CN220398015U

CN220398015U - Drying equipment

Info

Publication number: CN220398015U
Application number: CN202321987648.3U
Authority: CN
Inventors: 刘剑荣; 曾宪瑞; 段良飞; 胡瑶; 董国庆; 文国昇; 金从龙
Original assignee: Jiangxi Zhao Chi Semiconductor Co Ltd
Current assignee: Jiangxi Zhao Chi Semiconductor Co Ltd
Priority date: 2023-07-26
Filing date: 2023-07-26
Publication date: 2024-01-26
Anticipated expiration: 2033-07-26

Abstract

The utility model provides drying equipment, which relates to the technical field of wafer processing equipment, and comprises a first box body, a second box body for accommodating wafers, a heating component and an air injection component, wherein the second box body is at least partially embedded into the first box body, an accommodating space for accommodating liquid is formed between the outer side of the second box body and the inner side of the first box body, the heating component is arranged in the accommodating space, the heating component is used for heating the liquid stored in the accommodating space, the air injection component comprises a plurality of groups of spray heads, the spray heads are arranged in the second box body, the output port of each spray head in the plurality of groups of spray heads faces towards the wafers placed in the second box body, the spray heads are used for outputting gas so as to dry the wafers through the gas, and the hot gas directly acts on the surfaces of the wafers, so that the drying efficiency of the wafers can be improved, and the drying time of the wafers is shortened.

Description

Drying equipment

Technical Field

The utility model relates to the technical field of semiconductor processing equipment, in particular to drying equipment.

Background

The LED chip is a solid semiconductor device, the heart of the LED is a semiconductor wafer, one end of the wafer is attached to a bracket, the other end of the wafer is a negative electrode, and the other end of the wafer is connected with the positive electrode of a power supply, so that the whole wafer is encapsulated by epoxy resin.

In the process of processing the LED chip, wet cleaning is to utilize various chemical reagents to perform chemical reaction or dissolution with impurities and greasy dirt on the surface of the wafer, or to combine with physical measures such as ultrasonic, heating, vacuumizing and the like to enable the impurities to be desorbed (desorbed) from the surface of an object to be cleaned, and then flushing the object with a large amount of high-purity deionized water, so that a clean surface process is obtained, and the surface of the wafer is required to be dried subsequently, wherein a conventional drying mode is to put the wafer in an environment filled with hot nitrogen for drying.

However, the single wafer is baked in a hot nitrogen atmosphere, which has a problem of low efficiency.

Disclosure of Invention

Based on the above, the present utility model aims to provide a drying apparatus, so as to solve the problem of low efficiency in the prior art that a wafer is dried in a hot nitrogen environment.

The utility model provides drying equipment, which comprises a first box body, a second box body for containing wafers, a heating component and an air injection component, wherein the second box body is at least partially embedded into the first box body, a containing space for containing liquid is formed between the outer side of the second box body and the inner side of the first box body, the heating component is arranged in the containing space, and the heating component is used for heating the liquid stored in the containing space;

the jet assembly comprises a plurality of groups of jet heads, the jet heads are arranged in the second box body, the output port of each jet head in the plurality of groups of jet heads faces towards the wafer placed in the second box body, and the jet heads are used for outputting gas so as to dry the wafer through the gas.

Further, the air injection assembly further comprises a plurality of pipe bodies, wherein each spray head in each group of spray heads is connected with one pipe body respectively, and one end, away from the spray heads, of each pipe body is used for being connected with an air storage tank.

Further, the multiple groups of spray heads comprise two groups of spray heads, and the two groups of spray heads are symmetrically arranged with the center line of the top of the second box body and are all arranged on the top of the second box body.

Further, the drying equipment further comprises a bearing disc, the bearing disc is arranged in the second box body, a plurality of through holes are formed in the surface of the bearing disc, and the bearing disc is used for bearing a plurality of wafers.

Further, the heating assembly comprises a plurality of heating rods, and the heating rods are arranged in the accommodating space.

Further, a plurality of heating rods are arranged at intervals along the length direction of the first box body.

Further, the heating assembly further comprises a water inlet, a first water outlet and a second water outlet which are arranged on the first box body, and the water inlet, the first water outlet and the second water outlet are communicated with the accommodating space;

wherein one of the first drain opening and the second drain opening is provided at the top of the first casing.

