance value of a conductive pattern by using a detecting member to adjust the processing process of the printed circuit board according to the impedance value of the conductive pattern, and since the detecting member cannot directly detect the impedance of the conductive pattern, it is generally necessary to provide an impedance line provided in the same layer as the conductive pattern to simulate the conductive pattern through the impedance line, thereby simulating the impedance of the conductive pattern by obtaining the impedance of the impedance line.
However, since the residual copper rate at the impedance line is lower than that at the conductive pattern, the impedance difference between the impedance of the impedance line and the impedance of the conductive pattern is large, and when the impedance line arranged in the same layer as the conductive pattern is arranged on the printed circuit board and the impedance of the conductive pattern is simulated by obtaining the impedance of the impedance line, the impedance detection value error of the conductive pattern is large, thereby affecting the quality of the printed circuit board.
In order to solve the above technical problems, embodiments of the present application provide a printed circuit board and an electronic device, where the printed circuit board has a detection area and a functional area, and in the detection area, an impedance line is formed by using a part of a conductive layer, where the impedance line has a detection portion, so that the detection portion is electrically connected to a detection element, and the detection element can detect the impedance of the impedance line; and, through utilizing the conductive layer to form the filling portion for the difference of the copper rate of remaining of conductive layer in the detection zone and the copper rate of remaining of conductive layer in the functional zone is less than or equal to 20%, thereby makes the impedance line in the detection zone and the conductive pattern in the filling portion can simulate the conductive pattern in the functional zone, and the impedance detection value error of the conductive pattern of printed circuit board that this application embodiment provided is little for the printed circuit board among the related art, thereby has improved the processingquality of printed circuit board.
Reference will now be made in detail to exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numbers in different drawings refer to the same or similar elements, unless otherwise indicated. The implementations described in the following exemplary examples are not representative of all implementations consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as detailed in the accompanying claims.
The following describes the technical solutions of the present application and how the technical solutions of the present application solve the above technical problems in detail with specific embodiments. The following embodiments may be combined with each other, and the same or similar concepts or processes may not be described in detail in some embodiments. Embodiments of the present application will be described below with reference to the accompanying drawings.
Referring to fig. 1-3, embodiments of the present application provide a printed circuit board comprising at least one conductive layer 120, the printed circuit board having a functional area 140 and a detection area 130 connected to each other; in the functional region 140, a part of the conductive layer 120 constitutes a conductive pattern 121 to electrically connect components through the conductive pattern 121; in the detection region 130, a part of the conductive layer 120 constitutes an impedance line 122 and a filling portion 123, the impedance line 122 and the filling portion 123 are arranged in the same layer as the conductive pattern 121, and the impedance line 122 has a detection portion 1221 to electrically connect the detection member through the detection portion 1221; the difference between the copper residue ratio of the conductive layer 120 located in the detection region 130 and the copper residue ratio of the conductive layer 120 located in the functional region 140 is less than or equal to 20%, so that an error in the impedance detection value of the conductive pattern 121 can be reduced when the impedance of the conductive pattern 121 is simulated by acquiring the impedance of the impedance line 122.
Illustratively, the conductive layer 120 may be made of metallic copper to reduce the resistance of the conductive pattern 121 formed by the conductive layer 120. The copper residue ratio is set as follows: in the set region, a ratio of an area of the conductive layer 120 to a total area of the set region is provided; in the embodiment of the present application, the copper residue ratio of the conductive layer 120 in the functional region 140 is configured as follows: in the plane of the functional region 140, the ratio of the area of the conductive pattern 121 to the area of the functional region 140; the copper residue ratio of the conductive layer 120 located in the detection region 130 is configured to: in the plane of the detection area 130, the ratio of the sum of the area of the impedance line 122 and the area of the filling portion 123 to the area of the detection area 130; thus, the difference between the copper residue ratio of the conductive layer 120 located in the detection region 130 and the copper residue ratio of the conductive layer 120 located in the functional region 140 can be set to 20% or less, so that the impedance line 122 and the filling portion 123 in the detection region 130 can simulate the conductive pattern 121 in the functional region 140.
