CN220474443U

CN220474443U - Inverter inductance assembly and inverter

Info

Publication number: CN220474443U
Application number: CN202322039186.9U
Authority: CN
Inventors: 唐钰亮; 周立冬; 王文奇
Original assignee: Sineng Electric Co ltd
Current assignee: Sineng Electric Co ltd
Priority date: 2023-07-31
Filing date: 2023-07-31
Publication date: 2024-02-09
Anticipated expiration: 2033-07-31

Abstract

The utility model belongs to the field of energy equipment, and provides an inverter inductance component and an inverter, wherein the inverter inductance component comprises: a main housing having an interior cavity; a coil structure mounted in the inner cavity of the main housing; a silica gel heat conducting sheet covering the side surface and the bottom of the coil structure; and the heat-conducting glue is filled in the inner cavity of the main shell. The utility model is different from the prior art, the coil in the main shell is directly infused with the potting heat-conducting glue, the heat dissipation mode of the inverter inductance component is that the heat conduction is accelerated through the silica gel heat-conducting fin, and then the heat of the coil is conducted to the main shell through the common potting heat-conducting glue to dissipate the heat, so that the heat dissipation effect is improved.

Description

Inverter inductance assembly and inverter

Technical Field

The utility model belongs to the field of energy equipment, and particularly relates to an inverter inductance assembly and an inverter.

Background

The inverter is a converter for converting direct current energy into alternating current with fixed frequency and fixed voltage or frequency and voltage. The inverter consists of an inverter bridge, control logic and a filter circuit, and is widely applied to energy systems. In general, a plurality of power components are integrated in an inverter, wherein an inductor generally has a large heating value in operation, so that the inductor has a need of timely heat dissipation.

The existing inductance heat dissipation scheme is to place a bare inductance in a main shell with a large opening, and after encapsulation, an inductance unit rapidly conducts coil heat to the main shell through a silica gel heat conducting sheet and encapsulation heat conducting glue, so that heat is dissipated.

The heat dissipation effect of the heat dissipation mode depends on the heat conductivity coefficient of the potting heat conduction glue and the heat dissipation area of the inductance box, so that the heat conduction efficiency is low. If the efficiency of the heat conduction of the inductor needs to be improved, the heat dissipation area of the main shell needs to be enlarged, or the heat conductivity coefficient of the potting heat conducting glue needs to be improved, so that the placement space of the inductor needs to be enlarged, the overall cost of materials and processes is increased, the overall power density of the inductor is reduced, the whole machine weight is increased, and the use experience is affected.

Disclosure of Invention

The utility model provides an inverter inductance component, which aims to solve the problems of poor inductance heat dissipation effect and low overall power density in the existing inverter.

In a first aspect, the present utility model provides an inverter inductance assembly comprising:

a main housing having an interior cavity;

a coil structure mounted in the main housing interior;

a silica gel heat conducting sheet covering the side surface and the bottom of the coil structure; and

and the heat-conducting glue is filled in the inner cavity of the main shell.

Optionally, the coil structure includes:

a magnetic core; and

and a coil wound around the magnetic core.

Optionally, the magnetic core includes two magnetic core seats arranged at intervals;

and two magnetic core columns arranged in parallel between the magnetic core seats;

the coil is wound around the magnetic core leg.

Optionally, a skeleton plate is arranged between the magnetic core seat and the coil.

Optionally, the area of the skeleton plate is larger than the side area of the magnetic core seat.

Optionally, a positioning structure adapted to the skeleton plate is arranged in the main casing.

Optionally, the positioning structure includes:

two steps respectively arranged on two sides of the bottom surface of the inner cavity of the main shell along the length direction of the main shell;

the distance between the two steps is equal to the distance between the two bone plates.

Optionally, a plurality of heat dissipation ribs are arranged on the bottom surface and the side surface of the outer side of the main shell.

Optionally, the heat-conducting glue is polyurethane potting heat-conducting glue.

In a second aspect, the present utility model provides an inverter including the inverter inductance assembly described above.

The inverter inductance component provided by the embodiment of the utility model is different from the prior art in that the coil in the main shell is directly infused with the potting heat-conducting glue, the heat dissipation mode of the inverter inductance component is that the heat conduction is accelerated through the silica gel heat-conducting fin, and then the heat of the coil is conducted to the main shell through the common potting heat-conducting glue to dissipate the heat, so that the heat dissipation effect is improved; the overall size requirement of the inductance component is greatly reduced, the overall power density of the inductance is improved, and meanwhile, the cost is reduced.

