CN220441188U - High-efficient suction means of component of chip mounter - Google Patents

High-efficient suction means of component of chip mounter Download PDF

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Publication number
CN220441188U
CN220441188U CN202321386362.XU CN202321386362U CN220441188U CN 220441188 U CN220441188 U CN 220441188U CN 202321386362 U CN202321386362 U CN 202321386362U CN 220441188 U CN220441188 U CN 220441188U
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China
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negative pressure
chip mounter
assembly plate
plate
mounting
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CN202321386362.XU
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Chinese (zh)
Inventor
胡冀南
许家宏
许敏铭
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Fujian Urban Construction Intelligent Control Technology Co ltd
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Fujian Urban Construction Intelligent Control Technology Co ltd
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    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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Abstract

The utility model discloses an element high-efficiency suction device of a chip mounter, which belongs to the technical field of chip mounters and comprises a mounting plate and a negative pressure connector; the assembly plate is of a flat plate structure which is horizontally arranged, the top of the assembly plate is provided with an air cylinder, the assembly plate can be horizontally lifted and lowered through the air cylinder and is arranged in the main body, and the lower end of the negative pressure connector is detachably provided with a butt joint sucker; the negative pressure joint is arranged right above the raw material frame, so that a conventional chip mounter can be improved, under the condition that the running speed of the chip mounter is not changed, a circuit board can be efficiently attached with a plurality of components, and the components can be attached with a plurality of components at one time according to the attached positions of the components of different circuit boards.

