CN220399490U - Laser chip cos encapsulation temperature resistance test equipment - Google Patents
Laser chip cos encapsulation temperature resistance test equipment Download PDFInfo
- Publication number
- CN220399490U CN220399490U CN202321790008.3U CN202321790008U CN220399490U CN 220399490 U CN220399490 U CN 220399490U CN 202321790008 U CN202321790008 U CN 202321790008U CN 220399490 U CN220399490 U CN 220399490U
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- Prior art keywords
- fixedly connected
- laser chip
- board
- heating box
- simulation
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- 238000012360 testing method Methods 0.000 title claims abstract description 33
- 238000005538 encapsulation Methods 0.000 title claims description 7
- 238000004088 simulation Methods 0.000 claims abstract description 44
- 238000010438 heat treatment Methods 0.000 claims abstract description 43
- 238000007789 sealing Methods 0.000 claims abstract description 16
- 238000009413 insulation Methods 0.000 claims abstract description 11
- 238000005485 electric heating Methods 0.000 claims abstract description 7
- 238000004806 packaging method and process Methods 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 description 8
- 230000009286 beneficial effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000012774 insulation material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
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- Testing Electric Properties And Detecting Electric Faults (AREA)
Abstract
The utility model relates to the technical field of chip temperature resistance test, in particular to laser chip cos packaging temperature resistance test equipment, which comprises a heating box, wherein a heat insulation supporting piece is arranged in the heating box, an electric heating plate is fixedly connected to the top of the heat insulation supporting piece, a closed top cover is arranged at the top of the heating box, a sealing plug is fixedly connected to the bottom of the closed top cover, the bottom of the sealing plug penetrates through the heating box and extends to the inside of the heating box, two bearing arc plates are fixedly connected to the bottom of the sealing plug, the inner surfaces of the two bearing arc plates are fixedly connected with bearing plates, and the top cover and the bearing arc plates drive a simulation plate and a laser chip to move up and down so as to facilitate the replacement of the simulation plate and the laser chip to the upper side, so that the whole opening of the heating box is not needed when different laser chips are replaced for testing, the heat loss in the heating box is reduced, and the power consumption of the heating box is reduced.
Description
Technical Field
The utility model relates to the technical field of chip temperature resistance test, in particular to laser chip cos packaging temperature resistance test equipment.
Background
The laser chip is a miniature silicon chip, and the temperature resistance test is required to be carried out when the chip is packaged as a common chip.
In the prior art, a protection type semiconductor chip high temperature resistant packaging testing device as proposed in the patent application number "CN202020058938.X" includes: a base; the heating box is fixedly connected with a heat-conducting plate between two sides of the inner wall of the heating box, and the chips are placed in the air for heating, so that the chips are prevented from being burnt out due to direct heating of the chips, the interior of the heating box is effectively cooled rapidly, and a detector can take out the chips rapidly.
However, in the prior art, as in the patent application No. cn202020058938.X, a testing device is proposed, and the heating box needs to be opened once every time the temperature resistance test of the packaged chip is completed, so that great loss is generated in the heat of the inside of the heating box, and the heating is required to be re-performed when a new chip temperature resistance test is performed again, so that the power consumption of the heating box is increased, and the cost of the chip temperature resistance test is increased.
Disclosure of Invention
The utility model aims to provide laser chip cos package temperature resistance test equipment so as to solve the problems in the background technology.
The aim of the utility model can be achieved by the following technical scheme:
the utility model provides a laser chip cos encapsulation temperature resistance test equipment, includes the case that heats, the inside of heating the case is provided with thermal-insulated support piece, thermal-insulated support piece's top fixedly connected with electric plate, the top of heating the case is provided with the closed top cap, the bottom fixedly connected with sealing plug of closed top cap, the bottom of sealing plug runs through the inside of heating the case and extend to the heating case, the bottom fixedly connected with of sealing plug bears the arc board.
