CN216793638U - Wafer transfer box - Google Patents

Abstract

The utility model relates to a wafer transmission box, which comprises: the box body, the supporting part, the gas pipe and the communicating pipe. An air inlet is formed on the inner wall of the box body. The supporting part is arranged on the inner wall of the box body and used for supporting the wafer. The air pipe is arranged above the supporting part at intervals, and the pipe wall of the air pipe is provided with exhaust holes. The exhaust hole faces the support part. The gas pipe is communicated with the communicating pipe, and the communicating pipe is communicated with the gas inlet. Above-mentioned wafer conveying box during operation, the wafer supports fixedly through the supporting part and stores in the inside of box body, cleans the air supply and passes through the inlet port and get into communicating pipe, is carried for the gas-supply pipe by the communicating pipe, and the exhaust hole through the gas-supply pipe outwards discharges, and the gas flow sweeps is carried out the supporting part to the gas flow that cleans of gas-supply pipe exhaust to reduce the amount of supporting part and the regional absorbent steam in wafer surface and HF by a wide margin, finally can alleviate the risk and the degree that produce pressure welding point crystal defect by a wide margin.

Description

Wafer transfer box

Technical Field

The utility model relates to the technical field of semiconductor processing, in particular to a wafer conveying box.

Background

The wafer transfer box mainly plays a role in placing and conveying wafers (wafers) in semiconductor production, can protect, convey and store the wafers, prevents the wafers from collision and friction, provides safety protection during transportation, transfer and storage, has good air tightness and can prevent the generation of particulate matters.

To simplify shipping and minimize the risk of contamination, chip manufacturers utilize foups to handle and store wafers. However, Al Pad Crystal defects are easily formed at the contact portion between the wafer and the groove wall of the groove, and the pressure welding point Crystal defects formed at the edge of the wafer can affect the Crystal pressure welding performance test result in the subsequent packaging test procedure, and directly affect the product performance and quality.

SUMMERY OF THE UTILITY MODEL

Accordingly, there is a need to overcome the drawbacks of the prior art and to provide a wafer cassette that reduces the occurrence of crystal defects and improves the product performance and quality of wafers.

The technical scheme is as follows: a wafer pod, comprising: the wafer processing box comprises a box body and a supporting part, wherein an air inlet is formed in the inner wall of the box body, the supporting part is arranged on the inner wall of the box body, and the supporting part is used for supporting a wafer; the air pipe is arranged above the supporting part at intervals, the pipe wall of the air pipe is provided with an exhaust hole facing the supporting part, the air pipe is communicated with the communicating pipe, and the communicating pipe is communicated with the air inlet hole.

Above-mentioned wafer conveying box during operation, the wafer supports fixedly through the supporting part and stores in the inside of box body, cleans the air supply and passes through the inlet port and get into communicating pipe, is carried for the gas-supply pipe by the communicating pipe, and the exhaust hole through the gas-supply pipe outwards discharges, and the gas flow sweeps is carried out the supporting part to the gas flow that cleans of gas-supply pipe exhaust to reduce the amount of supporting part and the regional absorbent steam in wafer surface and HF by a wide margin, finally can alleviate the risk and the degree that produce pressure welding point crystal defect by a wide margin.

In one embodiment, the number of the exhaust holes is at least two, and the at least two exhaust holes are sequentially arranged at intervals along the axial direction of the gas conveying pipe; the two ends of the gas pipe and the two ends of the supporting part are respectively aligned.

In one embodiment, the air inlet hole is arranged on the bottom wall of the box body, and the supporting part is arranged on the side wall of the box body; one end of the communicating pipe is positioned on the bottom wall of the box body and is communicated with the air inlet hole, and the communicating pipe is further arranged along the bottom wall of the box body and the side wall of the box body.

In one embodiment, the air intake hole is also in direct communication with the interior space of the cartridge body, and is used to discharge a purge air stream directly to the interior of the cartridge body.

In one embodiment, the number of the supporting parts is at least two, and the at least two supporting parts are sequentially arranged along the inner wall of the box body from bottom to top at intervals; the gas transmission pipe is at least two, at least two the gas transmission pipe all with communicating pipe intercommunication to set up in at least two one-to-one the top of supporting part.