Description

High-efficient suction means of component of chip mounter
Technical Field
The utility model relates to the technical field of chip mounters, in particular to an element efficient suction device of a chip mounter.
Background
Chip mounter: also called a mounter, a surface mounting system, which is a device for accurately placing surface mounted components on pads of a PCB by moving a mounting head after a dispenser or a screen printer in a production line. The chip mounter is divided into manual and full-automatic ones.
The full-automatic chip mounter is used for realizing high-speed and high-precision full-automatic mounting of components and parts, and is the most critical and complex equipment in the whole SMT production. The chip mounter is a main device in an SMT production line, and has been developed from an early low-speed mechanical chip mounter to a high-speed optical centering chip mounter and has been developed to a multifunctional flexible connection modularization.
Because components of chip mounter subsides are components such as electric capacity, resistance and chip generally, and is fragile, also very accurate, the position that needs the installation also needs more accurate, in order to protect this kind of component, the clamping end of high-speed chip mounter is at present general sucking disc for press from both sides and get the component, press from both sides and get one at a time, high-speed chip mounter is general single lift negative pressure and presss from both sides and get, discern and high-speed operation through the high definition camera, this kind of mode can press from both sides and get at a high speed, flexible operation moreover, can both carry out nimble adjustment and press from both sides the component of getting the needs subsides dress to different PCB boards (circuit boards), but general conventional paster equipment, the functioning speed is slower, and efficiency is just low.
Based on the above, the utility model designs an element high-efficiency suction device of a chip mounter to solve the above problems.
Disclosure of Invention
The utility model aims to provide an element high-efficiency suction device of a chip mounter, which can improve the conventional chip mounter, can mount elements efficiently on a circuit board without changing the running speed of the chip mounter, can mount a plurality of elements at one time, can be conveniently adjusted according to the element mounting positions of different circuit boards, is convenient to use and various in adjustment position, and can be suitable for the mounting position relation of various circuit board elements.
The utility model is realized in the following way: an efficient component sucking device of a chip mounter, comprising:
the chip mounter includes host computer body and raw materials frame, the host computer body is the chip mounter main part, the raw materials frame is the work or material rest that the component was deposited, the settling that the raw materials frame can break away from is inside the host computer, include: an assembly plate and a negative pressure joint;
the assembly plate is of a flat plate structure which is horizontally arranged, the top of the assembly plate is provided with an air cylinder, and the assembly plate can be horizontally lifted and arranged in the main machine body through the air cylinder;
the mounting plate is provided with criss-cross mounting grooves which penetrate through the upper surface and the lower surface of the mounting plate;
the negative pressure connector is a straight pipe, the upper ends of the negative pressure connectors are connected with negative pressure hoses in a sealing way, a plurality of negative pressure connectors can be horizontally and slidably locked in the mounting groove, and the lower ends of the negative pressure connectors are detachably provided with butt joint suckers;
the negative pressure joint is arranged right above the raw material frame.
Furthermore, two guide rods are further arranged at the top of the assembly plate, and the two guide rods and the air cylinder are kept vertical.
Further, the lower end of the butt joint sucker is a negative pressure sucker, the lower end of the negative pressure connector is also provided with a sealing cover which can be separated through threads, and the sealing cover is an airtight plug;
the lower extreme of negative pressure joint stretches out in the assembly plate below, lock nut has still been installed on the top of negative pressure joint, lock nut sets up at the assembly plate top, negative pressure joint passes through lock nut separable locking on the assembly plate.
Further, the negative pressure hose is a high pressure hose, and the negative pressure hose is in sealing connection with a negative pressure device in the main body.
The beneficial effects of the utility model are as follows: 1. according to the utility model, the plurality of negative pressure connectors are arranged on the assembly plate, so that a plurality of different elements can be conveniently sucked and mounted, the moving speed of the air cylinder is not increased, and the mounting operation with high efficiency is performed;
2. the negative pressure connector of the device can be conveniently disassembled and assembled, so that the device is suitable for butting different numbers of elements, each negative pressure connector can slide in the mounting groove to adjust the position, the device is convenient to install and convenient to use, circuit board elements of different types can be used for mounting, the negative pressure connecting pipe of the device is a negative pressure hose, and the position of the negative pressure connector is not influenced by the position of the connecting pipe when being adjusted, so that the device is convenient to adjust;
3. the negative pressure connector of the device can be provided with the butt joint sucking disc or the sealing cover, so that the negative pressure connector does not need to be disassembled and assembled under the general condition, the position of the negative pressure connector only needs to be replaced, the assembly of circuit boards of different models can be completed by adapting to the butt joint sucking disc or the sealing cover, the use is convenient, the circuit boards of the same model are used in batches, and the operation is convenient only by adjusting once.
Drawings
The utility model will be further described with reference to examples of embodiments with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of the overall frontal structure of the present utility model;
