CN220438873U - Case (S) - Google Patents

Abstract

The present disclosure provides a chassis including a chassis body, a mounting portion, a first fan, and a second fan; the bottom of the box body is provided with an equipment bin which is configured to contain a power supply assembly; and the equipment bin is configured to be isolated from the rest area inside the box body; the mounting part is arranged in the box body and is configured to mount a main board, the main board is configured to be provided with a processor and an expansion card, and the expansion card is configured to be positioned above the processor; the first fan is arranged at the top of the box body and is configured to suck in outside air and form a first air flow blowing to the expansion card; the second fan is mounted at the front of the cabinet and configured to suck in external air and form a second air flow toward a corresponding position of the processor. The heat of the processor and the expansion card in the case can be rapidly discharged, the working temperature of the processor and the expansion card is effectively reduced, and the condition of heat accumulation in the case is avoided.

Description

Case (S)

Technical Field

The present disclosure relates to the field of computer hardware, and in particular, to a chassis.

Background

The chassis is an important part for loading and containing computer hardware equipment. For heat dissipation, the case is usually non-closed, an air inlet structure and an air outlet structure are arranged on the side walls, cold air outside the case enters the case through the air inlet structure so as to dissipate heat of electronic components inside the case, and then the air outlet structure discharges hot air outside the case.

The components with more heat generation in the case are mainly expansion cards such as a processor (CPU) and a display card, and the processor and the expansion card are required to be installed on a main board. In the existing chassis, the air inlet channels of expansion cards such as display cards are easy to interfere, so that air inlet is unsmooth, and the heat dissipation efficiency is low.

Disclosure of Invention

The present disclosure provides a chassis for solving the problems existing in the prior art.

According to a first aspect of the present disclosure, there is provided a chassis comprising:

a case, the bottom of which is provided with an equipment bin configured to accommodate a power supply assembly; and the equipment bin is configured to be isolated from the rest of the area within the box;

a mounting portion disposed within the case configured to mount a motherboard, the motherboard configured to mount a processor and an expansion card, the expansion card configured to be located above the processor;

a first fan mounted to a top of the case and configured to suck external air and form a first air flow blowing toward the expansion card;

and a second fan mounted to a front portion of the cabinet and configured to suck external air and form a second air flow toward a corresponding position of the processor.

In one embodiment of the disclosure, the equipment bin is disposed at a bottom rear side of the box;

the second fan is configured to extend from the case front side top end to the case front side bottom end.

In one embodiment of the disclosure, a flow guiding assembly is disposed in the box, the flow guiding assembly being disposed at a rear position of the second fan and configured to gather and guide the second air flow to an area where the processor is located.

In one embodiment of the present disclosure, the deflector assembly includes an upper deflector and a lower deflector, the upper deflector extending downward from a top end of the second fan to a corresponding position of the processor;

the lower guide plate extends upwards from the bottom end of the second fan to the corresponding position of the processor.

In one embodiment of the disclosure, a plurality of guide ribs are distributed on the upper guide plate and the lower guide plate, a plurality of guide channels are formed between the guide ribs, the guide channels are configured as straight channels or curved channels, and the curved channels are configured to be arc transition-shaped at the curved positions.

In one embodiment of the disclosure, a processor heat sink is disposed at a corresponding location of the processor, the processor heat sink including a processor fan and a processor heat conductor configured to contact the processor to absorb heat generated by the processor; the second air flow is configured to blow toward the processor fan to blow heat off the processor heat conductor under the combined action of the second air flow and the processor fan.

In one embodiment of the present disclosure, the expansion card includes an expansion card body and an expansion card heat sink including an expansion card fan and an expansion card heat conductor configured to contact the expansion card body to absorb heat generated by the expansion card body; the first air flow is configured to blow toward the expansion card to blow heat from the expansion card heat conductor under the combined action of the first air flow and the expansion card fan.

In one embodiment of the present disclosure, a third fan is further included, the third fan being disposed at a rear side of the cabinet and configured to suck air toward a corresponding position of the processor out of the cabinet.

In one embodiment of the present disclosure, the third fan is located at least at a position between the bottom end of the expansion card and the top end of the power supply compartment.

