CN220420536U

CN220420536U - Array position speed adjusting device for chip sealing and measuring

Info

Publication number: CN220420536U
Application number: CN202321905319.XU
Authority: CN
Inventors: 洪育铠; 洪育铃
Original assignee: Shenzhen Zhizhong Microelectronics Co ltd
Current assignee: Shenzhen Zhizhong Microelectronics Co ltd
Priority date: 2023-07-19
Filing date: 2023-07-19
Publication date: 2024-01-30
Anticipated expiration: 2033-07-19

Abstract

The utility model relates to an array position quick adjusting device for chip sealing and testing, which comprises a base, wherein a connecting port is formed in the base, a placing plate is movably connected to the upper surface of the base, a moving mechanism is arranged in the connecting port, and a positioning mechanism is arranged on the placing plate. This array position klystron that chip was sealed and survey usefulness is provided with moving mechanism and positioning mechanism, mutually support between each structure through moving mechanism and positioning mechanism, can conveniently make to place the board and remove, and moving mechanism sets up in the connector, can improve space utilization, make to place the material on the board and can more conveniently obtain processing, can make the thread bush remove through pivoted threaded rod, then can release the locking to the slider after the thread bush removes, thereby it can the adjustment position to make to place the board, can also conveniently change placing the board simultaneously, through the stopper of removal, can make the connecting block remove in the frame, after the connecting block moves, place the board then can separate with the base.

Description

Array position speed adjusting device for chip sealing and measuring

Technical Field

The utility model relates to the technical field of chip sealing and testing, in particular to an array position speed adjusting device for chip sealing and testing.

Background

An integrated circuit is a miniature electronic device or component, which adopts a certain technology to interconnect the elements such as transistors, resistors, capacitors, inductors and the like required in a circuit and wiring, and the elements are manufactured on a small semiconductor wafer or a medium substrate or a plurality of small semiconductor wafers, then the semiconductor wafers or the medium substrate are packaged in a tube shell to form a miniature structure with the required circuit function, and the chip package refers to the process that the wafer which passes the test is processed according to the model of the product and the functional requirements of the wafer, and then an independent chip is obtained.

For example, chinese patent publication No. CN218333694U discloses an array position speed adjusting device for chip sealing and measuring, and in particular relates to the technical field of chip sealing and measuring, which comprises a base, wherein four carrying plates are arranged at the top of the base, two sides of each carrying plate are fixedly connected with side plates, a first U-shaped plate is arranged outside each side plate, the top ends of the first U-shaped plates are fixedly connected with a second U-shaped plate, inserting rods are fixedly connected inside the second U-shaped plates, and the bottom ends of the inserting rods extend into the side plates respectively. According to the utility model, the hand-held blocks drive the inserting rods to move upwards, so that the inserting rods move out of the side plates, the locking of the carrying plates is released, the carrying plates are horizontally moved, the two side plates move out of the two first U-shaped plates, the types of the carrying plates are replaced according to the types and the number of wafers, the new carrying plates are installed and fixed in the same way, the array positions of the tube shells are quickly exchanged, and the utility model saves time and labor and is convenient to use.

The array position speed adjusting device for chip sealing and testing can conveniently detach the loading plate when in use, but has some defects when in use, for example, the device positions the loading plate through the assistance of the upright post when in use, but the upright post occupies larger space, and when the material on the loading plate is processed, the upright post occupying the space influences normal work, thereby reducing the practicability of the device.

Disclosure of Invention

Aiming at the defects of the prior art, the utility model provides an array position speed adjusting device for chip sealing and measuring, which has the advantages of high practicability and the like and solves the problem that the space occupied by the stand column is larger.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the array position speed adjusting device for chip sealing and testing comprises a base, wherein a connecting port is formed in the base, a placing plate is movably connected to the upper surface of the base, a moving mechanism is arranged in the connecting port, and a positioning mechanism is arranged on the placing plate;

the moving mechanism comprises two sliding rods fixed between an inner front wall and an inner back wall of a connecting port, the outer sides of the sliding rods are slidably connected with the same sliding block, the front surface of the sliding block is fixedly provided with two mounting plates, the inner sides of the mounting plates are slidably connected with threaded sleeves, the left sides and the right sides of the threaded sleeves penetrate through and extend to the outer sides of the mounting plates, the inner threads of the threaded sleeves are connected with the same threaded rod, two abutting plates are fixed on one sides of the threaded sleeves, which are opposite to each other, and one side of each abutting plate, which is far away from each threaded sleeve, is abutted to the outer sides of the sliding rods.