The two inner surfaces of the bearing arc plates are fixedly connected with bearing plates, a simulation plate is arranged between the two bearing arc plates, connecting blocks are fixedly connected to two sides of the simulation plate and arranged above the bearing plates, the bottom of the simulation plate and the bottom of the bearing arc plates are arranged on the same plane, and laser chips to be tested are arranged on the simulation plate.
Preferably, the connecting block is provided with a clamping hole, and the top of the bearing plate is fixedly connected with a clamping shaft matched with the clamping hole.
Preferably, the bottoms of the simulation plate and the bearing arc plate are contacted with the electric heating plate, the top of the simulation plate is provided with a groove, and the laser chip is arranged in the groove.
Preferably, the top of the closed top cover is fixedly connected with an L-shaped rack, one side of the heating box is provided with a driving motor, the output end of the driving motor is fixedly connected with a driving gear, and the driving gear is meshed with the L-shaped rack.
Preferably, one side fixedly connected with spacing slider of L shape rack, one side fixedly connected with two spacing guide bars of heating box, spacing guide bar and spacing slider sliding connection.
Preferably, the heating box is internally fixedly connected with a threaded shaft, the bottom of the heat insulation supporting piece is fixedly connected with a threaded sleeve, and the threaded sleeve is in threaded connection with the threaded shaft.
The utility model has the beneficial effects that:
the simulation board and the laser chip are driven to move up and down through the top cover and the bearing arc board, so that the simulation board and the laser chip can be conveniently moved to the upper side for each time when different laser chips are replaced for testing, the whole temperature box is not required to be opened, the heat loss in the temperature box is reduced, the power consumption of the temperature box is reduced, the simulation boards made of different materials simulate the main boards made of different materials, and the simulation boards can be replaced to simulate the temperature resistance of the laser chip when the laser chip is installed on the main boards made of different materials.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described, and it will be obvious to those skilled in the art that other drawings can be obtained according to these drawings without inventive effort;
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a rear view of the warming box of FIG. 1 according to the utility model;
FIG. 3 is an internal structural view of the heating cabinet of FIG. 1 according to the present utility model;
FIG. 4 is a schematic illustration of the connection of the closure cap and the load-bearing arc plate of FIG. 3 in accordance with the present utility model;
FIG. 5 is an enlarged view of the structure of FIG. 4A in accordance with the present utility model;
fig. 6 is a schematic view of the structure of the bottom of the thermal insulation support of fig. 5 in accordance with the present utility model.
Reference numerals in the drawings are as follows:
1. the heating box, 2, thermal insulation support piece, 3, electric plate, 4, closed top cover, 5, sealing plug, 6, bearing arc plate, 7, bearing plate, 701, clamping shaft, 8, simulation plate, 801, connecting block, 802, clamping hole, 9, laser chip, 10, groove, 11, L-shaped rack, 12, driving motor, 13, driving gear, 14, limit sliding block, 15, limit guide rod, 16, threaded shaft, 17 and threaded sleeve.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
The utility model provides a laser chip cos encapsulation temperature resistance test equipment, includes heating case 1, the inside of heating case 1 is provided with thermal-insulated support piece 2, and thermal-insulated support piece 2's top fixedly connected with electric plate 3, heating case 1's top is provided with sealed top cap 4, and sealed top cap 4's bottom fixedly connected with sealing plug 5, sealing plug 5's bottom runs through heating case 1 and extends to heating case 1's inside, sealing plug 5's bottom fixedly connected with two bear arc boards 6.
Two the equal fixedly connected with loading board 7 of internal surface that bears arc board 6 is provided with simulation board 8 between two loading boards 6, the equal fixedly connected with connecting block 801 in both sides of simulation board 8, connecting block 801 set up in loading board 7 top, the bottom of simulation board 8 and the bottom of loading board 6 set up in the coplanar, are provided with the laser chip 9 that waits to test on the simulation board 8.