Further, the drying equipment further comprises an exhaust pipe, one end of the exhaust pipe is communicated with the inside of the second box body, and the other end of the exhaust pipe penetrates through the first box body and the second box body.

Further, the drying device further comprises a temperature sensor, wherein the sensing end of the temperature sensor is communicated with the accommodating space and is used for detecting the temperature of the liquid.

Further, the drying equipment further comprises a liquid level detection device, wherein the detection end of the liquid level detection device is communicated with the accommodating space and used for detecting the liquid level of the liquid.

In summary, through the drying equipment provided above, for the stoving mode to the wafer among the prior art, have following beneficial effect:

in the drying equipment provided by the utility model, the liquid stored in the accommodating space can be heated by the heating device, so that the interior of the second box body is in a high-temperature environment, and then the spray head is utilized to directly apply the gas with high temperature to the surface of the wafer.

Drawings

FIG. 1 is a perspective view of an embodiment of the present utility model;

FIG. 2 is a perspective view of another embodiment of the present utility model;

FIG. 3 is a perspective cross-sectional view from a perspective of an embodiment of the present utility model;

fig. 4 is a perspective cross-sectional view from another perspective in accordance with one embodiment of the present utility model.

Description of main reference numerals:

100. a first case; 200. a second case; 300. a heating assembly; 310. a heating rod; 320. a water inlet; 330. a first drain port; 340. a second drain port; 400. a jet assembly; 410. a spray head; 420. a tube body; 500. an accommodation space; 600. an exhaust pipe; 700. a temperature sensor; 800. a liquid level detection device; 900. a carrying tray.

The utility model will be further described in the following detailed description in conjunction with the above-described figures.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

In order to facilitate an understanding of the utility model, several embodiments of the utility model will be presented below. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Referring to fig. 1 to 4, there is shown a drying apparatus according to a first embodiment of the present utility model, which includes a first casing 100, a second casing 200 for accommodating wafers, a heating assembly 300, and an air injection assembly 400, wherein the second casing 200 has an accommodating space 500 at least partially embedded inside the first casing 100 and formed between an outside of the second casing 200 and an inside of the first casing 100 for accommodating liquid, the heating assembly 300 is disposed in the accommodating space 500, and the heating assembly 300 is used for heating the liquid stored in the accommodating space 500;

the jet assembly 400 includes a plurality of groups of nozzles 410, the plurality of groups of nozzles 410 are all disposed in the second box 200, and an output port of each nozzle 410 of the plurality of groups of nozzles 410 faces toward a wafer disposed in the second box 200, and the nozzles 410 are configured to output a gas to dry the wafer by the gas.

Specifically, in the present embodiment, the heating assembly 300 includes a plurality of heating rods 310, the heating rods 310 are disposed in the accommodating space 500, and the plurality of heating rods 310 are disposed at intervals along the length direction of the first casing 100, that is, the liquid stored in the accommodating space 500 can be heat-treated by the heating rods 310, so that the inside of the second casing 200 is in a high-temperature environment.

In order to facilitate the delivery of the liquid into the accommodating space 500, in this embodiment, the heating assembly 300 further includes a water inlet 320, a first water outlet 330 and a second water outlet 340 provided on the first housing 100, wherein the water inlet 320, the first water outlet 330 and the second water outlet 340 are all in communication with the accommodating space 500, one of the first water outlet 330 and the second water outlet 340 is provided at the top of the first housing 100, and it should be noted that the liquid in the accommodating space 500 can be discharged through the first water outlet 330 or the second water outlet 340 by delivering the external liquid into the accommodating space 500, and in some preferred embodiments, the second water outlet 340 can be provided at the top of the first housing 100, that is, when the liquid flows out from the second water outlet 340, the operator can be reminded that the liquid in the accommodating space 500 is stored.

Further, the drying apparatus further includes a temperature sensor 700 and a liquid level detection device 800, where the sensing end of the temperature sensor 700 is connected to the accommodating space 500 for detecting the temperature of the liquid, and the sensing end of the liquid level detection device 800 is connected to the accommodating space 500 for detecting the liquid level of the liquid, and it should be noted that the temperature sensor 700 and the liquid level detection device 800 in this embodiment are all conventional technologies, and are not specifically described herein.

