CN220400563U - Fixing device - Google Patents

Abstract

The utility model provides a fixing device, which is used for fixing a substrate by matching with a bearing platform, and comprises a pressing piece, wherein the pressing piece comprises: a first portion for pressing against the substrate; a second portion extending from the first portion toward the load-bearing platform. According to the fixing device, the first part of the pressing piece is used for pressing the substrate, the second part extends towards the bearing platform, the path of water entering from the side face of the substrate is blocked, and the water entering risk of the substrate is reduced.

Description

Fixing device

Technical Field

Embodiments of the present utility model relate to a fixation device.

Background

Fig. 1 shows a simplified diagram of a prior art fixture, fig. 2 shows a simplified diagram of a prior art fixture, wherein more fixture bars 214 of the carrier platform 210 are shown than in fig. 1, fig. 3 shows a top view of a prior art fixture, fig. 4 shows a cross-sectional view taken along line a-a of fig. 3, now the substrate 200 is thinner and thinner, in a Flip Chip Bond (FCB) process connecting the die 300 to the substrate 200, the die area 206 of the substrate 200 for bonding the die 300 is more metal material than other areas, and thus is more susceptible to thermal deformation than other areas, and thus requires that other areas of the substrate 200 around the die area 206 be depressed by the first jig (cover jig) 220 during a reflow step following the Flip Chip bonding process, and cooperate with the downward negative pressure provided by the carrier platform 210 to minimize warpage, whereas the die area 206 of the prior art first jig 220 requires openings to expose the die area 206 of the substrate 200, and thus the die area 206 cannot be directly held down by the die area and is not sufficiently flat for the die bonding process, as shown in fig. 3.

In one embodiment, the substrate 200 is an Embedded Trace Substrate (ETS) with two layers of traces that are fixed using the existing first jig 220, fig. 5 shows a contour diagram of a portion of the substrate 200 corresponding to the size of one die 300, the X-axis and Y-axis are in pixels (pixels), the units can be scaled to length according to resolution, the substrate 200 is seen to have a "cry-face" shape with a high middle and a low periphery, and in fig. 5, the height of the highest point is 13.8 μm, the height of the lowest point is-20.1 μm, resulting in a warpage of about 34 μm, and at higher temperatures, the warpage of the substrate 200 is between 30 μm and 40 μm.

Referring to fig. 1, 2 and 4, during processing, the substrate 200 is first placed on the carrying platform 210, and then the first jig 220 and the carrying platform 210 are used to clamp the substrate 200 together; performing a flip chip bonding process to connect the die 300 to the substrate 200; executing a reflow soldering process; the first jig 220 is replaced with a second jig 222 as shown in fig. 6 and 7, a cleaning process of the flux is performed, wherein fig. 6 is a top view, fig. 7 is a sectional view taken along line b-b of fig. 6, and the openings of the second jig 222 expose all the dies 300, and in this step, there is a risk of water inflow on the side of the substrate 200 due to the gap 700 between the second jig 222 and the carrying platform 210; then unbinding the substrate 200 with the bearing platform 210 and the second jig 222; and finally unloading the substrate 200.

Disclosure of Invention

In view of the problems in the related art, it is an object of the present utility model to provide a fixing device to reduce the risk of substrate water ingress.

In order to achieve the above object, the present utility model provides a fixing device for fixing a substrate in cooperation with a carrier platform, including a pressing member, where the pressing member includes: a first portion for pressing against the substrate; a second portion extending from the first portion toward the load-bearing platform.

In some embodiments, the second portion is for contacting the load bearing platform.

In some embodiments, the pressing member is magnetically attracted to the load-bearing platform.

In some embodiments, the load bearing platform has a load bearing surface and a magnetic member embedded at the load bearing surface, the magnetic member securing the second portion by magnetic force.

In some embodiments, the first portion and the second portion together have an L-shape in a cross-sectional view taken along the pressing direction of the first portion.

In some embodiments, the press-on member further includes a slot for exposing a plurality of pads of the substrate.

In some embodiments, the first portion and the second portion surround the slot.

In some embodiments, the fixation device further comprises: and the bonding layer is used for being attached to one side of the substrate facing the bearing platform.

In some embodiments, the edge of the adhesive layer is not aligned with the edge of the substrate.

In some embodiments, the fixation device further comprises: the carrier plate is used for being attached to one side of the bonding layer, which faces the bearing platform.

