CN220450346U

CN220450346U - Electroplating device for manufacturing electronic accessories

Info

Publication number: CN220450346U
Application number: CN202321657846.3U
Authority: CN
Inventors: 易楚燕
Original assignee: Hubei Jiapinyuan Electronic Technology Co ltd
Current assignee: Hubei Jiapinyuan Electronic Technology Co ltd
Priority date: 2023-06-28
Filing date: 2023-06-28
Publication date: 2024-02-06
Anticipated expiration: 2033-06-28

Abstract

The utility model discloses an electroplating device for manufacturing electronic accessories, which belongs to the technical field of electroplating equipment and comprises an electroplating device, wherein the electroplating device comprises an electroplating box, an electroplating structure and a push plate, the inner cavity of the electroplating box is of a hollow structure, the electroplating structure is arranged in the inner cavity of the electroplating box, the electroplating structure comprises a plastic pipe and a copper pipe, and the copper pipe is of a hollow structure; this a setting of electroplating device for electronic parts manufacturing, structural design is reasonable, through having hung electroplating structure in electroplating box's inside, a plastic tubing is connected respectively at copper pipe both ends in the electroplating structure, and copper pipe is hollow out construction for copper pipe can submerge in the plating solution, and the inside push pedal of copper pipe can be reciprocating motion under the effect of stay cord, and then can derive the electronic parts after electroplating in the electroplating structure, and the other end can be used for adding new electronic parts that wait to electroplate, thereby can effectually improve the electroplating efficiency to electronic parts.

Description

Electroplating device for manufacturing electronic accessories

Technical Field

The utility model relates to the technical field of electroplating equipment, in particular to an electroplating device for manufacturing electronic accessories.

Background

In the manufacture of electronic parts, electroplating is to deposit predetermined metal or alloy on the surface of the electronic parts in an electrolytic mode so as to achieve the functions of protection and electric conduction, and the electroplated metal is deposited on the surface of the electronic parts, so that the electronic parts can be prevented from corrosion and abrasion and have the electric conduction performance.

The existing electronic accessory adopts a basket to load the electronic accessory for electroplating when electroplating, and the loading and unloading of the basket after the electroplating are completed need to be carried out separately, so that the loading and unloading can not be connected seamlessly. For this reason, new solutions need to be designed to solve.

Disclosure of Invention

The utility model aims to provide an electroplating device for manufacturing an electronic accessory, which is used for solving the problems that when the electronic accessory is electroplated, a basket is adopted to load the electronic accessory, the loading and the unloading of the basket are required to be carried out separately after the electroplating is completed, and the loading and the unloading cannot be connected seamlessly.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides an electroplating device for electronic accessory makes, includes electroplating device, electroplating device includes electroplating box, electroplating structure and push pedal, the inner chamber of electroplating box is hollow structure, the electroplating structure is arranged in the inner chamber of electroplating box, the electroplating structure includes plastic tubing and copper pipe, the copper pipe is hollow structure, the both ends of copper pipe are respectively through bolted connection one the plastic tubing, the push pedal is arranged in the inner chamber of electroplating structure, a stay cord is respectively through the bolt fastening to both sides wall of push pedal, the push pedal passes through the stay cord along the plastic tubing with the inside wall sliding contact of copper pipe.

In order to enable the electroplating structure to be in a suspended state in the electroplating box, as an electroplating device for manufacturing electronic accessories, the top of the electroplating box is preferably welded with a hanging rod, the outer side wall of the plastic pipe is fixed with a hook through a bolt, and the hook is connected with the hanging rod.

In order to prevent the push plate from being pulled out of the plating structure during pulling, as a plating apparatus for electronic parts manufacturing of the present utility model, it is preferable that an inner side wall of the plastic tube is fixed with an inner ring by bolts, and a side wall of the push plate is in contact with the inner ring.

In order to facilitate the manual pulling of the pull rope, as a plating device for manufacturing electronic accessories, the end part of the inner ring is preferably bound with a pull ring.

In order to scatter the electronic parts and avoid the inconvenience of electroplating when stacked together, as a plating device for manufacturing the electronic parts, preferably, the pull rope is clamped with a plurality of poking sheets near the outer part of the end part of the push plate.