In one embodiment of the present disclosure, the first fan, the second fan, and the third fan each comprise one or more fan units.

In the use process of the chassis, the first fan can absorb outside air from the upper part of the chassis body and form first air flow blown to the expansion card, so that heat generated by the expansion card is taken away; the second fan can absorb outside air from the front side of the box body and form second air flow which is blown to the corresponding position of the processor, so that heat generated by the processor is taken away; because first fan and second fan are located the top and the front portion of box respectively, can not receive the hindrance of other structures when induced drafting, also can not hinder each other, thereby can guarantee that first fan and second fan induced drafts smoothly, first fan forms the first air current of blowing to the expansion card moreover, take away after the heat that the expansion card produced, can also blow off from the rear of box jointly under the effect of second air current, thereby guarantee the quick-witted incasement of this disclosure, the heat of treater and expansion card can discharge fast, effectively reduce the operating temperature of treater and expansion card, avoid the condition that the heat accumulation appears in the machine incasement.

Other features of the present disclosure and its advantages will become apparent from the following detailed description of exemplary embodiments of the disclosure, which proceeds with reference to the accompanying drawings.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the disclosure.

Fig. 1 is a schematic cross-sectional view of a chassis provided by an embodiment of the present disclosure.

The one-to-one correspondence between component names and reference numerals in fig. 1 is as follows:

1. a case; 11. an equipment bin; 2. a main board; 21. a processor; 3. a first fan; 4. a second fan; 5. an expansion card; 51. an expansion card body; 52. expansion card fan; 53. expansion card heat conduction member; 6. a flow guiding assembly; 61. an upper deflector; 62. a lower deflector; 63. a deflector rib; 7. a processor heat sink; 71. a processor fan; 72. a processor heat conductor; 8. and a third fan.

Detailed Description

Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present disclosure unless it is specifically stated otherwise.

The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses.

Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but are intended to be part of the specification where appropriate.

In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of exemplary embodiments may have different values.

It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.

In this document, "upper", "lower", "front", "rear", "left", "right", and the like are used merely to indicate relative positional relationships between the relevant portions, and do not limit the absolute positions of the relevant portions.

Herein, "first", "second", etc. are used only for distinguishing one another, and do not denote any order or importance, but rather denote a prerequisite of presence.

Herein, "equal," "same," etc. are not strictly mathematical and/or geometric limitations, but also include deviations that may be appreciated by those skilled in the art and allowed by fabrication or use, etc.

Unless otherwise indicated, numerical ranges herein include not only the entire range within both of its endpoints, but also the several sub-ranges contained therein.

The present disclosure provides a chassis including at least a chassis body, a mounting portion, a first fan, and a second fan, wherein a bottom of the chassis body is provided with an equipment bin configured to accommodate a power supply assembly; and the equipment bin is configured to be isolated from the rest area inside the box body; the mounting part is arranged in the box body and is configured to mount a main board, the main board is configured to be provided with a processor and an expansion card, and the expansion card is configured to be positioned above the processor; the first fan is arranged at the top of the box body and is configured to suck in outside air and form a first air flow blowing to the expansion card; the second fan is mounted at the front of the cabinet and configured to suck in external air and form a second air flow toward a corresponding position of the processor.

In this way, in the use process of the chassis of the present disclosure, the first fan can absorb the outside air from the upper side of the chassis body and form a first air flow blowing to the expansion card, so as to take away the heat generated by the expansion card; the second fan can absorb outside air from the front side of the box body and form second air flow which is blown to the corresponding position of the processor, so that heat generated by the processor is taken away; because first fan and second fan are located the top and the front portion of box respectively, can not receive the hindrance of other structures when induced drafting, also can not hinder each other, thereby can guarantee that first fan and second fan induced drafts smoothly, first fan forms the first air current of blowing to the expansion card moreover, take away after the heat that the expansion card produced, can also blow off from the rear of box jointly under the effect of second air current, thereby guarantee the quick-witted incasement of this disclosure, the heat of treater and expansion card can discharge fast, effectively reduce the operating temperature of treater and expansion card, avoid the condition that the heat accumulation appears in the machine incasement.

For ease of understanding, the specific structure of the chassis of the present disclosure and its operating principles are described in detail below in connection with one embodiment with reference to fig. 1.