In some embodiments, the hardness of the carrier plate is greater than the hardness of the adhesive layer.

In some embodiments, a plurality of first through holes are formed in the carrier plate, and the first through holes penetrate through the carrier plate along the thickness direction of the carrier plate.

In some embodiments, a plurality of second through holes are formed in the adhesive layer, and the second through holes penetrate through the adhesive layer along the thickness direction of the adhesive layer.

In some embodiments, the first through holes and the second through holes are in one-to-one correspondence and aligned with each other.

In some embodiments, the carrier plate is configured to contact the load platform.

In some embodiments, the material of the carrier plate may be transparent to X-rays.

In some embodiments, the material of the carrier plate is AlCSi.

In some embodiments, the pressing member further includes a plurality of third through holes penetrating the second portion in the pressing direction of the pressing member.

In some embodiments, the load bearing platform has a load bearing surface and a securing lever protruding relative to the load bearing surface, and the third through hole is configured to receive the securing lever.

In some embodiments, the third through hole and the fixing rod are fitted to each other.

The beneficial technical effects of the utility model are as follows:

according to the fixing device, the first part of the pressing piece is used for pressing the substrate, the second part extends towards the bearing platform, the path of water entering from the side face of the substrate is blocked, and the water entering risk of the substrate is reduced.

Drawings

Fig. 1 shows a simplified diagram of a prior art fastening device.

Fig. 2 shows a simplified diagram of a prior art fixture.

Fig. 3 shows a top view of a prior art fastening device.

Fig. 4 shows a cross-sectional view taken along line a-a of fig. 3.

Fig. 5 shows a contour view of a substrate held using a prior art holding device.

Fig. 6 and 7 show a second jig of the prior art.

Fig. 8 and 9 show a simplified structural diagram of a fixing device according to an embodiment of the present application.

Fig. 10 shows a top view of a fixation device according to an embodiment of the present application.

Fig. 11A shows a cross-sectional view taken along line c-c of fig. 10.

FIG. 11B shows a cross-sectional view of the different embodiment from FIG. 11A taken along line c-c of FIG. 10.

Fig. 12 shows a machine with ejector pins.

Fig. 13 shows a contour view of a substrate secured using the securing means shown in fig. 11A.

Fig. 14, 15, 16, 17 are along the a '-a' line, a-a line of prior art fig. 3, c '-c' line of fig. 10 of the present embodiment, respectively. Schematic of the pads of the substrate, pads of the die, and solder taken along line c-c.

Fig. 18 shows a graph of the change in the warpage amounts of the control group 1 and the control group 2 with the change in temperature.

Fig. 19 shows a graph of the magnitude of change in the warpage amounts of the plurality of units in the control groups 1 to 4.

Detailed Description

For a better understanding of the spirit of embodiments of the present application, reference is made to the following description of some preferred embodiments of the present application.

Embodiments of the present application will be described in detail below. Throughout the specification, identical or similar components and components having identical or similar functions are denoted by similar reference numerals. The embodiments described herein with respect to the drawings are of illustrative nature, of diagrammatic nature and are used to provide a basic understanding of the present application. The examples of the present application should not be construed as limiting the present application.

As used herein, the terms "substantially," "substantially," and "about" are used to describe and illustrate minor variations. When used in connection with an event or situation, the term may refer to instances in which the event or situation occurs precisely and instances in which the event or situation occurs very nearly.

In this specification, unless specified or limited otherwise, relative terms such as: the terms "central," "longitudinal," "lateral," "front," "rear," "right," "left," "interior," "exterior," "lower," "upper," "horizontal," "vertical," "above," "below," "upper," "lower," "top," "bottom," and derivatives thereof (e.g., "horizontally," "downwardly," "upwardly," etc.) should be construed to refer to the directions as described in the discussion or as illustrated in the drawings. These relative terms are for convenience of description only and do not require that the present application be constructed or operated in a particular orientation.

For ease of description, "first," "second," "third," etc. may be used herein to distinguish between different components of a figure or series of figures. The terms "first," "second," "third," and the like are not intended to describe corresponding components.