In one embodiment, two adjacent supporting parts are matched to form a clamping groove, and the clamping groove is used for being fixedly matched with the edge of the wafer.

In one embodiment, the gas transmission pipe is a capillary gas pipe, and the exhaust hole is a capillary air hole.

In one embodiment, a surface of the supporting portion, which is used for abutting against the wafer, is defined as a supporting surface, and at least one through hole is formed in the supporting portion, and the through hole penetrates from the supporting surface to the rest of the surface of the supporting portion.

In one embodiment, the hollowed-out holes are circular holes, elliptical holes, or polygonal holes.

In one embodiment, the support part comprises a first support part and a second support part which are respectively arranged on the opposite wall surfaces of the inner wall of the box body, the first support part and the second support part are used for supporting the wafer, and the gas conveying pipes comprise first gas conveying pipes which are arranged above the first support part at intervals and second gas conveying pipes which are arranged above the second support part at intervals; the communicating pipe comprises a first communicating pipe communicated with the first gas pipe and a second communicating pipe communicated with the second gas pipe, and the first communicating pipe and the second communicating pipe are communicated with the gas inlet hole.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the utility model and, together with the description, serve to explain the utility model and not to limit the utility model.

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a wafer pod according to an embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a wafer pod according to another embodiment of the present invention;

FIG. 3 is a schematic view of a wafer cassette with wafers thereon according to one embodiment of the present invention;

FIG. 4 is a schematic view of a wafer cassette with wafers thereon according to another embodiment of the present invention;

FIG. 5 is a schematic view of a wafer cassette with wafers thereon according to another embodiment of the present invention;

FIG. 6 is a schematic view illustrating a structure of a wafer cassette for holding wafers according to another embodiment of the present invention.

10. A cartridge body; 11. an air inlet; 12. an opening; 13. a door panel; 14. a hoisting part; 20. a support portion; 201. hollowing out holes; 202. a card slot; 2021. a first card slot; 2022. a second card slot; 21. a first support section; 22. a second support portion; 30. a gas delivery pipe; 301. an exhaust hole; 31. a first gas delivery pipe; 32. a second gas delivery pipe; 40. a communicating pipe; 41. a first communication pipe; 42. a second communicating pipe; 50. and (5) a wafer.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

Conventionally, when the door of the wafer transfer box is opened or closed, the water vapor in the air is pushed into the interior of the wafer transfer box and diffuses in the interior of the wafer transfer box, so that the inner wall of the wafer transfer box and the groove wall of the clamping groove can easily adsorb more water vapor and HF. Therefore, after the passivation process step, when the wafer is stored in the wafer transmission box for too long time or the humidity of the storage environment is too high, Crystal (Crystal) is formed under the common reaction of Al Pad, F and water vapor, and Al Pad Crystal defect (pressure welding point Crystal defect) is easily formed at the contact part of the wafer and the groove wall of the clamping groove, so that the pressure welding point Crystal defect formed at the edge of the wafer can influence the Crystal pressure welding performance test result in the subsequent packaging test procedure, and the product performance and the quality are directly influenced.

Referring to fig. 1, fig. 1 is a schematic structural diagram of a wafer transfer box according to an embodiment of the present invention, and the wafer transfer box according to the embodiment of the present invention includes: the box body 10, the supporting part 20, the gas pipe 30 and the communicating pipe 40. An air inlet hole 11 is formed on the inner wall of the cartridge body 10. The support 20 is disposed on the inner wall of the cassette body 10, and the support 20 is used for supporting a wafer 50 (as shown in fig. 3). The air pipes 30 are arranged above the supporting part 20 at intervals, and the pipe wall of the air pipe 30 is provided with air vents 301. The discharge hole 301 faces the support 20. The air pipe 30 is communicated with the communicating pipe 40, and the communicating pipe 40 is communicated with the air inlet 11.