As shown in fig. 1, the present disclosure provides a chassis including at least a chassis body 1, a mounting portion, a first fan 3, and a second fan 4.

Wherein the bottom of the box 1 is provided with an equipment bin 11, and the equipment bin 11 is configured to accommodate a power supply assembly; and the equipment bin 11 is configured to be isolated from the rest of the interior of the box 1; it will be appreciated that the equipment compartment 11 may also be used to house other electronic equipment such as hard disks.

As shown in fig. 1, the mounting portion is provided in the case 1, and the mounting portion is provided in the case 1 and is configured to mount the motherboard 2, and the motherboard 2 is configured to mount the processor 21 and the expansion card 5, and the expansion card 5 is configured to be located above the processor 21. Specifically, the expansion card 5 may be a display card, or may be another expansion card 5 such as a sound card or a computing card, which is not limited herein. The heat generation amount of the display card and the calculation card is generally higher compared to other forms of the expansion card 5.

As shown in fig. 1, a first fan 3 is mounted on the top of the cabinet 1 and configured to suck in external air and form a first air flow toward the expansion card 5. Specifically, the first fan 3 may be one fan unit with a larger size, or may be a row of two or more fan units. These fan units are configured to intake air from the upper side and exhaust air from the lower side, thereby forming a first air flow that blows toward the expansion card 5 to carry away heat generated by the expansion card 5.

As shown in fig. 1, the second fan 4 is mounted to the front of the cabinet 1 and configured to suck in external air and form a second air flow toward a corresponding position of the processor 21. In particular, the second fan 4 may be a larger fan unit, or may be a row of two or more fan units. These fan units are configured to intake air from the front side and to exhaust air from the rear side, thereby forming a second air flow that is blown toward the corresponding location of the processor 21. Specifically, the position of the dashed box in fig. 1 is the corresponding position of the processor 21; since the processor 21 is mounted on the main board 2 while being attached to the main board 2, the second air flow is blown to the side of the processor 21 to remove heat generated from the processor 21.

In this way, during the use of the chassis of the present disclosure, the first fan 3 can absorb the outside air from above the chassis 1 and form a first air flow blowing toward the expansion card 5, so as to take away the heat generated by the expansion card 5; the second fan 4 can absorb external air from the front side of the case 1 and form a second air flow blowing to a corresponding position of the processor 21, thereby taking away heat generated by the processor 21; because the first fan 3 and the second fan 4 are located the top and the front portion of the box 1 respectively, can not receive the hindrance of other structures when induced drafting, also can not hinder each other, thereby can guarantee that the first fan 3 and the second fan 4 induced drafts smoothly, the first air current of expansion card 5 to blowing is formed to the first fan 3 moreover, take away after the heat that expansion card 5 produced, can also blow off from the rear side of box 1 jointly under the effect of second air current, thereby guarantee the quick-witted incasement of this disclosure, the heat of treater 21 and expansion card 5 can discharge fast, effectively reduce the operating temperature of treater 21 and expansion card 5, avoid the case internal heat accumulation's condition.

Specifically, as shown in fig. 1, in one embodiment of the present disclosure, an equipment bin 11 is provided at the bottom rear side of the case 1; the second fan 4 is configured to extend from the front top end of the casing 1 to the front bottom end of the casing 1. Because the second fan 4 extends to the bottom end of the front side of the box body 1 from the top end of the front side of the box body 1, the extension length of the second fan 4 in the vertical direction can be effectively increased, the setting number and the setting size of the fan units of the second fan 4 can be increased, and the air inlet quantity of the second fan 4 is improved.

And because equipment bin 11 sets up in the bottom rear side of box 1, even second fan 4 extends to box 1 front side bottom by box 1 front side top, can not produce very big hindrance to the air-out route of second fan 4 yet to can guarantee that second fan 4 can normally air-out, and then improve the radiating efficiency of second fan 4.

Further, as shown in fig. 1, in one embodiment of the present disclosure, a flow guiding assembly 6 is disposed in the case 1, and the flow guiding assembly 6 is disposed at a rear position of the second fan 4 and configured to gather and guide the second air flow to an area where the processor 21 is located. Through setting up water conservancy diversion subassembly 6, can make the second air current gather together the direction to the region that treater 21 is located to can improve the amount of wind that reaches the region that treater 21 is located, and then improve the radiating effect of second air current.

