CN219392613U

CN219392613U - Electronic equipment

Info

Publication number: CN219392613U
Application number: CN202320364184.4U
Authority: CN
Inventors: 陈宏亮; 袁剑
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2023-02-23
Filing date: 2023-02-23
Publication date: 2023-07-21
Anticipated expiration: 2033-02-23

Abstract

The application provides an electronic device, comprising: the heat dissipation module is vertically arranged between the main board and a first board body arranged in parallel with the main board and is used for dissipating heat of a first heat-generating component positioned in the accommodating space; the first plate body is provided with an air outlet corresponding to the air outlet side of the heat radiation module, so that a heat radiation channel isolated from the air inlet side of the heat radiation module is formed on the air outlet side of the heat radiation module.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

The electronic equipment (such as a host computer of a computer) is internally provided with a heating component (such as a display card), the heating component can generate heat in the working process, and the normal working of the heating component can be influenced by heat accumulation, such as: the heat is accumulated to slow down the reaction speed of the heat generating component. For this reason, a cooling fan is usually disposed in the electronic device, and the cooling fan is capable of delivering an air flow into the electronic device to accelerate the flow of the air in the electronic device, thereby realizing a reduction in the temperature in the electronic device to ensure the normal operation of the heat generating components.

However, in the continuous operation of the heat generating component, high-temperature air is fully distributed around the heat dissipating fan, so that the temperature of the air flow conveyed by the heat dissipating fan is high, and therefore, a large amount of heat is easily accumulated around the heat generating component, and the normal operation of the heat generating component is affected.

Disclosure of Invention

In view of this, the present application provides an electronic device, which has the following technical scheme:

to achieve the above object, an embodiment of the present application provides an electronic device, including: the heat dissipation module is vertically arranged between the main board and a first board body arranged in parallel with the main board and is used for dissipating heat of a first heat-generating component positioned in the accommodating space; the first plate body is provided with an air outlet corresponding to the air outlet side of the heat radiation module, so that a heat radiation channel isolated from the air inlet side of the heat radiation module is formed on the air outlet side of the heat radiation module.

In some embodiments, the electronic device further comprises: and the separation structure is arranged between the heat radiation module and the first plate body and is respectively connected with the heat radiation module and the first plate body.

In some embodiments, the blocking structure is vertically connected with the first plate body, and the thickness of the blocking structure is the same as or different from the thickness of the heat dissipation module; the thickness of the heat radiation module is from the air inlet side of the heat radiation module to the air outlet side of the heat radiation module.

In some embodiments, the first plate body is provided with an air inlet corresponding to an air inlet side of the heat dissipation module.

In some embodiments, the hole wall of the air inlet hole is obliquely arranged, and the hole wall of the air outlet hole is obliquely arranged; the inclination direction of the air inlet hole and the inclination direction of the air outlet hole are opposite to the heat dissipation module respectively.

In some embodiments, the first plate body is provided with a first flow guiding structure, and the first flow guiding structure is used for conveying the air flow passing through the air inlet hole to the heat dissipation module; the first plate body is provided with a second flow guiding structure, and the second flow guiding structure is used for guiding the air flow passing through the air outlet hole to a direction far away from the air inlet hole.

In some embodiments, the first flow guiding structure and/or the second flow guiding structure is/are a flow guiding sheet, the flow guiding sheet is rotationally connected with the box body, and when the flow guiding sheet rotates relative to the box body, the inclination direction of the flow guiding sheet is changed.

In some embodiments, the first flow guiding structure is a first flow guiding plate, the first flow guiding plate is arranged on the outer side of the box body and is located at a position where the air inlet is far away from the air outlet, and the first flow guiding plate is inclined towards the direction of the heat dissipating module; the second guide structure is a second guide plate, the second guide plate is arranged on the outer side of the box body and located at the position, away from the air inlet, of the air outlet, and the second guide plate is inclined towards the direction of the heat radiation module.

In some embodiments, the area of the air inlet is smaller than the area of the air outlet; when the number of the air inlet holes and the number of the air outlet holes are respectively multiple, the sum of the areas of the air inlet holes is smaller than the sum of the areas of the air outlet holes.

In some embodiments, the first heat generating component is disposed between an air outlet side of the heat dissipating module and the air outlet hole.