Drawings

Fig. 1 is a schematic diagram of an exploded structure of an inverter inductance assembly according to an embodiment of the present utility model;

fig. 2 is a schematic structural diagram of a coil structure of an inverter inductance assembly according to an embodiment of the present utility model;

fig. 3 is a schematic structural diagram of a magnetic core of an inverter inductance assembly according to an embodiment of the present utility model;

fig. 4 is a schematic structural diagram of a main housing of an inverter inductance assembly according to an embodiment of the present utility model.

Description of main reference numerals:

100. a main housing; 110. a positioning structure; 120. a heat dissipation rib;

200. a coil structure; 210. a magnetic core; 211. a magnetic core seat; 212. a magnetic core column; 220. a coil; 230. a bone plate;

300. silica gel heat conducting fin.

Detailed Description

The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. Examples of the embodiments are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements throughout or elements having like or similar functionality. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model. Furthermore, it should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the present utility model.

In the description of the present utility model, it should be understood that the terms "length," "width," "upper," "lower," "left," "right," "horizontal," "top," "bottom," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different structures of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize applications of other processes and/or usage scenarios for other materials.

The inverter inductance component provided by the embodiment of the utility model is different from the prior art in that the coil in the main shell is directly infused with the potting heat-conducting glue, the heat dissipation mode of the inverter inductance is that the heat conduction is accelerated through the silica gel heat-conducting fin, and then the heat of the coil is conducted to the main shell through the common potting heat-conducting glue to dissipate the heat, so that the heat dissipation effect is improved; the overall size requirement of the inductance component is greatly reduced, the overall power density of the inductance component is improved, and meanwhile, the cost is reduced.

Example 1

Referring to fig. 1 to 4, the present embodiment provides an inverter inductance assembly, including:

a main housing 100 provided with an inner cavity;

a coil structure 200 mounted in the inner cavity of the main housing 100;

a silicon rubber heat conduction sheet 300 covering the side and bottom of the coil structure 200; and

and the heat conducting glue is filled in the inner cavity of the main shell 100.

The inverter inductance component provided by the embodiment of the utility model can be applied to an inverter. The combination of the inductor and other elements matched with the inductor can carry out filtering treatment on the direct current input signal, prevent high-frequency noise from interfering with the signal quality, and ensure the stability and smoothness of alternating current output. Meanwhile, the inductor can store energy and control the rapid change of the current of the system, so that the system has better adaptability to load change. In addition, the inductor can limit the current change rate, so that the use of the inductor element in the inverter can ensure stable and reliable operation of the circuit and play a role in protecting the circuit and the equipment.

In some embodiments, the inductive component may be a single packaged unitary body so as to be conveniently assembled in a desired location. Specifically, the inductor assembly includes a main housing 100, the main housing 100 having an interior cavity. The shape, size, etc. of the main housing 100 and its inner cavity may be set according to the coil structure 200, the heat conductive member, etc. adapted thereto in actual use, and are not particularly limited herein. For example, the main casing 100 may be provided as a rectangular casing, and the inner cavity may be provided in a shape conforming to the external appearance, so that the inner cavity volume can be maximized as much as possible while the weight of the main casing 100 can be reduced. In the present embodiment, description will be made taking the main casing 100 as an approximately rectangular casing as an example. Specifically, the four vertical edges of the approximately rectangular housing may be provided as connection columns, a connection structure is provided at the bottom of each connection column, the connection structure may be a connection portion extending in a direction perpendicular to the connection columns, a plurality of connection holes may be formed in each connection portion, and the connection holes may be threaded holes, so as to be matched with screws, studs, and the like, so that the main housing 100 is integrally and fixedly mounted at a desired position.

It is to be understood that the main housing 100 is used as a packaging component of the inductance assembly and has a heat dissipation function, so that the main housing 100 may be made of a material with strong heat conductivity, such as metal aluminum, and the like, which is not limited herein.