Specifically, as shown in fig. 1, the flow guiding assembly 6 includes an upper flow guiding plate 61 and a lower flow guiding plate 62, and the upper flow guiding plate 61 extends downwards from the top end of the second fan 4 to the corresponding position of the processor 21; the lower baffle 62 extends upward from the bottom end of the second fan 4 to a corresponding position of the processor 21. As shown in fig. 1, since the top end of the second fan 4 is higher than the corresponding position of the processor 21, by providing the upper baffle 61, the air flow formed by the fan unit at the upper part of the second fan 4 can be guided to the corresponding position of the processor 21. Similarly, since the bottom end of the second fan 4 is lower than the corresponding position of the processor 21, by providing the lower deflector 62, the air flow formed by the fan unit at the lower portion of the second fan 4 can be guided to the corresponding position of the processor 21.

Further, as shown in fig. 1, in one embodiment of the present disclosure, a plurality of guide ribs 63 are distributed on the upper guide plate 61 and the lower guide plate 62, a plurality of guide channels are formed between the plurality of guide ribs 63, and the guide channels are configured as straight channels or curved channels, and the curved channels are configured to be arc transition-shaped at the curved positions. By providing the guide ribs 63, a guide passage is formed between the guide ribs 63, so that the second air flow generated by the second fan 4 can be better guided to the area where the processor 21 is located. Moreover, the bending position of the bending channel is in an arc transition shape, so that dead angles can be avoided, dust is not easy to fall off, and great loss of wind power is avoided.

Specifically, as shown in fig. 1, in one embodiment of the present disclosure, a processor heat sink 7 is disposed at a corresponding position of the processor 21, the processor heat sink 7 includes a processor fan 71 and a processor heat conductor 72, and the processor heat conductor 72 is configured to contact the processor 21 to absorb heat generated by the processor 21; the second air flow is configured to blow toward the processor fan 71 to blow heat off the processor heat conductor 72 under the combined action of the second air flow and the processor fan 71.

Thus, during the operation of the processor 21, after the processor 21 emits a large amount of heat, the processor heat conducting member 72 can absorb a large amount of heat generated by the processor 21 through heat conduction, and then the second air flow blows to the processor fan 71, so that the heat on the processor heat conducting member 72 can be blown out under the combined action of the second air flow and the processor fan 71, thereby achieving the purpose of exhausting the heat generated by the processor 21.

Similarly, in one embodiment of the present disclosure, the expansion card 5 includes an expansion card body 51 and an expansion card 5 heat sink, the expansion card 5 heat sink including an expansion card fan 52 and an expansion card heat conductor 53, the expansion card heat conductor 53 being configured to contact the expansion card body 51 to absorb heat generated by the expansion card body 51; the first air flow is configured to blow toward the expansion card 5 to blow heat off the expansion card heat conductor 53 under the combined action of the first air flow and the expansion card fan 52.

Thus, in the operation process of the expansion card 5, after the expansion card body 51 emits a large amount of heat, the expansion card heat conduction member 53 can absorb a large amount of heat generated by the expansion card body 51 through heat conduction, and then the first air flow blows to the expansion card fan 52, so that the heat on the expansion card heat conduction member 53 can be blown out under the combined action of the first air flow and the expansion card fan 52, thereby realizing the purpose of discharging the heat generated by the expansion card 5.

In order to improve the heat dissipation effect of the chassis, as shown in fig. 1, in an embodiment of the present disclosure, the chassis further includes a third fan 8, and the third fan 8 is disposed at the rear side of the chassis 1 and configured to suck air to a corresponding position of the processor 21 outside the chassis 1. By providing the third fan 8, the hot air flow passing through the position of the processor 21 and the hot air flow blown out by the expansion card fan 52 can be sucked out from the inside of the chassis, and thus the heat radiation efficiency can be effectively improved. As previously mentioned, in one embodiment of the present disclosure, the third fan 8 may also include one or more fan units, and in particular, may be disposed according to a space on the rear side of the machine body, which is not limited herein.