The application provides an electronic equipment, through being provided with the apopore in the air-out side of the corresponding heat dissipation module of first plate body, can pass through the apopore with the high temperature gas around the heat dissipation module and send out, and then make the temperature of the air current that the heat dissipation module carried low to can reduce the possibility that gathers a large amount of heat around the first heating part and ensure the normal work of first heating part. In addition, the air outlet side of the heat radiation module forms a heat radiation channel isolated from the air inlet side of the heat radiation module so as to reduce the possibility that heat at the air outlet side flows back to the air inlet side, thereby further reducing the possibility that a large amount of heat is gathered around the first heat generating component so as to ensure the normal operation of the first heat generating component.

The foregoing description is only an overview of the technical solutions of the present application, and in order to make the technical means of the present application more clearly understood, it can be implemented according to the content of the specification, and the following detailed description of the preferred embodiments of the present application will be given with reference to the accompanying drawings.

Drawings

In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and other drawings may be obtained according to these drawings without inventive effort to a person of ordinary skill in the art.

Fig. 1 is a schematic diagram of a partial structure of an electronic device (side view) according to an embodiment of the present application;

fig. 2 is a schematic diagram of a partial structure of an electronic device (in a top view) according to an embodiment of the present application.

Reference numerals illustrate:

10. an electronic device; 11. a case; 111. a first plate body; 1111. an air outlet hole; 1112. an air inlet hole; 1113. a first flow guiding structure; 1114. a second flow guiding structure; 12. a main board; 13. a heat dissipation module; 131. an air outlet side; 132. an air inlet side; 14. a barrier structure; 15. a first heat generating member; 16. and an air outlet structure.

Detailed Description

For the purposes of making the objects, technical solutions and advantages of the embodiments of the present application more clear, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is apparent that the described embodiments are some of the embodiments of the present application, but not all of the embodiments. All other embodiments, based on the embodiments herein, which would be apparent to one of ordinary skill in the art without undue burden are within the scope of the present application. Accordingly, the following detailed description of the embodiments of the present application, provided in the accompanying drawings, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application.

Embodiments and features of embodiments in this application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

The present application provides an electronic device, as shown in fig. 1 and 2, an electronic device 10 includes: the heat dissipation device comprises a box body 11, a main board 12 and a heat dissipation module 13, wherein the box body 11 comprises an accommodating space formed by surrounding at least one board body, the main board 12 is arranged in the accommodating space, the heat dissipation module 13 is vertically arranged between the main board 12 and a first board body 111 arranged in parallel with the main board 12, and the heat dissipation module 13 is used for dissipating heat of a first heat-generating component 15 positioned in the accommodating space; the first plate 111 is provided with an air outlet 1111 corresponding to the air outlet side 131 of the heat dissipating module 13, so as to form a heat dissipating channel isolated from the air inlet side 132 of the heat dissipating module 13 at the air outlet side 131 of the heat dissipating module 13.

Specifically, the case 11 includes an accommodating space formed by enclosing at least one plate, and herein, accommodating spaces of different shapes may be formed by enclosing according to the shape and number of the plates, such as: the 6 rectangular plates enclose to form a cuboid-shaped accommodating space, such as: the accommodating space formed by enclosing 7 rectangular plates is outwards protruded at one side of the accommodating space formed by enclosing 7 rectangular plates compared with the cuboid-shaped accommodating space formed by enclosing 6 rectangular plates.

The main board 12 is disposed in the accommodating space, the heat dissipation module 13 is vertically disposed between the main board 12 and the first board 111 parallel to the main board 12, that is, the first board 111 is a part of the structure of the box 11, and forms the accommodating space of the box 11 in cooperation with other boards, and the main board 12 and the first board 111 are parallel to each other, and the heat dissipation module 13 is respectively perpendicular to the main board 12 and the first board 111, for example: referring to fig. 1, the heat dissipation module 13 is vertically inserted on the motherboard 12. The heat dissipation module 13 is configured to dissipate heat of the first heat generating component 15 located in the accommodating space, where the heat dissipation module 13 includes an axial fan, and may also be other heat dissipation devices, the first heat generating component 15 may be a graphics card, or may be other structures, and the first heat generating component 15 may be disposed on an air outlet side 131 of the heat dissipation module 13, or may be disposed on an air inlet side 132 of the heat dissipation module 13.