In order to ensure that the wafers placed in the second box 200 are sufficiently dried and the drying efficiency thereof is ensured, the air injection assembly 400 further comprises a plurality of pipes 420, wherein each nozzle 410 in each group of nozzles 410 is respectively connected with one pipe 420, one end of each pipe 420, which is far away from the nozzle 410, is used for being connected with an air storage tank, in practical cases, the air storage tank can be a tank for storing nitrogen, the nitrogen is transported by the pipe 420, so that the nitrogen can be transported at each nozzle 410, then the nitrogen can be directly acted on the surface of the wafer through the nozzle 410, compared with the traditional drying method in which the wafers are placed at a high temperature, the nitrogen and the high temperature in the second box 200 are formed, so that the nitrogen with the high temperature, namely the hot nitrogen, directly acts on the surface of the wafers, the drying efficiency of the wafers is improved, the drying time of the wafers is reduced, the nitrogen adopted in the embodiment can be prevented from being blown on the surface of the wafers, and simultaneously, compared with the air blown on the surface of the wafers, the wafer is prevented from polluting, and other components are not particularly used.

The multiple sets of spray heads 410 include two sets of spray heads 410, and the two sets of spray heads 410 are symmetrically arranged with a central line at the top of the second box 200 and are all arranged at the top of the second box 200, in some preferred embodiments, the drying device further includes a carrying tray 900, the carrying tray 900 is arranged in the second box 200, a plurality of through holes are formed in the surface of the carrying tray 900, the carrying tray 900 is used for carrying a plurality of wafers, and it is noted that the bottom of the carrying tray 900 can be provided with a plurality of supporting feet, so that the carrying surface of the carrying tray 900 can be spaced from the bottom of the second box 200, the drying device further includes an exhaust pipe 600, one end of the exhaust pipe 600 is communicated with the inside of the second box 200, and the other end of the exhaust pipe 600 penetrates through the first box 100 and the second box 200.

In summary, in the drying apparatus according to the above embodiment of the present utility model, compared with the drying manner of the wafer in the prior art, the liquid stored in the accommodating space 500 can be heated by the heating device, so that the interior of the second box 200 is in a high-temperature environment, and then the gas can be directly applied to the surface of the wafer by using the nozzle 410, and compared with the conventional drying manner in which the wafer is placed in the high-temperature environment, the gas and the high-temperature gas in the second box 200 form the gas with high temperature, that is, the hot gas directly acts on the surface of the wafer, so as to improve the drying efficiency of the wafer, and reduce the drying time of the wafer.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The foregoing examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. The drying equipment is characterized by comprising a first box body, a second box body, a heating component and an air injection component, wherein the second box body is at least partially embedded in the first box body, an accommodating space is formed between the outer side of the second box body and the inner side of the first box body and used for accommodating liquid, the heating component is arranged in the accommodating space, and the heating component is used for heating the liquid stored in the accommodating space;

2. The drying apparatus according to claim 1, wherein the air injection assembly further comprises a plurality of pipes, wherein each of the plurality of spray heads is connected to a respective one of the pipes, and wherein an end of the pipe remote from the spray heads is adapted to be connected to an air reservoir.

3. The drying apparatus according to claim 1, wherein the plurality of sets of spray heads includes two sets of spray heads, and the two sets of spray heads are symmetrically arranged with respect to a center line of the top of the second casing, and are all provided at the top of the second casing.

4. The drying apparatus according to claim 1, further comprising a carrier tray disposed in the second housing, wherein a surface of the carrier tray is provided with a plurality of through holes, and the carrier tray is configured to carry a plurality of wafers.

5. The drying apparatus according to claim 1, wherein the heating assembly includes a plurality of heating bars provided in the accommodating space.

6. The drying apparatus according to claim 5, wherein a plurality of the heating bars are disposed at intervals along a length direction of the first casing.

7. The drying apparatus of claim 5, wherein the heating assembly further comprises a water inlet, a first water outlet, and a second water outlet provided on the first housing, the water inlet, the first water outlet, and the second water outlet all communicating with the receiving space;

8. The drying apparatus according to claim 1, further comprising an exhaust pipe having one end communicating with the inside of the second casing and the other end penetrating the first casing and the second casing.

9. The drying apparatus according to claim 1, further comprising a temperature sensor having a sensing end in communication with the receiving space for detecting the temperature of the liquid.

10. The drying apparatus according to claim 1, further comprising a liquid level detection device, a detection end of the liquid level detection device being in communication with the accommodation space for detecting a liquid level of the liquid.