FIG. 2 is a schematic view of the internal structure of the main body of the present utility model;
FIG. 3 is a schematic top view of the mounting plate of the present utility model;
FIG. 4 is a schematic diagram of the structure of the negative pressure connector and the assembly plate according to the present utility model;
fig. 5 is a schematic structural view of a single negative pressure connector according to the present utility model.
In the drawings, the list of components represented by the various numbers is as follows:
the device comprises a main body 1, an air cylinder 11, a guide rod 12, a 2-assembling plate 21, an installing groove 3-negative pressure connector 31-butt joint sucking disc 32-sealing cover 33-negative pressure hose 34-locking nut and a 4-raw material frame.
Detailed Description
Referring to fig. 1 to 5, the present utility model provides a technical solution: an efficient component sucking device of a chip mounter, comprising:
the chip mounter includes host computer body 1 and raw materials frame 4, host computer body 1 is the chip mounter main part, raw materials frame 4 is the work or material rest that the component was deposited, the settling that raw materials frame 4 can break away from is inside host computer 1, includes: a mounting plate 2 and a negative pressure joint 3;
the assembly plate 2 is of a flat plate structure which is horizontally arranged, the top of the assembly plate 2 is provided with an air cylinder 11, and the assembly plate 2 can be horizontally lifted and lowered through the air cylinder 11 and is arranged in the main machine body 1;
the mounting plate 2 is provided with criss-cross mounting grooves 21, and the mounting grooves 21 penetrate through the upper surface and the lower surface of the mounting plate 2;
the negative pressure connector 3 is a straight pipe, the upper end of the negative pressure connector 3 is connected with a negative pressure hose 33 in a sealing way, a plurality of negative pressure connectors 3 can be locked in the mounting groove 21 in a horizontal sliding way, and the lower end of the negative pressure connector 3 is provided with a butt joint sucker 31 in a separable way;
the negative pressure joint 3 sets up directly over raw materials frame 4, can improve conventional chip mounter, under the condition that does not change its functioning speed, just can carry out efficient dress component to the circuit board, can paste a plurality of components moreover once only to can be according to the component mounting position of different circuit boards, convenient to use adjusts, and it is convenient to adjust, and the adjustment position variation is various moreover, can be suitable for the subsides dress positional relationship of multiple different circuit board components.
Wherein, the top of the assembly plate 2 is also provided with two guide rods 12, and the two guide rods 12 and the air cylinder 11 are kept vertical, so that the assembly plate 2 can be stably lifted and kept as horizontal as possible;
the lower end of the butt joint sucker 31 is a negative pressure sucker, the lower end of the negative pressure connector 3 is also provided with a sealing cover 32 which can be separated through threads, and the sealing cover 32 is an airtight plug;
the lower end of the negative pressure connector 3 extends out of the lower part of the assembly plate 2, the locking nut 34 is further arranged at the top end of the negative pressure connector 3, the locking nut 34 is arranged at the top of the assembly plate 2, the negative pressure connector 3 is detachably locked on the assembly plate 2 through the locking nut 34, so that the negative pressure connector 3 can be conveniently assembled and abutted against the sucker 31 to absorb negative pressure, and the sucker can be plugged through the sealing cover 32 when the sucker is not needed, the sucker is convenient to use, the height of the sealing cover 32 is far lower than the height of the sucker 31, the sealing cover 32 is effectively prevented from touching other unnecessary accessories on the raw material frame 4, a plurality of different elements are arranged on the raw material frame 4, and the elements are not arranged below the position of the sucker 31, so that clamping is only needed, and errors are avoided when the sucker is not needed;
the negative pressure hose 33 is a high pressure hose, the negative pressure hose 33 is in sealing connection with a negative pressure device in the main machine body 1, the connection is convenient, and the negative pressure is stable.
In one embodiment of the utility model:
the embodiment of the utility model provides an element high-efficiency suction device of a chip mounter, which solves the technical problems that: 1. the conventional chip mounter needs to increase the mounting speed of elements and the operation speed of a clamp of the chip mounter, and the current solution is to improve the mounting speed into a high-speed chip mounter which is sold in the market, namely a plurality of suction clamping heads are used for sucking, each of the suction clamping heads can operate and clamp at a high speed, and the chip mounter is stable to use, but the required equipment has high intelligent degree and high cost; 2. the conventional chip mounter has inconvenient operation, low efficiency and inconvenient use; 3. the conventional chip mounter can only replace the whole clamping component aiming at different circuit boards, has poor adaptability and large replacement difficulty, and one clamping component can only aim at one batch of circuit boards, so that the market demands are hardly met.
The technical problems solved by the utility model are as follows: through reforming transform conventional chip mounter, can once absorb a plurality of components of centre gripping, form efficient mounting operation to can be convenient adjust and change the position overall arrangement of absorbing the component, thereby deal with various different circuit board models.
The technical effects are realized as follows: 1. according to the utility model, the plurality of negative pressure connectors 3 are arranged on the assembly plate 2, so that a plurality of different elements can be conveniently sucked and mounted, the mounting operation with high efficiency is performed under the condition of not increasing the moving speed of the air cylinder 11, and the cost and the manufacturing condition are far lower than those of a high-speed chip mounter;