The first plate 111 is provided with an air outlet 1111 corresponding to the air outlet side 131 of the heat dissipation module 13, so as to form a heat dissipation channel isolated from the air inlet side 132 of the heat dissipation module 13 at the air outlet side 131 of the heat dissipation module 13, so that the air flow conveyed by the air outlet side 132 of the heat dissipation module 13 can be output from the air outlet 1111 through the space of the air outlet side 131.

In this embodiment, by providing the air outlet 1111 on the air outlet side 131 of the first plate 111 corresponding to the heat dissipating module 13, the high temperature air around the heat dissipating module 13 can be sent out through the air outlet 1111, so that the possibility of accumulating a large amount of heat around the first heat generating component 15 can be reduced, and the normal operation of the first heat generating component 15 can be ensured. In addition, the air outlet side 131 of the heat dissipation module 13 forms a heat dissipation channel isolated from the air inlet side 132 of the heat dissipation module 13, so as to reduce the possibility that the heat of the air outlet side 131 flows back to the air inlet side 132, thereby further reducing the possibility that a large amount of heat is accumulated around the first heat generating component 15 to ensure the normal operation of the first heat generating component 15. Meanwhile, compared with the arrangement that heat accumulation around a heating component is reduced by increasing the wind power of a fan in electronic equipment (wind power increasing noise becomes larger) in the prior art, the air outlet side 131 of the heat radiation module 13 of the application forms a heat radiation channel isolated from the air inlet side 132 of the heat radiation module 13, so that the possibility that the heat of the air outlet side 131 flows back to the air inlet side 132 is reduced, the possibility that a large amount of heat is accumulated around the first heating component 15 is reduced, and the noise from a heat radiation structure can be relatively reduced.

In some embodiments, referring to fig. 1 and 2, the electronic device 10 may further include: the blocking structure 14 is arranged between the heat dissipation module 13 and the first plate 111 and is respectively connected with the heat dissipation module 13 and the first plate 111.

Specifically, the barrier structure 14 may be a single-layer plate structure, a composite plate structure, a hollow plate structure, or other structures. The blocking structure 14 may be disposed obliquely to the first plate 111 or may be disposed vertically to the first plate 111.

In this embodiment, the blocking structure 14 can further reduce the possibility that the heat of the air outlet side 131 flows back to the air inlet side 132, so that the possibility that a large amount of heat is accumulated around the first heat generating component 15 can be further reduced to ensure the normal operation of the first heat generating component 15.

In some embodiments, referring to fig. 1 and 2, the blocking structure 14 is connected to the first plate 111 vertically, and the thickness of the blocking structure 14 is the same as or different from the thickness of the heat dissipation module 13; the thickness of the heat dissipation module 13 is from the air inlet side 132 of the heat dissipation module 13 to the air outlet side 131 of the heat dissipation module 13.

Specifically, the above-mentioned blocking structure 14 is vertically connected to the first plate 111, so that the space at both sides of the blocking structure 14 is more square, thereby facilitating the structural design in the accommodating space of the case 11. The thickness of the blocking structure 14 is the same as or different from the thickness of the heat dissipation module 13, where, according to the actual requirement, the thickness of the blocking structure 14 may be set to be the same as or different from the thickness of the heat dissipation module 13, for example: in order to make the connection of the heat dissipation module 13 in the box 11 firmer, the thickness of the blocking structure 14 can be made larger than the thickness of the heat dissipation module 13 so that the blocking structure 14 pulls the heat dissipation module 13 to realize firmer connection of the heat dissipation module 13 in the box 11; for another example, to reduce the cost of the barrier structure 14, the thickness of the barrier structure 14 may be made smaller than the thickness of the heat dissipation module 13.

In some embodiments, referring to fig. 1, the first plate 111 is provided with an air inlet 1112 corresponding to the air inlet side 132 of the heat dissipation module 13. Therefore, an air inlet channel isolated from the air outlet side 131 of the heat dissipation module 13 can be formed on the air inlet side 132 of the heat dissipation module 13, and thus, the air inlet 1112, the air inlet side 132 of the heat dissipation module 13, the air outlet side 131 of the heat dissipation module 13 and the air outlet 1111 form a unidirectional heat dissipation channel, so that the possibility of accumulating a large amount of heat around the first heat generating component 15 can be further reduced, and the normal operation of the first heat generating component 15 can be ensured.

