CN220426540U - Two unification stamping die and lead frame stamping equipment - Google Patents

Abstract

The utility model belongs to the technical field of lead frame production, and particularly relates to a two-in-one stamping die and lead frame stamping equipment. A plurality of patch diodes or photovoltaic diodes are arranged on a two-in-one stamping die in a vertical column manner, each patch diode is provided with a clamping jumper wire at the tail part, the clamping jumper wires are arranged on the stamping die through the patch diodes and are in one-to-one correspondence with the patch diodes, each four adjacent photovoltaic diodes are provided with a double-overlapping single-core jumper wire, and each double-overlapping single-core jumper wire is arranged on the stamping die through each four adjacent photovoltaic diodes. The utility model realizes stamping of two products which are not connected and are different, reduces the generation of waste materials, solves the problem of serious economic loss caused by the generation of more waste materials, reduces the production cost, improves the utilization rate of stamping material resources, and ensures the production efficiency of the two products which are not connected and are different.

Description

Two unification stamping die and lead frame stamping equipment

Technical Field

The utility model belongs to the technical field of lead frame production, and particularly relates to a two-in-one stamping die and lead frame stamping equipment.

Background

The lead frame is mostly stamped during production by using a stamping die mounted on a press, which is a special process equipment for processing materials (metal or nonmetal) into parts (or semi-finished products) during cold stamping. The existing stamping die can only stamp one product, but the structure of the product is limited, so that the stamped material can generate more or less vacant or redundant parts (namely waste), the vacant or redundant parts can become waste materials for recycling after being stamped, and the waste materials for recycling are far lower than the price of the product, so that the economic loss is serious, the production cost is increased, the production efficiency is lower, and the resource waste is serious.

In the prior art, research on reducing production cost of stamping dies is directed to, for example, a wiring board and a fixed contact two-in-one die of patent application CN216881276U, a two-in-one terminal of CN204376009U and the like, which are both formed by stamping two products simultaneously through the stamping dies, so that the problem of cost caused by respectively stamping the two products by adopting the two stamping dies is solved, but the existing two-in-one stamping dies only stamp two products (see a wiring board and a fixed contact two-in-one die of CN216881276U in detail) or products of the same variety but different specifications (see a two-in-one terminal of CN204376009U in detail) which are not connected with each other and are not stamped, so that the resource utilization rate of the existing two-in-one stamping dies is still not high, and the problem of serious economic loss still exists. For this reason, a new solution is needed to solve the above technical problems.

Disclosure of Invention

The utility model aims to provide a two-in-one stamping die and lead frame stamping equipment, which are used for solving the problems that the two-in-one stamping die at the current stage proposed in the background art cannot stamp two products which are not connected with each other and are different in variety, so that the resource utilization rate of the existing two-in-one stamping die is still not high, and economic loss is serious still.

In order to achieve the above purpose, the present utility model provides the following technical solutions: two unification stamping die, the last vertical column arrangement of stamping die is provided with the paster diode or the photovoltaic diode of a plurality of dysmorphism structure, its characterized in that, every it has all been seted up to the afterbody of paster diode and has been smuggled the wire jumper secretly, smuggle the wire jumper and set up through the paster diode on stamping die and with paster diode one-to-one, every four adjacent a double-lap single core wire jumper has all been seted up between the photovoltaic diode, double-lap single core wire jumper sets up on stamping die through every four adjacent photovoltaic diodes.

Further, a chip A is arranged on the clamping strip jumper wire, a U-shaped groove is formed in the head of the clamping strip jumper wire, the clamping strip jumper wire is embedded in the groove at the tail of the patch diode, the U-shaped groove at the head of the clamping strip jumper wire is wedged with an arc arranged in the middle of the groove at the tail of the patch diode, two side edges of the clamping strip jumper wire are wedged with two side edges of the groove at the tail of the patch diode, and the tail of the clamping strip jumper wire and two side edge end parts of the groove at the tail of the patch diode are arranged on the same horizontal plane.

Further, the both ends of two single-core jumpers that take are provided with lug A and lug B respectively, be provided with the frame piece of glasses-like structure between lug A and the lug B, the intermediate position of frame piece is provided with chip B, lug A's upper end side sets up the right side bottom in the first photovoltaic diode in four adjacent photovoltaic diodes, lug A's lower extreme side sets up the right side top in the third photovoltaic diode in four adjacent photovoltaic diodes, lug A's tip sets up between the right side bottom in first photovoltaic diode and the right side top in third photovoltaic diode, lug B's upper end side sets up the left side bottom in the second photovoltaic diode in four adjacent photovoltaic diodes, lug B's lower extreme side sets up the left side top in the fourth photovoltaic diode in four adjacent photovoltaic diodes, lug B's tip sets up the right side top in the third photovoltaic diode in four adjacent photovoltaic diodes, lug A's tip sets up between the right side bottom in the frame piece, the upper end sets up in the right side bottom in the fourth photovoltaic diode.