Above-mentioned wafer conveying box during operation, wafer 50 supports through supporting part 20 fixedly and stores in the inside of box body 10, clean the air supply and pass through the inlet port 11 and get into communicating pipe 40, carry for gas-supply pipe 30 by communicating pipe 40, exhaust hole 301 through gas-supply pipe 30 outwards discharges, gas-supply pipe 30 exhaust cleans the air current and carries out the air current to supporting part 20 and sweep, thereby reduce the amount of the adsorbed steam of supporting part 20 and wafer 50 surface area and HF by a wide margin, finally can alleviate the risk and the degree that produce pressure welding point crystal defect by a wide margin.

The purge gas is a gas that does not participate in the chemical reaction, and is, for example, an inert gas. As one example, the purge gas stream includes, but is not limited to, nitrogen.

Referring to fig. 1, in one embodiment, there are at least two exhaust holes 301, and the at least two exhaust holes 301 are sequentially arranged at intervals along the axial direction of the air pipe 30 (i.e., the direction from one end of the air pipe 30 to the other end). Two ends of the air pipe 30 are aligned with two ends of the supporting portion 20 respectively. So, during operation, the inside air current that cleans of gas-supply pipe 30 is outwards arranged through two at least exhaust holes 301, and each position on the supporting part 20 can be swept to the exhaust air current that cleans, and then can realize cleaning of each position on the supporting part 20 to have better cleaning effect to the supporting part 20.

Of course, as an alternative, it is not necessary to align the two ends of the air pipe 30 with the two ends of the support portion 20, and it is also not necessary to provide at least two air pipes 30 on the air pipe 30, but for example, only one exhaust hole 301 may be provided on the air pipe 30, and specifically, the exhaust hole 301 is provided in the middle portion of the air pipe 30, so that the air flow inside the air pipe 30 is blown to the middle portion of the support portion 20 after being exhausted through the exhaust hole 301 in the middle portion, and then flows towards the two side portions of the support portion 20, and when the intensity of the cleaning air flow is large enough, a certain cleaning effect is also provided for the support portion 20.

Referring to fig. 1, in one embodiment, the air inlet 11 is disposed on the bottom wall of the box body 10, and the supporting portion 20 is disposed on the side wall of the box body 10. One end of the communication pipe 40 is located on the bottom wall of the cartridge body 10 and communicates with the air intake hole 11, and the communication pipe 40 is also arranged along the bottom wall of the cartridge body 10 and the side wall of the cartridge body 10.

Of course, it should be noted that the air intake holes 11 are not limited to be disposed on the bottom wall of the box body 10, and may be disposed on the side wall and the top wall of the box body 10, and may be opened according to actual requirements, and are not limited herein. When the air intake holes 11 are provided at other portions of the cartridge body 10, the end portions of the communication pipes 40 are correspondingly arranged at other portions of the cartridge body 10 so as to communicate with the air intake holes 11.

Referring to fig. 1, in one embodiment, the air inlet 11 is also directly communicated with the inner space of the box body 10, and is used for directly discharging the scavenging air flow to the inside of the box body 10. Thus, the air inlet hole 11 not only conveys the cleaning air flow to the air delivery pipe 30 through the communication pipe 40, but also discharges the cleaning air flow to the inside of the box body 10 by discharging the cleaning air flow to the support portion 20 through the air discharge hole 301 of the air delivery pipe 30 to clean the support portion 20, for example, when directly discharging from the bottom wall of the box body 10 upward, the cleaning effect can be further performed.

Referring to fig. 1, in one embodiment, there are two or more supporting portions 20, and the two or more supporting portions 20 are sequentially disposed along the inner wall of the box body 10 from bottom to top at intervals. In this way, by providing two or more support portions 20, it is possible to support and fix two or more wafers 50, thereby realizing storage and transportation of two or more wafers 50. In addition, correspondingly, there are at least two air delivery pipes 30, and at least two air delivery pipes 30 are both communicated with the communicating pipe 40 and are arranged above the at least two supporting parts 20 in a one-to-one correspondence manner. Therefore, the at least two gas transmission pipes 30 can respectively transmit the purging gas flow to the wafer 50 placed on the corresponding at least two supporting parts 20, and the product quality of the wafer 50 is ensured.

Referring to fig. 1, in one embodiment, two adjacent supports 20 cooperate to define a slot 202, and the slot 202 is adapted to fixedly cooperate with an edge of the wafer 50. By fixedly placing the edge of the wafer 50 in the pocket 202 in this manner, the wafer 50 can be stably supported and fixed.