The coil structure 200 is installed in the inner cavity of the main housing 100, and the overall volume of the coil structure 200 is slightly smaller than the volume of the inner cavity of the main housing 100, so that a certain gap exists between the coil structure 200 and the inner cavity of the main housing 100. The overall shape of the coil structure 200 may be a regular shape, such as an approximately rectangular parallelepiped, an approximately cylindrical body, or the like, or may be an irregular shape, which is not particularly limited herein. In the present embodiment, the coil structure 200 is described as an example in which the coil structure 200 is formed in an approximately rectangular parallelepiped shape, and the coil structure 200 may be horizontally mounted in the inner cavity of the main housing 100 along the length direction. In this way, in the installation state, the coil structure 200 is convenient to maintain a stable posture in the inner cavity of the main housing 100, and avoids the situations of overturning, tilting and the like, thereby ensuring that the inductance assembly is maintained in a normal working state. In addition, the regular shape of the coil structure 200 can save the installation space required for installation, thereby improving the overall power density of the inductor assembly.

The two sides and the bottom of the coil structure 200 are covered with the silicon rubber heat conductive sheet 300, and since the silicon rubber heat conductive sheet 300 has good flexibility, the shape of the coil structure 200 can be adaptively changed according to the appearance of the coil structure 200, thereby better contacting with the coil structure 200, enhancing heat conduction performance and improving heat dissipation effect. In addition, the silicon rubber heat conductive sheet 300 has good compressibility, and the portion covering the coil structure 200 can be compressed to a small thickness, thereby further reducing the installation space required for the curve rescue. Furthermore, the silica gel heat conducting sheet 300 has better viscosity, so that the silica gel heat conducting sheet can be adhered to the coil structure 200 without using other connecting parts, the number of parts of the inductance assembly is reduced, meanwhile, the assembly is convenient, the production efficiency is improved, and the connection stability of the silica gel heat conducting sheet 300 and the coil structure 200 can be ensured.

It should be noted that, the silica gel heat conducting sheet 300 has a relatively high heat conductivity coefficient, and when the inductance assembly works, the heat emitted by the coil structure 200 can be rapidly conducted through the heat conducting silica gel sheet. And then to the main housing 100 via other media for final dispersion.

In some embodiments, after the coil structure 200 and the silicone thermal conductive sheet 300 covering the side and bottom thereof are installed in the main housing 100, a certain gap exists between the coil structure and the inner cavity of the main housing 100, and the gap is occupied by filling the thermal conductive adhesive. That is, the heat conductive paste is simultaneously in contact with the coil structure 200 or the heat conductive silicone sheet, and the main housing 100, thereby allowing the three to be in thermal communication. It is understood that the thermal conductivity of the thermal paste is generally less than that of the thermal silicone sheet due to physical properties or structural composition limitations. In this embodiment, the positions that the heat-conducting glue can reach include: the top of the coil structure 200, the gap between the silicone rubber heat conduction sheet 300 covered by the side surface of the coil structure 200 and the inner cavity of the main housing 100, and the like. The coil structure 200 and the silica gel heat conducting fin 300 are together installed in the inner cavity of the main housing 100, and after the heat conducting glue is encapsulated, the top of the main housing 100 can be closed through the cover plate.

In this way, the heat dissipation mode of the inductance component is to accelerate heat conduction through the heat conduction silica gel sheet with higher heat conduction coefficient, and then conduct a large amount of heat generated by the coil structure 200 to the main housing 100 through the potting heat conduction glue with lower heat conduction coefficient to finally dissipate. Unlike the prior art that heat of the coil 220 mechanism is directly conducted to the main shell 100 through potting heat conducting glue to dissipate heat, the heat dissipation effect of the embodiment of the utility model is better; the heat conduction performance of the high Wen Diangan component to the inverter case and the inside of the inverter case is improved, so that the ambient temperature inside the case is improved; the inductor has the advantages that the rapid heat dissipation of the inductor in a narrow space is realized, the overall external dimension requirement of the inductor assembly is greatly reduced, the overall power density of the inductor is improved, and meanwhile, the cost is reduced.

The inverter inductance component provided by the embodiment of the utility model is different from the prior art in that the coil 220 in the main shell 100 is directly infused with the potting heat-conducting glue, the heat dissipation mode of the inverter inductance component is that the heat conduction is accelerated through the silica gel heat-conducting fin, and then the heat of the coil is conducted to the main shell through the common potting heat-conducting glue to dissipate the heat, so that the heat dissipation effect is improved; the overall size requirement of the inductance component is greatly reduced, the overall power density of the inductance is improved, and meanwhile, the cost is reduced.