In order to improve the use strength of the copper tube, it is preferable that the outer side wall of the copper tube is sleeved with a plurality of reinforcing rings, and the reinforcing rings and the copper tube are fixed by bolts.

In order to improve the connection strength between the copper pipe and the plastic pipe, the electroplating device for manufacturing the electronic accessory is preferably provided with a clamping ring extending from the end of the copper pipe, wherein the clamping ring is inserted into the end of the plastic pipe.

Compared with the prior art, the utility model has the beneficial effects that: this a setting of electroplating device for electronic parts manufacturing, structural design is reasonable, through having hung electroplating structure in electroplating box's inside, a plastic tubing is connected respectively at copper pipe both ends in the electroplating structure, and copper pipe is hollow out construction for copper pipe can submerge in the plating solution, and the inside push pedal of copper pipe can be reciprocating motion under the effect of stay cord, and then can derive the electronic parts after electroplating in the electroplating structure, and the other end can be used for adding new electronic parts that wait to electroplate, thereby can effectually improve the electroplating efficiency to electronic parts.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic view of the electroplating structure of the present utility model;

fig. 3 is a schematic view of the copper pipe connection structure of the present utility model.

In the figure: 100. an electroplating device; 110. an electroplating box; 111. a hanging rod; 120. electroplating structure; 121. a plastic tube; 122. copper pipe; 123. an inner ring; 124. a hook; 125. a reinforcing ring; 126. a clasp; 130. a push plate; 131. a pull rope; 132. a pull ring; 133. a pulling piece.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, the present utility model provides a technical solution:

in the technical scheme, an electroplating device for manufacturing electronic accessories comprises an electroplating device 100, wherein the electroplating device 100 comprises an electroplating box 110, an electroplating structure 120 and a push plate 130, the inner cavity of the electroplating box 110 is of a hollow structure, the electroplating structure 120 is arranged in the inner cavity of the electroplating box 110, the electroplating structure 120 comprises a plastic pipe 121 and a copper pipe 122, the copper pipe 122 is of a hollow structure, two ends of the copper pipe 122 are respectively connected with the plastic pipe 121 through bolts, the push plate 130 is arranged in the inner cavity of the electroplating structure 120, two side walls of the push plate 130 are respectively fixed with a pull rope 131 through bolts, and the push plate 130 is in sliding contact with the inner side walls of the plastic pipe 121 and the copper pipe 122 through the pull ropes 131;

in this technical solution, the electroplating tank 110 is used for storing electroplating solution, the electroplating structure 120 is integrally disposed in an inner cavity of the electroplating tank 110, the inner cavity is used for storing electronic components to be electroplated, the copper pipe 122 is electrified to enable the electronic components inside to be electroplated, the two pull ropes 131 are mutually pulled to control the push plate 130 to move in the inner cavity of the electroplating structure 120, the push plate 130 can guide out the electroplated components along one of the plastic pipes 121 in the moving process, and the other plastic pipe 121 can guide the electronic components to be electroplated into the inner cavity of the electroplating structure 120.

In some embodiments, referring to fig. 1, a hanging rod 111 is welded on top of the plating tank 110, a hook 124 is fixed on an outer sidewall of the plastic tube 121 by a bolt, and the hook 124 is connected with the hanging rod 111.

In this embodiment, the use of the hanger 111 and the hook 124 in combination allows the plating structure 120 to be stably suspended within the interior cavity of the plating tank 110.

In some embodiments, referring to fig. 1 and 3, an inner ring 123 is fixed to an inner side wall of the plastic tube 121 by bolts, and a side wall of the push plate 130 contacts the inner ring 123.

In this embodiment, the use of the inner ring 123 prevents the push plate 130 from being pulled out of the plastic tube 121 by the pull cord 131 to affect use.

In some embodiments, referring to fig. 1-2, the end of the inner ring 123 is stitched with a pull ring 132.

In this solution, the pull ring 132 can be used to facilitate manual pulling of the pull cord 131.

In some embodiments, referring to fig. 2, a plurality of pulling tabs 133 are fastened to the outside of the pulling cord 131 near the end of the push plate 130.