In some embodiments, the walls of the air inlet 1112 are inclined, and the walls of the air outlet 1111 are inclined; wherein, the inclination direction of the air inlet 1112 and the inclination direction of the air outlet 1111 are opposite to the heat dissipation module 13, respectively. In this way, the air direction sent into the box 111 from the outside of the box 11 through the air inlet 1112 blows away against the direction of the heat dissipating module 13, and the hot air flow at the air outlet side 131 of the heat dissipating module 13 can be directly sent out against the air outlet 1111, so that the conveying path of the air flow in the box 11 can be shortened, the aggregation of high-temperature air in the box 11 can be reduced, the possibility of aggregating a large amount of heat around the first heat generating component 15 can be further reduced, and the normal operation of the first heat generating component 15 can be ensured.

In some embodiments, referring to fig. 1, the first plate 111 is provided with a first flow guiding structure 1113, where the first flow guiding structure 1113 is used to convey the airflow passing through the air inlet 1112 to the heat dissipating module 13; the first plate 111 is provided with a second flow guiding structure 1114, and the second flow guiding structure 1114 is used for guiding the air flow passing through the air outlet 1111 away from the air inlet 1112.

Specifically, the first flow guiding structure 1113 may be disposed outside the case 11, inside the case 11, or inside the air inlet 1112, and the second flow guiding structure 1114 may be disposed outside the case 11, inside the case 11, or inside the air outlet 1111. The first flow guiding structure 1113 may be a structure with a guiding plane (such as the structure shown in fig. 1), a structure with active air supply (such as a fan), or other arrangements. The second flow guiding structure 1114 may be a structure with a guiding plane (such as the structure shown in fig. 1), a structure with active air suction (such as an air suction fan), or other arrangements.

In this embodiment, the first flow guiding structure 1113 conveys the air flow passing through the air inlet 1112 to the heat dissipating module 13, and the second flow guiding structure 1114 guides the air flow passing through the air outlet 1111 away from the air inlet 1112, so that the conveying speed of the air flow in the box 11 can be accelerated, and the possibility of accumulating a large amount of heat around the first heat generating component 15 can be further reduced, so that the normal operation of the first heat generating component 15 can be ensured.

In some embodiments, the first flow directing structure 1113 and/or the second flow directing structure 1114 are flow directing plates that are rotatably coupled to the housing 11 such that the direction of inclination of the flow directing plates changes as the flow directing plates rotate relative to the housing 11. Here, reference may be made to the arrangement of the blind, which is not described here in detail.

In this embodiment, the inclination direction of the air deflector can be changed by rotating the air deflector relative to the case 11, so that the fine adjustment of the position of the heat dissipation module 13 in the case 11 or the change of the size of the heat dissipation module 13 can be adapted, and the environmental adaptability of the first air deflector 1113 and the second air deflector 1114 can be improved.

In some embodiments, referring to fig. 1, the first flow guiding structure 1113 is a first flow guiding plate, the first flow guiding plate is disposed on the outer side of the box 11 and is located at a position where the air inlet 1112 is far from the air outlet 1111, and the first flow guiding plate is inclined towards the direction of the heat dissipating module 13; the second flow guiding structure 1114 is a second flow guiding plate, the second flow guiding plate is arranged on the outer side of the box 11 and located at a position of the air outlet 1111 far away from the air inlet 1112, and the second flow guiding plate is inclined towards the direction of the heat dissipating module 13. Here, the first flow guiding structure 1113 and the second flow guiding structure 1114 are both flow guiding plates, and the flow guiding plates have simple structures, so that the manufacturing cost of the first flow guiding structure 1113 and the second flow guiding structure 1114 can be reduced.

In particular implementations, the first and second baffles may be hollow to further reduce the cost of manufacturing the first and second flow structures 1113, 1114.

In some embodiments, the area of the air inlet 1112 is smaller than the area of the air outlet 1111; when the number of the air inlet holes 1112 and the number of the air outlet holes 1111 are plural, respectively, the sum of the areas of the plurality of air inlet holes 1112 is smaller than the sum of the areas of the plurality of air outlet holes 1111. That is, the total area of the air inlet holes 1112 is smaller than the total area of the air outlet 1111, thereby enabling more high temperature gas in the housing 11 to be sent out through the air outlet holes 1111, so that the possibility of accumulating a large amount of heat around the first heat generating part 15 can be further reduced to ensure the normal operation of the first heat generating part 15.