Example two

Referring to fig. 1 to 4, a coil structure 200 of the present embodiment includes:

a magnetic core 210; and

a coil 220 wound around the core 210.

Further, the magnetic core 210 includes two magnetic core seats 211 disposed at intervals;

and two magnetic core columns 212 disposed in parallel between the magnetic core bases 211;

the coil 220 is wound around the core leg 212.

In some embodiments, coil structure 200 is comprised of magnetic core 210 and coil 220. The magnetic core 210 may include a core holder 211 and a core leg 212 connected to the core holder 211. In this embodiment, two magnetic core columns 212 are provided and spaced apart. It will be appreciated that when the coil structure 200 is assembled into the main housing 100, the two magnetic core holders 211 are disposed along the length direction of the main housing 100, and therefore, the distance between the two magnetic core holders 211 should be smaller than the length of the main housing 100, so that a certain gap exists between the magnetic core holders 211 and the side wall of the inner cavity of the main housing 100. When the assembly is completed, the gap is filled with heat conducting glue.

In this embodiment, two parallel magnetic core columns 212 are disposed between two magnetic core bases 211, and it is understood that a certain distance is also provided between two magnetic core columns 212, so as to provide space for the coil 220. When the magnetic core 210 is in a mounted state in a plan view, the magnetic core holder 211 and the magnetic core column 212 are connected to form an approximate rectangle, the two magnetic core holders 211 are a group of wide sides of the rectangle, and the two magnetic core columns 212 are a group of long sides of the rectangle correspondingly.

The coil 220 is wound around the two magnetic core legs 212, wherein the number of windings can be set according to practical use requirements. The material of the coil 220 may be a metal material with high conductivity and good corrosion resistance, such as copper wire, silver wire, etc., and is not particularly limited herein.

It will be appreciated that when assembled, the thermally conductive silicone sheet directly covers the sides and bottom of the coil 220.

Example III

Referring to fig. 1 to 4, a frame plate 230 is disposed between the core holder 211 and the coil 220 in the present embodiment.

In some embodiments, the coil 220 mechanism is mounted to the inner cavity of the main housing 100 by the frame plate 230, so that a certain space is created between the magnetic core 210 and the coil 220 and the main housing 100, and the space can be filled with heat-conducting glue when the assembly is completed. The skeleton plate 230 may be disposed between the magnetic core holder 211 and the coil 220, that is, two magnetic core holders 211 on two sides of the magnetic core 210 are respectively provided with one skeleton plate 230, and the skeleton plate 230 may be provided with a via hole, which has the same shape as the magnetic core holder 211 and a slightly larger area than the side area of the magnetic core holder 211, so that the magnetic core holder 211 may pass through the via hole.

Example IV

Referring to fig. 1 to 4, the area of the skeleton plate 230 of the present embodiment is larger than the side area of the core holder 211.

In some embodiments, the area of the cage plate 230 is larger than the side area of the core holder 211, such that the periphery of the core holder 211 is seen surrounded by the cage plate 230 when viewed from the side, i.e., the core holder 211 is in contact with the outside world, requiring passage through the cage plate 230. When the coil structure 200 is in the assembled state, the frame plate 230 acts as a support, so that the magnetic core 210, the coil 220 wound around the magnetic core 210, and the silica gel heat conducting sheet 300 covering the side and bottom of the coil 220 are in a suspended state and not in direct contact with the inner cavity of the main housing 100 or other components. That is, at this time, a certain space is formed between the coil structure 200 and the heat conductive silicone sheet and the inner cavity of the main housing 100, and the space can be filled with the heat conductive adhesive when the assembly is completed.

Example five

Referring to fig. 1 to 4, a positioning structure 110 adapted to the skeleton plate 230 is disposed in the main housing 100 of the present embodiment.

Further, the positioning structure 110 includes:

two steps respectively arranged on two sides of the bottom surface of the inner cavity of the main shell 100 along the length direction of the main shell 100;

the pitch of the two steps is equal to the pitch of the two skeletal plates 230.