Specifically, the thickness of the wafer 50 is, for example, 1mm to 2mm, and the gap between two adjacent supports 20 is, for example, 5mm to 50mm, so that the gap between two supports 20 corresponds to the clamp groove 202, and the edge of the wafer 50 can be stably supported and fixed. In addition, the gap size of the clamping groove 202 is also large enough to accommodate the installation air pipe 30.

In one embodiment, the gas delivery conduit 30 is a capillary gas conduit and the vent holes 301 are capillary air holes. Thus, the air pipe 30 is suitable in size and not too large, and can be placed in the clamping groove 202 formed by the matching of the two adjacent supporting parts 20; in addition, the size of the air pipe 30 is not too small, so that the cleaning effect of the cleaning air flow on the supporting part 20 can be ensured.

Specifically, the diameter of the capillary pores is 0.5mm-2 mm; the interval between two adjacent capillary air holes is 8mm-20 mm.

In one embodiment, the surface of the supporting portion 20 for abutting against the wafer 50 is defined as a supporting surface, and at least one through hole 201 is formed in the supporting portion 20, and the through hole 201 penetrates from the supporting surface to the rest of the surface of the supporting portion 20. So, when the supporting surface of supporting part 20 supports fixed wafer 50, owing to be provided with fretwork hole 201 on supporting part 20, the fretwork hole 201 that sets up can reduce the area of contact of supporting surface and wafer 50 by a wide margin, and fretwork hole 201 makes supporting part 20 change easily simultaneously and washs, can reduce the absorption of steam and HF on the supporting surface to alleviate the risk and the degree that produce pressure welding point crystal defect.

The remaining surface means a surface other than the supporting surface on the supporting portion 20.

The "support portion 20" may be a "part of the box body 10", that is, the "support portion" may be integrally formed with "the other part of the box body 10"; or a separate member separable from the other part of the cartridge body 10, that is, the support portion may be separately manufactured and then integrated with the other part of the cartridge body 10.

Referring to fig. 2 and 3, fig. 2 is a schematic structural diagram of a wafer pod according to another embodiment of the utility model. Fig. 2 is different from fig. 1 in that a hollow hole 201 is additionally formed in the support portion 20 in fig. 2. In one embodiment, the hollowed-out holes 201 penetrate from the support surface to a surface of the support 20 that is disposed opposite the support surface. So set up, fretwork hole 201 makes supporting part 20 change in the washing more easily, can reduce the absorption of steam and HF on the holding surface to alleviate the risk and the degree that produce pressure welding point crystal defect. Of course, the hollow hole 201 may also penetrate from the supporting surface to the surface of the supporting portion 20 adjacent to the supporting surface.

Referring to fig. 3 to 6, fig. 4 is a schematic structural diagram illustrating a wafer 50 placed on a pod according to another embodiment of the present invention, fig. 5 is a schematic structural diagram illustrating a wafer 50 placed on a pod according to yet another embodiment of the present invention, and fig. 6 is a schematic structural diagram illustrating a wafer 50 placed on a pod according to yet another embodiment of the present invention. In one embodiment, the hollowed-out holes 201 are circular holes (as shown in fig. 3), elliptical holes, or polygonal holes (as shown in fig. 4-6). So, set up fretwork hole 201 into the hole that the shape is comparatively regular, can be convenient for processing production, reduction in production cost improves production efficiency.

Alternatively, the polygonal holes include, but are not limited to, triangular holes, quadrangular holes (as shown in fig. 4), pentagonal holes (as shown in fig. 5), hexagonal holes (as shown in fig. 6), and the like, and the polygonal holes are flexibly arranged according to actual requirements.

It should be noted that the hollow holes 201 may be holes designed in a regular shape, or holes in an irregular shape, as long as the contact area between the supporting surface and the wafer 50 can be reduced, and the specific shape is not limited herein, and may be flexibly set according to actual requirements.

