CN212665126U - Miniature reflow oven suitable for chip test - Google Patents
Miniature reflow oven suitable for chip test Download PDFInfo
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- CN212665126U CN212665126U CN202021397569.3U CN202021397569U CN212665126U CN 212665126 U CN212665126 U CN 212665126U CN 202021397569 U CN202021397569 U CN 202021397569U CN 212665126 U CN212665126 U CN 212665126U
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Abstract
The utility model discloses a miniature reflow soldering furnace suitable for chip testing, which comprises a workbench, wherein a chip placing area is arranged on the workbench, the chip placing area is used for placing an IC chip and heating and cooling a temperature curve suitable for reflow soldering, a heating component and a cooling component are also arranged on the workbench, the heating component is positioned above the cooling component, the heating component can heat the workbench, the cooling component can cool the workbench, the heating component comprises a heating wire, the heating wire is arranged in the workbench, the heating wire is connected with a heating controller and controls the accurate temperature of the heating wire through the heating controller, the cooling component comprises a cooling pipe, the cooling pipe is arranged in the workbench, the cooling pipe is connected with a refrigerator, the refrigerator is under the action of a liquid pump, and introducing the refrigerant into a cooling pipe of the workbench for cooling.
Description
Technical Field
The utility model relates to a chip test equipment field especially relates to a compound miniature reflow oven that is applicable to chip testing.
Background
Because the IC chip is welded on the PCB through the SMT surface mounting technology after being packaged, reflow soldering is needed to carry out high-temperature soldering during the SMT soldering, and the soldering quality can be influenced by the deformation of the IC chip caused by temperature change during the reflow soldering. It is necessary to test the planarity of the chip under various temperature conditions after the chip packaging is completed. The 3D profile tester at the highest end of the world is kirnshi VR-5000 (test accuracy 0.1um) in japan, and the XYZ moving platform of the tester has a length and width W180mm × L200mm, a height space of only 65mm, and a platform load of less than 4 Kg. The existing reflow soldering is generally a heating and cooling partition structure, and at least 3 heating zones and a cold zone are needed in order to reach a standard lead-free soldering curve, so that the volume and the weight of the reflow soldering are large, and the reflow soldering cannot be placed on a tester platform.
Therefore, the inventor of the present invention is directed to a micro reflow oven for chip testing, which is suitable for the above technical problems.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects, the utility model aims to provide a miniature reflow oven suitable for chip testing.
In order to achieve the above purpose, the utility model discloses a technical scheme is: a micro reflow soldering furnace suitable for chip testing comprises a precision workbench, wherein a chip placing area is arranged on the precision workbench and used for placing an IC chip and simulating heating and cooling during reflow soldering, a heating component and a cooling component are further arranged on the workbench, the heating component is positioned above the cooling component and can heat the workbench, the cooling component can cool the workbench and comprises a heating wire, the heating wire is arranged in the workbench and is connected with a microcomputer heating controller, accurate temperature control is carried out on the heating wire through the microcomputer heating controller, the cooling component comprises a cooling pipe, the cooling pipe is arranged in the workbench and is connected with a refrigerator, and the refrigerator is under the action of a liquid pump, and introducing a refrigerant into the cooling pipe of the workbench for cooling.
Preferably, the workstation is two-layer about including, and the upper strata is the alloy hot plate, and the lower floor is stereoplasm aluminum plate, and set up the heater strip in the alloy hot plate set up the cooling tube in the stereoplasm aluminum plate, just bond through high temperature heat-conducting glue between alloy hot plate and the stereoplasm aluminum plate. The stability of the workbench structure is ensured, and the reflow soldering is convenient to carry out.
Preferably, the cooling assembly further comprises a three-way switching valve, the three-way switching valve is arranged between the refrigerating machine and the water inlet of the cooling pipe, and three interfaces of the three-way switching valve are respectively connected with the refrigerating machine, the water inlet of the cooling pipe and the air. Namely, the cooling pipe can evacuate the refrigerant in the cooling pipe through the air connection interface during heating, and smooth heating is ensured.
Preferably, the heating wires are distributed in a serpentine shape in the alloy heating plate, and the cooling pipes are also distributed in a serpentine shape in the hard aluminum plate. I.e. to ensure smooth heating and cooling.