It is to be understood that, in the embodiment of the present application, the difference between the copper residue ratio of the conductive layer 120 located in the detection area 130 and the copper residue ratio of the conductive layer 120 located in the functional area 140 is set to a value, specifically set to: the copper residue ratio of the conductive layer 120 in the detection region 130 may be greater than or equal to the copper residue ratio of the conductive layer 120 in the functional region 140, and the difference between the copper residue ratio of the conductive layer 120 in the detection region 130 and the copper residue ratio of the conductive layer 120 in the functional region 140 may be less than or equal to 20%; alternatively, the copper residue ratio of the conductive layer 120 in the detection region 130 may be smaller than the copper residue ratio of the conductive layer 120 in the functional region 140, and the difference obtained by subtracting the copper residue ratio of the conductive layer 120 in the detection region 130 from the copper residue ratio of the conductive layer 120 in the functional region 140 is smaller than or equal to 20%, that is, the copper residue ratio of the conductive layer 120 in the detection region 130 is greater than or equal to 0.8 times the copper residue ratio of the conductive layer 120 in the functional region 140, and is smaller than or equal to 1.2 times the copper residue ratio of the conductive layer 120 in the functional region 140.
Illustratively, the copper residue ratio of the conductive layer 120 in the detection region 130 is greater than or equal to 0.9 times the copper residue ratio of the conductive layer 120 in the functional region 140, and is less than or equal to 1.1 times the copper residue ratio of the conductive layer 120 in the functional region 140, for example, the copper residue ratio of the conductive layer 120 in the detection region 130 is equal to the copper residue ratio of the conductive layer 120 in the functional region 140, so as to reduce the error of the detection value of the impedance of the conductive pattern 121.
Referring to fig. 1-3, in some possible embodiments, a printed circuit board includes a multi-layer core board 100 in a stacked arrangement, the core board 100 including a substrate 110, a surface of the substrate 110 being connected to a conductive layer 120; the conductive pattern 121 disposed in the functional region 140, the impedance line 122 disposed in the detection region 130, and the filling portion 123 may be integrally formed on the surface of the substrate 110.
For example, a conductive layer foundation may be formed on the surface of the substrate 110, and then etched to remove at least a portion of the conductive layer foundation, so that the surface of the substrate 110 is exposed, thereby forming the conductive pattern 121 in the functional region 140, and forming the resistive line 122 and the filling portion 123 in the detection region 130, so that the conductive pattern 121 disposed in the functional region 140, the resistive line 122 disposed in the detection region 130, and the filling portion 123 are arranged in the same layer, thereby facilitating the formation process of the conductive pattern 121, the resistive line 122, and the filling portion 123.
The printed circuit board further includes a plurality of adhesive layers 200, the adhesive layers 200 being disposed between the adjacent two-layered core boards 100, at least a portion of the adhesive layers 200 being connected to the conductive layer 120, and at least a portion of the adhesive layers 200 being connected to the surface of the substrate 110 to fix the adjacent two-layered core boards 100 through the adhesive layers 200, and the adhesive layers 200 may be provided as prepregs or the like to adhesively fix the adjacent two-layered core boards 100 through the prepregs, for example.
It is easy to understand that when the difference between the copper residue ratio of the conductive layer 120 in the detection region 130 and the copper residue ratio of the conductive layer 120 in the functional region 140 is large, for example, the copper residue ratio of the conductive layer 120 in the detection region 130 is less than half of the copper residue ratio of the conductive layer 120 in the functional region 140; the adhesive layer 200 is at least partially connected to the surface of the substrate 110 to fix the adjacent two core boards 100 by the adhesive layer 200.
When the multi-layer core board 100 and the multi-layer adhesive layer 200 are in press-fit connection, the adhesive layer 200 in the detection area 130 is more than the adhesive layer 200 in the functional layer, so that the thickness of the adhesive layer 200 in the detection area 130 is different from the thickness of the adhesive layer 200 in the functional area 140, thereby the thicknesses of the areas of the printed circuit board are different, further the overall stability of the printed circuit board is affected, and the detection error of the impedance of the conductive pattern 121 is increased, and the processing quality of the printed circuit board is affected.