In this embodiment, the electronic components disposed in the cavity of the plating structure 120 can be flattened by using the paddle 133, so as to avoid the influence of aggregation on plating.

In some embodiments, referring to fig. 2, the outer sidewall of the copper tube 122 is sleeved with a plurality of reinforcing rings 125, and the reinforcing rings 125 are fixed to the copper tube 122 by bolts.

In this embodiment, the use of the reinforcing ring 125 can reinforce the whole copper tube 122, and prevent the copper tube 122 from being deformed.

In some embodiments, referring to fig. 3, a snap ring 126 extends from the end of the copper tube 122, and the snap ring 126 is inserted into the end of the plastic tube 121.

In this embodiment, the use of the snap ring 126 can improve the connection strength of the plastic tube 121 between the copper tube 122.

Working principle: the hanger 124 is hung on the hanging rod 111, the electroplating structure 120 is integrally suspended in the inner cavity of the electroplating box 110, electroplating liquid is poured into the inner cavity of the electroplating box 110 and the copper pipe 122 is integrally submerged, at the moment, an electronic accessory to be electroplated is led into the copper pipe 122 through the left plastic pipe 121, at the moment, two pull ropes 131 are pulled back and forth, so that a pulling piece 133 pulls the electronic accessory to avoid stacking, after the electroplating is completed, the left pull ropes 131 are pulled, the pull ropes 131 drive a push plate 130 to move so as to lead out the electronic accessory after the electroplating is completed, at the moment, the electronic accessory to be electroplated can be led into the copper pipe 122 from the right plastic pipe 121, and one plastic pipe 121 at the discharge end is the feed end, so that the electronic accessory can be subjected to seamless connection feeding and discharging.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although the utility model has been described hereinabove with reference to embodiments, various modifications thereof may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the features of the disclosed embodiments may be combined with each other in any manner so long as there is no structural conflict, and the exhaustive description of these combinations is not given in this specification merely for the sake of brevity and resource saving. Therefore, it is intended that the utility model not be limited to the particular embodiment disclosed, but that the utility model will include all embodiments falling within the scope of the appended claims.

Claims

1. An electroplating device for manufacturing electronic accessories, which is characterized in that: including electroplating device (100), electroplating device (100) are including electroplating tank (110), electroplating structure (120) and push pedal (130), the inner chamber of electroplating tank (110) is hollow structure, electroplating structure (120) are arranged in the inner chamber of electroplating tank (110), electroplating structure (120) are including plastic tubing (121) and copper pipe (122), copper pipe (122) are hollow structure, one through bolted connection respectively in the both ends of copper pipe (122) plastic tubing (121), push pedal (130) are arranged in the inner chamber of electroplating structure (120), both sides wall of push pedal (130) are respectively through a bolt fastening stay cord (131), push pedal (130) are through stay cord (131) are followed plastic tubing (121) with inside wall sliding contact of copper pipe (122).

2. A plating apparatus for electronic parts manufacturing according to claim 1, wherein: the top of the electroplating box (110) is welded with a hanging rod (111), a hook (124) is fixed on the outer side wall of the plastic pipe (121) through a bolt, and the hook (124) is connected with the hanging rod (111).

3. A plating apparatus for electronic parts manufacturing according to claim 1, wherein: an inner ring (123) is fixed on the inner side wall of the plastic pipe (121) through bolts, and the side wall of the push plate (130) is in contact with the inner ring (123).

4. A plating apparatus for electronic parts manufacturing according to claim 1, wherein: a pull ring (132) is tied at the end of the inner ring (123).

5. A plating apparatus for electronic parts manufacturing according to claim 1, wherein: the outside that stay cord (131) is close to push pedal (130) tip joint has a plurality of plectrums (133).

6. A plating apparatus for electronic parts manufacturing according to claim 1, wherein: the outer side wall of the copper pipe (122) is sleeved with a plurality of reinforcing rings (125), and the reinforcing rings (125) and the copper pipe (122) are fixed through bolts.

7. A plating apparatus for electronic parts manufacturing according to claim 1, wherein: the end part of the copper pipe (122) is extended with a clamping ring (126), and the clamping ring (126) is inserted with the end part of the plastic pipe (121).