Fig. 8 and 9 show a simplified schematic of a fixture according to an embodiment of the present application, fig. 9 shows more fixing bars 214 of the carrier platform 210 than fig. 8, fig. 10 shows a top view of the fixture, fig. 11A shows a cross-sectional view taken along line c-c of fig. 10, the embodiment of the present application provides a fixture for fixing a substrate 200 in cooperation with the carrier platform 210, the fixture comprising a pressing member 10, the pressing member 10 comprising: a first portion 11 for pressing against the substrate 200; the second portion 12 extends from the first portion 11 toward the carrying platform 210. The first portion 11 of the pressing member 10 of the fixing device of the embodiment of the present application is used to press against the substrate 200, and the second portion 12 extends toward the carrying platform 210, blocking the path of water entering from the side of the substrate 200, and reducing the risk of water entering the substrate 200.

In some embodiments, the second portion 12 is configured to contact the carrier platform 210, and the second portion 12 abuts against the carrier platform 210, such that the distance between the first portion 11 and the carrier platform 210 is fixed, that is, the pressing force provided by the first portion 11 to the substrate 200 is fixed, and the warpage of the substrate 200 is not exacerbated by the unstable position of the first portion 11.

In some embodiments, the pressing member 10 is attracted to the carrying platform 210 by a magnetic force, so that the pressing member 10 cannot easily move relative to the carrying platform 210. Referring to fig. 11A, in some embodiments, the carrier platform 210 has a carrier surface 212 and a magnetic member 204 embedded at the carrier surface 212, the magnetic member 204 secures the second portion 12 by magnetic force, the second portion 12 contacting the magnetic member 204. In some embodiments, the magnetic member 204 is a magnet.

In some embodiments, the first portion 11 and the second portion 12 together have a (inverted) L-shape in a cross-sectional view taken along the pressing direction of the first portion 11.

Referring to fig. 11A, in some embodiments, the press-on member 10 further includes a slot 14, the slot 14 for exposing the plurality of pads 140 of the substrate 200. In some embodiments, the first portion 11 and the second portion 12 surround the slot 14.

In some embodiments, the fixation device further comprises: the adhesive layer 20 is used for attaching to one side of the substrate 200 facing the carrying platform 210.

Referring to fig. 11A, in some embodiments, the edges of carrier plate 30, adhesive layer 20, and substrate 200 are aligned. In some embodiments, the edges of the carrier plate 30, the adhesive layer 20, the substrate 200 are not aligned, e.g., the edges of both the carrier plate 30 and the adhesive layer 20 are beyond the edge of the substrate 200 (see fig. 11B), or the edges of both the carrier plate 30 and the adhesive layer 20 are recessed relative to the edge of the substrate 200. The edge of the carrier plate 30 exceeds the edge of the adhesive layer 20, the edge of the substrate 200. In some embodiments, the edge of the adhesive layer 20 is not aligned with the edge of the substrate 200, e.g., the edge of the adhesive layer 20 is beyond the edge of the substrate 200 (see fig. 11B), or is recessed relative to the edge of the substrate 200.

In some embodiments, the fixation device further comprises: the carrier 30 is used for attaching to a side of the adhesive layer 20 facing the carrying platform 210. Embodiments of the present application use a combination of carrier plate 30 and adhesive layer 20 to provide downward adhesion to all areas of substrate 200 in the horizontal direction, allowing substrate 200 to be attached to carrier plate 30, allowing the die area of substrate 200 for bonding die 300 to also be subjected to downward forces, effectively planarizing substrate 200. Moreover, the embodiments of the present application do not require the carrier platform 210 to provide a negative pressure, so as to planarize the substrate 200. In some embodiments, the upper surface of the die 300 is not higher than the upper surface of the abutment 10, for example, the die 300 may have a thickness of 100 μm to 750 μm and the first portion 11 of the abutment 10 may have a thickness of 1mm.

In some embodiments, the hardness of the carrier plate 30 is greater than the hardness of the adhesive layer 20.

Referring to fig. 11A, in some embodiments, a plurality of first through holes 41 are formed in the carrier plate 30, and the first through holes 41 penetrate through the carrier plate 30 along the thickness direction of the carrier plate 30. In some embodiments, a plurality of second through holes 42 are formed in the adhesive layer 20, and the second through holes 42 penetrate through the adhesive layer 20 along the thickness direction of the adhesive layer 20. In some embodiments, the first through holes 41 and the second through holes 42 are in one-to-one correspondence and aligned with each other.

In some embodiments, carrier plate 30 is used to contact carrier platform 210. In some embodiments, the material of the carrier 30 can be penetrated by X-ray to facilitate inspection of bonding quality, inspection of flatness, easy processing, and good adhesion of an adhesive layer, such as aluminum alloy. In some embodiments, the material of the carrier plate 30 is AlCSi or the like.