Further, positioning mechanism is including fixing two connecting blocks at placing the board lower surface, the last fixed surface of slider has two frames, the bottom surface of connecting block runs through and extends to the inside of frame, connecting block sliding connection is in the inside of frame, spacing hole has been seted up to the inside of connecting block, the inside sliding connection of spacing hole has the stopper, two the frame is all fixed with the spring in one side of being on the back mutually, two the spring is all fixed with the arm-tie in one side of being on the back mutually, two the stopper is all run through and extend to the outside of frame in one side of being on the back mutually, two the opposite one side of arm-tie is fixed respectively in one side of being on the back mutually at two stoppers, spring movable suit is in the outside of stopper.

Further, a through hole for the sliding rod to penetrate is formed in the sliding block, and the outer diameter of the sliding rod is matched with the inner diameter of the through hole.

Further, a connecting hole for the threaded sleeve to penetrate is formed in the mounting plate, and the threaded sleeve is in clearance fit with the connecting hole.

Further, the cross section of the abutting plate is arc-shaped, and the threaded sleeve linearly moves left and right on the outer side of the threaded rod.

Further, the connecting block linearly moves up and down in the frame, and the frame is in a cuboid shape with hollow inside and missing bottom surfaces and top surfaces.

Further, place board swing joint at the upper surface of frame, the length and the width of connecting block respectively with the length and the width looks adaptation of frame inner chamber.

Compared with the prior art, the technical scheme of the application has the following beneficial effects:

1. this array position klystron that chip was surveyed and is used is provided with moving mechanism, mutually support between each structure through moving mechanism, can conveniently make to place the board and remove, and moving mechanism sets up in the connector, can improve space utilization, makes the material of placing on the board can more convenient obtain processing, can make the thread bush remove through pivoted threaded rod, then can release the locking to the slider after the thread bush removes to make to place the board and can adjust the position.

2. This array position klystron that chip was sealed and is surveyed usefulness is provided with positioning mechanism, mutually support between each structure through positioning mechanism, can conveniently change placing the board, through the stopper that removes, can make the connecting block remove in the frame, after the connecting block to removing, place the board then can separate with the base to be convenient for change placing the board, and change efficiently.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the bottom structure of the base of the present utility model;

FIG. 3 is a schematic view of a moving mechanism according to the present utility model;

FIG. 4 is a schematic view of a positioning mechanism according to the present utility model.

In the figure: 1. a base; 2. placing a plate; 3. a connection port; 4. a moving mechanism; 401. a slide block; 402. a pressing plate; 403. a thread sleeve; 404. a threaded rod; 405. a slide bar; 406. a mounting plate; 5. a positioning mechanism; 501. a limiting block; 502. a limiting hole; 503. a connecting block; 504. a frame; 505. a spring; 506. pulling the plate.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-2, an array position speed adjusting device for chip package in this embodiment includes a base 1, a connection port 3 provided in the base 1, a placing plate 2 movably connected to an upper surface of the base 1, a moving mechanism 4 provided in the connection port 3, and a positioning mechanism 5 provided on the placing plate 2.