2. the negative pressure connector 3 of the device can be conveniently disassembled and assembled, so that the device is suitable for butting different numbers of elements, each negative pressure connector 3 can horizontally slide in the mounting groove 21 to adjust the position, the device is convenient to install and convenient to use, circuit board elements of different types and layouts can be suitably attached, the negative pressure connecting pipe of the device is a negative pressure hose 33, and the position of the connecting pipe cannot be influenced when the position of the negative pressure connector is adjusted, so that the device is convenient to adjust;
3. the butt joint sucking disc 31 or the sealed lid 32 can be installed to the negative pressure joint 3 of this device to make this device when circuit board overall arrangement takes place small change, need not dismouting negative pressure joint 3 down, only need adjust negative pressure joint 3 position and circuit board overall arrangement match can, the operation is more convenient, and the assembly of the circuit board of different models can be accomplished to adaptation butt joint sucking disc 31 or sealed lid 32, it is convenient to use, and a batch of circuit boards of same model only need adjust once can, convenient operation, high-efficient paste dress circuit board, with low costs.
The technical scheme in the embodiment of the utility model aims to solve the problems, and the overall thought is as follows:
in order to better understand the above technical solutions, the following detailed description will refer to the accompanying drawings and specific embodiments.
When the chip mounter is manufactured, the main machine body 1 and the raw material frame 4 on the conventional chip mounter are needed to be taken, the main machine body 1 is a chip mounter main body, the raw material frame 4 is a material frame for transferring elements, the raw material frame 4 can be arranged in the main machine 1 in a separated mode, all the chip mounter components are needed to be equipped, and the chip mounter belongs to a common device.
The improvement of the device is that the assembly plate 2 and the negative pressure joint 3;
the assembly plate 2 is of a flat plate structure which is horizontally arranged, the top of the assembly plate 2 is provided with an air cylinder 11, and the assembly plate 2 can be horizontally lifted and lowered through the air cylinder 11 and is arranged in the main machine body 1; two guide rods 12 are further arranged at the top of the assembly plate 2, and the two guide rods 12 and the air cylinder 11 are kept vertical;
the mounting plate 2 is provided with the mounting grooves 21 which are crisscrossed vertically and horizontally, the mounting grooves 21 penetrate through the upper surface and the lower surface of the mounting plate 2, and the mounting grooves 21 are long-strip-shaped grooves with different shapes as shown in fig. 3, and are crisscrossed vertically and horizontally, so that the mounting plate 2 of the device is mainly used for adapting to the distribution of elements on circuit boards matched with different position layouts, the layout of the mounting grooves 21 is not limited to the illustrated state, but various shapes can be used, the shape of a Chinese character 'mi' and the shape of an arc can be used, the mounting plate 2 is a flat plate-shaped mounting plate, the negative pressure connector 3 can be assembled, and the mounting plate 2 can be conveniently butted with the air cylinder 11, so that the mounting plate 2 of the device is provided with more replacement parts of the mounting grooves 21 with different shapes, and the use is more convenient;
the negative pressure joint 3 is a straight pipe, the upper end of the negative pressure joint 3 is connected with a negative pressure hose 33 in a sealing way, the negative pressure hose 33 is a high-pressure hose, and the negative pressure hose 33 is connected with a negative pressure device in the main machine body 1 in a sealing way;
the negative pressure connectors 3 can be horizontally and slidably locked in the mounting groove 21, and the butt joint suckers 31 are detachably arranged at the lower ends of the negative pressure connectors 3; the lower end of the butt joint sucker 31 is a negative pressure sucker, the lower end of the negative pressure joint 3 is also provided with a sealing cover 32 which can be separated through threads, and the sealing cover 32 is an airtight plug;
the lower end of the negative pressure joint 3 extends out of the lower part of the assembly plate 2, a lock nut 34 is further arranged at the top end of the negative pressure joint 3, the lock nut 34 is arranged at the top of the assembly plate 2, and the negative pressure joint 3 can be locked on the assembly plate 2 in a separated manner through the lock nut 34;
the negative pressure joint 3 is arranged right above the raw material frame 4.
When the utility model is used, the controller of the main machine body 1 controls the air cylinder 11 to stretch and retract, so that the whole assembly plate 2 moves downwards together, the negative pressure connector 3 is lowered, the butt joint sucker 31 touches the element on the raw material frame 4, the negative pressure sucks the element, the element is butt jointed on the circuit board in the main machine body 1 after being sucked, the mounting is completed, a plurality of elements are mounted at one time, and then the next circuit board can be mounted;
when the circuit board is changed in component layout and component mounting is needed, the component feeding layout of the raw material frame can be changed, then the raw material frame is in butt joint with the device, the locking nut 34 is loosened, the negative pressure connector 3 is in sliding adjustment position in the mounting groove 21 of the assembly plate 2, the position of the negative pressure connector 3 is matched with the position of the component on the whole circuit board, adaptation is carried out, and then the negative pressure connector 3 is locked through the locking nut 34;
and the redundant negative pressure connector 3 is plugged by the sealing cover 32, and the negative pressure connector 3 which needs to be sucked is assembled by the butt-joint sucking disc 31, so that the method is suitable for mounting newly laid circuit board elements, and is convenient to operate.
While specific embodiments of the utility model have been described above, it will be appreciated by those skilled in the art that the specific embodiments described are illustrative only and not intended to limit the scope of the utility model, and that equivalent modifications and variations of the utility model in light of the spirit of the utility model will be covered by the claims of the present utility model.