As shown in fig. 3 and 4, the top of the heating box 1 is provided with an annular opening, the sealing plug 5 is clamped in the annular opening, the sealing cover plate 4 is covered above the annular opening, the heat insulation supporting piece 2 is made of heat insulation materials, the heat insulation supporting piece 2 is used for providing bearing for the electric heating plate 3, the simulation plate 8 is used for simulating the materials of the main plate, the influence of the main plate made of different materials on the laser chip 9 can be simulated by replacing different simulation plates, and the packaging mode adopted by the laser chip 9 is cos packaging.
The connecting block 801 is provided with a clamping hole 802, and the top of the bearing plate 7 is fixedly connected with a clamping shaft 701 matched with the clamping hole 802.
As shown in fig. 3, 4 and 5, when the simulation board 8 is arranged between the two bearing arc boards 6, the clamping shaft 701 and the clamping hole 802 are clamped together, so that the connection block 801 and the simulation board 8 are more stable, and the simulation board 8 is prevented from sliding.
The bottom of the simulation plate 8 and the bottom of the bearing arc plate 6 are contacted with the electric heating plate 3, a groove 10 is formed in the top of the simulation plate 8, and the laser chip 9 is arranged in the groove 10.
As shown in fig. 4, the laser chip 9 is placed in the groove 10, so that the laser chip 9 can be prevented from being separated from the dummy plate 8 in the process of moving the dummy plate 8 up and down.
The top of the closed top cover 4 is fixedly connected with an L-shaped rack 11, one side of the heating box 1 is provided with a driving motor 12, the output end of the driving motor 12 is fixedly connected with a driving gear 13, and the driving gear 13 is meshed with the L-shaped rack 11.
As shown in fig. 1 and 2, the driving motor 12 is externally connected with a power supply, and a corresponding control switch is arranged outside, and the driving gear 13 is meshed with the vertical end of the L-shaped rack 11, so that the L-shaped rack 11 can be driven to move up and down.
One side of the L-shaped rack 11 is fixedly connected with a limit sliding block 14, one side of the heating box 1 is fixedly connected with two limit guide rods 15, and the limit guide rods 15 are in sliding connection with the limit sliding block 14.
As shown in fig. 1 and 2, the limit guide rod 15 passes through the limit slider 14, so that the limit slider 14 and the L-shaped rack 11 can only move up and down in the direction of the limit guide rod 15, and the offset between the L-shaped rack 11 and the driving gear 13 is avoided.
The heating box 1 is internally and fixedly connected with a threaded shaft 16, the bottom of the heat insulation support 2 is fixedly connected with a threaded sleeve 17, and the threaded sleeve 17 is in threaded connection with the threaded shaft 16.
As shown in fig. 3 and 6, the screw sleeve 17 is driven to rotate by manually rotating the heat insulation support 2, so that the heights of the screw sleeve 17 and the heat insulation support 2 can be adjusted, and the temperature resistance test of the laser chips 9 with different thicknesses is convenient.
The working principle of the cos package temperature resistance test equipment for the laser chip provided by the utility model is as follows:
the electric heating plate 3 heats to transfer heat to the simulation plate 8, and then the simulation plate 8 transfers heat to the laser chip 9 to perform temperature resistance test on the laser chip 9;
after the temperature resistance test of the laser chip is finished, the driving motor 12 drives the driving gear 13 to rotate clockwise, the driving gear 13 drives the L-shaped rack 11 to ascend, the L-shaped rack 11 drives the closed top cover 4 to ascend, the closed top cover 4 drives the sealing plug 5 and the bearing arc plate 6 to ascend, the bearing arc plate 6 drives the simulation plate 8 and the laser chip 9 to ascend, at the moment, the laser chip 9 can be removed from the simulation plate 8, the new laser chip 9 is replaced to carry out the temperature resistance test, or the simulation plate 8 is pulled upwards to remove the simulation plate 8, and then the new simulation plate 8 is matched with the clamping shaft 701 through the clamping hole 802 and is clamped between the two bearing arc plates 6;
then the motor 12 drives the driving gear 13 to rotate anticlockwise, the driving gear 13 drives the L-shaped rack 11 to move downwards, the L-shaped rack 11 drives the bearing arc plate 6 to move downwards, the bearing arc plate 6 drives the simulation plate 8 and the laser chip 9 to move downwards, the simulation plate 8 is in contact with the electric heating plate 3 in a collision mode, and the laser chip is subjected to simulation test again.