In some embodiments, referring to fig. 1 and 2, the first heat generating part 15 is disposed between the air outlet side 131 and the air outlet 1111 of the heat dissipating module 13. The heat dissipation module 13 can supply air to the first heat generating component 15 at a shorter distance, so that the possibility of gathering a large amount of heat around the first heat generating component 15 can be further reduced to ensure the normal operation of the first heat generating component 15.

In the specific implementation process of the present application, one or more air outlet structures 16 may be disposed in the box 11 to further accelerate the flow speed of the air flow in the box 11, where the air outlet structures 16 may be an axial flow fan or other arrangements. Such as: referring to fig. 2, the air outlet structure 16 is disposed on one side of the heat dissipating module 13, and is at least partially opposite to the air outlet side 131 of the heat dissipating module 13 and is at least partially opposite to the air inlet side 132 of the heat dissipating module 13.

Example 1:

referring to fig. 1 and 2, an electronic device 10 includes:

the box 11, the box 11 includes the accommodation space that is enclosed by at least one plate body and closes, and first plate body 111 is the one of them plate body that forms accommodation space on the box 11, and first plate body 111 is provided with a plurality of air-out holes 1111 and a plurality of air inlet 1112.

The main board 12, the main board 12 is disposed in the accommodation space, and the main board 12 is parallel to the first board body 111.

The heat dissipation module 13, the heat dissipation module 13 is vertically arranged between the main board 12 and the first board body 111 and is vertically inserted on the main board 12, the air outlet side 131 of the heat dissipation module 13 corresponds to the air outlet 1111 of the first board body 111, and the air inlet side 132 of the heat dissipation module 13 corresponds to the air inlet 1112 of the first board body 111, so that the air inlet 1112, the air inlet side 132 of the heat dissipation module 13, the air outlet side 131 of the heat dissipation module 13 and the air outlet 1111 form an air flow channel, and the air inlet side 132 of the heat dissipation module 13 and the air outlet side 131 of the heat dissipation module 13 are isolated from each other.

The separation structure 14, the separation structure 14 sets up between heat dissipation module 13 and first plate body 111 and is connected with heat dissipation module 13 and first plate body 111 respectively, and separation structure 14 is connected with first plate body 111 is perpendicular, and the thickness of separation structure 14 is less than the thickness of heat dissipation module 13, and separation structure 14 can further keep apart air inlet side 132 of heat dissipation module 13 and air-out side 131 of heat dissipation module 13 each other. Here, the thickness of the heat dissipation module 13 is from the air inlet side 132 of the heat dissipation module 13 to the air outlet side 131 of the heat dissipation module 13.

The first heating component 15, the first heating component 15 is disposed between the air outlet side 131 and the air outlet 1111 of the heat dissipating module 13.

The first plate 111 is provided with a first flow guiding structure 1113, and the first flow guiding structure 1113 is used for conveying the air flow passing through the air inlet 1112 to the heat dissipation module 13; the first plate 111 is provided with a second flow guiding structure 1114, and the second flow guiding structure 1114 is used for guiding the air flow passing through the air outlet 1111 away from the air inlet 1112. The first flow guiding structure 1113 in this embodiment is a first flow guiding plate, the first flow guiding plate is disposed at the outer side of the box 11, the first flow guiding plate is inclined towards the direction of the heat dissipating module 13, and one first flow guiding plate corresponds to a row of air inlet holes 1112; the second flow guiding structure 1114 is a second flow guiding plate, the second flow guiding plate is arranged at the outer side of the box 11, the second flow guiding plate inclines towards the direction of the heat dissipating module 13, and one second flow guiding plate corresponds to one air listing hole 1111.

Example 2:

the electronic device 10 includes:

The first plate 111 is provided with a first flow guiding structure 1113, and the first flow guiding structure 1113 is used for conveying the air flow passing through the air inlet 1112 to the heat dissipation module 13; the first plate 111 is provided with a second flow guiding structure 1114, and the second flow guiding structure 1114 is used for guiding the air flow passing through the air outlet 1111 away from the air inlet 1112. In this embodiment, the first flow guiding structure 1113 and/or the second flow guiding structure 1114 are/is flow guiding plates, which are rotatably connected with the case 11, and when the flow guiding plates rotate relative to the case 11, the inclination direction of the flow guiding plates is changed.