In some embodiments, positioning may be achieved by the positioning structure 110 fitting into the skeletal plate 230 when the coil structure 200 is installed in the interior cavity of the main housing 100. Specifically, the positioning structure 110 includes two steps respectively disposed on two sides of the bottom surface of the inner cavity of the main housing 100 along the length direction of the main housing 100, and the heights of the two steps may be slightly lower than the distance between the lowest point of the skeleton plate 230 and the lowest point of the magnetic core seat 211, so that when the assembly is completed, a certain space is also formed between the magnetic core seat 211 and the upper surface of the step, and similarly, the space may be filled with heat-conducting glue.

The interval of two steps equals the interval of two skeleton boards 230, and during the assembly, the outside of two skeleton boards 230 can laminate with the inside wall of two steps respectively to make coil structure 200 whole in the ascending motion of main casing 100 length direction receive the restriction, in order to realize the location, and then can improve assembly efficiency.

Example six

Referring to fig. 1 to 4, a plurality of heat dissipating ribs 120 are disposed on the bottom surface and the side surface of the outer side of the main housing 100 in the present embodiment.

In some embodiments, the bottom and side surfaces of the outer side of the main housing 100 are provided with a plurality of heat dissipating ribs 120. The shape, size, number, layout, etc. of the heat dissipating ribs 120 may be set according to actual use requirements. In this embodiment, five parallel plate-shaped ribs 120 are taken as an example for illustration, the side ribs 120 may be formed to extend a distance in a direction perpendicular to the side surface of the main housing 100, and similarly, the bottom ribs 120 may be formed to extend a distance in a direction perpendicular to the bottom of the main housing 100. The side and bottom ribs 120 may communicate with each other. In this way, the heat dissipation area can be increased by the heat dissipation ribs 120, and the heat emitted from the coil 220 is further accelerated to dissipate after being conducted to the main housing 100 via the silica gel heat conducting sheet 300 and the heat conducting gel, so as to enhance the heat dissipation effect.

Example seven

Referring to fig. 1 to 4, the heat-conducting glue of the present embodiment is a polyurethane potting heat-conducting glue.

The polyurethane heat-conducting pouring sealant has good stress intensity and can bear external pressure and impact, so that the service life of the inductance component can be prolonged; in addition, the polyurethane heat conduction pouring sealant can be well stretch-resistant and tear-resistant, so that the coil structure 200 is protected.

Example eight

Referring to fig. 1 to 4, the present embodiment provides an inverter including the inverter inductance assembly of any of the above embodiments.

The inverter provided in this embodiment may be applied to a photovoltaic system or other power systems, and may also be applied to household appliances and the like.

Unlike the prior art, in the inductor assembly, the coil 220 in the main housing 100 is directly infused with the potting heat-conducting adhesive, and the heat dissipation mode of the inductor assembly of the inverter is that the heat conduction is accelerated through the silica gel heat-conducting sheet, and then the heat of the coil is conducted to the main housing through the common potting heat-conducting adhesive to dissipate the heat, so that the heat dissipation effect is improved; the overall size requirement of the inductance component is greatly reduced, the overall power density of the inductance is improved, and meanwhile, the cost is reduced.

The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.

Claims

1. An inverter inductance assembly, comprising:

a main housing having an interior cavity;

a coil structure mounted in the main housing interior;

and the heat-conducting glue is filled in the inner cavity of the main shell.

2. The inverter inductance assembly of claim 1, wherein the coil structure includes:

a magnetic core; and

and a coil wound around the magnetic core.

3. The inverter inductance assembly of claim 2, wherein said core includes two spaced apart core receptacles;

the coil is wound around the magnetic core leg.

4. An inverter inductance assembly according to claim 3, wherein a skeleton plate is provided between the core holder and the coil.

5. The inverter inductance assembly of claim 4, wherein an area of said skeletal plate is greater than a side area of said core print.

6. The inverter inductance assembly of claim 4, wherein a locating structure is provided within the main housing that mates with the skeletal plate.

7. The inverter inductance assembly of claim 6, wherein the positioning structure includes:

8. The inverter inductance assembly of claim 1, wherein the bottom and sides of the main housing are provided with a plurality of heat dissipating ribs.

9. The inverter inductance assembly of claim 1, wherein the thermal conductive glue is a polyurethane potting thermal conductive glue.

10. An inverter comprising an inverter inductance assembly as claimed in any one of claims 1 to 9.