The utility model relates to a miniature reflow soldering stove suitable for chip test's beneficial effect is, this miniature reflow soldering stove has adopted the rapid heating of a new research and development, cooling integral type hot plate, built-in heater strip of this hot plate and cooling tube, the product temperature of different time quantums is realized to the circulation volume and the temperature of power through the control heater and refrigerant, thereby reach the required temperature curve of different products, reach W180mm L180mm mm simultaneously, weight is less than 3.5Kg, can place in the VR 3D tester platform of high accuracy, carry out the plane degree test of IC chip under the different temperatures, not only satisfy the requirement of size and weight, and can accomplish the same temperature curve of large-scale reflow soldering.
Drawings
FIG. 1 is a schematic structural diagram of a micro reflow oven suitable for chip testing.
Fig. 2 is a schematic longitudinal section of the table.
Fig. 3 is a temperature profile of reflow soldering.
In the figure:
1-a workbench, 2-a chip placing area, 3-a heating assembly, 4-a cooling assembly,
11-alloy heating plate, 12-hard aluminum plate,
31-a heating wire, 32-a heating controller,
41-cooling pipe, 42-refrigerator, 43-liquid pump, 44-three-way switching valve.
Detailed Description
The following detailed description of the preferred embodiments of the present invention will be provided in conjunction with the accompanying drawings, so as to enable those skilled in the art to more easily understand the advantages and features of the present invention, and thereby define the scope of the invention more clearly and clearly.
Referring to fig. 1-3, the micro reflow oven for chip testing in this embodiment includes a worktable 1, a chip placement area 2 is disposed on the worktable 1, the chip placing area 2 is used for placing IC chips and performing reflow soldering, the workbench 1 is also provided with a heating component 3 and a cooling component 4, the heating component 3 is positioned above the cooling component 4, the heating component 3 can heat the workbench 1, the cooling component 4 can cool the workbench 1, the heating component 3 comprises a heating wire 31, the heating wire 31 is arranged in the workbench 1, meanwhile, the heating wire 31 is connected with the heating controller 32, and the heating wire 31 is acted by the heating controller 32, the cooling component 4 comprises a cooling pipe 41, the cooling pipe 41 is arranged in the workbench 1, the cooling pipe 41 is connected to a refrigerator 42, and the refrigerator 42 cools the cooling medium by introducing the cooling medium into the cooling pipe 41 of the table 1 by a liquid pump 43.
The workbench 1 comprises an upper layer and a lower layer, the upper layer is an alloy heating plate 11, the lower layer is a hard aluminum plate 12, a heating wire 31 is arranged in the alloy heating plate 11, a cooling pipe 41 is arranged in the hard aluminum plate 12, and the alloy heating plate 11 and the hard aluminum plate 12 are bonded through high-temperature heat-conducting glue. The stability of the structure of the workbench 1 is ensured, and the reflow soldering is convenient to carry out.
The cooling assembly 4 further includes a three-way switching valve 44, the three-way switching valve 44 is disposed between the refrigerator 42 and the water inlet of the cooling pipe 41, and three ports of the three-way switching valve 44 are respectively connected to the refrigerator 42 and the water inlet of the cooling pipe 41 and air. That is, it is ensured that the cooling pipe 41 can evacuate the refrigerant in the cooling pipe 41 through the air connection interface during heating, thereby ensuring smooth heating.
In order to ensure the accuracy of temperature control, a temperature sensor is also arranged in the workbench 1.
The heating wires 31 are distributed in a serpentine shape in the alloy heating plate 11, and the cooling pipes 41 are also distributed in a serpentine shape in the hard aluminum plate 12. I.e. to ensure smooth heating and cooling.
The utility model provides a miniature reflow oven suitable for chip test's beneficial effect is, this miniature reflow oven has adopted a new development's rapid heating, the cooling integral type hot plate, heater strip 31 and cooling tube 41 are built-in to this hot plate, realize the product temperature of different time quantums through the circulation volume and the temperature of the control heater's power and refrigerant, thereby reach the required temperature curve of different products, reach W180mm L180mm mm simultaneously, weight is less than 3.5Kg, can place in the VR 3D tester platform of high accuracy, carry out the flatness test of IC chip under the different temperatures, not only satisfy the requirement of size and weight, and can accomplish the same temperature curve of large-scale reflow soldering.