In some embodiments, the pressing member 10 further includes a plurality of third through holes 43, and the third through holes 43 penetrate the second portion 12 along the pressing direction of the pressing member 10. In some embodiments, the carrying platform 210 has a carrying surface 212 and a fixing rod 214 protruding with respect to the carrying surface 212, and the third through hole 43 is configured to receive the fixing rod 214.

In some embodiments, the third through hole 43 and the fixing rod 214 may be fitted to each other as shown in fig. 11A. In other embodiments, a gap 900 may exist between the third through hole 43 and the fixing rod 214 as shown in fig. 9, because the third through hole 43 is formed on the second portion 12, but not on the first portion 11, and the gap 900 does not affect the waterproof effect of the pressing member 10.

Embodiments of the present application may share the prior art carrier platform 210 and also share part of the processing steps of the prior art, except that the embodiments of the present application do not need to replace the jig as in the prior art when performing the flip chip bonding process, the reflow process, and the cleaning process, but may always use the pressing member 10, simplifying the production process. Also, referring to fig. 12, a machine having pins (pins) 1200 is used, the pins 1200 penetrate the first through holes 41 and the second through holes 42 to push the substrate 200 open, and the substrate 200 is separated from the adhesive layer 20 and the carrier 30. The carrier 30 and the adhesive layer 20 can be cleaned and then used to carry other substrates 200 for recycling.

Fig. 13 is a contour diagram of a portion of the substrate 200 corresponding to the size of one die 300, which is fixed using the fixing device shown in fig. 11A, and units of X-axis and Y-axis are pixels (pixels), which can be converted into lengths according to resolution, and it is possible to obtain a smaller warpage amount of the substrate 200 fixed by the fixing device of the embodiment of the present application, wherein a central region of the substrate 200 (a die region for bonding the die 300 is located within the central region) is particularly flat. In some embodiments, the unit warpage of the substrate 200 (corresponding to a portion of the size of one die 300) is less than 10 μm.

Fig. 14, 15, 16, 17 are along the a '-a' line, a-a line of prior art fig. 3, c '-c' line of fig. 10 of the present embodiment, respectively. The schematic view of the bonding pad 140 of the substrate 200, the bonding pad 144 of the die, and the solder 142 taken along line c-c, it can be seen that the prior art bonding pads 140 and 144 have a variable spacing and a large difference, and that there is still a blank/cold bonding condition when the spacing is large (e.g., the middle diagram of fig. 14), whereas the spacing between the bonding pads 140 and 144 of the embodiments of the present application is constant, the difference is small, and the bonding condition is stable.

The carrier plate 30 and the adhesive layer 20 of embodiments of the present application can handle a substantial portion of the warped substrate 200, including substrates 200 using special materials such as low CTE (e.g., 10ppm/°c) materials and ultra low Coefficient of Thermal Expansion (CTE) (e.g., <5ppm/°c) materials (higher rigidity) that are not handled by the prior art first fixture 220, control group 1 is a 2 to 6 layer substrate with a low coefficient of thermal expansion, having a thickness of 100 to 800 μm, using prior art fixtures; setting the control group 2 as a substrate with 2 to 6 layers of ultralow thermal expansion coefficient and thickness of 100 to 800 mu m, and using a fixing device in the prior art; control group 3 is a low coefficient of thermal expansion 2 to 6 layer substrate with a thickness of 100 to 800 μm using the fixture of the present application; the control group 4 was set to be a 2 to 6 layer substrate of ultra low thermal expansion coefficient with a thickness of 100 to 800 μm using the fixture of the present application. Fig. 18 shows a graph 1800 of the change in the warpage amount (in μm) of the control group 1 and the control group 2 with the change in temperature, wherein the broken line is a case where the control group 1 and the control group 2 use the fixing device of the embodiment of the present application, and the solid line is a case where the control group 1 and the control group 2 use the fixing device of the embodiment of the related art. Fig. 19 shows a graph 1900 of the variation amplitude of the warpage amount (in μm) of a plurality of units (units) in the control groups 1 to 4. The fixing device of the embodiment of the present application effectively reduces the warpage amount of the substrate 200.