Specifically, as shown in fig. 1, in one embodiment of the present disclosure, the third fan 8 is located at least at a position between the bottom end of the expansion card 5 and the top end of the power supply compartment. The third fan 8 is arranged at a position between the bottom end of the expansion card 5 and the top end of the power supply bin, and can be adjacent to the positions of the processor 21 and the expansion card 5, so that the efficiency of sucking out the hot air flow passing through the position of the processor 21 and the hot air flow blown out by the expansion card fan 52 from the chassis can be effectively improved, and the heat dissipation efficiency is further improved.

The foregoing description of the embodiments of the present disclosure has been presented for purposes of illustration and description, and is not intended to be exhaustive or limited to the embodiments disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the various embodiments described. The terminology used herein was chosen in order to best explain the principles of the embodiments, the practical application, or the technical improvements in the marketplace, or to enable others of ordinary skill in the art to understand the embodiments disclosed herein. The scope of the present disclosure is defined by the appended claims.

Claims (10)

1. A chassis, comprising:

a case (1), the bottom of the case (1) being provided with a device compartment (11), the device compartment (11) being configured to house a power supply assembly; and the equipment bin (11) is configured to be isolated from the rest of the interior of the box (1);

a mounting portion provided within the case (1) and configured to mount a motherboard (2), the motherboard (2) being configured to mount a processor (21) and an expansion card (5), the expansion card (5) being configured to be located above the processor (21);

-a first fan (3), said first fan (3) being mounted on top of said box (1) and configured for sucking in ambient air and forming a first air flow towards said expansion card (5);

-a second fan (4), said second fan (4) being mounted to the front of said housing (1) and configured for sucking in ambient air and creating a second air flow towards a corresponding position of said processor (21).

2. The cabinet according to claim 1, wherein the equipment compartment (11) is provided at a bottom rear side of the cabinet body (1);

the second fan (4) is configured to extend from a front top end of the case (1) to a front bottom end of the case (1).

3. The cabinet according to claim 2, wherein a flow guiding assembly (6) is arranged in the cabinet (1), and the flow guiding assembly (6) is arranged at a rear position of the second fan (4) and is configured to gather and guide the second air flow to an area where the processor (21) is located.

4. A cabinet according to claim 3, wherein the deflector assembly (6) comprises an upper deflector (61) and a lower deflector (62), the upper deflector (61) extending downwards from the top end of the second fan (4) towards the corresponding position of the processor (21);

the lower deflector (62) extends upwards from the bottom end of the second fan (4) to a corresponding position of the processor (21).

5. The cabinet of claim 4, wherein the upper and lower baffles (61, 62) are provided with a plurality of guide ribs (63), a plurality of guide channels are formed between the guide ribs (63), the guide channels are configured as straight channels or curved channels, and the curved channels are configured to be arc transition-shaped at curved positions.

6. The chassis according to claim 1, wherein the processor (21) is provided with a processor heat sink (7) at a corresponding location, the processor heat sink (7) comprising a processor fan (71) and a processor heat conductor (72), the processor heat conductor (72) being configured to be in contact with the processor (21) to absorb heat generated by the processor (21); the second air flow is configured to blow toward the processor fan (71) to blow heat off the processor heat conductor under the combined action of the second air flow and the processor fan (71).

7. The chassis of claim 1, wherein the expansion card (5) comprises an expansion card body (51) and an expansion card (5) heat sink, the expansion card (5) heat sink comprising an expansion card fan (52) and an expansion card heat conductor (53), the expansion card heat conductor (53) being configured to contact the expansion card body (51) to absorb heat generated by the expansion card body (51); the first air flow is configured to blow toward the expansion card (5) to blow heat on the expansion card heat conduction member (53) under the combined action of the first air flow and the expansion card fan (52).

8. The cabinet according to claim 1, further comprising a third fan (8), the third fan (8) being arranged at the rear side of the cabinet (1) and configured to suck air to a corresponding position of the processor (21) out of the cabinet (1).

9. The cabinet according to claim 8, wherein the third fan (8) is located at least at a position between the bottom end of the expansion card (5) and the top end of the equipment compartment (11).

10. The cabinet according to claim 8, wherein the first fan (3), the second fan (4) and the third fan (8) each comprise one or more fan units.