Further, the right side of the first photovoltaic diode is opposite to the left side of the second photovoltaic diode, the bottom of the first photovoltaic diode is opposite to the top of the third photovoltaic diode, the right side of the third photovoltaic diode is opposite to the left side of the fourth photovoltaic diode, and the top of the fourth photovoltaic diode is opposite to the bottom of the second photovoltaic diode.

Besides the technical scheme, lead frame stamping equipment with the two-in-one stamping die is also provided.

Compared with the prior art, the utility model has the beneficial effects that:

1. the utility model adopts the mode that the tail part of the patch diode is provided with the clamping jumper wire or the tail part of the four adjacent photovoltaic diodes is provided with the double-lap single-core jumper wire, so that the stamping die can realize stamping of two products which are not connected with each other and are different in variety, the production of product waste is effectively reduced, the problem of serious economic loss caused by more product waste is solved, the production cost of the product is effectively reduced, the utilization rate of stamping material resources is improved, and the production efficiency of two products which are not connected with each other and are different in variety is ensured;

2. the utility model adopts the groove wedge arrangement of the clamping jumper wire and the tail part of the patch diode, so that the stamping die can realize stamping of two products which are not connected with each other and are different in variety, the generation of waste materials is effectively reduced, the problem of serious economic loss caused by a large amount of generated waste materials is solved, the production cost is effectively reduced, the utilization rate of stamping material resources is improved, and the production efficiency of the clamping jumper wire and the patch diode is ensured;

3. according to the utility model, the double-lap single-core jumper is arranged between every four adjacent photovoltaic diodes, so that the stamping die can realize stamping of two products which are not connected with each other and are different in variety, the generation of waste is effectively reduced, the problem of serious economic loss caused by a large amount of generated waste is solved, the production cost is effectively reduced, the utilization rate of stamping material resources is improved, and the production efficiency of the double-lap single-core jumper and the photovoltaic diodes is ensured;

4. according to the utility model, the arrangement relation among the first photovoltaic diode, the second photovoltaic diode, the third photovoltaic diode and the fourth photovoltaic diode is utilized, so that the double-overlapping single-core jumper wire can have a larger stamping space, thereby effectively reducing the generation of stamping waste of the photovoltaic diode, effectively reducing the production cost, improving the utilization rate of stamping material resources and ensuring the production efficiency of the double-overlapping single-core jumper wire and the photovoltaic diode.

Drawings

Fig. 1 is a schematic structural diagram of a stamping die according to embodiment 1 of the present utility model;

fig. 2 is a schematic structural diagram of the patch diode of fig. 1 without the clamping jumper;

FIG. 3 is a schematic diagram of a patch diode with an entrained jumper wire in FIG. 1;

FIG. 4 is a schematic diagram of the patch diode of FIG. 1 with the entrained patch cord removed;

FIG. 5 is a schematic elevational view of the entrained patch cord of the present utility model;

FIG. 6 is a schematic side view of an entrained patch cord of the present utility model;

fig. 7 is a schematic structural diagram of a stamping die according to embodiment 2 of the present utility model;

FIG. 8 is a schematic diagram of the connection structure of four adjacent photovoltaic diodes in FIG. 7;

FIG. 9 is a schematic diagram of a front view of a dual-overlap single-core jumper of the present utility model;

fig. 10 is a schematic side view of a dual-overlap single-core jumper according to the present utility model.

Wherein: 1. stamping die; 2. a patch diode; 201. a groove; 202. arc; 203. an excess region; 3. carrying jumper wires; 4. a chip A; 5. a U-shaped groove; 6. a photovoltaic diode; 601. a first photovoltaic diode; 602. a second photovoltaic diode; 603. a third photovoltaic diode; 604. a fourth photovoltaic diode; 7. double-lapping single-core jumper wire; 701. a bump A; 702. a bump B; 703. a frame block; 8. a spare area; 9. chip B.

Detailed Description

The following examples are intended to further illustrate the utility model and are not intended to limit the application of the utility model.

Example 1: (taking the example that the jumper 3 and the patch diode 2 are both arranged on the stamping die 1)

Referring to fig. 1-6, a two-in-one stamping die is disclosed, a plurality of special-shaped patch diodes 2 are arranged on a stamping die 1 in a vertical column manner, each patch diode 2 is one of products on the stamping die 1, an excess area 203 is arranged at the tail of each patch diode 2, an entrainment jumper 3 is arranged in each excess area 203, the entrainment jumper 3 is another product which is synchronously stamped with the patch diode 2 on the stamping die 1, and the entrainment jumper 3 is arranged on the stamping die 1 through the patch diodes 2 in a one-to-one correspondence with the patch diodes 2.

