CN220397137U - Forced air cooling type semiconductor temperature-regulating notebook computer bracket - Google Patents
Forced air cooling type semiconductor temperature-regulating notebook computer bracket Download PDFInfo
- Publication number
- CN220397137U CN220397137U CN202321320103.7U CN202321320103U CN220397137U CN 220397137 U CN220397137 U CN 220397137U CN 202321320103 U CN202321320103 U CN 202321320103U CN 220397137 U CN220397137 U CN 220397137U
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- notebook computer
- air
- base
- bracket
- turbofan
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 238000001816 cooling Methods 0.000 title claims abstract description 24
- 238000005192 partition Methods 0.000 claims abstract description 12
- 230000001105 regulatory effect Effects 0.000 claims description 8
- 230000007246 mechanism Effects 0.000 claims description 6
- 238000001914 filtration Methods 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 13
- 238000007789 sealing Methods 0.000 abstract description 8
- 230000001965 increasing effect Effects 0.000 abstract description 7
- 230000000694 effects Effects 0.000 abstract description 6
- 238000005057 refrigeration Methods 0.000 abstract description 6
- 239000000428 dust Substances 0.000 abstract description 5
- 230000002035 prolonged effect Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 6
- 239000003292 glue Substances 0.000 description 4
- 239000002184 metal Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 229920000742 Cotton Polymers 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Forced air cooling type semiconductor adjusts temperature notebook computer support, its characterized in that: including the support and locate semiconductor hybrid air-cooled refrigerating plant on the support body, its characterized in that: the frame body comprises a base, a middle partition plate and an upper bracket; the base and the middle partition plate form a cavity for providing air for the turbofan; taking the cold end of the semiconductor refrigerating sheet as a cold source, and performing heat exchange on air through the inner radiating sheet after the air is pressurized by the turbofan; the air after cooling and pressurizing is buffered in the cavity of the bracket. The utility model improves the heat dissipation effect of the notebook computer, and reduces the temperature of air inhaled by the notebook computer by adopting semiconductor refrigeration; the sealing ring and the turbofan are used for increasing the air inlet quantity of the notebook computer, improving the radiating effect of the notebook computer, and the sponge sheet is placed at the air inlet to filter air, so that the dust deposit of the notebook computer can be effectively reduced, and the service life of the notebook computer can be prolonged.
Description
Technical Field
The utility model relates to a forced air cooling type semiconductor temperature-regulating notebook computer bracket
Background
At present, home offices have become mainstream, and most enterprises or institutions can equip personal business notebook computers for staff, so that staff individuals can purchase notebook supports and docking stations according to the situation to meet various use requirements.
And with the improvement of the performance of the notebook, a large amount of heat is generated in the running process. When the accumulated heat cannot be timely dissipated, the temperature of the notebook computer can be rapidly increased. At high temperatures, the performance of notebook computers can be limited. Meanwhile, the long-term high temperature can reduce the service life of the hardware of the computer and the failure rate can be obviously increased during operation.
The radiator support in the current market adopts air cooling heat dissipation. Air-cooled heat dissipation enhances heat dissipation by enhancing air convection, but the heat dissipation effect of most products is not obvious. When the water-cooled heat dissipation is used, the internal structure of the common notebook computer needs to be modified, extra cost is needed, and risks exist. The use of water cooling heat dissipation is to use liquid for heat exchange, and the heat dissipation effect is good but the heat dissipation has higher requirements on the sealing quality of the radiator. When the seal fails, the coolant may overflow. Unnecessary economic losses are incurred.
Disclosure of Invention
Aiming at the defects and shortcomings of the prior art, the utility model provides the semiconductor refrigeration notebook computer bracket which is simple to use, good in heat dissipation performance and capable of adjusting humidity and temperature.
The technical scheme for solving the technical problems is as follows: the forced air cooling type semiconductor temperature-regulating notebook computer support comprises a support and a semiconductor mixed air cooling refrigerating device arranged on a support body, wherein the support body comprises a base, a middle partition plate and an upper support, and the base and the upper support are detachably connected through a connecting piece.
Further, the base is connected with the upper bracket through glue, and the top of the upper bracket is connected with the bottom of the sealed shock-absorbing voice coil isolation coil through glue.
Further, the connecting piece include the bolt and with bolt complex draw-in groove, the draw-in groove with the bolt is located respectively both sides fluting and intermediate matters in the base, for the intermediate matters stretches into the draw-in groove and connects through the bolt base and upper bracket. Square holes which are uniformly distributed on opposite sides are formed in two sides of the base.