Claims (4)

1. The utility model provides a high-efficient suction means of component of chip mounter, chip mounter includes host computer body (1) and raw materials frame (4), host computer body (1) is the chip mounter main part, raw materials frame (4) are the work or material rest that the component was transferred and is stored, the settling of raw materials frame (4) ability break away from is inside host computer body (1), a serial communication port, include: a mounting plate (2) and a negative pressure joint (3);
the assembly plate (2) is of a flat plate structure which is horizontally arranged, the top of the assembly plate (2) is provided with an air cylinder (11), and the assembly plate (2) can be horizontally lifted and lowered through the air cylinder (11) and is arranged in the main machine body (1);
the mounting plate (2) is provided with criss-cross mounting grooves (21), and the mounting grooves (21) penetrate through the upper surface and the lower surface of the mounting plate (2);
the negative pressure connector (3) is a straight pipe, the upper ends of the negative pressure connectors (3) are connected with negative pressure hoses (33) in a sealing way, a plurality of negative pressure connectors (3) can be horizontally and slidably locked in the mounting groove (21), and butt joint suckers (31) are detachably arranged at the lower ends of the negative pressure connectors (3);
the negative pressure joint (3) is arranged right above the raw material frame (4).
2. The efficient component sucking device of a chip mounter according to claim 1, wherein: two guide rods (12) are further arranged at the top of the assembly plate (2), and the two guide rods (12) and the air cylinder (11) are kept vertical.
3. The efficient component sucking device of a chip mounter according to claim 1, wherein: the lower end of the butt joint sucker (31) is a negative pressure sucker, the lower end of the negative pressure joint (3) is also provided with a sealing cover (32) which can be separated through threads, and the sealing cover (32) is an airtight plug;
the lower extreme that negative pressure connects (3) stretches out in assembly board (2) below, lock nut (34) have still been installed on the top that negative pressure connects (3), lock nut (34) set up at assembly board (2) top, negative pressure connects (3) through lock nut (34) detachable locking on assembly board (2).
4. The efficient component sucking device of a chip mounter according to claim 1, wherein: the negative pressure hose (33) is a high-pressure hose, and the negative pressure hose (33) is in sealing connection with a negative pressure device in the main machine body (1).
CN202321386362.XU 2023-06-02 2023-06-02 High-efficient suction means of component of chip mounter Active CN220441188U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202321386362.XU CN220441188U (en) 2023-06-02 2023-06-02 High-efficient suction means of component of chip mounter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202321386362.XU CN220441188U (en) 2023-06-02 2023-06-02 High-efficient suction means of component of chip mounter

Publications (1)

Publication Number Publication Date
CN220441188U true CN220441188U (en) 2024-02-02

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ID=89690916

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202321386362.XU Active CN220441188U (en) 2023-06-02 2023-06-02 High-efficient suction means of component of chip mounter

Country Status (1)

Country Link
CN (1) CN220441188U (en)

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