Embodiments of the present application fix the die area of the substrate 200 by attaching the substrate 200 to the carrier 30 using an adhesive layer (e.g., tape) 20, solving the problem of the prior art that the die area is prone to warpage due to lack of support during the reflow process. The embodiment of the application uses the adhesive layer 20 to attach the substrate to the metal carrier 30 which is not easy to deform by heat, the adhesive layer 20 can provide good fixity, the pressing piece 10 does not need to press the periphery of the die area below each die 300, therefore, only a slot 14 capable of exposing all the die areas simultaneously needs to be formed on the pressing piece 10, and therefore, the adhesive layer can be suitable for substrates 200 with various designs, and moisture and flux (flux) can be prevented from remaining on the periphery of the die area during the cleaning step.

The carrier plate 30 of the embodiment of the application is provided with a first through hole 41, and the adhesive layer 20 is provided with a second through hole 42, so that the ejector pin 1200 can penetrate through and push up the substrate 200, and the substrate 200 is separated from the adhesive layer 20. Although the carrier 30 and the adhesive layer 20 are provided to support the substrate 200 such that the distance between the first portion 11 and the carrying platform 210 becomes longer, the pressing member 10 further has a second portion 12 extending toward the carrying platform 210, so that the pressing member 10 is advantageously fixed on the carrying platform 210 by magnetic attraction.

Compared with the prior art and the application, when the flip chip process and the reflow soldering process are performed, the prior art uses the net-shaped first jig 220, and the application uses the pressing piece 10 with one complete slot 14, so that the metal material of the pressing piece 10 is less than that of the net-shaped first jig 220, less heat is absorbed in the high-temperature process (reflow soldering process), and the temperature is easier to control; the prior art requires the support platform 210 to provide the negative pressure, and the substrate 200 is leveled together with the first jig 220, but the support platform 210 is not required to provide the negative pressure in the present application; when the substrates 200 in the prior art are different, the first jig 220 needs to be replaced accordingly, that is, the material or the size of the first jig 220 is changed, that is, the heat absorbed during the reflow process is changed, and the parameters of the reflow process need to be readjusted due to the replacement of the first jig, the material, the size and the reflow process, while the embodiment of the present application uses the pressing member 10 with a complete slot 14, even if the type of the substrate 200 is changed, the pressing member 10 does not need to be replaced, so that the above problems in the prior art do not exist; the prior art embodiment needs to control the warpage of the substrate 200, the coplanarity of the solder (solder ball) 142, the volume of the solder 142 to avoid the solder 142 contacting the first jig 220, etc., and the embodiment of the present application only needs to confirm the feeding quality of the carrier board 30, for example, because the substrate 200 is supported by the carrier board 30, it needs to determine that the carrier board 30 itself is not warped or that the carrier board 30 is at the same height in the height direction (Z-axis direction); the amount of warpage of the substrate 200 using the prior art fixture is dependent on the design and material of the substrate 200 and is generally a "crying" shape, the substrate 200 using embodiments of the fixture of the present application being controlled primarily by the carrier plate 30, the adhesive layer 20, the amount of warpage being less than 20 μm.

The above is only a preferred embodiment of the present utility model, and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (10)

1. A fixing device for fixing a substrate in cooperation with a load-bearing platform, comprising a pressing member, the pressing member comprising:

a first portion for pressing against the substrate;

a second portion extending from the first portion toward the load-bearing platform.

2. The fixture of claim 1, wherein the second portion is configured to contact the load-bearing platform.

3. The fixture of claim 1, wherein the load bearing platform has a load bearing surface and a magnetic member embedded at the load bearing surface, the magnetic member securing the second portion by magnetic force.

4. The fixation device of claim 1, wherein the first portion and the second portion together have an L-shape in a cross-sectional view taken along a pressing direction of the first portion.

5. The fixture of claim 1, wherein the press-on member further comprises a slot for exposing a plurality of pads of the substrate.

6. The fixation device of claim 5, wherein the first portion and the second portion surround the slot.

7. The fixture of claim 1, further comprising:

and the bonding layer is used for being attached to one side of the substrate facing the bearing platform.

8. The fixture of claim 7, wherein an edge of the adhesive layer is not aligned with an edge of the substrate.

9. The fixture of claim 7, further comprising:

and the carrier plate is used for being attached to one side of the bonding layer facing the bearing platform.

10. The fixture of claim 9, wherein the carrier plate has a hardness greater than the hardness of the adhesive layer.