The heat radiation structure is located the trompil side of upper bracket, outer fin and interior fin are installed in the trompil side of upper bracket, and the semiconductor refrigeration piece is placed in the trompil of upper bracket, and radiator fan installs the fin department at outer fin.
Further, the turbine fan is positioned in a cavity formed by the base and the middle partition plate and is fixed in a square hole at the bottom of the middle partition plate
Further, a speed regulating mechanism and a temperature setting mechanism of a fan are arranged in the inner cavity of the notebook computer bracket.
The utility model has the beneficial effects that: simple structure, the cost is lower, and its structure possesses the function that does benefit to the dismantlement to be convenient for carry out the dismouting with required part, thereby do benefit to its clearance work, in order to avoid more dust to influence its radiating effect and efficiency after long-term use, and satisfy the radiating area of different model size notebooks, the commonality is higher.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a partial cross-sectional view of the present utility model;
FIG. 3 is a three view of the intermediate baffle of the present utility model;
fig. 4 is an assembly view of the upper bracket and the semiconductor refrigeration sheet of the present utility model;
in the figure: 1. the device comprises a base, a middle partition plate, a base, an outer radiating fin, a radiating fan, an upper support, a sealing shock-absorbing voice coil, an inner radiating fin, a turbofan, a semiconductor refrigerating fin, a filtering sponge fin and a filtering sponge fin.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1-4, the forced air cooling type semiconductor temperature-regulating notebook computer bracket comprises a bracket and a semiconductor mixed air cooling refrigerating device arranged on a bracket body, wherein the bracket body comprises a base, a middle partition plate and an upper bracket, and the base and the upper bracket are detachably connected through a connecting piece.
The base is connected with the upper bracket through glue, and the top of the upper bracket is connected with the bottom of the sealed shock-absorbing voice coil isolation coil through glue. The connecting piece include the bolt and with bolt complex draw-in groove, the draw-in groove with the bolt is located respectively both sides fluting and intermediate matters in the base, for the intermediate matters stretches into the draw-in groove and connects through the bolt base and upper bracket. Square holes which are uniformly distributed on opposite sides are formed in two sides of the base.
The heat dissipation structure is positioned at the open hole side of the upper bracket, the outer radiating fins and the inner radiating fins are arranged at the open hole side of the upper bracket, the semiconductor refrigerating fins are arranged in the open holes of the upper bracket, and the heat dissipation fan is arranged at the heat dissipation fins of the outer radiating fins; the turbofan is positioned in a cavity formed by the base and the middle partition plate and is fixed in a square hole at the bottom of the middle partition plate.
And a speed regulating mechanism and a temperature setting mechanism of a fan are arranged in the inner cavity of the temperature regulating notebook computer bracket.
The semiconductor refrigerating sheet is a loop composed of a P-type semiconductor and an N-type semiconductor. When a direct current I is applied, carriers (holes) in the P-type semiconductor and carriers (electrons) in the N-type semiconductor move under the action of an external field. The electron movement direction of the metal sheet and the N-type semiconductor is opposite to the current direction, and the hole movement direction in the P-type semiconductor is the same as the current direction. Since the energy of electrons in a metal is lower than that in an N-type semiconductor, it is necessary to absorb heat when it flows from a metal sheet into the N-type semiconductor. Holes in the P-type semiconductor are opposite to the movement direction of electrons, so that the internal energy is increased, and the temperature is raised and releases heat to the surrounding environment; when holes are separated from electrons, electron-hole pairs are generated, resulting in a decrease in internal energy, a decrease in temperature, and heat absorption from the surrounding environment. Obviously, the switching between refrigeration and heating can be realized by changing the direction of the current. The semiconductor refrigerating sheet has no vibration, noise, long service life and easy installation. And has two functions, can refrigerate, can heat again, the refrigeration efficiency is generally not high, but the heating efficiency is very high, is greater than 1 forever. Thus, one element may be used instead of a separate heating and cooling system.
The frame body ensures the normal air intake of the device, is provided with a turbine fan for fixing and pressurizing, provides space for the pressurized air, and forces the pressurized air to exchange heat with the inner radiating fins. The temperature and absolute humidity of the air passing through the inner fin are reduced. The upper bracket forms a sealed space with the lower bottom surface of the notebook computer by sealing the voice coil, and the air pressure in the space is higher than the external atmospheric pressure, so that the air inlet quantity of the notebook computer is increased. The temperature of the pressurized air is lower than the ambient temperature, increasing the heat exchange between the air and the notebook heating components. The sealing ring is made of damping cotton and has the functions of sealing and buffering. The influence of vibration generated by the fan on the computer is reduced, and the noise generated by the fan is reduced. A filter screen can be arranged at the air inlet to purify air, so that dust entering a computer is reduced.