Referring to fig. 3, a temperature profile for reflow soldering is illustrated:
1) when the time reaches the initial temperature and the temperature rises to TC2, the temperature rising slope A1, and the TC2 temperature value and the time T1 value are set, the heating controller 32 can control the power output of the heating controller 32 in real time according to the temperature value measured by the temperature sensor in real time, so that the set temperature value is reached in the set time;
2) keeping constant temperature TC2 in the time from T1 to T2, wherein when the set temperature TC2 is reached, the heating controller 32 performs heat compensation in real time according to the heat loss amount so as to ensure constant temperature conditions;
3) the temperature rise of T2-T3 is shown in step 1, and the constant temperature of T3-T4 is shown in step 2;
4) temperature reduction of T4-T5, cooling temperature TC1 and cooling gradient A3 are set as follows: by setting the TC1 value and the slope A3, the cooling module 4 can adjust the flow of the cooling water in real time to achieve the set temperature and time requirements.
Also, referring to the figure, the temperature of T1 is lower than T2.
The use method of the micro reflow soldering furnace is described by combining the temperature curve as follows:
according to the temperature curve setting requirement, when the temperature is in the rising stage, the cooling component 4 automatically switches the three-way switching valve 44 to the air opening state, the refrigerator 42 pumps the refrigerant in the cooling pipe 41 and the pipeline to the refrigerator 42, and at the moment, the heating component 3 utilizes the electric power, the heating controller 32 and the temperature sensor to perform closed-loop PID control time and temperature curve; when the temperature needs to be reduced, the three-way switching valve 44 is automatically switched to the main pipeline to be opened, so that the cold coal enters the cooling pipe 41 to realize circulation, and the curve of controlling the temperature and the time in the cooling stage is achieved by controlling the flow of the cold coal. The high-efficiency micro reflow soldering is achieved, and the temperature test requirements of various IC chips can be met.
The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, so as not to limit the protection scope of the present invention, and all equivalent changes or modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.
Claims (4)
1. The utility model provides a miniature reflow oven suitable for chip test which characterized in that: comprises a precision workbench, a chip placing area is arranged on the precision workbench and used for placing an IC chip and heating and cooling during simulated reflow soldering, the workbench is also provided with a heating component and a cooling component, the heating component is positioned above the cooling component, the heating component can heat the workbench, the cooling component can cool the workbench, the heating component comprises a heating wire, the heating wire is arranged in the workbench, meanwhile, the heating wire is connected with a microcomputer heating controller and is subjected to accurate temperature control through the microcomputer heat controller, the cooling component comprises a cooling pipe, the cooling pipe is arranged in the workbench, and the cooling pipe is connected with a refrigerator, and the refrigerator introduces a refrigerant into the cooling pipe of the workbench for cooling under the action of the liquid pump.
2. The micro reflow oven suitable for chip testing according to claim 1, wherein: the workbench comprises an upper layer and a lower layer, wherein the upper layer is an alloy heating plate, the lower layer is a hard cooling plate, heating wires are arranged in the alloy heating plate, cooling pipes are arranged in the hard cooling plate, and the alloy heating plate and the hard cooling plate are bonded through high-temperature heat-conducting glue.
3. The micro reflow oven suitable for chip testing according to claim 1, wherein: the cooling assembly further comprises a three-way switching valve, the three-way switching valve is arranged between the refrigerating machine and the water inlet of the cooling pipe, and three interfaces of the three-way switching valve are respectively connected with the refrigerating machine, the water inlet of the cooling pipe and the air.
4. The micro reflow oven suitable for chip testing according to claim 1, wherein: the heater strip is snakelike the distribution in the alloy hot plate, the cooling tube also is snakelike the distribution in stereoplasm aluminum plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021397569.3U CN212665126U (en) | 2020-07-15 | 2020-07-15 | Miniature reflow oven suitable for chip test |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202021397569.3U CN212665126U (en) | 2020-07-15 | 2020-07-15 | Miniature reflow oven suitable for chip test |
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| Publication Number | Publication Date |
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| CN212665126U true CN212665126U (en) | 2021-03-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202021397569.3U Active CN212665126U (en) | 2020-07-15 | 2020-07-15 | Miniature reflow oven suitable for chip test |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114131131A (en) * | 2021-11-25 | 2022-03-04 | 江苏长实基业电气科技有限公司 | Reflow soldering device for circuit board production and operation method |
-
2020
- 2020-07-15 CN CN202021397569.3U patent/CN212665126U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114131131A (en) * | 2021-11-25 | 2022-03-04 | 江苏长实基业电气科技有限公司 | Reflow soldering device for circuit board production and operation method |
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