By adopting the above technical scheme, when preparing a printed circuit board, the multi-layer core boards 100 are sequentially stacked, and the adhesive layer 200 is placed between two adjacent core boards 100; the adhesive layer 200 is at least partially connected to the surface of the substrate 110, and then the multi-layer core board 100 and the multi-layer adhesive layer 200 are press-connected to fix the adjacent two-layer core boards 100 through the adhesive layer 200, and the adhesive layer 200 is at least partially filled between the resistance wire 122 and the filling portion 123 to ensure the stability of the connection between the adhesive layer 200 and the core board 100.
Referring to fig. 1-3, in some possible embodiments, the printed circuit board is provided with a test hole 400, and the test hole 400 is correspondingly provided to the detecting part 1221; in the thickness direction of the printed circuit board, the length of the test hole 400 is equal to the thickness of the printed circuit board, and a plating layer 410 is disposed in the test hole 400, and the plating layer 410 is electrically connected to the impedance line 122. When the impedance of the impedance line 122 is detected by the detecting member, the probe of the detecting member can be inserted into the test hole 400, so that the probe of the detecting member can be electrically connected with the impedance line 122 through the plating layer 410, thereby facilitating the detection process of the impedance line 122.
For example, the impedance line 122 may be provided with one or more detection portions 1221, and each detection portion 1221 may be provided with one or more test holes 400, which is not further limited by the embodiment of the present application. And, the printed circuit board is further provided with at least one grounding hole 500, and each grounding hole 500 is correspondingly arranged in one testing hole 400, so that the probe of the detecting piece can detect the impedance of the impedance line 122 through the grounding hole 500 and the detecting hole.
It is easily understood that the printed circuit board has the functional region 140 and the detection region 130 connected, and the detection region 130 may be disposed at the edge of the functional region 140 to reduce the possibility that the impedance line 122 and the filling portion 123 in the detection region 130 may affect the conductive pattern 121 in the functional region 140, for example.
Referring to fig. 1-3, in some possible embodiments, the printed circuit board further includes a multi-layer shield layer disposed in a stack with the conductive layer 120; the conductive layer 120 is accommodated between two adjacent shielding layers, the shielding layers are provided with shielding portions 300, and the shielding portions 300 are correspondingly arranged on the conductive layer 120 in the detection area 130, so that the shielding portions 300 play a role in shielding the impedance detection process of the impedance line 122, and errors detected by the impedance line 122 are reduced.
It is easy to understand that the shielding layer is disposed on the surface of the substrate 110, or the shielding layer may be formed by a portion of the conductive layer 120, which is not further limited in the embodiment of the present application. Illustratively, in the area where the shielding part 300 is located, the copper residue rate of the area where the shielding part 300 is located is 100%, and in the thickness direction of the printed circuit board, the shielding part 300 is correspondingly disposed in the detection area 130, so as to play a role in shielding the detection process of the impedance line 122 through the shielding parts 300 disposed at both sides of the impedance line 122 and the filling part 123.
The structure of the conductive layer 120 in the detection region 130 will be described below with reference to fig. 1 to 3, and by way of example, the number of the filling portions 123 in the detection region 130 is set to be plural, and a gap 124 is provided between each two adjacent filling portions 123. When the adjacent two-layer core boards 100 are adhesively fixed by the adhesive layer 200, at least part of the adhesive layer 200 is filled between the resistance wire 122 and the filling portion 123, and at least part of the adhesive layer 200 is filled in the gap 124, so that the adhesive layer 200 can be fully contacted with the substrate 110 of the core board 100, thereby ensuring the adhesive stability of the adhesive layer 200 to the adjacent two-layer core boards 100.
Illustratively, within the detection zone 130, the number of the impedance lines 122 is set to be plural, and the plurality of the impedance lines 122 are arranged at intervals. The plurality of impedance lines 122 may be disposed at intervals in the middle of the detection region 130, or the plurality of impedance lines 122 may be disposed at edges of the detection region 130, which is not further limited in the embodiment of the present application.