Referring to fig. 2 and 3, in an embodiment, at least two of the through holes 201 are disposed on the supporting portion 20 at intervals. So, when the quantity of arranging of fretwork hole 201 is more, it reduces more to realize also that the area of contact of holding surface and wafer face reduces, just so can make supporting part 20 change easily and wash, can reduce the absorption of steam and HF on the holding surface to alleviate risk and the degree that produces pressure welding point crystal defect.

It can be understood that, when at least two hollow holes 201 are provided on the support portion 20, the size and shape of each hollow hole 201 may be the same or different, and the hollow holes may be flexibly provided according to actual requirements, and are not limited herein.

In one embodiment, at least two of the hollows 201 are sequentially spaced along the length direction of the support 20. Thus, the hollow holes 201 are uniformly distributed at each position in the length direction of the supporting part 20, and the contact area between the supporting surface and the wafer surface can be greatly reduced. It should be noted that the longitudinal direction of the support portion 20 refers to a direction from one end of the support portion 20 to the other end, i.e., a direction indicated by an arrow S in fig. 2.

Of course, as an alternative, the number of the through holes 201 may be one. And the designed length of the hollow hole 201 is long enough, and the hollow hole extends from one end of the supporting part 20 to the other end of the supporting part 20 as far as possible, so that the contact area between the supporting surface and the wafer surface can be greatly reduced, and the effect of reducing the defect of pressure welding points is achieved.

Referring to fig. 2 and 3, in one embodiment, the supporting portion 20 includes a first supporting portion 21 and a second supporting portion 22 respectively disposed on opposite walls of an inner wall of the box body 10. The first support portion 21 and the second support portion 22 are used for supporting the wafer 50. In this way, the wafer 50 is supported by the first support portion 21 and the second support portion 22, respectively, and the wafer 50 can be stably supported.

In addition, the air pipe 30 includes a first air pipe 31 disposed above the first support portion 21 at an interval, and a second air pipe 32 disposed above the second support portion 22 at an interval. The communication pipe 40 includes a first communication pipe 41 communicating with the first gas pipe 31, and a second communication pipe 42 communicating with the second gas pipe 32, both the first communication pipe 41 and the second communication pipe 42 communicating with the intake port 11. So, equally divide on first supporting part 21 and the second supporting part 22 and be provided with first gas-supply pipe 31 and second gas-supply pipe 32 respectively at intervals, also purge the air current through first gas-supply pipe 31 to first supporting part 21, purge the air current through second gas-supply pipe 32 to second supporting part 22, thereby can the greatly reduced first supporting part 21, the absorption of steam and HF on the second supporting part 22, thereby alleviate risk and the degree that produces pressure welding point crystal defect.

More specifically, the number of the intake ports 11 is two, and the intake ports communicate with the first communication pipe 41 and the second communication pipe 42, respectively. Of course, the air intake holes 11 may be provided as one, for example, to communicate the first communication pipe 41 and the second communication pipe 42 with each other through one air intake hole 11.

Further, at least one hollow hole 201 is disposed on each of the first supporting portion 21 and the second supporting portion 22. Thus, the first supporting portion 21 and the second supporting portion 22 are both provided with at least one hollow hole 201, that is, the contact area between the supporting surfaces of the first supporting portion 21 and the second supporting portion 22 and the wafer 50 can be greatly reduced, the supporting portion 20 can be easily cleaned, and the absorption of water vapor and HF on the supporting surfaces can be reduced, so that the risk and degree of generating the pressure welding point crystal defect can be reduced.

The number, shape, and arrangement intervals of the hollow holes 201 in the first support portion 21 may be different from those of the second support portion 22. Of course, the first support portion 21 and the second support portion 22 may be configured to have the same shape, and when the first support portion 21 and the second support portion 22 are configured to have the same structure, the support portion 20 can be mass-produced and processed, and the production efficiency can be greatly improved.

Of course, as an alternative, the support portion 20 may only include the first support portion 21 or the second support portion 22, so as to support one side of the wafer 50, and the other side is disposed empty, and also stably support the wafer 50. In addition, in another alternative, the support portion 20 may include not only the first support portion 21 and the second support portion 22, but also, for example, the third support portion 20, that is, three portions of the edge of the wafer 50 are supported by the first support portion 21, the second support portion 22 and the third support portion 20, so that the wafer 50 can be stably supported and fixed.