Referring to fig. 2-6, a chip A4 is disposed on the entrainment jumper 3, a U-shaped groove 5 is formed in the head of the entrainment jumper 3, the entrainment jumper 3 is embedded in a groove 201 at the tail of the patch diode 2, the U-shaped groove 5 of the head of the entrainment jumper 3 is wedged with an arc 202 disposed in the middle of the groove 201 at the tail of the patch diode 2, two side edges of the entrainment jumper 3 are wedged with two side edges of the groove 201 at the tail of the patch diode 2, and the tail of the entrainment jumper 3 and two side edge end parts of the groove 201 at the tail of the patch diode 2 are disposed on the same horizontal plane.

The working principle and the using process of the embodiment are as follows: as shown in fig. 1-6, after the two-in-one stamping die is assembled, when two products, i.e. a lead frame with a patch diode 2 and an entrainment jumper 3, are required to be obtained at the same time, an operator needs to first place a material to be stamped (the lead frame is made of a copper material, so that the stamping material can be a copper plate) on the two-in-one stamping die integrally, and then stamp the stamping material by using a stamping device, so that two products which are not connected and are different in variety, i.e. the lead frame with the patch diode 2 and the entrainment jumper 3, are obtained. Specifically: the shapes of the patch diode 2 and the clamping jumper 3 are determined according to design requirements, then a stamping die 1 meeting requirements is selected according to the shapes of the patch diode 2 and the clamping jumper 3, at the moment, the clamping jumper 3 on the stamping die 1 is arranged in an excess area 203 of the patch diode 2, namely the clamping jumper 3 is arranged in a groove 201 at the tail part of the patch diode 2, meanwhile, two side edges of the clamping jumper 3 are wedged and arranged with two side edges of the groove 201, the tail part of the clamping jumper 3 and two side edges of the groove 201 are arranged on the same horizontal plane, meanwhile, a U-shaped groove 5 and an arc 202 are wedged and arranged, and then a material to be stamped is arranged on the stamping die 1.

Example 2: (taking the example that two products of the double-lap single-core jumper 7 and the photovoltaic diode 6 are arranged on the stamping die 1)

Referring to fig. 7-10, a two-in-one stamping die is shown, a plurality of irregularly-shaped photovoltaic diodes 6 are arranged on a stamping die 1 in a vertical column manner, each photovoltaic diode 6 is one of products on the stamping die 1, a free area 8 is arranged between every four adjacent photovoltaic diodes 6, a double-overlapping single-core jumper 7 is arranged in each free area 8, the double-overlapping single-core jumper 7 is another product which is synchronously stamped with the photovoltaic diodes 6 on the stamping die 1, and the double-overlapping single-core jumper 7 is arranged on the stamping die 1 through the free areas 8.

Referring to fig. 8-10, two ends of the double-lap single-core jumper 7 are respectively provided with a bump a701 and a bump B702, a frame block 703 with a glasses-like frame structure is arranged between the bump a701 and the bump B702, and a chip B9 is arranged in the middle of the frame block 703;

the upper end side of the bump a701 is arranged at the right bottom of the first photovoltaic diode 601 of the four adjacent photovoltaic diodes 6, the lower end side of the bump a701 is arranged at the right top of the third photovoltaic diode 603 of the four adjacent photovoltaic diodes 6, and the end of the bump a701 is arranged between the right bottom of the first photovoltaic diode 601 and the right top of the third photovoltaic diode 603;

the upper end side of the bump B702 is arranged at the left bottom of the second photovoltaic diode 602 in the four adjacent photovoltaic diodes 6, the lower end side of the bump B702 is arranged at the left top of the fourth photovoltaic diode 604 in the four adjacent photovoltaic diodes 6, and the end of the bump B702 is arranged between the left bottom of the second photovoltaic diode 602 and the left top of the fourth photovoltaic diode 604;

the upper end side of the frame block 703 is disposed between the right bottom of the first photovoltaic diode 601 and the left bottom of the second photovoltaic diode 602, and the lower end side of the frame block 703 is disposed between the right top of the third photovoltaic diode 603 and the left top of the fourth photovoltaic diode 604;

the right side of the first photovoltaic diode 601 is disposed opposite to the left side of the second photovoltaic diode 602, the bottom of the first photovoltaic diode 601 is disposed opposite to the top of the third photovoltaic diode 603, the right side of the third photovoltaic diode 603 is disposed opposite to the left side of the fourth photovoltaic diode 604, and the top of the fourth photovoltaic diode 604 is disposed opposite to the bottom of the second photovoltaic diode 602.