Also, with a plane perpendicular to the extending direction of the impedance line 122 as a cross section, the cross-sectional shape of the impedance line 122 may be set to one of a trapezoid, a rectangle, and a triangle, and as for the shape of the impedance line 122, the impedance line 122 may be set as a linear type impedance line 122, or the impedance line 122 may also be set as a polygonal type impedance line 122, for example; it is easily understood that the sectional area of the impedance line 122 may have an effect on the impedance of the impedance line 122, and thus the sectional area of the impedance line 122 may be set to be equal to the sectional area of the conductive pattern 121 to reduce an error in the impedance detection value of the conductive pattern 121.
Referring to fig. 1 to 3, in some possible embodiments, the number of the filling portions 123 may be set to be plural, and the arrangement manner of the plurality of filling portions 123 may be adjusted according to practical situations, for example, when the plurality of impedance lines 122 are arranged at intervals in the middle of the detection area 130, the plurality of filling portions 123 are distributed at edges of the detection area 130, and a distance is provided between the plurality of filling portions 123 and the impedance lines 122 so that the filling portions 123 will not contact with the impedance lines 122.
Alternatively, the plurality of filling portions 123 may be arranged in a plurality of rows and a plurality of columns, and gaps 124 between two adjacent filling portions 123 are arranged in the same manner in the row direction of the filling portions 123, and gaps 124 between two adjacent filling portions 123 are arranged in the same manner in the column direction of the filling portions 123; when the two adjacent core boards 100 are fixed by the adhesive layer 200, the adhesive layer 200 is filled in the gap 124, so that the adhesive layer 200 is distributed more uniformly in the detection area 130, and the adhesive quality of the adhesive layer 200 to the two adjacent core boards 100 is ensured.
Illustratively, the filling portion 123 may be provided in various shapes in the plane of the detection region 130, for example, each filling portion 123 is provided as one of a polygonal line type filling portion 123, a linear type filling portion 123, a square type filling portion 123 and a circular type filling portion 123 among the plurality of filling portions 123, so as to increase the copper residue rate of the conductive layer 120 in the detection region 130 by the plurality of filling portions 123 having different shapes.
In the embodiment of the present application, the plurality of filling portions 123 are all provided as the polygonal filling portions 123, and portions of the plurality of polygonal filling portions 123 are provided outside the plurality of impedance lines 122, so that the copper residue rate of the conductive layer 120 in the detection region 130 is increased by the plurality of polygonal filling portions 123. The cross-sectional shape of the fold-line type filling portion 123 may be set to one of a trapezoid, a rectangle, and a triangle with a plane perpendicular to the fold-line type filling portion 123 as a cross-section.
In summary, the printed circuit board has the detection area 130 and the functional area 140, and the impedance line 122 is formed by using the part of the conductive layer 120 in the detection area 130, wherein the impedance line 122 has the detection portion 1221, so that the detection member is electrically connected to the detection member through the detection portion 1221, and the detection member can detect the impedance of the impedance line 122; and, by forming the filling portion 123 using the conductive layer 120, a difference between a copper residue ratio of the conductive layer 120 located in the detection region 130 and a copper residue ratio of the conductive layer 120 located in the functional region 140 is made to be 20% or less, so that the impedance line 122 and the filling portion 123 in the detection region 130 can simulate the conductive pattern 121 in the functional region 140;
the difference between the copper residue ratio of the conductive layer 120 in the detection area 130 and the copper residue ratio of the conductive layer 120 in the functional area 140 is less than or equal to 20%, so that the difference between the thickness of the adhesive layer 200 in the detection area 130 and the thickness of the adhesive layer 200 in the functional area 140 is smaller, and compared with the printed circuit board in the related art, the impedance detection value error of the conductive pattern 121 of the printed circuit board provided by the embodiment of the utility model is small, and the thickness of each area of the printed circuit board is more uniform, thereby improving the processing quality of the printed circuit board.