Referring to fig. 3, the moving mechanism 4 in this embodiment includes two sliding rods 405 fixed between the inner front wall and the inner back wall of the connecting port 3, the outer sides of the two sliding rods 405 are slidably connected with the same sliding rod 401, after the sliding rod 401 is unlocked, the sliding rod 405 can move, the sliding rod 401 can adjust the position of the placing plate 2 after moving, two mounting plates 406 are fixed on the front surface of the sliding rod 401, a threaded sleeve 403 is slidably connected inside the mounting plate 406, after the two threaded sleeves 403 relatively move, the abutting plate 402 is separated from the sliding rod 405, the locking of the sliding rod 401 is released, the left side and the right side of the threaded sleeve 403 penetrate and extend to the outer sides of the mounting plate 406, the inner threads of the threaded sleeve 403 are connected with the same threaded rod 404, after the threaded rod 404 rotates, the two threaded rod 404 can move the two threaded sleeves 403, the threaded rod 404 includes two threaded rods, the opposite sides of the two threaded sleeves 403 are respectively fixed with an abutting plate 402, and one side of the abutting plate 402 far from the threaded sleeve 403 abuts against the outer sides of the sliding rod 405.

The inside of slider 401 has been seted up and has been supplied the perforation that slide bar 405 runs through, the external diameter of slide bar 405 and the inside looks adaptation of perforation, the connecting hole that supplies thread bush 403 to run through has been seted up to the inside of mounting panel 406, thread bush 403 is spacing by the connecting hole when removing, thread bush 403 and connecting hole clearance fit, the shape of support tight board 402 cross section is convex, thread bush 403 is about the threaded rod 404 is linear movement, reverse threaded rod 404, two thread bushes 403 can make support tight board 402 support the outside of board slide bar 405 to lock slider 401.

The threaded sleeve 403 can be moved by the rotating threaded rod 404, and the slider 401 can be moved on the slide bar 405 after the abutment plate 402 is separated from the slide bar 405.

The moving mechanism 4 can conveniently move the placing plate 2, the threaded sleeve 403 can be moved through the rotating threaded rod 404, and the locking of the sliding block 401 can be released after the threaded sleeve 403 moves, so that the placing plate 2 can be adjusted in position.

Referring to fig. 4, the positioning mechanism 5 in this embodiment includes two connection blocks 503 fixed on the lower surface of the placement plate 2, the connection blocks 503 can be moved out from the frame 504, the placement plate 2 can also be moved out from the base 1 along with the connection blocks, two frames 504 are fixed on the upper surface of the sliding block 401, the bottom surface of each connection block 503 penetrates through and extends to the inside of each frame 504, the connection blocks 503 are slidably connected in the frames 504, a limiting hole 502 is formed in the connection blocks 503, after the limiting block 501 moves, the limiting blocks 501 can be removed from the limiting holes 502 after being separated from the limiting holes 502, the limiting blocks 501 are slidably connected in the limiting holes 502, the two limiting blocks 501 can be moved relatively after the sliding blocks 506 move, springs 505 are fixed on opposite sides of the two frames 504, the opposite sides of the two springs 505 are fixed with sliding blocks 506, the opposite sides of the two limiting blocks 501 can be moved relatively by pressing the two sliding blocks 506, the opposite sides of the two limiting blocks 501 penetrate through and extend to the outer sides of the frames 504, the opposite sides of the two limiting blocks are fixed on opposite sides of the two limiting blocks 501 respectively, and the two limiting blocks 501 are movably sleeved on the outer sides of the limiting blocks 501.

The connecting block 503 moves linearly up and down in the frame 504, the frame 504 is in a cuboid shape with hollow inside and missing bottom and top surfaces, the placing plate 2 is movably connected to the upper surface of the frame 504, and the length and the width of the connecting block 503 are respectively matched with the length and the width of the inner cavity of the frame 504.

The connection block 503 can be moved out of the frame 504 by the cooperation of the stopper 501 and the stopper hole 502, so that the placement plate 2 can be separated from the base 1.

The positioning mechanism 5 can conveniently replace the placing plate 2, the connecting block 503 can move in the frame 504 through the moving limiting block 501, and when the connecting block 503 moves, the placing plate 2 can be separated from the base 1, so that the placing plate 2 can be replaced.