Compared with the related art, the laser chip cos package temperature resistance test equipment provided by the utility model has the following beneficial effects:
the simulation board 8 and the laser chip 9 are driven to move up and down through the top cover 4 and the bearing arc board 6, so that the simulation board 8 and the laser chip 9 can be conveniently moved to the upper part for each time when different laser chips are replaced for testing, the whole temperature box is not required to be opened, the heat loss in the temperature box is reduced, the power consumption of the temperature box is reduced, the simulation boards 8 made of different materials simulate the main boards made of different materials, and the simulation boards 8 can be replaced to simulate the temperature resistance of the laser chip when the laser chip is installed on the main boards made of different materials.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made without departing from the spirit and scope of the utility model, which is defined in the appended claims.
Claims (6)
1. The utility model provides a laser chip cos encapsulation temperature resistance test equipment, includes heating case (1), its characterized in that, the inside of heating case (1) is provided with thermal-insulated support piece (2), the top fixedly connected with electric plate (3) of thermal-insulated support piece (2), the top of heating case (1) is provided with closed top cap (4), the bottom fixedly connected with sealing plug (5) of closed top cap (4), the bottom of sealing plug (5) runs through heating case (1) and extends to the inside of heating case (1), the bottom fixedly connected with of sealing plug (5) bears arc board (6);
two the equal fixedly connected with loading board (7) of internal surface of loading arc board (6), be provided with between two loading arc boards (6) simulation board (8), the equal fixedly connected with connecting block (801) in both sides of simulation board (8), connecting block (801) set up in loading board (7) top, the bottom of simulation board (8) and the bottom of loading arc board (6) set up in the coplanar, are provided with laser chip (9) of waiting to test on simulation board (8).
2. The laser chip cos packaging temperature-resistant testing device according to claim 1, wherein the connecting block (801) is provided with a clamping hole (802), and the top of the bearing plate (7) is fixedly connected with a clamping shaft (701) matched with the clamping hole (802).
3. The laser chip cos package temperature resistance test device according to claim 2, wherein the bottom of the simulation board (8) and the bottom of the bearing arc board (6) are both in contact with the electric heating board (3), the top of the simulation board (8) is provided with a groove (10), and the laser chip (9) is arranged in the groove (10).
4. The laser chip cos encapsulation temperature-resistant test equipment according to claim 3, wherein the top of the closed top cover (4) is fixedly connected with an L-shaped rack (11), one side of the heating box (1) is provided with a driving motor (12), the output end of the driving motor (12) is fixedly connected with a driving gear (13), and the driving gear (13) is meshed with the L-shaped rack (11).
5. The laser chip cos encapsulation temperature-resistant testing device according to claim 4, wherein one side of the L-shaped rack (11) is fixedly connected with a limit sliding block (14), one side of the heating box (1) is fixedly connected with two limit guide rods (15), and the limit guide rods (15) are in sliding connection with the limit sliding block (14).
6. The laser chip cos packaging temperature-resistant testing device according to claim 1, wherein a threaded shaft (16) is fixedly connected in the heating box (1), a threaded sleeve (17) is fixedly connected to the bottom of the heat insulation support (2), and the threaded sleeve (17) is in threaded connection with the threaded shaft (16).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321790008.3U CN220399490U (en) | 2023-07-10 | 2023-07-10 | Laser chip cos encapsulation temperature resistance test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321790008.3U CN220399490U (en) | 2023-07-10 | 2023-07-10 | Laser chip cos encapsulation temperature resistance test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220399490U true CN220399490U (en) | 2024-01-26 |
Family
ID=89599004
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321790008.3U Active CN220399490U (en) | 2023-07-10 | 2023-07-10 | Laser chip cos encapsulation temperature resistance test equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220399490U (en) |
-
2023
- 2023-07-10 CN CN202321790008.3U patent/CN220399490U/en active Active
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