The embodiment of the application also provides an electronic device, which comprises the printed circuit board in any one of the embodiments.
In the detection region 130 of the printed circuit board, an impedance line 122 is formed by using a part of the conductive layer 120, wherein the impedance line 122 has a detection part 1221 to electrically connect the detection member through the detection part 1221, so that the detection member can detect the impedance of the impedance line 122; in addition, by forming the filling portion 123 by using the conductive layer 120, the difference between the copper residue ratio of the conductive layer 120 in the detection area 130 and the copper residue ratio of the conductive layer 120 in the functional area 140 is less than or equal to 20%, so that the impedance line 122 and the filling portion 123 in the detection area 130 can simulate the conductive pattern 121 in the functional area 140, and compared with the printed circuit board in the related art, the impedance detection value error of the conductive pattern 121 of the printed circuit board provided by the embodiment of the present application is small, thereby improving the processing quality of the printed circuit board.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
In the description of the present utility model, it should be understood that the terms "comprises" and "comprising," and any variations thereof, as used herein, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements that are expressly listed or inherent to such process, method, article, or apparatus.
Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium, and can lead the connection between the two elements or the interaction relationship between the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present utility model, and not for limiting the same; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.
Claims (10)
1. A printed circuit board comprising at least one conductive layer, said printed circuit board having a functional area and a detection area connected;
in the functional area, part of the conductive layer forms a conductive pattern so as to electrically connect components through the conductive pattern; in the detection area, part of the conductive layer forms an impedance line and a filling part, the impedance line and the filling part are arranged on the same layer as the conductive pattern, and the impedance line is provided with a detection part so as to be electrically connected with a detection piece through the detection part;
the difference between the copper residue rate of the conductive layer in the detection region and the copper residue rate of the conductive layer in the functional region is less than or equal to 20%.
2. The printed circuit board of claim 1, wherein a copper residue ratio of the conductive layer in the detection zone is equal to a copper residue ratio of the conductive layer in the functional zone.
3. The printed circuit board of claim 1, wherein a number of the filling portions is plural in the detection area, and a gap is provided between each two adjacent filling portions.
4. A printed circuit board according to claim 3, wherein in the detection area, the impedance line is provided in the middle of the detection area, and a plurality of the filling portions are provided at the edges of the detection area.
5. The printed circuit board of claim 3, wherein each of the filling portions is provided as one of a fold line type filling portion, a linear type filling portion, a square filling portion, and a circular filling portion among the plurality of filling portions.
6. The printed circuit board of claim 1, wherein the number of impedance lines is a plurality, and wherein a plurality of the impedance lines are disposed within the detection zone.
7. The printed circuit board of claim 3, further comprising an adhesive layer, the adhesive layer connecting the conductive layer;
at least part of the bonding layer is filled between the impedance line and the filling part, and at least part of the bonding layer is filled in the gap.
8. The printed circuit board of any of claims 1-7, further comprising a plurality of shield layers, wherein a plurality of the shield layers are stacked with the conductive layer;
the conducting layers are accommodated between two adjacent shielding layers, the shielding layers are provided with shielding parts, and the shielding parts are correspondingly arranged on the conducting layers in the detection areas.
9. The printed circuit board according to any one of claims 1 to 7, wherein the printed circuit board is provided with test holes, the test holes being correspondingly provided in the detection portion; and an electroplated layer is arranged in the test hole and is electrically connected with the impedance line.
10. An electronic device comprising a printed circuit board according to any of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223404416.9U CN220475978U (en) | 2022-12-19 | 2022-12-19 | Printed circuit board and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223404416.9U CN220475978U (en) | 2022-12-19 | 2022-12-19 | Printed circuit board and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220475978U true CN220475978U (en) | 2024-02-09 |
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ID=89804770
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223404416.9U Active CN220475978U (en) | 2022-12-19 | 2022-12-19 | Printed circuit board and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220475978U (en) |
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2022
- 2022-12-19 CN CN202223404416.9U patent/CN220475978U/en active Active
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