The upper bracket of the frame body can be provided with a temperature sensor for detecting the air temperature, and the air inlet quantity is regulated according to the temperature of the upper bracket to play a role in regulating the temperature. When the environmental temperature is too low, the anode and the cathode of the semiconductor refrigerating sheet can be reversely connected, so that the refrigerating sheet heats and plays a role in heating. In the use, the air inlet quantity can be regulated by regulating the rotating speed of the turbofan, and when the semiconductor refrigerating sheet is used for cooling, the cooling fan is required to be turned on first, so that the temperature of the heating end of the semiconductor refrigerating sheet is prevented from being too high.
The notebook computer cooling fan is suitable for cooling a notebook computer, only the air inlet is ensured to be smooth, the fan works normally, a high-pressure area is formed under the notebook computer, the air inlet quantity of the notebook computer is increased, the temperature of the notebook computer can be effectively reduced, the sealing of a spliced part is not needed, the cost is saved, and the cleaning work in the future is convenient.
The folding gasket can be arranged at the bottom side of the bracket, the height of the notebook computer can be adjusted in multiple stages by adjusting the size of the gasket, the personalized requirements of different users are met, and the application range is wider. The occupied space is small, and the device can be attached to the bottom side of the bracket when not in use.
The sealing ring used by the support can be suitable for notebook computers with different sizes, the application range of the support is improved, and resonance between the fan and the notebook computers can be avoided through shock absorption. And can provide enough friction force to prevent the notebook computer in an inclined state from sliding down the notebook computer bracket.
The notebook computer bracket is cleaned, the bracket can be disassembled only by upwards supporting the middle partition plate from the chute of the base, then dust on the inner radiating fins is erased, the dust in the cavity is removed, and the filtering sponge at the air inlet is replaced. Other cleaning operations can be performed without disassembling the notebook stand.
In order to achieve the ideal cooling effect, a separate power supply is needed to be provided for the forced air cooling type semiconductor temperature-regulating notebook computer bracket for supplying power. If the power is directly supplied to the notebook computer through the USB interface, the total power of the notebook computer may be too large to exceed the charging power.
The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that modifications and variations could be made by those skilled in the art without departing from the technical principles of the present utility model, and such modifications and variations should also be regarded as being within the scope of the utility model.
Claims (6)
1. Forced air-cooled semiconductor adjusts temperature notebook computer support, including notebook computer support and heat radiation structure, its characterized in that: the notebook computer bracket comprises two split bracket bodies: the base and the upper bracket are detachably connected through a connecting piece.
2. The notebook computer bracket according to claim 1, wherein the connecting piece comprises a bolt and a clamping groove matched with the bolt, the clamping groove and the bolt are respectively arranged on two side grooves in the base and an intermediate baffle plate, and the intermediate baffle plate extends into the clamping groove through the bolt and connects the base and the upper bracket.
3. The notebook computer bracket according to claim 2, wherein square holes are formed on two sides of the base, the opposite sides of the base are uniformly distributed, and the filtering sponge sheet is placed in the square holes of the base.
4. The notebook computer stand according to claim 1 or 2, wherein the base and the upper stand are separated by a middle partition to form two cavities, and a turbofan is placed in the cavities, and the turbofan is fixed in a square hole at the bottom of the middle partition.
5. The notebook computer holder of claim 1, wherein a speed regulating mechanism and a temperature setting mechanism of a fan are disposed in an internal cavity of the notebook computer holder.
6. The notebook computer bracket according to claim 1, wherein an outer cooling fin and an inner cooling fin are installed outside the opening of the upper bracket, a semiconductor cooling fin is arranged inside the opening of the upper bracket, and a cooling fan is installed at the cooling fin of the outer cooling fin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321320103.7U CN220397137U (en) | 2023-05-29 | 2023-05-29 | Forced air cooling type semiconductor temperature-regulating notebook computer bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321320103.7U CN220397137U (en) | 2023-05-29 | 2023-05-29 | Forced air cooling type semiconductor temperature-regulating notebook computer bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220397137U true CN220397137U (en) | 2024-01-26 |
Family
ID=89607165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321320103.7U Active CN220397137U (en) | 2023-05-29 | 2023-05-29 | Forced air cooling type semiconductor temperature-regulating notebook computer bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220397137U (en) |
-
2023
- 2023-05-29 CN CN202321320103.7U patent/CN220397137U/en active Active
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