Referring to fig. 2 and 3, in one embodiment, the foup further includes a connection portion (not shown). The connection portion is provided on the cartridge body 10, and all the support portions 20 are provided on the connection portion. So, all supporting parts 20 are installed on box body 10 through connecting portion, and box body 10 can adopt the material that is different from connecting portion, supporting part 20 like this, and for example box body 10 can choose the lower transparent material of cost for use to in order to observe the 50 situations of the inside wafer of box body 10, supporting part 20 and connecting portion both can adopt other materials, in order to guarantee structural strength, can produce simultaneously in batches and process supporting part 20 and connecting portion, and production efficiency is higher. Of course, the same material may be used for the cartridge body 10, the connecting portion, and the supporting portion 20, and the material is not limited to this and may be provided according to actual circumstances.

Referring to fig. 2 and 3, in one embodiment, the supporting portion 20 and the connecting portion are integrated, and the connecting portion is adhered or clamped to the inner wall of the box body 10. Thus, the support part 20 and the connecting part can be manufactured separately, for example, by injection molding, so that the molding quality and the production efficiency of the support part 20 and the connecting part are ensured; after the support portion 20 and the connecting portion are produced, the structure formed by combining the support portion 20 and the connecting portion is fixedly mounted on the box body 10 by means of bonding or clamping.

The "support portion 20" may be a "part of the connecting portion", that is, the "support portion 20" and the "other part of the connecting portion" are integrally formed; the support portion 20 may be made separately from the other portions of the connecting portion and may be combined with the other portions of the connecting portion to form a single unit.

It should be noted that the "connecting portion" may be a part of the cartridge body 10, that is, the "connecting portion" and the other parts of the cartridge body 10 are integrally formed; the "connecting portion" may be a separate member that is separable from the "other portion of the cartridge body 10", and may be formed separately and integrated with the "other portion of the cartridge body 10".

Referring to fig. 2 and 3, in an embodiment, the number of the first supporting portions 21 is two or more, and the two or more first supporting portions 21 are sequentially disposed at intervals. The number of the second supporting portions 22 is two or more, and the two or more second supporting portions 22 and the two or more first supporting portions 21 are arranged in a one-to-one correspondence. Two adjacent first supporting portions 21 are matched to form a first clamping groove 2021, and two adjacent second supporting portions 22 are matched to form a second clamping groove 2022. Thus, two opposite edges of the wafer 50 are respectively disposed in the first slot 2021 and the second slot 2022, so that the wafer 50 can be stably fixed.

Further, the connection portion includes a first connection portion (not shown in the drawings) and a second connection portion (not shown in the drawings), respectively. All the first supporting parts 21 are sequentially arranged on the first connecting parts at intervals, namely, are arranged on one side wall of the box body 10 through the first connecting parts; all the second supporting parts 22 are sequentially disposed on the second connecting parts at intervals, and are mounted on the opposite side walls of the box body 10 through the second connecting parts.

Referring to fig. 2 and 3, in one embodiment, the box body 10 is provided with an opening 12, and a door 13 openably disposed on the opening 12. In this way, the door 13 is normally closed to prevent dust and impurities from entering the cassette body 10 through the opening 12, and when the wafer 50 needs to be loaded and unloaded, the door 13 is opened to allow the wafer 50 to be loaded into the cassette body 10 and mounted on the support portion 20 through the opening 12, or the wafer 50 in the cassette body 10 is taken out.

Referring to fig. 2 and 3, in one embodiment, the foup further includes a lifting portion 14 disposed on the pod body 10. The hoisting part 14 is used for being matched with a hook of a crane. Therefore, when the wafer transmission box needs to be moved, the hook of the crane acts on the hoisting part 14, so that the wafer transmission box can be moved to a target position; when the wafer cassette does not need to be moved, the hook of the crane is only required to release the lifting part 14.

It should be noted that the "hanging part 14" may be a part of the box body 10, that is, the "hanging part 14" and the other parts of the box body 10 are integrally formed; or an independent member separable from the other parts of the cartridge body 10, that is, the "hanging part 14" may be manufactured separately and then integrated with the other parts of the cartridge body 10. As shown in fig. 2, in one embodiment, the "sling 14" is a part of the "box body 10" that is integrally formed.