The working principle of the embodiment is as follows:

(1) When the placing plate 2 needs to be detached and replaced, the two pulling plates 506 are pressed, so that the two pulling plates 506 move relatively, the two limiting blocks 501 move relatively after the pulling plates 506 move, the springs 505 shrink when the pulling plates 506 push the limiting blocks 501 to move, the limiting blocks 501 can move out of the limiting holes 502, and when the limiting blocks 501 move to be separated from the limiting holes 502, the limiting of the connecting blocks 503 can be released, the connecting blocks 503 can move out of the frames 504, and the placing plate 2 also moves out of the base 1.

(2) When the placing plate 2 needs to be moved, the threaded rod 404 can be rotated, the threaded rod 404 can enable the two threaded sleeves 403 to move relatively, the threaded sleeves 403 are limited by the mounting plate 406, the abutting plate 402 can be separated from the sliding rod 405 after the threaded sleeves 403 move, the locking of the sliding block 401 is released, at this time, the sliding block 401 can move on the sliding rod 405, the position of the placing plate 2 can be adjusted after the sliding block 401 moves, after the position adjustment of the placing plate 2 is completed, the threaded rod 404 is reversed, and the two threaded sleeves 403 can enable the abutting plate 402 to abut against the outer side of the sliding rod 405 and lock the sliding block 401.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The array position speed adjusting device for chip sealing and testing comprises a base (1), and is characterized in that: a connecting port (3) is formed in the base (1), a placing plate (2) is movably connected to the upper surface of the base (1), a moving mechanism (4) is arranged in the connecting port (3), and a positioning mechanism (5) is arranged on the placing plate (2);

the moving mechanism (4) comprises two sliding rods (405) fixed between an inner front wall and an inner back wall of the connecting port (3), the outer sides of the sliding rods (405) are connected with the same sliding block (401) in a sliding mode, two mounting plates (406) are fixed on the front face of the sliding block (401), threaded sleeves (403) are connected with the inner sides of the mounting plates (406) in a sliding mode, the left sides and the right sides of the threaded sleeves (403) penetrate through and extend to the outer sides of the mounting plates (406), the inner threads of the threaded sleeves (403) are connected with the same threaded rod (404), two abutting plates (402) are fixed on the opposite sides of the threaded sleeves (403), and one side, away from the threaded sleeves (403), of each abutting plate (402) abuts against the outer sides of the sliding rods (405).

2. An array position adjustment device for chip package according to claim 1, wherein: positioning mechanism (5) are including fixing two connecting blocks (503) of placing board (2) lower surface, the upper surface fixed of slider (401) has two frames (504), the bottom surface of connecting block (503) runs through and extends to the inside of frame (504), connecting block (503) sliding connection is in the inside of frame (504), spacing hole (502) have been seted up to the inside of connecting block (503), the inside sliding connection of spacing hole (502) has stopper (501), two one side that frame (504) is opposite all is fixed with spring (505), two one side that spring (505) is opposite all is fixed with arm-tie (506), two one side that stopper (501) is opposite all runs through and extends to the outside of frame (504), two one side that arm-tie (506) are opposite is fixed respectively in the one side that two stoppers (501) are opposite, the activity suit is in the outside of stopper (501).

3. An array position adjustment device for chip package according to claim 1, wherein: the inside of slider (401) is offered and is supplied the perforation that slide bar (405) runs through, the external diameter of slide bar (405) and the internal diameter looks adaptation of perforation.

4. An array position adjustment device for chip package according to claim 1, wherein: the inside of mounting panel (406) is offered and is supplied the connecting hole that screw thread cover (403) runs through, screw thread cover (403) and connecting hole clearance fit.

5. An array position adjustment device for chip package according to claim 1, wherein: the cross section of the abutting plate (402) is circular arc-shaped, and the threaded sleeve (403) moves linearly left and right outside the threaded rod (404).

6. An array position adjustment device for chip package according to claim 2, wherein: the connecting block (503) moves linearly up and down in the frame (504), and the frame (504) is in a cuboid shape with hollow inside and missing bottom surface and top surface.

7. An array position adjustment device for chip package according to claim 2, wherein: the placing plate (2) is movably connected to the upper surface of the frame (504), and the length and the width of the connecting block (503) are respectively matched with the length and the width of the inner cavity of the frame (504).