The working principle and the using process of the embodiment are as follows: as shown in fig. 7-10, after the two-in-one stamping die is assembled, when two products, i.e., a lead frame with a photovoltaic diode 6 and a double-overlapping single-core jumper 7, are required to be obtained at the same time, an operator needs to first place a material to be stamped (the lead frame is made of a copper material, so that the stamping material can be a copper plate) on the two-in-one stamping die as a whole, and stamp the stamping material by using a stamping device, so that two products which are not connected and are different from each other, i.e., the lead frame with the photovoltaic diode 6 and the double-overlapping single-core jumper 7, can be obtained. Specifically: the method comprises the steps of determining the shapes of a photovoltaic diode 6 and a double-lapping single-core jumper 7 according to design requirements, selecting a stamping die 1 meeting requirements according to the shapes of the photovoltaic diode 6 and the double-lapping single-core jumper 7, wherein the double-lapping single-core jumper 7 on the stamping die 1 is arranged in a spare area 8 between every four adjacent photovoltaic diodes 6, namely a lug A701 of the double-lapping single-core jumper 7 is arranged between a first photovoltaic diode 601 and a third photovoltaic diode 603, a lug B702 is arranged between a second photovoltaic diode 602 and a fourth photovoltaic diode 604, a frame block 703 is arranged in the middle of the spare area 8 through the lug A701 and the lug B702, then a material to be stamped is arranged on the stamping die 1, and the stamping die 1 is arranged on stamping equipment, so that the stamping material arranged on the stamping die 1 is stamped by the stamping equipment, and a lead frame (a lead frame with the photovoltaic diode 6 is a JK09-ED lead frame) and a double-lapping single-core jumper 7 which are not connected with each other.

Example 3:

referring to fig. 1 to 10, as another object of the present utility model, a lead frame stamping apparatus is provided, in which any of the above two-in-one stamping dies is provided, so that the lead frame stamping apparatus can obtain any of the advantages of any of the above two-in-one stamping dies, which are not described herein.

Claims (10)

1. Two unification stamping die, the last vertical column arrangement of stamping die is provided with the paster diode or the photovoltaic diode of a plurality of dysmorphism structure, its characterized in that, every it has all been seted up to the afterbody of paster diode and has been smuggled the wire jumper secretly, smuggle the wire jumper and set up through the paster diode on stamping die and with paster diode one-to-one, every four adjacent a double-lap single core wire jumper has all been seted up between the photovoltaic diode, double-lap single core wire jumper sets up on stamping die through every four adjacent photovoltaic diodes.

2. The two-in-one stamping die of claim 1, wherein the clamping jumper wire is provided with a chip A, and a U-shaped groove is formed in the head of the clamping jumper wire.

3. The two-in-one stamping die according to claim 2, wherein the clamping jumper is embedded in a groove at the tail of the patch diode, a U-shaped groove at the head of the clamping jumper is wedged with an arc arranged in the middle of the groove at the tail of the patch diode, and two side edges of the clamping jumper are wedged with two side edges of the groove at the tail of the patch diode.

4. A two-in-one stamping die according to claim 3, wherein the tail of the clip jumper is disposed on the same horizontal plane as the two side ends of the tail groove of the patch diode.

5. The two-in-one stamping die of claim 1, wherein two ends of the double-lap single-core jumper are respectively provided with a bump a and a bump B, a frame block with a glasses-like frame structure is arranged between the bump a and the bump B, and a chip B is arranged in the middle of the frame block.

6. The two-in-one stamping die of claim 5, wherein the upper end side of the bump a is disposed at the right bottom of a first one of four adjacent photovoltaic diodes, the lower end side of the bump a is disposed at the right top of a third one of the four adjacent photovoltaic diodes, and the end of the bump a is disposed between the right bottom of the first photovoltaic diode and the right top of the third photovoltaic diode.

7. The two-in-one stamping die of claim 5, wherein the upper end side of the bump B is disposed at the left bottom of the second one of the four adjacent photovoltaic diodes, the lower end side of the bump B is disposed at the left top of the fourth one of the four adjacent photovoltaic diodes, and the end of the bump B is disposed between the left bottom of the second photovoltaic diode and the left top of the fourth photovoltaic diode.

8. The two-in-one stamping die of claim 5, wherein an upper end side of the frame block is disposed between a right bottom of the first photovoltaic diode and a left bottom of the second photovoltaic diode, and a lower end side of the frame block is disposed between a right top of the third photovoltaic diode and a left top of the fourth photovoltaic diode.

9. The two-in-one stamping die of claim 8, wherein a right side of the first photovoltaic diode is disposed opposite a left side of the second photovoltaic diode, a bottom of the first photovoltaic diode is disposed opposite a top of the third photovoltaic diode, a right side of the third photovoltaic diode is disposed opposite a left side of the fourth photovoltaic diode, and a top of the fourth photovoltaic diode is disposed opposite a bottom of the second photovoltaic diode.

10. A lead frame stamping apparatus comprising a two-in-one stamping die as claimed in any one of claims 1 to 9.