In summary, the wafer transport box in the above embodiments has at least the following advantages:

1. the wafer 50 is supported and fixed by the supporting part 20 and stored in the box body 10, the cleaning air source enters the communicating pipe 40 through the air inlet 11, the communicating pipe 40 is conveyed to the air conveying pipe 30, the air is discharged outwards through the exhaust hole 301 of the air conveying pipe 30, the cleaning air flow discharged by the air conveying pipe 30 carries out air flow purging on the supporting part 20, so that the amount of water vapor and HF adsorbed on the surface area of the supporting part 20 and the wafer 50 is greatly reduced, and finally, the risk and degree of generating pressure welding point crystal defects can be greatly reduced.

2. When the supporting surface of the supporting portion 20 supports the fixed wafer 50, due to the hollow holes 201 arranged on the supporting portion 20, the contact area between the supporting surface and the wafer 50 can be greatly reduced by the arranged hollow holes 201, and meanwhile, the supporting portion 20 is easier to clean due to the hollow holes 201, so that the adsorption of water vapor and HF on the supporting surface can be reduced, and the risk and degree of generating the pressure welding point crystal defect are reduced.

The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the utility model. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the utility model and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the utility model.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless explicitly specified otherwise.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature "under," "beneath," and "under" a second feature may be directly under or obliquely under the second feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.

Claims (10)

1. A wafer pod, comprising:

the wafer processing box comprises a box body and a supporting part, wherein an air inlet is formed in the inner wall of the box body, the supporting part is arranged on the inner wall of the box body, and the supporting part is used for supporting a wafer;

the air pipe is arranged above the supporting part at intervals, the pipe wall of the air pipe is provided with an exhaust hole facing the supporting part, the air pipe is communicated with the communicating pipe, and the communicating pipe is communicated with the air inlet hole.

2. The wafer conveying box according to claim 1, wherein the number of the exhaust holes is at least two, and the at least two exhaust holes are sequentially arranged at intervals along the axial direction of the gas conveying pipe; the two ends of the gas pipe and the two ends of the supporting part are respectively aligned.

3. The wafer transport box of claim 1, wherein the air inlet is disposed on a bottom wall of the box body, and the support portion is disposed on a side wall of the box body; one end of the communicating pipe is positioned on the bottom wall of the box body and is communicated with the air inlet hole, and the communicating pipe is further arranged along the bottom wall of the box body and the side wall of the box body.

4. The foup of claim 1, wherein the inlet port is also in direct communication with the interior space of the pod body and is adapted to exhaust a purge gas stream directly into the interior of the pod body.

5. The wafer conveying box as claimed in claim 1, wherein the number of the supporting portions is at least two, and the at least two supporting portions are sequentially spaced from bottom to top along the inner wall of the box body; the gas transmission pipe is at least two, at least two the gas transmission pipe all with communicating pipe intercommunication to set up in at least two one-to-one the top of supporting part.

6. The wafer transport box of claim 5, wherein adjacent two of the support portions cooperate to define a slot, the slot being adapted to fixedly engage with an edge of the wafer.

7. The wafer transport box of claim 1, wherein the gas pipe is a capillary pipe and the vent hole is a capillary hole.

8. The foup of claim 1, wherein the surface of the support portion for abutting against the wafer is defined as a support surface, and at least one hole is formed in the support portion, the hole penetrating from the support surface to the rest of the surface of the support portion.

9. The foup of claim 8, wherein the hollowed-out holes are circular, elliptical, or polygonal holes.

10. The wafer conveying box according to claim 1, wherein the supporting part comprises a first supporting part and a second supporting part which are respectively arranged on opposite wall surfaces of the inner wall of the box body, the first supporting part and the second supporting part are both used for supporting the wafer, and the gas pipes comprise first gas pipes which are arranged above the first supporting part at intervals and second gas pipes which are arranged above the second supporting part at intervals; the communicating pipe comprises a first communicating pipe communicated with the first gas pipe and a second communicating pipe communicated with the second gas pipe, and the first communicating pipe and the second communicating pipe are communicated with the gas inlet hole.

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