Example 3:

the electronic device 10 includes:

Wherein, the hole wall of the air inlet 1112 is inclined, the hole wall of the air outlet 1111 is inclined, and the inclination direction of the air inlet 1112 and the inclination direction of the air outlet 1111 are opposite to the heat dissipation module 13.

In the description of the present application, it should be understood that the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or an implicit indication of the number of technical features being indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature.

In addition, in the description of the present application, it should be understood that the terms "longitudinal", "transverse", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.

Furthermore, in the present application, unless explicitly specified and limited otherwise, the terms "connected," "coupled," and the like are to be construed broadly and may be mechanically coupled or electrically coupled, for example; either directly, or indirectly through intermediaries, or in communication with each other, or in interaction with each other, unless explicitly defined otherwise, the meaning of the terms in this application will be understood to those of ordinary skill in the art.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An electronic device, comprising:

the box body comprises an accommodating space formed by enclosing at least one plate body;

a main board arranged in the accommodating space; and, a step of, in the first embodiment,

the heat dissipation module is vertically arranged between the main board and a first board body which is parallel to the main board and is used for dissipating heat of a first heating component positioned in the accommodating space;

the first plate body is provided with an air outlet corresponding to the air outlet side of the heat radiation module, so that a heat radiation channel isolated from the air inlet side of the heat radiation module is formed on the air outlet side of the heat radiation module.

2. The electronic device of claim 1, further comprising:

and the separation structure is arranged between the heat radiation module and the first plate body and is respectively connected with the heat radiation module and the first plate body.

3. The electronic device of claim 2, wherein the electronic device comprises a memory device,

the blocking structure is vertically connected with the first plate body, and the thickness of the blocking structure is the same as or different from the thickness of the heat radiation module;

the thickness of the heat radiation module is from the air inlet side of the heat radiation module to the air outlet side of the heat radiation module.

4. The electronic device according to any one of claim 1 to 3, characterized in that,

and an air inlet hole is formed in the first plate body corresponding to the air inlet side of the heat radiation module.

5. The electronic device of claim 4, wherein the electronic device comprises a memory device,

the hole wall of the air inlet hole is obliquely arranged;

the hole wall of the air outlet hole is obliquely arranged;

the inclination direction of the air inlet hole and the inclination direction of the air outlet hole are opposite to the heat dissipation module respectively.

6. The electronic device of claim 4, wherein the electronic device comprises a memory device,

the first plate body is provided with a first flow guiding structure which is used for conveying the air flow passing through the air inlet hole to the heat radiation module;

the first plate body is provided with a second flow guiding structure, and the second flow guiding structure is used for guiding the air flow passing through the air outlet hole to a direction far away from the air inlet hole.

7. The electronic device of claim 6, wherein the electronic device comprises a memory device,

the first flow guiding structure and/or the second flow guiding structure are/is flow guiding sheets, the flow guiding sheets are rotationally connected with the box body, and when the flow guiding sheets rotate relative to the box body, the inclination direction of the flow guiding sheets is changed.

8. The electronic device of claim 6, wherein the electronic device comprises a memory device,

the first flow guide structure is a first flow guide plate, the first flow guide plate is arranged on the outer side of the box body and is positioned at the position, far away from the air outlet, of the air inlet, and the first flow guide plate is inclined towards the direction of the heat radiation module;

the second guide structure is a second guide plate, the second guide plate is arranged on the outer side of the box body and located at the position, away from the air inlet, of the air outlet, and the second guide plate is inclined towards the direction of the heat radiation module.

9. The electronic device of claim 4, wherein the electronic device comprises a memory device,

the area of the air inlet hole is smaller than that of the air outlet hole;

when the number of the air inlet holes and the number of the air outlet holes are respectively multiple, the sum of the areas of the air inlet holes is smaller than the sum of the areas of the air outlet holes.

10. The electronic device of claim 1, wherein the electronic device comprises a memory device,

the first heating component is arranged between the air outlet side of the heat radiation module and the air outlet hole.